Liquid cooling integrated board assembly

Abstract

The utility model provides a slave control cooling integrated board assembly in a novel battery management system, which comprises a shell, a PCB (printed circuit board), heat-conducting glue and a cooling integrated board, the PCB, the shell and the cooling integrated board are fixed together by the shell through buckle connection, and the whole is fixed with a vehicle body through a base. The heating device on the PCB is directly connected with the cooling integrated board through the heat-conducting glue, so that the distance between the electronic device and the liquid cooling board is shortened, the thermal resistance is further reduced, and meanwhile, the structure of the liquid cooling system is simplified. Therefore, when the system starts current equalization, heat generated by a heating device can be rapidly taken away, so that an electronic device always works in a normal temperature range, and the equalization capability of the system is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electric vehicles, in particular to a liquid cooling integrated board component for slave control in a battery management system. Background Art

[0002] During the use of electric vehicles, the charging and discharging of each battery is unbalanced due to differences in internal resistance, capacity, etc. The battery management system balances the batteries with inconsistent voltages to achieve the purpose of extending battery life and improving charging and discharging efficiency. The balancing between batteries is mainly that the high-voltage battery discharges through the line and consumes the excess energy by means of resistance heating. The size of the balancing current is the key factor in measuring the balancing ability. The larger the balancing current, the stronger the balancing ability. Since electronic devices such as resistors have limited tolerance to temperature, the higher the temperature, the higher the failure rate. Therefore, in order to increase the size of the balancing current, it is often necessary to conduct the heat generated by the balancing current through a liquid cooling plate so that the electronic devices on the PCB work within the normal temperature range. However, the liquid cooling method often has a more complex structure, resulting in an increase in the number of components. At the same time, the length of the heat conduction path also has a greater impact on the cooling effect. The longer the heat conduction path and the greater the thermal resistance, the worse the balancing ability. Utility Model Content

[0003] In order to overcome the above-mentioned technical defects, the purpose of the utility model is to provide a cooling integrated board assembly for a slave control in a new battery management system, integrating the slave control radiator and the liquid cooling plate into one, and the shell is assembled and fixed with the positioning structure of the integrated board by snaps and positioning columns. By reducing the distance and the number of components between the electronic heating device on the slave control PCB and the liquid cooling plate, the thermal resistance between the heating device and the liquid cooling plate is reduced, thereby improving the balancing ability between batteries.

[0004] The utility model discloses a liquid-cooled integrated board component, comprising: a shell, a PCB board, a heat-conducting adhesive, and a cooling integrated board. The cooling integrated board is a double-layer plate-like structure, a closed interlayer is arranged in the middle of the double-sided plate-like structure as a cooling liquid flow channel, a liquid inlet and a liquid outlet are respectively arranged on the closed interlayer extending along the length direction of the integrated board to the two ends of the integrated board, the integrated board has a width L1, the closed interlayer has a width L2, wherein L1 is greater than L2, and a plurality of openings are arranged on the side of the integrated board and avoiding the width range of the interlayer; the shell is used to accommodate the PCB board, two positioning structures are arranged in the shell, a plurality of snap structures are arranged on the upper shell of the shell, a support is arranged between the snap structures, the length of the support is L3, the upper shell of the shell has a height L4, wherein L3 is less than L4, and the heat-conducting adhesive is arranged between the PCB board and the cooling integrated board.

[0005] Further, the integrated board is a U-shaped double-layer structure, which includes a first rectangular structure, a first curved section, a second rectangular structure, and a third rectangular structure, a second curved section and a fourth rectangular structure; the first rectangular structure, the first curved section, and the second rectangular structure are connected end to end in sequence to form an outer layer; the third rectangular structure, the second curved section and the fourth rectangular structure are connected end to end in sequence to form an inner layer;

[0006] Furthermore, a closed interlayer is provided between the inner layer and the outer layer to serve as a liquid cooling channel, and the interlayer has two extended parts extending and protruding along the U-shaped structure, and the extended parts are triangular in shape, and a liquid inlet and a liquid outlet are respectively provided at the ends of the two extended parts;

[0007] Furthermore, the shell is a rectangular parallelepiped structure;

[0008] Further, the positioning structure is arranged at a diagonal position inside the housing;

[0009] Furthermore, the housing is a plastic housing;

[0010] Furthermore, positioning openings are respectively provided at each diagonal portion of the first rectangular structure, the second rectangular structure, the third rectangular structure and the fourth rectangular structure and avoiding the width of the interlayer, for fixing the positioning structure in the shell;

[0011] Furthermore, the shell is divided into a plurality of electronic device placement areas, the electronic device placement areas correspond to and match the corresponding electronic devices on the PCB board, insulating spacers are arranged between adjacent electronic device placement areas, and a plurality of openings are arranged on the lower peripheral shell of the shell for accommodating the connector on the PCB board;

[0012] Furthermore, a fixing base is provided at one end of the integrated board for fixing to the vehicle body.

[0013] Compared with the prior art, the above technical solution has the following beneficial effects:

[0014] 1) There is only thermal conductive glue between the electronic heating device and the liquid cooling plate, which reduces the thermal resistance between the heating device and the liquid cooling plate, and can achieve the effect of rapid cooling, thereby improving the balancing ability between batteries, thereby achieving the purpose of improving battery performance;

[0015] 2) By integrating the radiator with the liquid cooling plate, the number of BMS control and cooling system parts is reduced, the structure is simple, the amount of thermal conductive glue used is reduced, and the cost of the liquid cooling system is reduced;

[0016] 3) The cooling integrated board has positioning holes for positioning the PCB and the plastic shell and a positioning structure for snap-fitting with the plastic shell. The positioning holes are located on both sides of the liquid cooling channel. There is a base at the bottom of the liquid cooling board to fix the slave control and liquid cooling system to the vehicle body.

[0017] 4) The orientation of the slave control and liquid cooling plate in the battery pack can be flexibly adjusted to facilitate docking with the battery liquid cooling system;

[0018] 5) There is no need to design a separate slave-controlled liquid cooling plate in the battery pack, and the slave-controlled liquid cooling system can be flexibly arranged in the battery pack. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1-Figure 4 A schematic diagram of a prior art slave controlled liquid cooling system;

[0020] Figure 5 It is a heat conduction path in the slave controlled liquid cooling system in the prior art;

[0021] Figure 6 It is an exploded view of the liquid cooling integrated plate assembly of the utility model;

[0022] Figure 7-Figure 9 A schematic diagram of a liquid cooling integrated board according to an embodiment of the present utility model;

[0023] Figure 10-11 It is a schematic diagram of a plastic housing according to an embodiment of the present utility model;

[0024] Figure 12-Figure 15 This is a schematic diagram of the installation of the liquid cooling integrated board assembly of the utility model;

[0025] Fig.16 It is a heat conduction path in the slave controlled liquid cooling system of the utility model.

[0026] Reference numerals:

[0027] 1. Plastic shell; 2. PCB board; 3. Thermal conductive adhesive; 4. Liquid cooling integrated board; 11. Positioning structure; 12. Snap structure; 13. Support member; 14. Opening; 41. First rectangular structure 41; 42. First curved section; 43. Second rectangular structure; 44 Third rectangular structure; 45 Second curved section; 46 Fourth rectangular structure; 47 Liquid inlet; 48 Liquid outlet; 49 Fixed base; 50 Positioning opening. DETAILED DESCRIPTION

[0028] The advantages of the present invention are further described below in conjunction with the accompanying drawings and specific embodiments.

[0029] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0030] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0031] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0032] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In the description of the present utility model, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection of two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0034] In the following description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present invention, and they themselves have no specific meaning. Therefore, "module" and "component" can be used interchangeably.

[0035] See also Figure 1-Figure 4 The slave control liquid cooling system of the prior art has 4 slave controls in one battery pack. The slave control is composed of a plastic shell, a PCB, a thermal conductive adhesive and a heat sink. Figure 1 Based on the structure of the slave control, the slave control liquid cooling system usually consists of a slave control, thermal conductive glue and a bracket, and then connected to the liquid cooling plate in the battery pack through the thermal conductive glue 2. Its structure is as follows Figure 2 , 3 The plastic shell fixes the PCB, plastic shell and heat sink together through buckles. Thermal conductive glue is applied between the PCB and the heat sink. The heat conduction path is as follows: Figure 4 As shown. From the heat conduction path and the overall structure, it can be seen that the disadvantages of the slave control liquid cooling system are: 1) There are many parts (4) that need to be crossed from the heat-generating device to the liquid cooling plate, which increases the thermal resistance between the heat-generating device and the liquid cooling plate and makes the liquid cooling effect poor; 2) Due to the structural size of the bracket itself, the path for heat to be conducted from the bottom of the bracket to the top of the bracket is long, which further increases the thermal resistance between the heat-generating device and the liquid cooling plate and reduces the thermal conductivity; 3) In the entire heat conduction path, there is thermal conductive glue on both sides of each slave control radiator, and thermal conductive glue is also required between the bracket and the liquid cooling plate, which makes the amount of thermal conductive glue large, increases the assembly cost, and it takes a certain amount of time for the thermal conductive glue to solidify, resulting in reduced production efficiency; 4) There are grooves at both ends of the slave control plastic shell and PCB to provide space for fixing the slave control and the bracket, thereby increasing the overall size of the slave control plastic shell and PCB, making the size of the slave control larger; 5) The battery pack contains battery liquid cooling and slave control liquid cooling. Since the slave control liquid cooling needs to match the battery liquid cooling, the structural design of the slave control liquid cooling plate has certain limitations. See Figure 5 It is a heat conduction path in the slave controlled liquid cooling system in the prior art.

[0036] See also Figure 6 It is an exploded view of the liquid cooling integrated board assembly of the utility model, wherein the liquid cooling integrated board assembly comprises a plastic shell 1, a PCB board 2, a thermal conductive adhesive 3 and a liquid cooling integrated board 4, wherein the plastic shell 1 and the PCB board 2 constitute a slave control.

[0037] See also Figure 7-Figure 8The present invention is a schematic diagram of an embodiment of a liquid-cooled integrated plate in a liquid-cooled integrated plate assembly of the utility model, wherein the integrated plate 4 has an overall structure of a U-shape, and the U-shaped structure includes a first rectangular structure 41, a first curved section 42, a second rectangular structure 43, and a third rectangular structure 44, a second curved section 45 and a fourth rectangular structure 46. The first rectangular structure 41, the first curved section 42, and the second rectangular structure 43 are connected end to end in sequence to form an outer layer; the third rectangular structure 44, the second curved section 45 and the fourth rectangular structure 46 are connected end to end in sequence to form an inner layer, and a closed interlayer is provided between the inner layer and the outer layer as a liquid cooling channel, and a liquid inlet 47 and a liquid outlet 48 are respectively provided at opposite ends of the curved end of the U-shaped structure. In the present embodiment, the liquid inlet 47 and the liquid outlet 48 are extended portions of the interlayer extending and protruding along the U-shaped structure, and the extended portion is triangular, and a liquid inlet and a liquid outlet are respectively provided at its ends. The U-shaped integrated board has a width L1, and the closed interlayer has a width L2, wherein L1 is greater than L2. The specific width of the interlayer is as follows: Fig. 9 A fixed base 49 is provided at the lower end of the integrated board to be fixed to the vehicle body, and a positioning opening 50 is provided at each diagonal of the first rectangular structure 41, the second rectangular structure 43, the third rectangular structure 44 and the fourth rectangular structure 46 for installing the PCB board 2.

[0038] See also Figure 10-11 It is a schematic diagram of the plastic shell 1 in the liquid-cooled integrated board assembly of the utility model. The plastic shell 1 is a rectangular parallelepiped structure as a whole, which matches the rectangular structure shape in the U-shaped integrated board structure. Two positioning structures 11 are arranged at opposite corners in the plastic shell 1, which are used to position the plastic shell on the positioning opening 50 of the rectangular structure of the U-shaped integrated board. A plurality of snap structures 12 are arranged on the upper shell of the plastic shell 1. In the present embodiment, three snaps 12 are arranged. Support members 13 are arranged between the snap structures. The length of the support member is L3. The height of the upper shell of the plastic shell is L4, wherein L3 is less than L4. The inside of the plastic shell 1 is divided into a plurality of electronic device placement areas, which correspond to the corresponding electronic devices. Insulating spacers are arranged between adjacent electronic device placement areas. A plurality of openings 14 are arranged on the lower shell of the plastic shell 1 for accommodating connectors on a PCB board.

[0039] See also Figure 12-Figure 15This is a schematic diagram of the installation of the liquid-cooled integrated board assembly of the utility model. One side of the PCB board with electronic devices is accommodated in the plastic shell, and together with the plastic shell, it constitutes a slave control 1. The other side of the PCB board is in close contact with one side of the thermal conductive adhesive, and the other side of the thermal conductive adhesive is in close contact with the first rectangular structure of the integrated board. When the plastic shell is installed on the first rectangular structure of the integrated board, the buckle on the upper shell of the plastic shell is engaged with the upper side of the first rectangular structure, and the positioning structure 11 is positioned in the positioning opening 50 of the first rectangular structure 41 of the integrated board (see Fig.14 ), the support member 13 abuts against the integrated board 4 and forms a support area at the abutment (see Fig.11 ), taking slave control board 1 as an example, the buckle and support area on the plastic shell cooperate with the first rectangular structure of the integrated board to realize the positioning of the PCB board in the Y direction; the positioning structure on the plastic shell cooperates with the positioning port on the first rectangular structure to realize the positioning of the PCB board in the X and Z directions. Similarly, slave control 2 to slave control 4 can be installed on the second rectangular structure, the third rectangular structure and the fourth rectangular structure of the integrated board respectively, forming a structure as shown in FIG. Fig.15 Slave controlled liquid cooling system shown. Fig.16 It is the heat conduction path in the slave controlled liquid cooling system of the utility model.

[0040] The present application discloses a liquid cooling integrated panel assembly having the following characteristics:

[0041] 1) There is only thermal conductive glue between the electronic heating device and the liquid cooling plate, which reduces the thermal resistance between the heating device and the liquid cooling plate, and can achieve the effect of rapid cooling, thereby improving the balancing ability between batteries, thereby achieving the purpose of improving battery performance;

[0042] 2) By integrating the radiator with the liquid cooling plate, the number of BMS control and cooling system parts is reduced, the structure is simple, the amount of thermal conductive glue used is reduced, and the cost of the liquid cooling system is reduced;

[0043] 3) The cooling integrated board has positioning holes for positioning the PCB and the plastic shell and a positioning structure for snap-fitting with the plastic shell. The positioning holes are located on both sides of the liquid cooling channel. There is a base at the bottom of the liquid cooling board to fix the slave control and liquid cooling system to the vehicle body.

[0044] 4) The orientation of the slave control and liquid cooling plate in the battery pack can be flexibly adjusted to facilitate docking with the battery liquid cooling system;

[0045] 5) There is no need to design a separate slave-controlled liquid cooling plate in the battery pack, and the slave-controlled liquid cooling system can be flexibly arranged in the battery pack.

[0046] It should be noted that the embodiments of the present invention have better practicability and do not impose any form of limitation on the present invention. Any technician familiar with the field may use the technical content disclosed above to change or modify it into an equivalent effective embodiment. However, any modifications or equivalent changes and modifications made to the above embodiments without departing from the technical essence of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A liquid cooling integrated panel assembly, characterized in that: include: A shell, a PCB board, a thermally conductive adhesive, and a cooling integrated board. The cooling integrated board is a double-layer plate-like structure. A closed interlayer is arranged in the middle of the double-sided plate-like structure to serve as a coolant flow channel. A liquid inlet and a liquid outlet are arranged on the closed interlayer extending along the length direction of the integrated board to both ends of the integrated board, respectively. The integrated board has a width L1, and the closed interlayer has a width L2, wherein L1 is greater than L2. A plurality of openings are arranged on the side of the integrated board and avoid the width range of the interlayer. The shell is used to accommodate the PCB board. Two positioning structures are arranged in the shell. A plurality of snap structures are arranged on the upper shell of the shell. A support is arranged between the snap structures. The length of the support is L3. The height of the upper shell of the shell is L4, wherein L3 is less than L4. The thermally conductive adhesive is arranged between the PCB board and the cooling integrated board.

2. The liquid cooling integrated panel assembly according to claim 1, characterized in that: The integrated board is a U-shaped double-layer structure, which includes a first rectangular structure, a first curved section, a second rectangular structure, and a third rectangular structure, a second curved section and a fourth rectangular structure; the first rectangular structure, the first curved section, and the second rectangular structure are connected end to end in sequence to form an outer layer; the third rectangular structure, the second curved section and the fourth rectangular structure are connected end to end in sequence to form an inner layer.

3. The liquid cooling integrated panel assembly according to claim 2, characterized in that: The closed interlayer between the inner layer and the outer layer has two extended parts extending and protruding along the U-shaped structure, the extended parts are triangular, and a liquid inlet and a liquid outlet are respectively arranged at the ends of the two extended parts.

4. The liquid cooling integrated panel assembly according to claim 1, characterized in that: The shell is a rectangular parallelepiped structure.

5. The liquid cooling integrated panel assembly according to claim 1, characterized in that: The positioning structure is arranged at opposite corners in the housing.

6. The liquid cooling integrated panel assembly according to claim 1, characterized in that: The shell is a plastic shell.

7. The liquid cooling integrated panel assembly according to claim 2, characterized in that: A positioning opening is respectively provided at each diagonal portion of the first rectangular structure, the second rectangular structure, the third rectangular structure and the fourth rectangular structure and avoiding the width of the interlayer, so as to fix the positioning structure in the shell.

8. The liquid cooling integrated panel assembly according to any one of claims 1 to 7, characterized in that: The shell is divided into a plurality of electronic device placement areas, and the electronic device placement areas correspond to and match the corresponding electronic devices on the PCB board. Insulating spacers are arranged between adjacent electronic device placement areas. A plurality of openings are arranged on the lower shell of the shell for accommodating the connector on the PCB board.

9. The liquid cooling integrated panel assembly according to any one of claims 1 to 7, characterized in that: A fixing base is arranged at one end of the integrated board for fixing to the vehicle body.

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