Transfer device and machining equipment

Abstract

The transfer device and the processing equipment disclosed by the utility model are used for transferring a wafer assembly, the wafer assembly comprises a wafer and a wafer frame, the wafer is connected with the wafer frame through an adhesive tape, the wafer frame is provided with a positioning surface, and the transfer device comprises a transmission part and a clamping part. Wherein the transmission part comprises a transmission support, two supporting parts and a guide part, the supporting parts are slidably arranged on the transmission support and can transport the wafer assembly to a designated position along the transmission support, the supporting parts are used for bearing the wafer assembly, and the guide part is arranged on the supporting parts and used for guiding the wafer assembly to move through sliding of the supporting parts. Therefore, the guiding part is gradually close to the positioning surface and is attached to the positioning surface, thereby realizing the guiding of the wafer assembly. The clamping part is used for taking the wafer assembly out of the wafer box and transferring the wafer assembly to the supporting part.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, and more specifically to a transfer device and processing equipment. Background Art

[0002] Semiconductor wafers need to be cut into individual semiconductor chips through a dicing process and then used in various electronic devices.

[0003] When cutting semiconductor wafers, in order to stably support thinner semiconductor wafers, it is necessary to stick the back of the semiconductor wafer to the central part of the adhesive surface of the adhesive tape, and at the same time stick a wafer frame to the outer periphery of the adhesive surface, so that the semiconductor wafer is integrated with the wafer frame through the adhesive tape. The semiconductor wafer integrated with the wafer frame is stored in a wafer box, and the wafer frame needs to be clamped by a transfer device to take it out of the wafer box and move it to a designated position, and finally transported to the chuck table by a suction plate. The semiconductor wafer on the chuck table is cut into individual semiconductor chips, and then after steps such as cleaning and removing cutting chips, it is stored in the wafer box through the transfer device. When processing semiconductor wafers, the semiconductor wafer must be integrated with the wafer frame through the adhesive tape to transport and hold the wafer frame.

[0004] However, since the initial posture of the wafer assembly composed of the semiconductor wafer taken out of the wafer box by the transfer device and the wafer frame is inconsistent, the placement posture of the wafer assembly adsorbed and transferred to the chuck table by the suction plate is also different, which will affect the cutting process of the semiconductor wafer. The existing technology generally adjusts the posture of the semiconductor wafer by rotating and moving the suction plate, and this adjustment scheme is relatively complicated.

[0005] Therefore, how to achieve wafer alignment during the transportation of wafer assemblies has become a technical problem that needs to be urgently solved by those skilled in the art. Utility Model Content

[0006] In view of this, an object of the present invention is to provide a transfer device to achieve wafer alignment during the transfer of wafer assemblies.

[0007] Another object of the utility model is to provide a processing equipment including the above-mentioned transfer device.

[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0009] A transfer device is used to transfer a wafer assembly, wherein the wafer assembly includes a wafer and a wafer frame, wherein the wafer is connected to the wafer frame via an adhesive tape, and a positioning surface is provided on the wafer frame, and includes a transfer component, wherein the transfer component includes:

[0010] Transmission bracket;

[0011] The supporting part is a component slidably disposed on both sides of the transmission bracket, and is used to support the wafer assembly;

[0012] The guiding part is arranged on the supporting part and is used for guiding the wafer frame by fitting with the positioning surface.

[0013] Optionally, in the above-mentioned transfer device, the guiding portion is a limit baffle plate arranged at one end of the support portion away from each other, and the side wall of the limit baffle plate is used to fit with the positioning surface.

[0014] Optionally, in the above-mentioned transfer device, the two limit baffles are inclined in a direction away from each other at one end away from the transfer bracket to form a guide port for the wafer to move to above the support portion.

[0015] Optionally, in the above-mentioned transfer device, a mounting groove is provided on the support portion, and the guiding portion includes:

[0016] A limit stopper is disposed in the mounting groove, with a first end exposed outside the mounting groove, and is used to fit with the positioning surface;

[0017] An elastic member is disposed in the installation groove and abuts against the limit stopper, and the elastic member is arranged along the sliding direction of the support portion.

[0018] Optionally, in the above-mentioned transfer device, the installation groove is a stepped groove including a first groove body and a second groove body, the first groove body is located at the open end of the installation groove, and the size of the first groove body is larger than the size of the second groove body;

[0019] The first end of the limit stopper is exposed from the first slot body, and the second end is arranged in the second slot body. The elastic member is arranged in the first slot body, and there are two of them, which are respectively located at the two ends of the limit stopper.

[0020] Optionally, in the above-mentioned transfer device, the limit stopper is provided with a positioning groove for the end of the elastic member to be embedded; and / or,

[0021] A positioning groove for the end of the elastic member to be embedded is provided on the side wall of the installation groove.

[0022] Optionally, in the above-mentioned transfer device, the guiding portion further comprises a mounting seat, and the mounting seat is provided with an assembly groove;

[0023] The limit stopper and the elastic member are both arranged in the assembly groove, and the mounting seat is used to be arranged in the mounting groove.

[0024] Optionally, in the above-mentioned transfer device, a disassembly opening for a disassembly tool to pass through is formed through the bottom of the installation groove.

[0025] Optionally, in the above-mentioned transfer device, along the extension direction of the support part, the guiding part is one or more parts arranged on the support part.

[0026] Optionally, in the above-mentioned transfer device, when the support portion does not support the wafer assembly, each of the limit stops is on the same straight line or on a different straight line.

[0027] Optionally, the above-mentioned transfer device further includes a clamping component for transferring the wafer assembly from an initial position to the support portion.

[0028] A processing equipment comprises the above-mentioned transfer device.

[0029] The transfer device provided by the utility model is used for transferring wafer assemblies. The wafer assemblies include wafers and wafer frames. The wafers are connected to the wafer frames by adhesive tapes, and the wafer frames are provided with positioning surfaces. The transfer device includes a transmission component and a clamping component. The transmission component includes a transmission bracket, a support portion and a guiding portion. The support portion is two portions slidably arranged on the transmission bracket, and the wafer assembly can be transported to a designated position along the transmission bracket. The support portion is used for supporting the wafer assembly. The guiding portion is arranged on the support portion, and is used for gradually approaching the positioning surface and fitting with the positioning surface through the sliding of the support portion, thereby achieving the correction of the wafer assembly. The clamping component is used for taking the wafer assembly out of the wafer box and handing the wafer assembly over to the support portion.

[0030] When the wafer assembly is handed over to the transmission component, the support part 110 is supported on the bottom of the wafer assembly, and the guiding part 120 is not tightly attached to the side wall of the wafer. Then, the sliding of the support part 110 on the transmission bracket 100 drives the guiding part 120 to gradually approach the positioning surface of the wafer frame 200 until the guiding part 120 is attached to the positioning surface, thereby achieving the alignment and clamping of the wafer assembly. After the transmission component transports the wafer assembly to the specified position in this state, the two support parts 110 move a certain distance away from each other, so that the guiding part 120 releases the clamping of the wafer assembly and completes the handover with the suction plate, so that the wafer assembly transferred to the chuck table has the same posture.

[0031] Compared with the prior art, the transfer device provided by the utility model has a simple and reliable structure, and can realize the guidance of the wafer assembly during the transfer process, thereby ensuring that the wafer assembly has the same posture when being adsorbed by the adsorption plate, thereby improving the degree of automation of the wafer processing equipment.

[0032] The processing equipment provided by the utility model includes the above-mentioned transfer device, so it also has the above-mentioned structure and beneficial effects, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 It is a schematic diagram of the structure of the transmission component disclosed in the embodiment of the utility model;

[0035] Figure 2 This is a schematic diagram of the internal structure of the transmission component disclosed in the embodiment of the utility model.

[0036] Wherein, 100 is a transmission bracket, 101 is a cylinder, 110 is a support part, 111 is a movable fork arm, and 120 is a guide part;

[0037] 200 is a wafer frame. DETAILED DESCRIPTION

[0038] The core of the utility model is to disclose a transfer device to realize the correction of wafers during the transfer process of wafer components.

[0039] Another object of the utility model is to provide a processing equipment including the above-mentioned transfer device.

[0040] The following is an explanation of the embodiments with reference to the accompanying drawings. In addition, the embodiments shown below do not limit the contents of the utility model described in the claims. In addition, the entire contents of the construction represented by the following embodiments are not limited to those necessary as solutions to the utility model described in the claims. It should be noted that, for ease of description, only the parts related to the relevant application are shown in the accompanying drawings. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other.

[0041] Combination Figure 1The transfer device disclosed in the embodiment of the utility model is used to transfer a wafer assembly. The wafer assembly includes a wafer and a wafer frame 200. The wafer is connected to the wafer frame 200 by an adhesive tape, and the wafer frame 200 is provided with a positioning surface. The transfer device includes a transmission component. The transmission component includes a transmission bracket 100, a support portion 110 and a guide portion 120. The support portion 110 is two slidably arranged on the transmission bracket 100, and the wafer assembly can be transported to a designated position along the transmission bracket 100. The support portion 110 is used to support the wafer assembly. The guide portion 120 is arranged on the support portion 110, and is used to make the guide portion 120 gradually approach the positioning surface and fit with the positioning surface through the sliding of the support portion 110, thereby realizing the correction of the wafer assembly.

[0042] When the wafer assembly is handed over to the transmission component, the support part 110 is supported on the bottom of the wafer assembly, and the guiding part 120 is not tightly attached to the side wall of the wafer. Then, the sliding of the support part 110 on the transmission bracket 100 drives the guiding part 120 to gradually approach the positioning surface of the wafer frame 200 until the guiding part 120 is attached to the positioning surface, thereby achieving the alignment and clamping of the wafer assembly. After the transmission component transports the wafer assembly to the specified position in this state, the two support parts 110 move a certain distance away from each other, so that the guiding part 120 releases the clamping of the wafer assembly and completes the handover with the suction plate, so that the wafer assembly transferred to the chuck table has the same posture.

[0043] Compared with the prior art, the transfer device disclosed in the embodiment of the utility model has a simple and reliable structure, and can realize the guidance of the wafer assembly during the transfer process, thereby ensuring that the wafer assembly has the same posture when being adsorbed by the adsorption plate, thereby improving the degree of automation of the wafer processing equipment.

[0044] In one embodiment, the transfer device further includes a clamping component, which is used to take the wafer assembly out of the wafer box and transfer the wafer assembly to the support portion 110 .

[0045] When the wafer assembly is taken out of the wafer box by the clamping component, the clamping component drives the wafer assembly to move to the starting position of the transmission component, and hands the wafer assembly to the transmission component, so that the support part 110 is supported on the bottom of the wafer assembly, and then the support part 110 slides on the transmission bracket 100 to drive the guiding part 120 to gradually approach the positioning surface of the wafer frame 200 until the guiding part 120 fits with the positioning surface to achieve the guidance and clamping of the wafer assembly. After the transmission component transports the wafer assembly to the specified position in this state, the two supporting parts 110 move a certain distance away from each other, so that the guiding part 120 releases the clamping of the wafer assembly and completes the handover with the suction plate, so that the wafer assembly transferred to the chuck table has the same posture.

[0046] When the wafer assembly is cut, the transfer component can receive the wafer assembly transferred by the suction plate again, transfer it back to the starting position, and then transfer it to the wafer box for storage by the clamping component.

[0047] It should be noted that the transfer device disclosed in the embodiment of the utility model can make the wafer assembly have the same posture when it is adsorbed by the adsorption plate, and its specific position on the chuck table can be controlled by the adsorption plate driving the wafer assembly to move.

[0048] In a specific embodiment disclosed in the present utility model, the guiding portion 120 is a limit baffle plate arranged at one end of the support portion 110 away from each other. During the guiding process, the side wall of the limit baffle plate gradually fits with the positioning surface of the wafer frame 200, wherein the two limit baffle plates are symmetrically arranged relative to the center lines of the two support portions 110.

[0049] The support part 110 is a long plate-like structure, and one end of the support part 110 is slidably disposed on the transmission bracket 100 through a movable fork arm 111, and the movable fork arm 111 is driven by a cylinder 101. The width of the support part 110 can be designed according to actual needs, for example, it can only support the operating length of the wafer frame 200 to reduce the weight of the structure.

[0050] Combination Figure 1 In order to facilitate the handover of the wafer between the clamping component and the transmission component, the two limit baffles are tilted away from each other at one end of the transmission bracket 100 to form a guide port for the wafer to move to the top of the support part 110. The clamping component can drive the wafer to move to the top of the support part 110 through the guide port. After the handover is completed, the clamping component is withdrawn from between the two support parts 110 through the guide port.

[0051] Combination Figure 2 The limit baffle and the support part 110 form an L-shaped strip structure. The end of the limit baffle away from the transmission bracket 100 expands in a direction away from each other to form a guide structure for the clamping component to transfer the wafer assembly from this position to the top of the support part 110; the end of the limit baffle close to the transmission bracket 100 expands in a direction away from each other to avoid the connection structure between the support part 110 and the movable arm 111.

[0052] When the transmission component is waiting to receive the wafer assembly at the starting position, the limit baffles on the two support parts 110 are spaced apart by a first distance, and the two support parts 110 are spaced apart by a second distance. The first distance is greater than the width of the wafer assembly (the distance between the two positioning surfaces of the wafer frame 200), and the second distance is less than the width of the wafer assembly. When the clamping component releases the wafer assembly at the handover position, the wafer assembly automatically falls onto the support part 110 of the transmission component. At this time, the wafer assembly has no contact with the limit baffle. Then the two support parts 110 are controlled to slide in a direction approaching each other, or one of them slides toward the other, until the two limit baffles are in contact with the positioning surface to guide the wafer assembly.

[0053] Combination Figure 2 The two positioning surfaces of the wafer frame 200 are parallel, and the two supporting parts 110 are also arranged in parallel and vertically relative to the transmission bracket 100 (the sliding direction of the supporting parts 110).

[0054] In another specific embodiment disclosed in the present utility model, a mounting groove is provided on the support portion 110, and the mounting groove is arranged along the extension direction of the transmission bracket 100, and the guide portion 120 includes a limit stopper and an elastic member. The limit stopper is arranged in the mounting groove, and the first end is exposed in the mounting groove, and is used to abut and fit with the positioning surface of the wafer frame 200. The elastic member is also arranged in the mounting groove, and the elastic member is arranged along the sliding direction of the support portion 110, and abuts against the limit stopper, and is used to push the limit stopper to the side of the support portion 110 for supporting the wafer frame 200.

[0055] During the process of guiding the wafer assembly, the limit stops are pushed away from each other by the wafer assembly.

[0056] Among them, the elastic part can be a thrust spring, and the number can be one or two. When there is one, the elastic part is located at the end of the limit block away from the wafer assembly. When there are two, the elastic parts are arranged on both sides of the mounting groove. The setting of the elastic part makes the limit block slidable in the mounting groove, and in the process of the two support parts 110 approaching, the limit block gradually increases the guiding force acting on the wafer assembly through the elastic part, providing a certain fault tolerance for the mutual approach of the support parts 110, thereby avoiding the wafer assembly being excessively squeezed by the guiding part 120 during the correction process to cause deformation or damage.

[0057] Furthermore, the mounting groove is a stepped groove including a first groove body and a second groove body, the first groove body is located at the open end of the mounting groove, and the size of the first groove body is larger than the size of the second groove body. The first end of the limit stopper is exposed in the first groove body, and the second end is arranged in the second groove body. The elastic member is arranged in the first groove body, and there are two of them, and they are respectively located at the two ends of the limit stopper along the sliding direction of the support portion 110.

[0058] The second groove body can limit the extreme position of the sliding of the limit stopper, and the first groove body provides an installation space for the elastic member.

[0059] In order to facilitate the installation of the limit stopper and the elastic member, a positioning groove for the end of the elastic member to be embedded is provided on the limit stopper.

[0060] In order to facilitate the installation of the support portion 110 and the elastic member, a positioning groove for the elastic end to be embedded is provided on the side wall of the installation groove.

[0061] When the positioning groove is replaced with an outwardly protruding positioning column structure, it can also play a role in positioning and installing the elastic member. Compared with the positioning solution of the positioning column, the positioning groove solution is easier to install.

[0062] In order to facilitate the installation of the guiding part 120 and the supporting part 110, the guiding part 120 also includes a mounting seat, which is provided with an assembly groove, and the limit stopper and the elastic member are both arranged in the mounting groove. The mounting seat is used to be arranged in the mounting groove.

[0063] That is, the above-mentioned positioning grooves or positioning column structures are correspondingly arranged on the mounting seat or the assembly groove is a stepped groove structure, so that the guiding part 120 becomes a separate elastic limiting unit through the mounting seat. According to actual installation requirements, the elastic limiting unit can be selectively assembled into the mounting groove of the support part 110, and the installation position can be conveniently changed.

[0064] In order to facilitate the disassembly of the elastic limiting unit and the mounting groove, a disassembly opening for a disassembly tool to pass through is provided at the bottom of the mounting groove. The disassembly tool may be a push rod, which can push the mounting seat out of the mounting groove after passing through the disassembly opening, thereby realizing the disassembly of the elastic limiting unit and the support part 110.

[0065] When the mounting groove is a stepped groove, the mounting seat can be configured as a corresponding stepped structure to facilitate positioning and installation with the mounting groove.

[0066] The elastic limiting unit mentioned above may be one or more units disposed on the support portion 110 along the extension direction of the support portion 110 .

[0067] When there are a plurality of elastic limiting units disposed on the support portion 110 along the extension direction of the support portion 110 , and when the support portion 110 does not support a wafer assembly, each limiting stopper may be located on the same straight line or on different straight lines.

[0068] When the limit blocks on the same support portion 110 are not on the same straight line in the initial state, the elastic limit unit can achieve hierarchical correction of the wafer assembly during the correction process.

[0069] It should be noted that the structures of the guiding parts 120 corresponding to the two supporting parts 110 of the transmission component can be the same or different. For example, a combination of a limit baffle and an elastic limit unit can be used to meet the requirements of the error tolerance of the guiding process and reduce the difficulty of assembly.

[0070] The clamping component disclosed in the embodiment of the utility model is provided with a clamping claw for clamping the wafer frame 200, and its specific structure is the prior art and will not be described in detail here.

[0071] After clamping the wafer assembly, the clamping component can be transferred to the top of the transmission component, and then the clamping claws are released to allow the wafer assembly to automatically fall onto the support portion 110. After the transmission component transfers the cut wafer assembly to the handover position, the clamping component can clamp the wafer assembly.

[0072] The processing equipment disclosed in the embodiment of the utility model includes the above-mentioned transfer device, so it also has the above-mentioned structure and beneficial effects, which will not be repeated here.

[0073] The terms "first" and "second" and the like in the specification and claims of the utility model are used to distinguish different objects, rather than to describe a specific order, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not set to the listed steps or units, but may include steps or units that are not listed. In addition, in the description of the embodiments of the present application, "multiple" refers to two or more than two.

[0074] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A transfer device for transferring a wafer assembly, wherein the wafer assembly comprises a wafer and a wafer frame (200), wherein the wafer is connected to the wafer frame (200) via an adhesive tape, and a positioning surface is provided on the wafer frame (200), wherein: A transmission component is included, wherein the transmission component includes: Transmission support (100); The supporting part (110) is a component slidably disposed on both sides of the transmission bracket (100) and is used to support the wafer assembly; The guiding part (120) is arranged on the supporting part (110) and is used for guiding the wafer frame (200) by fitting with the positioning surface.

2. The transfer device according to claim 1, characterized in that: The guiding portion (120) is a limit baffle plate arranged at one end of the supporting portion (110) that is away from each other, and the side wall of the limit baffle plate is used to fit with the positioning surface.

3. The transfer device according to claim 2, characterized in that: The ends of the two limit baffles away from the transmission support (100) are inclined in directions away from each other to form a guide opening for the wafer to move to above the support portion (110).

4. The transfer device according to claim 1, characterized in that: The support portion (110) is provided with a mounting groove, and the guiding portion (120) comprises: A limit stopper is disposed in the mounting groove, with a first end exposed outside the mounting groove, and is used to fit with the positioning surface; An elastic member is arranged in the installation groove and abuts against the limit stopper, and the elastic member is arranged along the sliding direction of the support portion (110).

5. The transfer device according to claim 4, characterized in that: The mounting groove is a stepped groove including a first groove body and a second groove body, the first groove body is located at an open end of the mounting groove, and the size of the first groove body is larger than the size of the second groove body; The first end of the limit stopper is exposed from the first slot body, and the second end is arranged in the second slot body. The elastic member is arranged in the first slot body, and there are two of them, which are respectively located at the two ends of the limit stopper.

6. The transfer device according to claim 4, characterized in that: The limit stopper is provided with a positioning groove for the end of the elastic member to be embedded; and / or, A positioning groove for the end of the elastic member to be embedded is provided on the side wall of the installation groove.

7. The transfer device according to claim 4, characterized in that: The guiding part (120) also includes a mounting seat, and a mounting groove is formed on the mounting seat; The limit stopper and the elastic member are both arranged in the assembly groove, and the mounting seat is used to be arranged in the mounting groove.

8. The transfer device according to claim 7, characterized in that: The bottom of the installation groove is penetrated by a disassembly opening for a disassembly tool to pass through.

9. The transfer device according to claim 4, characterized in that: Along the extension direction of the support portion (110), the guiding portion (120) is one or more portions arranged on the support portion (110); and / or, When the support portion (110) does not support the wafer assembly, each of the limit blocks is located on the same straight line or on a different straight line.

10. The transfer device according to any one of claims 1 to 9, characterized in that: It also includes a clamping component for transferring the wafer assembly from an initial position to the supporting portion (110).

11. A processing equipment, characterized in that: Comprising a transfer device as described in any one of claims 1-10.

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