Heat dissipation structure of edge computing gateway

Abstract

The utility model provides an edge computing gateway heat dissipation structure, which comprises a gateway body, a front panel and a back plate, the front face of the gateway body is fixedly connected with the front panel, and the back of the gateway body is fixedly connected with the back plate. Compared with the prior art, the gateway has the advantages that the form of front air inlet and back air outlet is adopted, air flows through the interior of the gateway from front to back, meanwhile, the air inlets in the two sides assist in air inlet, the air circulation amount in the gateway is increased, heat in the gateway is effectively taken away, the bent cooling fin structure is designed, the two points of the cooling fin are connected with the heat conduction strips in a penetrating mode, and the heat dissipation efficiency is improved. The heat conduction strip can uniformly conduct heat of a heating element in the gateway to the radiating fins, the radiating area of a single radiating fin is large, when air flows through the radiating fins, heat at the radiating fins can be quickly taken away, the support supports the heat conduction strip, and the fan plays a role in quickly circulating air in the gateway. The gateway has efficient heat dissipation performance, heat is not easy to accumulate in the gateway, and the service life is effectively ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of gateways, in particular to a heat dissipation structure of an edge computing gateway. Background Art

[0002] Computing gateways, especially edge computing gateways, are advanced network devices that perform data processing, analysis, and communication with other devices at the edge of the network. IoT devices are connected to the gateway through different communication protocols. The gateway collects device data and processes and stores it locally. The gateway can send data to the cloud platform for further analysis and processing, or directly respond to control instructions from the device. The gateway can also perform some local intelligent computing tasks, such as data filtering, preprocessing, and edge reasoning.

[0003] Since the edge computing gateway in the prior art has multiple types of ports, such as USB ports, network ports and serial ports, it is connected to multiple devices and multiple IoT sensors when working, and the parallel computing pressure required to be performed simultaneously is high. Its CPU and memory are always in a high load state. Relying solely on the fan heat dissipation of the existing gateway itself cannot meet the heat dissipation requirements of the gateway in the prior art. Therefore, a new edge computing gateway heat dissipation structure is proposed to solve the above problems. Utility Model Content

[0004] The purpose of the present invention is to solve at least one of the above technical deficiencies.

[0005] To this end, one purpose of the present invention is to propose an edge computing gateway heat dissipation structure to solve the problems mentioned in the background technology and overcome the deficiencies in the prior art.

[0006] In order to achieve the above-mentioned object, an embodiment of one aspect of the utility model provides an edge computing gateway heat dissipation structure, including a gateway body, a front panel, and a back panel, wherein the front of the gateway body is fixedly connected to the front panel, and the back of the gateway body is fixedly connected to the back panel;

[0007] The front panel is integrated with a USB port, a serial port and a switch; the back panel is integrated with a serial port, an Ethernet port and a power port;

[0008] A connector is fixedly connected to the edge of the front face of the front panel, an air inlet is provided on the front panel and a filter is fixedly connected to the air inlet;

[0009] Air inlets are provided on both sides of the gateway body;

[0010] The back plate is provided with an air outlet;

[0011] A plurality of heat sinks are fixedly connected to the bottom of the inner side of the gateway body, and the heat sinks are bent;

[0012] A heat-conducting strip is inserted through the heat sink, and the heat-conducting strip is bent. A bracket is fixedly connected to the bottom of the inner side of the gateway body, and the top of the bracket abuts the heat-conducting strip. A plurality of fans are fixedly connected to the bottom of the inner side of the gateway body, and the fans are located behind the heat sink.

[0013] Preferably, in any of the above schemes, the front panel is connected to the gateway body via screws, and the back panel is connected to the gateway body via screws.

[0014] Adopting the above technical solution: the device is divided into two parts, one is the gateway body part, which is composed of the gateway body, front panel, back panel and connector;

[0015] The second is the heat dissipation mechanism of the gateway, which consists of an air inlet, a filter, an air inlet, an air outlet, a heat sink, a thermal strip, a bracket and a fan.

[0016] Preferably, any of the above solutions is that there are a plurality of USB ports and serial ports on the front panel, and a plurality of indicator lights are provided on the front panel.

[0017] Adopting the above technical solution: This edge computing gateway connects the IoT device with the cloud server and is responsible for data collection, processing and forwarding. Its internal components mainly include processors, memory, storage, etc. These hardware devices provide the gateway with the necessary computing power, storage space and operating environment. It also includes an embedded operating system: the gateway's software system, which is responsible for managing and scheduling hardware resources to achieve data collection, processing and storage. The operating system usually supports multiple communication protocols and interfaces to meet the needs of different devices and scenarios. Network interface: used to connect IoT devices and cloud servers to achieve data transmission. The network interface has a variety of communication protocols and interface types to meet the needs of different devices and scenarios.

[0018] The structures inside the gateway that generate a lot of heat include the processor, memory, and power module. The copper thermal strips are connected to the surfaces of these structures to conduct away the heat they generate.

[0019] Preferably, any of the above schemes is that a plurality of serial ports and network ports are provided on the back panel, and the filter is made of plastic.

[0020] Adopting the above technical scheme: the core structure of this device is: air inlet, filter, air inlet, air outlet, heat sink, thermal strip, bracket, fan. The core advantages of this device are: this gateway is designed with an efficient heat dissipation structure, using the air inlet of the front panel of the gateway body to take in air, and the air outlet of the back panel to discharge air, that is, the front air inlet and the back air outlet, the air flows through the inside of the gateway from front to back, at the same time, the air inlets on both sides assist in the air intake, increase the air circulation inside the gateway, and effectively take away the heat inside the gateway. At the same time, a bent heat sink structure is designed, and the two points of the heat sink are connected with the thermal strip, which can evenly conduct the heat of the heating element inside the gateway to the heat sink. The heat dissipation area of ​​a single heat sink is large, and when the air flows between the heat sinks, it can quickly take away the heat here. The bracket supports the thermal strip, and the function of the fan is to make the air circulate quickly inside the gateway. Such a structural design can make this gateway have efficient heat dissipation performance, and it is not easy to accumulate heat inside, which effectively guarantees the service life.

[0021] Preferably, in any of the above schemes, the air outlet is located behind the fan, and the vertical cross-section of the heat sink is V-shaped.

[0022] Preferably, any of the above schemes is that the heat sink is made of aluminum alloy, there are two connection points between the thermal conductive strip and the single heat sink, and the thermal conductive strip is made of copper.

[0023] Preferably, any of the above solutions is that the heat conductive strip is connected to the components inside the gateway body, and the air outlet end of the fan faces the air outlet.

[0024] The above technical solution is adopted: the filter is designed to filter the air entering the gateway and filter out dust.

[0025] Compared with the prior art, the advantages and beneficial effects of the utility model are:

[0026] The heat dissipation structure of the edge computing gateway is designed with an efficient heat dissipation structure through the coordinated arrangement of air inlet strips, filters, air inlets, air outlets, heat sinks, thermal strips, brackets, and fans. The gateway adopts the form of air inlet strips on the front panel of the gateway body and air outlets on the back panel, that is, air inlet from the front and air outlet from the back. The air flows through the inside of the gateway from front to back. At the same time, the air inlets on both sides assist in air intake, increase the air circulation inside the gateway, and effectively take away the heat inside the gateway. At the same time, a bent heat sink structure is designed. The two points of the heat sink are connected with thermal strips. The thermal strips can evenly conduct the heat of the heating elements inside the gateway to the heat sink. The heat dissipation area of ​​a single heat sink is large. When air flows between the heat sinks, the heat here can be quickly taken away. The bracket supports the thermal strips. The function of the fan is to quickly circulate air inside the gateway. Such a structural design can make the gateway have efficient heat dissipation performance, and it is not easy to accumulate heat inside, which effectively guarantees the service life.

[0027] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0029] Figure 1 It is a structural schematic diagram of the utility model from the first perspective;

[0030] Figure 2 It is a structural schematic diagram of the utility model from a second viewing angle;

[0031] Figure 3 It is a partial structural schematic diagram of the fan of the utility model;

[0032] Figure 4 It is a schematic diagram of the local structure of the heat sink of the utility model.

[0033] In the figure: 1-gateway body, 2-front panel, 3-back panel, 4-USB port, 5-serial port, 6-switch, 7-network port, 8-connector, 9-air inlet, 10-filter, 11-air inlet, 12-air outlet, 13-heat sink, 14-thermal strip, 15-bracket, 16-fan. DETAILED DESCRIPTION

[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] like Figure 1-4 As shown, the heat dissipation structure of the edge computing gateway includes a gateway body 1, a front panel 2, and a back panel 3. The front of the gateway body 1 is fixedly connected to the front panel 2, and the back of the gateway body 1 is fixedly connected to the back panel 3;

[0037] The front panel 2 is integrated with a USB port 4, a serial port 5 and a switch 6; the back panel 3 is integrated with a serial port 5, a network port 7 and a power port;

[0038] A connector 8 is fixedly connected to the edge of the front face of the front panel 2, an air inlet 9 is provided on the front panel 2, and a filter 10 is fixedly connected to the air inlet 9;

[0039] Air inlets 11 are provided on both sides of the gateway body 1;

[0040] An air outlet 12 is provided on the back plate 3;

[0041] A plurality of heat sinks 13 are fixedly connected to the bottom of the inner side of the gateway body 1, and the heat sinks 13 are bent;

[0042] A heat conducting strip 14 is inserted into the heat sink 13 , and the heat conducting strip 14 is bent. A bracket 15 is fixedly connected to the bottom of the inner side of the gateway body 1 , and the top of the bracket 15 abuts against the heat conducting strip 14 . A plurality of fans 16 are fixedly connected to the bottom of the inner side of the gateway body 1 , and the fans 16 are located behind the heat sink 13 .

[0043] Embodiment 1: The front panel 2 is connected to the gateway body 1 by screws, and the back panel 3 is connected to the gateway body 1 by screws. This device is divided into two parts, one is the gateway body 1 part, which is composed of the gateway body 1, the front panel 2, the back panel 3, and the connector 8;

[0044] The second is the heat dissipation mechanism of the gateway, which is composed of an air inlet 9, a filter 10, an air inlet 11, an air outlet 12, a heat sink 13, a heat conducting strip 14, a bracket 15 and a fan 16.

[0045] Embodiment 2: There are several USB ports 4 and serial ports 5 on the front panel 2, and several indicator lights are provided on the front panel 2. The structures that generate a lot of heat inside the gateway include: processor, memory, power module, and the copper thermal conductive strip 14 is connected to the surface of these structures to conduct away the heat generated. There are several serial ports 5 and network ports 7 on the back panel 3, and the filter 10 is made of plastic. The air outlet 12 is located behind the fan 16, and the vertical cross-section of the heat sink 13 is V-shaped. The heat sink 13 is made of aluminum alloy, and there are two connection points between the thermal conductive strip 14 and the single heat sink 13, and the material of the thermal conductive strip 14 is copper. The thermal conductive strip 14 is connected to the components inside the gateway body 1, and the air outlet end of the fan 16 faces the air outlet 12. The design of the filter 10 filters the air entering the gateway and removes dust.

[0046] The working principle of the utility model is as follows:

[0047] This edge computing gateway connects IoT devices with cloud servers and is responsible for data collection, processing and forwarding. It mainly includes processors, memory, storage, etc. These hardware devices provide the gateway with the necessary computing power, storage space and operating environment. It also includes an embedded operating system: the gateway's software system, which is responsible for managing and scheduling hardware resources to achieve data collection, processing and storage. The operating system usually supports multiple communication protocols and interfaces to meet the needs of different devices and scenarios. Network interface: used to connect IoT devices and cloud servers to achieve data transmission. The network interface has a variety of communication protocols and interface types to meet the needs of different devices and scenarios.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] The heat dissipation structure of the edge computing gateway is designed with an efficient heat dissipation structure through the coordinated arrangement of the air inlet 9, the filter 10, the air inlet 11, the air outlet 12, the heat sink 13, the heat conductive strip 14, the bracket 15, and the fan 16. The air inlet 9 of the front panel 2 of the gateway body 1 is used for air intake, and the air outlet 12 of the back panel 3 is used for air discharge, that is, the air inlets are in front and the air outlets are in back. The air flows through the inside of the gateway from front to back. At the same time, the air inlets 11 on both sides assist the air intake, increase the air circulation inside the gateway, and effectively take away the inside of the gateway. At the same time, a bent heat sink 13 structure is designed. Two points of the heat sink 13 are connected with a heat conducting strip 14. The heat conducting strip 14 can evenly conduct the heat of the heating element inside the gateway to the heat sink 13. The heat dissipation area of ​​the single heat sink 13 is large. When the air flows between the heat sinks 13, the heat here can be quickly taken away. The bracket 15 supports the heat conducting strip 14. The function of the fan 16 is to make the air circulate quickly inside the gateway. Such a structural design can make the gateway have efficient heat dissipation performance, it is not easy to accumulate heat inside, and effectively ensure the service life.

Claims

1. An edge computing gateway heat dissipation structure, characterized in that: It comprises a gateway body (1), a front panel (2), and a back panel (3), wherein the front of the gateway body (1) is fixedly connected to the front panel (2), and the back of the gateway body (1) is fixedly connected to the back panel (3); The front panel (2) is integrated with a USB port (4), a serial port (5) and a switch (6); the back panel (3) is integrated with a serial port (5), a network port (7) and a power port; A joint (8) is fixedly connected to the edge of the front face of the front panel (2); an air inlet strip (9) is provided on the front panel (2) and a filter screen (10) is fixedly connected to the air inlet strip (9); Air inlets (11) are provided on both sides of the gateway body (1); The back plate (3) is provided with an air outlet (12); A plurality of heat sinks (13) are fixedly connected to the bottom of the inner side of the gateway body (1), and the heat sinks (13) are bent; a heat conducting strip (14) is inserted into the heat sink (13), and the heat conducting strip (14) is bent; a bracket (15) is fixedly connected to the bottom of the inner side of the gateway body (1), and the top of the bracket (15) abuts against the heat conducting strip (14); and a plurality of fans (16) are fixedly connected to the bottom of the inner side of the gateway body (1), and the fans (16) are located behind the heat sink (13).

2. The edge computing gateway heat dissipation structure according to claim 1, characterized in that: The front panel (2) is connected to the gateway body (1) via screws, and the back panel (3) is connected to the gateway body (1) via screws.

3. The edge computing gateway heat dissipation structure according to claim 2, characterized in that: The front panel (2) is provided with a plurality of USB ports (4) and serial ports (5), and the front panel (2) is provided with a plurality of indicator lights.

4. The edge computing gateway heat dissipation structure according to claim 3, characterized in that: A plurality of serial ports (5) and network ports (7) are provided on the back panel (3), and the filter screen (10) is made of plastic.

5. The edge computing gateway heat dissipation structure according to claim 4, characterized in that: The air outlet (12) is located behind the fan (16), and the vertical cross-section of the heat sink (13) is V-shaped.

6. The edge computing gateway heat dissipation structure according to claim 5, characterized in that: The heat sink (13) is made of aluminum alloy, the heat conducting strip (14) has two connection points with the single heat sink (13), and the heat conducting strip (14) is made of copper.

7. The edge computing gateway heat dissipation structure according to claim 6, characterized in that: The heat conducting strip (14) is connected to components inside the gateway body (1), and the air outlet end of the fan (16) faces the air outlet (12).

Images