Stripping structure and ceramic capacitor processing equipment

Abstract

The utility model belongs to the technical field of diaphragm stripping, and particularly relates to a stripping structure and ceramic capacitor processing equipment. The stripping base is slidably arranged in the linear direction, the stripping plate is arranged opposite to the adsorption plate and provided with a stripping face, the adjusting piece is used for adjusting the parallelism of the stripping face relative to the adsorption plate, one end of the adjusting piece is connected with the stripping base, and the other end of the adjusting piece is connected with the stripping plate. The substrate layer is conveyed in the preset direction and passes through the stripping face, a heat insulation cavity is formed in the stripping face, the substrate layer covers the heat insulation cavity, the adsorption plate moves towards the stripping face and adsorbs the dielectric film unit, and the stripping base slides in the direction opposite to the conveying direction so that the adsorption plate can strip the dielectric film unit from the substrate layer. The heat insulation cavity can prevent heat on the adsorption plate from being conducted to the stripping plate, so that the temperature of the stripping plate is prevented from being too high, subsequent stripping of the white film unit is facilitated, and the stripping efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of film stripping, in particular to a stripping structure and ceramic capacitor processing equipment. Background Art

[0002] The manufacturing process of multi-layer ceramic chip capacitors (MLCC) includes multiple steps. Before cutting, it mainly includes the following processes: batching, casting, printing, lamination, capping and lamination. Among them, the lamination stage involves laminating the ceramic diaphragms with printed inner electrodes according to the designed misalignment requirements to form the MLCC bar. The entire production process is carried out step by step, layer by layer, and finally the manufacturing of MLCC is completed.

[0003] Lamination is a step in this process, and its purpose is to prepare the protective layer and the dielectric layer through the lamination process, and then press them to form a block. In the process of laminating the dielectric film to form the dielectric layer, the dielectric film is attached to the base layer, and the dielectric film is cut into multiple dielectric film units through the cutting process. Then, the dielectric film units are peeled off from the base layer through the cooperation of the adsorption plate and the peeling structure, and finally, the multiple dielectric film units are stacked and molded in sequence to form the dielectric layer.

[0004] When the dielectric film unit is peeled off, an adsorption plate with a certain temperature is generally used to adsorb the dielectric film unit located on the peeling structure. The high-temperature adsorption plate can effectively adsorb the dielectric film unit, and the dielectric film unit softens and adheres to the adsorption plate. However, at the same time, the heat will also be conducted to the peeling structure, which will cause the temperature of the peeling structure to be too high. The peeling structure will conduct the heat to the subsequent dielectric film unit, which will increase the adhesion between the subsequent dielectric film unit and the base layer, and also increase the adhesion between the base layer and the peeling structure, thereby making it difficult for the base layer to be separated from the peeling structure, causing local stretching and displacement of the base layer, and making it difficult for the subsequent dielectric film unit to be peeled off from the base layer, thereby reducing the peeling efficiency. Utility Model Content

[0005] The purpose of the embodiments of the present application is to provide a peeling structure, aiming to solve the problem of how to improve the efficiency of peeling the dielectric film unit from the base layer.

[0006] To achieve the above purpose, the technical solution adopted in this application is:

[0007] In a first aspect, a peeling structure is provided, which cooperates with an adsorption plate to peel off a dielectric film unit from a base layer, and the peeling structure includes: a peeling base arranged to slide in a linear direction, a peeling plate arranged relative to the adsorption plate and having a peeling surface, and an adjusting member for adjusting the parallelism of the peeling surface relative to the adsorption plate, one end of the adjusting member is connected to the peeling base, and the other end of the adjusting member is connected to the peeling plate, the base layer is conveyed in a predetermined direction and passes through the peeling surface, the peeling surface is provided with an insulating cavity, and the base layer covers the insulating cavity, the adsorption plate moves toward the peeling surface and adsorbs the dielectric film unit, and the peeling base slides in a direction opposite to the conveying direction, so that the adsorption plate peels off the dielectric film unit from the base layer.

[0008] In some embodiments, the thermal insulation chambers are arranged in plurality at intervals.

[0009] In some embodiments, a first air blowing hole is opened at the peeling surface, the first air blowing hole is located at the center of the peeling surface, and the first air blowing hole is spaced apart from the heat insulation cavity.

[0010] In some embodiments, a second air blowing hole is further provided at the peeling surface, and a plurality of the second air blowing holes are arranged at intervals, and each of the second air blowing holes is arranged circumferentially around the center position of the peeling surface.

[0011] In some embodiments, the aperture of the first blowing hole is larger than the aperture of the second blowing hole.

[0012] In some embodiments, the stripping base is provided with an adjustment threaded hole, and the adjustment member includes a support screw and an adjustment nut connected to the support screw, one end of the support screw is screwed into the adjustment threaded hole, and the other end of the support screw is rotatably connected to and supports the stripping plate, and the adjustment nut is used to drive the support screw to rotate so as to adjust the length of the support screw between the stripping plate and the stripping base.

[0013] In some embodiments, the stripping base includes a base relative to the stripping plate and a positioning plate located between the base and the stripping plate, the positioning plate is connected to the base, the adjusting threaded hole is opened in the positioning plate, and one end of the support screw passes through the adjusting threaded hole, the adjusting member also includes a tube spring, the tube spring is sleeved on and connected to one end of the support screw, and the tube spring abuts against the edge of the adjusting threaded hole and presses the positioning plate toward the adsorption plate to tighten the connection between the support screw and the positioning plate.

[0014] In some embodiments, the stripping plate is provided with a guide surface, and the base layer at least partially adheres to the guide surface along the conveying direction to guide the adsorption plate to strip the medium film unit.

[0015] In some embodiments, the peeling structure also includes a transfer plate connected to the adsorption plate and a guide roller abutting the base layer, and two transfer plates are arranged at intervals, and the two ends of the guide roller are respectively rotatably connected to the two transfer plates, and the connection position of the transfer plate to the adsorption plate can be adjusted along the sliding direction of the peeling base.

[0016] In a second aspect, a ceramic capacitor processing device is provided, which includes the stripping structure. The ceramic capacitor processing device also includes a manipulator for moving the dielectric membrane unit, and the manipulator includes the adsorption plate.

[0017] The beneficial effect of the present application is that during the stripping process, the temperature of the adsorption plate is higher than that of the stripping plate, thereby softening the dielectric film unit, so that the dielectric film unit can be better and more evenly attached to the adsorption plate, which is also conducive to the separation of the dielectric film unit from the base layer, thereby improving the stripping efficiency. By providing a heat insulation cavity on the stripping surface, the heat insulation cavity can prevent the heat from the adsorption plate from being transferred to the stripping plate, thereby avoiding the stripping plate from being too hot, facilitating the subsequent stripping of the dielectric film unit, and improving the stripping efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or exemplary technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the cooperation between the peeling structure and the adsorption plate provided in the embodiment of the present application;

[0020] Figure 2 yes Figure 1 Schematic diagram of the three-dimensional structure of the peeling structure;

[0021] Figure 3 yes Figure 2 Exploded schematic diagram of the peeled structure;

[0022] Figure 4 yes Figure 2 Schematic cross-sectional view of the peeling structure.

[0023] Among them, the reference numerals in the figure are:

[0024] 100, peeling structure; 12, adsorption plate; 10, base layer; 11, dielectric membrane unit; 101, horizontal section; 102, inclined section; 200, peeling plate; 300, adjusting member; 400, peeling base; 201, heat insulation cavity; 211, first blowing hole; 212, second blowing hole; 213, peeling surface; 401, base; 402, positioning plate; 501, adapter plate; 502, guide roller; 214, guide surface; 403, adjusting threaded hole; 301, adjusting nut; 302, support screw; 303, tube spring; DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0026] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "first" and "second" are only used for the purpose of convenience of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0027] See also Figures 1 to 4 The embodiment of the present application provides a stripping structure 100 and a ceramic capacitor processing device having the same, and the ceramic capacitor processing device is used to produce multilayer chip ceramic capacitors. The base layer 10 moves along the transmission direction V1 and is linearly attached with a plurality of dielectric film units 11 in sequence. When the base layer 10 passes through the stripping structure 100, the stripping structure 100 cooperates with the robot to strip a single dielectric film unit 11 from the base layer 10, so that the plurality of dielectric film units 11 can be stacked and pressed to form a dielectric layer.

[0028] See also Figures 1 to 4The peeling structure 100 includes: a peeling base 400 slidingly arranged in a linear direction, a peeling plate 200 arranged relative to the adsorption plate 12 and having a peeling surface 213, and an adjusting member 300 for adjusting the parallelism of the peeling surface 213 relative to the adsorption plate 12. It can be understood that the peeling base 400 slides linearly along a horizontal plane, and its sliding direction V2 can be the same as the conveying direction of the base layer 10 in the horizontal plane, or opposite to the conveying direction of the base layer 10 in the horizontal plane, that is, the peeling base 400 can perform reciprocating linear sliding, the peeling surface 213 is horizontally arranged, and the adsorption plate 12 is located above the peeling surface 213.

[0029] See also Figures 1 to 4 , one end of the adjusting member 300 is connected to the stripping base 400, and the other end of the adjusting member 300 is connected to the stripping plate 200. The stripping surface 213 can be arranged as horizontally as possible and parallel to the adsorption plate 12 through the adjusting member 300, and the stripping surface 213 is provided with a heat insulation cavity 201. The base layer 10 is transported along the transport direction and passes through the stripping surface 213, and the base layer 10 covers the heat insulation cavity 201. When the adsorption plate 12 moves toward the stripping surface 213 and adsorbs the dielectric film unit 11, the hollow structure of the heat insulation cavity 201 can prevent the heat on the adsorption plate 12 from being transferred to the stripping plate 200, thereby reducing the temperature of the adsorption plate 12. At the same time, the stripping base 400 slides, and the sliding direction is opposite to the transport direction of the base layer 10, so that the adsorption plate 12 can strip the dielectric film unit 11 from the base layer 10, and at the same time, there is another dielectric film unit 11 corresponding to the stripping surface 213.

[0030] See also Figures 1 to 4 In the peeling structure 100 provided in the embodiment of the present application, during the peeling process, the temperature of the adsorption plate 12 is higher than the temperature of the peeling plate 200, so that the dielectric film unit 11 can be softened, so that the dielectric film unit 11 can be better and more evenly attached to the adsorption plate 12, which is also conducive to the separation of the dielectric film unit 11 from the base layer 10, thereby improving the peeling efficiency. By setting a heat insulation cavity 201 on the peeling surface 213, the heat insulation cavity 201 can prevent the heat on the adsorption plate 12 from being transferred to the peeling plate 200, thereby avoiding the peeling plate 200 from being too high in temperature, facilitating the subsequent peeling of the dielectric film unit 11, and improving the peeling efficiency.

[0031] In some embodiments, a plurality of the thermal insulation cavities 201 are arranged at intervals.

[0032] Optionally, four insulation cavities 201 are arranged at intervals, and the four insulation cavities 201 are arranged in an array, thereby effectively preventing the heat on the adsorption plate 12 from being transferred to the stripping plate 200 . At the same time, the insulation cavities 201 arranged at intervals can enable the adsorption plate 12 to absorb the dielectric membrane unit 11 on the stripping surface 213 .

[0033] In some embodiments, a first air blowing hole 211 is opened on the peeling surface 213 , and the first air blowing hole 211 is located at the center of the peeling surface 213 .

[0034] See also Figures 1 to 4 Optionally, the center position of the dielectric membrane unit 11 covers the first blowing hole 211, and the first blowing hole 211 is connected to an external air source. When the adsorption plate 12 is close to the dielectric membrane unit 11, the first blowing hole 211 blows air toward the base layer 10, so that the corresponding dielectric membrane unit 11 moves toward the adsorption plate 12 and is adsorbed on the adsorption plate 12. Since the first blowing hole 211 is located at the center position of the dielectric membrane unit 11, the center position of the dielectric membrane unit 11 is first attached to the adsorption plate 12, and then transferred from the center position to the surroundings, so that the dielectric membrane unit 11 is flatly adsorbed on the adsorption plate 12 as a whole, avoiding the generation of bubbles and wrinkles after the dielectric membrane unit 11 and the adsorption plate 12 are adsorbed.

[0035] See also Figures 1 to 4 In some embodiments, the stripping surface 213 is further provided with a second blowing hole 212, a plurality of the second blowing holes 212 are arranged at intervals, and each of the second blowing holes 212 is arranged circumferentially around the center of the stripping surface 213. The first blowing hole 211 is arranged at intervals from the heat insulation cavity 201.

[0036] Optionally, the second blowing hole 212 is also connected to an external air source, and in the process of picking up a single dielectric membrane unit 11, the first blowing hole 211 blows air first, and then the second blowing holes 212 blow air, so that the center position of the dielectric membrane unit 11 is first adsorbed on the adsorption plate 12, and the edges of the dielectric membrane unit 11 are adhered to the adsorption plate 12 under the action of the second blowing holes 212.

[0037] See also Figures 1 to 4 In some embodiments, the aperture of the first blowing hole 211 is larger than the aperture of the second blowing hole 212, so that the center position of the dielectric membrane unit 11 can be blown and adsorbed to the adsorption plate 12, and the second blowing hole 212 can make other positions of the dielectric membrane unit 11 adsorbed to the adsorption plate 12.

[0038] Optionally, a second blowing hole 212 is provided at the bottom of the heat insulation cavity 201 .

[0039] It is understandable that a vacuum adsorption hole may be provided on the adsorption plate 12 to adsorb the medium membrane unit 11 by using negative pressure.

[0040] Optionally, four adjusting members 300 are provided, and the four adjusting members 300 are respectively located at four right angles of the peeling plate 200 .

[0041] In some embodiments, the stripping base 400 is provided with an adjustment threaded hole 403, the adjustment member 300 includes a support screw and an adjustment nut 301 connected to the support screw, one end of the support screw 302 is screwed into the adjustment threaded hole 403, and the other end of the support screw 302 is rotatably connected to and supports the stripping plate 200, and the adjustment nut 301 is used to drive the support screw 302 to rotate so as to adjust the length of the support screw 302 between the stripping plate 200 and the stripping base 400.

[0042] See also Figures 1 to 4 It can be understood that the height of the stripping base 400 is fixed, but it can slide horizontally. By manually driving the adjusting nut 301 to rotate and driving the supporting screw 302 to rotate in the adjusting threaded hole 403, the length of the supporting screw 302 between the stripping plate 200 and the stripping base 400 can be changed, thereby adjusting the local height of the stripping plate 200, and then making the stripping surface 213 as a whole in a horizontal state, that is, the stripping surface 213 is parallel to the adsorption plate 12, which is conducive to the adsorption plate 12 to absorb the medium film unit 11 at the stripping surface 213.

[0043] See also Figures 1 to 4 In some embodiments, the stripping base 400 includes a base 401 relative to the stripping plate 200 and a positioning plate 402 located between the base 401 and the stripping plate 200, the positioning plate 402 is connected to the base 401, the adjusting threaded hole 403 is opened in the positioning plate 402, and one end of the support screw 302 passes through the adjusting threaded hole 403, the adjusting member 300 also includes a tube spring 303, the tube spring 303 is sleeved on and connected to one end of the support screw 302, and the tube spring 303 abuts against the edge of the adjusting threaded hole 403 and presses the positioning plate 402 toward the adsorption plate 12 to tighten the connection between the support screw 302 and the positioning plate 402, so that the support screw 302 stably supports the stripping plate 200.

[0044] It can be understood that the upper end of the support screw 302 is rotatably disposed in the receiving hole of the stripping plate 200 and supports the stripping plate 200 by abutting against the edge of the receiving hole.

[0045] See also Figures 1 to 4 In some embodiments, the stripping plate 200 is provided with a guide surface 214 , and the base layer 10 at least partially adheres to the guide surface 214 along the conveying direction to guide the adsorption plate 12 to strip the dielectric film unit 11 .

[0046] See also Figures 1 to 4Optionally, the guide surface 214 is located on the side surface of the stripping plate 200 , and after the base layer 10 passes through the guide surface 214 , the horizontal transmission is switched to the vertical transmission, thereby facilitating the separation of the medium film unit 11 from the base layer 10 .

[0047] See also Figures 1 to 4 In some embodiments, the peeling structure 100 also includes a transfer plate 501 connected to the adsorption plate 12 and a guide roller 502 abutting the base layer 10, and two transfer plates 501 are arranged at intervals, and the two ends of the guide roller 502 are respectively rotatably connected to the two transfer plates 501, and the connection position of the transfer plate 501 to the adsorption plate 12 can be adjusted along the sliding direction of the peeling base 400.

[0048] It can be understood that the guide roller 502 presses the base layer 10 and makes the base layer 10 fit the guide surface 214, and by adjusting the position of the guide roller 502 in the horizontal direction, the tightness of the guide roller 502 pressing the base layer 10 can be adjusted, thereby adjusting the angle between the horizontal section 101 and the inclined section 102 of the base layer 10. For example, when the guide roller 502 moves away from the stripping plate 200, the angle increases, and when the guide roller 502 moves toward the stripping plate 200, the angle decreases. A suitable angle can improve the convenience of stripping the dielectric film unit 11 and adapt to different dielectric film units 11.

[0049] See also Figures 1 to 4 The utility model also proposes a ceramic capacitor processing device, which includes a stripping structure 100. The specific structure of the stripping structure 100 refers to the above embodiment. Since the ceramic capacitor processing device adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0050] In some embodiments, the ceramic capacitor processing equipment further includes a robot for moving the dielectric membrane unit 11 , and the robot includes the adsorption plate 12 .

[0051] The above are only optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A peeling structure, in cooperation with an adsorption plate, to peel off the dielectric film unit from the base layer, It is characterized in that The peeling structure includes: a peeling base slidingly arranged in a linear direction, a peeling plate arranged relative to the adsorption plate and having a peeling surface, and an adjusting member for adjusting the parallelism of the peeling surface relative to the adsorption plate, one end of the adjusting member is connected to the peeling base, and the other end of the adjusting member is connected to the peeling plate, the base layer is transported along a predetermined direction and passes through the peeling surface, the peeling surface is provided with an insulating cavity, and the base layer covers the insulating cavity, the adsorption plate moves toward the peeling surface and adsorbs the dielectric film unit, and the peeling base slides in a direction opposite to the transport direction so that the adsorption plate peels the dielectric film unit from the base layer.

2. The peeling structure according to claim 1, Features: A plurality of the heat insulation cavities are arranged at intervals.

3. The peeling structure according to claim 1, Features: A first air blowing hole is provided at the peeling surface, the first air blowing hole is located at the center of the peeling surface, and the first air blowing hole is spaced apart from the heat insulation cavity.

4. The peeling structure according to claim 3, Features: The peeling surface is also provided with a second air blowing hole, a plurality of the second air blowing holes are arranged at intervals, and each of the second air blowing holes is arranged circumferentially around the center position of the peeling surface.

5. The peeling structure according to claim 4, Features: The aperture of the first blowing hole is larger than the aperture of the second blowing hole.

6. The peeling structure according to any one of claims 1 to 5, Features: The stripping base is provided with an adjustment threaded hole, and the adjustment member includes a support screw and an adjustment nut connected to the support screw. One end of the support screw is screwed into the adjustment threaded hole, and the other end of the support screw is rotatably connected to and supports the stripping plate. The adjustment nut is used to drive the support screw to rotate so as to adjust the length of the support screw between the stripping plate and the stripping base.

7. The peeling structure according to claim 6, Features: The stripping base includes a base relative to the stripping plate and a positioning plate located between the base and the stripping plate, the positioning plate is connected to the base, the adjusting threaded hole is opened in the positioning plate, and one end of the supporting screw passes through the adjusting threaded hole, the adjusting member also includes a tube spring, the tube spring is sleeved on and connected to one end of the supporting screw, and the tube spring abuts against the edge of the adjusting threaded hole and presses the positioning plate toward the adsorption plate to tighten the connection between the supporting screw and the positioning plate.

8. The peeling structure according to claim 7, Features: The stripping plate is provided with a guide surface, and the base layer at least partially adheres to the guide surface along the conveying direction to guide the adsorption plate to strip the medium film unit.

9. The peeling structure according to any one of claims 1 to 5, Features: The peeling structure also includes an adapter plate connected to the adsorption plate and a guide roller abutting the base layer. Two adapter plates are arranged at intervals, and the two ends of the guide roller are respectively rotatably connected to the two adapter plates, and the connection position of the adapter plate to the adsorption plate can be adjusted along the sliding direction of the peeling base.

10. A ceramic capacitor processing device, It is characterized in that Comprising the peeling structure as described in any one of claims 1-9, the ceramic capacitor processing equipment also includes a manipulator for moving the dielectric film unit, and the manipulator includes the adsorption plate.

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