Electronic component and electronic equipment

Abstract

The utility model discloses an electronic component and electronic equipment, and belongs to the technical field of power electronics. The electronic assembly comprises a substrate, a power device, a first supporting column and a driving board, wherein the substrate comprises a first surface and a second surface which are arranged oppositely; the power device is mounted on the first surface of the substrate; the first supporting column is connected with the base plate, the first supporting column comprises a first extending part, and the first extending part extends from the first surface to the driving plate; the driving plate is located on one side, deviating from the substrate, of the power device and the first extension part, a pin of the power device penetrates through the driving plate from a first through hole formed in the driving plate, the pin and the driving plate are welded together, and meanwhile the driving plate is fixedly connected with the first extension part; when the electronic assembly is prepared, the driving board is fixedly connected with the first extension part, and then the pins and the driving board are welded. According to the invention, the first supporting columns are arranged on the substrate, so that the power device and the substrate can be protected, and the product yield is ensured.

Description

Technical Field

[0001] The present application relates to the field of power electronics technology, and in particular, to an electronic component and an electronic device. Background Art

[0002] With the rapid development of energy storage and new energy vehicle business, the demand for power devices as core devices for energy conversion and transmission is growing more and more. However, the technicians of this application found that the IGBT single tube and substrate are easily damaged during the assembly process, resulting in low product yield. Utility Model Content

[0003] The main technical problem solved by the present application is to provide an electronic component and an electronic device, which can protect power devices and ensure product yield by installing a first support column on the first surface of a substrate.

[0004] In order to solve the above technical problems, a technical solution adopted in the present application is: an electronic component is provided, including a substrate, a power device, a first support column and a driving board, the substrate including a first surface and a second surface arranged opposite to each other; the power device is installed on the first surface of the substrate; the first support column is connected to the substrate, the first support column includes a first extension portion, and the first extension portion extends from the first surface toward the driving board; the driving board is located on the side of the power device and the first extension portion away from the substrate, the pin of the power device passes through the driving board from the first through hole provided on the driving board, and the pin is welded to the driving board, and the driving board is fixedly connected to the first extension portion; wherein, when preparing the electronic component, the driving board is first fixedly connected to the first extension portion, and then the pin is welded to the driving board.

[0005] Furthermore, the driving plate is provided with a first locking hole, and the electronic component further comprises a first locking member, which is inserted into the first extension portion from the first locking hole to fix the driving plate and the first extension portion.

[0006] Furthermore, there are a plurality of power devices, a plurality of first support columns, and the plurality of first support columns are arranged at intervals around the plurality of power devices.

[0007] Furthermore, the power device includes a device body and a pin, the device body is mounted on the first surface, one end of the pin is connected to the device body, and the other end is bent and extended in a direction away from the device body to form a second extension portion; wherein, in a direction perpendicular to the substrate, the height of the second extension portion is greater than the height of the device body.

[0008] Furthermore, an extending direction of the second extending portion is perpendicular to a surface of the device body, and / or the second extending portion is in a bow-shaped K-shaped structure.

[0009] Furthermore, the substrate is provided with a second locking hole, and the electronic component further includes a second locking piece, which is used to fix the substrate and the welding tooling / heat sink through the second locking hole; wherein, the drive board is provided with a second through hole, and the orthographic projection of the second through hole on the substrate covers the second locking hole.

[0010] Furthermore, the strength of the second locking member connecting the base plate and the welding fixture is greater than the strength of the first locking member connecting the driving plate and the first supporting column.

[0011] Furthermore, the diameter of the second locking hole is greater than the diameter of the first locking hole.

[0012] Furthermore, the substrate is provided with a third through hole, the first support column is passed through the third through hole and fixedly connected to the substrate, and the electronic component also includes a fastener, which is passed through the third through hole, passes through the substrate from the second surface and connects to the heat sink.

[0013] Furthermore, the substrate material includes at least one of copper, iron, aluminum and gold.

[0014] The present application also includes a second technical solution, an electronic device, the electronic device includes the above-mentioned electronic components and a heat sink; wherein the heat sink is located on the side of the substrate away from the driving board, and the substrate is fixedly mounted on the heat sink.

[0015] Furthermore, the electronic device further comprises a second support column, which is mounted on the surface of the heat sink facing the electronic component and is located between the heat sink and the driving board, wherein the driving board is fixedly connected to the second support column.

[0016] Furthermore, the driving plate is provided with a third locking hole, and the electronic device further comprises a third locking member, which is inserted into the second supporting column from the third locking hole to fix the driving plate to the second supporting column.

[0017] Furthermore, a connection hole is provided on the end surface of the heat sink facing away from the driving plate to connect with a fastener penetrating through the first support column.

[0018] Beneficial effects: Different from the prior art, the electronic assembly includes a substrate, a power device, a first support column, and a driving board. The substrate includes a first surface and a second surface that are arranged opposite to each other. The power device is installed on the first surface of the substrate. The first support column is installed on the first surface of the substrate. The driving board is located on the side of the power device and the first support column away from the substrate. The pins of the power device pass through the driving board from the first through hole provided on the driving board, and the pins are welded together with the driving board, and the driving board is fixedly connected with the first support column. By setting and installing the first support column on the substrate, and when preparing the electronic assembly, first fixing the driving board with the first extension part, and then welding the pins with the driving board, the first support column is used to resist the force during the assembly process, which can protect the power device and the substrate, thereby ensuring the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0020] Figure 1 It is a schematic diagram of the structure of a substrate and a power device in an embodiment of an electronic component of the present application;

[0021] Figure 2 is a schematic diagram of the structure of an electronic component during assembly in one embodiment of the present application;

[0022] Figure 3 It is a schematic diagram of an exploded structure in an embodiment of an electronic device of the present application;

[0023] Figure 4 is a schematic cross-sectional structure diagram of another embodiment of the electronic device of the present application;

[0024] Figure 5 1 is a schematic diagram of the structure of a substrate and a power device in another embodiment of the electronic component of the present application. DETAILED DESCRIPTION

[0025] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of the present application.

[0026] The term "multiple" in this application means at least two, such as two, three, etc., unless otherwise clearly and specifically limited. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. Mentioning "embodiment" in this article means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0027] See also Figure 1 as well as Figure 2 In one embodiment of the present application, the electronic component 100 includes a substrate 110, a power device 120, a first support column 130 and a driving board 140. The substrate 110 includes a first surface 111 and a second surface 112 that are arranged opposite to each other; the power device 120 is mounted on the first surface 111 of the substrate 110; the first support column 130 is connected to the substrate 110, and the first support column 130 includes a first extension portion 131, and the first extension portion 131 extends from the first surface 111 to the driving board 140. Extension; the driving board 140 is located on the side of the power device 120 and the first extension portion 131 away from the substrate 110, the pin 121 of the power device 120 passes through the driving board 140 from the first through hole 141 provided on the driving board 140, and the pin 121 is welded to the driving board 140, and the driving board 140 is fixedly connected to the first extension portion 131; when preparing the electronic component 100, the driving board 140 is first fixedly connected to the first extension portion 131, and then the pin 121 is welded to the driving board 140.

[0028] Specifically, the substrate 110 plays a role in supporting the device and conducting heat in the electronic component 100. The material of the substrate 110 may include at least one metal material selected from copper, iron, aluminum, and gold. The metal substrate 110 has good thermal conductivity and mechanical processing properties. It should be noted that the present application does not limit the specific material of the substrate 110. For example, in other embodiments, the material of the substrate 110 may also be an insulating material. The structure of the substrate 110 is a sandwich structure, which is composed of an upper and lower metal substrate and an insulating layer in the middle, wherein the upper layer is used for conduction, the middle insulating layer can ensure good electrical insulation performance, and the lower layer plays a role in conducting heat.

[0029] The power device 120 is the core of power conversion and circuit control in the electronic device, and the power device 120 can be a diode, a thyristor, a MOSFET (metal oxide semiconductor field effect transistor) or an IGBT (insulated gate bipolar transistor), etc. The power device 120 can be mounted on the first surface 111 of the substrate 110 by bonding, clamping or chip reflow.

[0030] The material of the first support column can be a metal material, or other materials such as plastic, resin, etc., and the present application does not limit its material. In one embodiment, the first support column 130 can be installed on the substrate 110 by riveting, and fixing the first support column 130 by riveting is fast and simple to install. In other embodiments, the first support column 130 can also be installed on the substrate 110 by through-hole reflow soldering. Fixing the first support column 130 by through-hole reflow soldering can reduce production costs and shorten production cycles. Alternatively, the first support column 130 can also be installed on the substrate 110 by patch reflow.

[0031] The driving board 140 is integrated with a circuit, and the first through hole 141 provided on the driving board 140 may be a plated hole, and the pin 121 of the power device 120 is welded to the driving board 140 through the first through hole 141, so that the power device 120 can transmit signals with the circuit on the driving board 140. The pin 121 and the driving board 140 can be welded together by wave soldering, spot welding, hand soldering, etc., so that the power device 120 and the driving board 140 are electrically interconnected.

[0032] During assembly, the power device 120 may be first mounted on the first surface 111 of the substrate 110, and then the first support column 130 may be fixed on the substrate 110, and then the first extension portion 131 of the first support column 130 may be connected to the driving board 140 before the pin 121 of the power device 120 is welded together with the driving board 140. Since the first support column 130 is mounted on the first surface 111 of the substrate 110, when the driving board 140 and the pin 121 of the power device 120 are welded together, the first support column 130 may resist the force of the driving board 140 on the power device 120, thereby protecting the power device 120 and the substrate 110, thereby ensuring the product yield.

[0033] In one embodiment of the present application, Figure 2 The driving plate 140 is provided with a first locking hole 142 , and the electronic component 100 further includes a first locking member 143 . The first locking member 143 is inserted into the first extension portion 131 from the first locking hole 142 to fix the driving plate 140 and the first extension portion 131 together.

[0034] Specifically, the first extension portion 131 is provided with an insertion hole 133 corresponding to the first locking hole 142. During assembly, the first locking member 143 is inserted into the insertion hole 133 of the first extension portion 131 through the first locking hole 142, thereby locking the drive plate 140 and the first support column 130 to ensure the firmness of the connection between the drive plate 140 and the base plate 110.

[0035] The first locking hole 142 may be a threaded through hole or a through hole without threads, and the insertion hole 133 provided on the first support column 130 may be a blind hole with threads. The first locking member 143 may be a bolt, a rivet, etc., which is not limited here.

[0036] It should be noted that, in other embodiments, the first locking member 143 may not be used to lock the driving plate 140 and the first supporting column 130 .

[0037] In one embodiment of the present application, continue to refer to Figure 1 as well as Figure 2 , there are multiple power devices 120, there are multiple first support columns 130, and multiple first support columns 130 are arranged at intervals on the periphery of the multiple power devices 120. Specifically, the number of the first support columns 130 is multiple, which can disperse the pressure of the driving plate 140 on the substrate 110, thereby further improving the protection effect. At the same time, the multiple first support columns 130 are arranged at intervals on the periphery of the multiple power devices 120, which can protect the multiple power devices 120 at the same time.

[0038] In one embodiment, if Figure 1 As shown, the number of the first support columns 130 is four, and the four first support columns 130 are arranged at the four corners of the substrate 110. Of course, in other embodiments, the number of the first support columns 130 can also be other, such as two, three or more, which is not limited here.

[0039] In one embodiment, if Figure 1 As shown, the first support column 130 is in the shape of a cylinder. Of course, in other embodiments, the first support column 130 may also be in the shape of a cuboid or other structures.

[0040] In one embodiment, the plurality of first support pillars 130 may also be arranged at equal intervals around the plurality of power devices 120 .

[0041] Meanwhile, in other implementations, the plurality of first supporting columns 130 may also be distributed between the plurality of power devices 120 .

[0042] In summary, the present application does not impose too many restrictions on the number, location and shape of the first support pillars 130 .

[0043] In one embodiment of the present application, refer to Figure 1 and Figure 2The power device 120 includes a device body 122 and a pin 121. The device body 122 is mounted on the first surface 111. One end of the pin 121 is connected to the device body 122, and the other end is bent and extended in a direction away from the device body 122 to form a second extension portion 1211; wherein, in a direction perpendicular to the substrate 110, the height of the second extension portion 1211 is greater than the height of the device body 122.

[0044] Specifically, the device body 122 is provided with various circuits inside, and is the core of the power device 120, and the pin 121 is used to realize the communication between the device body 122 and the outside world. Among them, the second extension part 1211 of the pin 121 is connected to the driving board 140, so that the driving board 140 is connected to the substrate 110 through the power device 120, and the first support column 130 is also connected to the driving board 140 and the substrate 110. The height of the first support column 130 is greater than the height of the device body 122, so that the device body 122 does not bear the pressure between the driving board 140 and the substrate 110, effectively protecting the device body 122 and improving the product yield.

[0045] It should be noted that, in other embodiments, in a direction perpendicular to the substrate 110 , the height of the first support column 130 may also be equal to the height of the device body 122 .

[0046] In one embodiment of the present application, refer to Figure 1 The extending direction of the second extension portion 1211 is perpendicular to the surface of the device body 122 , and the second extension portion 1211 is in a bow-shaped K-shaped structure.

[0047] Specifically, the extension direction of the second extension portion 1211 is perpendicular to the device body 122, which is conducive to automated production, and can quickly and accurately complete welding, thereby improving production efficiency. The K-type structure can release stress and protect the device body 122 and the substrate 110.

[0048] Of course, in other embodiments, the extension direction of the second extension portion 1211 may not be perpendicular to the surface of the device body 122 depending on the component type and circuit design requirements. At the same time, the second extension portion 1211 may also be a plug-in structure. In short, the present application does not limit the structure of the second extension portion 1211.

[0049] In one embodiment of the present application, refer to Figures 1 to 3 The substrate 110 is provided with a second locking hole 113, and the electronic component 100 also includes a second locking piece 114, which is used to fix the substrate 110 and the welding tool 150 or the heat sink 160 through the second locking hole 113; wherein the driving plate 140 is provided with a second through hole 144, and the orthographic projection of the second through hole 144 on the substrate 110 covers the second locking hole 113.

[0050] Specifically, during assembly, first insert the second extension 1211 of the power device 120 on the substrate 110 into the first through hole 141, then insert the second locking member 114 into the second locking hole 113, lock the substrate 110 and the welding fixture 150, then insert the first locking member 143 through the first locking hole 142 set on the driving plate 140 into the first support column 130 to lock the driving plate 140 and the substrate 110, then weld the pin 121 of the power device 120 to the driving plate 140, at this time, because the orthographic projection of the second through hole 144 on the substrate 110 covers the second locking hole 113, the second locking member 114 is exposed in the second through hole 144, so the second locking member 114 can be removed through the second through hole 144, and then the substrate 110 is separated from the welding fixture 150, and the assembly of the electronic component 100 is completed. If you want to fix the electronic component 100 to other devices later, such as Figure 3 On the heat sink 160 in the substrate 110, the second locking member 114 is passed through the second through hole 144 in sequence, so that the substrate 110 and the heat sink 160 are locked.

[0051] In one embodiment of the present application, the strength of the second locking member 114 connecting the substrate 110 and the welding fixture 150 is greater than the strength of the first locking member 143 connecting the driving plate 140 and the first supporting column 130. Specifically, it can be seen from the above assembly process that the substrate 110 and the welding fixture 150 are first connected through the second locking hole 113 and the second locking member 114, and then the first locking member 143 is inserted into the first supporting column 130 through the first locking hole 142 set on the driving plate 140 to connect the driving plate 140 and the substrate 110. At this time, since the strength of the second locking member 114 connecting the substrate 110 and the welding fixture 150 is greater than the strength of the first locking member 143 connecting the driving plate 140 and the first supporting column 130, when the first locking member 143 is used to lock the driving plate 140 and the substrate 110, the substrate 110 and the welding fixture 150 will not be separated, and the state between the substrate 110 and the welding fixture 150 is more stable.

[0052] In one embodiment of the present application, the diameter of the second locking hole 113 is greater than the diameter of the first locking hole 142. Specifically, the diameter of the second locking hole 113 is greater than the diameter of the first locking hole 142, so that the binding force between the second locking member 114 and the second locking hole 113 is greater than the binding force between the first locking member 143 and the first locking hole 142, thereby ensuring that the strength of the second locking member 114 connecting the substrate 110 and the welding fixture 150 is greater than the strength of the first locking member 143 connecting the driving plate 140 and the first supporting column 130. When the first locking member 143 connects the driving plate 140 and the first supporting column 130, the substrate 110 can also be connected to the welding fixture 150 in a flat manner.

[0053] In one embodiment, if Figure 4 and Figure 5 The substrate 110 is provided with a third through hole 115, the first support column 130 is passed through the third through hole 115 and is fixedly connected to the substrate 110, and the electronic component 100 further includes a fastener 180, which is passed through the third through hole 115, passes through the substrate 110 from the second surface 112 and is connected to the heat sink 160. The first support column 130 is directly connected to the heat sink 160, reducing the steps of connecting the substrate 110 and the heat sink 160.

[0054] In one embodiment, in addition to being fixedly connected via the second locking member 114 and the second locking hole 113, the connection between the substrate 110 and the heat sink 160 is also strengthened by the fastener 180 of the electronic component 100 passing through the third through hole 115, passing through the substrate 110 from the second surface 112 and connecting to the heat sink 160.

[0055] Of course, in other embodiments, the first support column 130 can be directly installed on the substrate 110, and the third through hole 115 is not provided on the substrate 110. The connection between the substrate 110 and the heat sink 160 is only fixed by the second locking member 114 and the second locking hole 113.

[0056] See also Figure 3 The electronic device 200 includes the above-mentioned electronic component 100 and a heat sink 160; wherein the heat sink 160 is located on the side of the substrate 110 away from the driving board 140, and the substrate 110 is fixedly mounted on the heat sink 160. Specifically, the heat sink 160 can be used to conduct and release the heat of the electronic component 100, reduce the overall temperature of the electronic device 200, and extend the service life of the electronic device 200. For details about the electronic component 100, please refer to the above-mentioned related content, which will not be repeated here.

[0057] In one embodiment of the present application, refer to Figure 3 The electronic device 200 further includes a second support column 170, which is mounted on the surface of the heat sink 160 facing the electronic component 100 and is located between the heat sink 160 and the driving board 140, wherein the driving board 140 is fixedly connected to the second support column 170. Specifically, the second support column 170 can also resist the force during the assembly process, thereby further protecting the power device 120 and the substrate 110 and ensuring the product yield.

[0058] The material, quantity and shape of the second support column 170 may be the same as those of the first support column 130 , and will not be described in detail herein.

[0059] In one embodiment of the present application, continue to refer to Figure 3The driving board 140 is provided with a third locking hole 145, and the electronic device 200 further includes a third locking member 146. The third locking member 146 is inserted into the second support column 170 from the third locking hole 145, and the driving board 140 is fixedly connected to the second support column 170. Specifically, the second support column 170 is provided with an insertion hole 134 corresponding to the third locking hole 145. During assembly, the third locking member 146 is inserted into the insertion hole 134 on the second support column 170 through the third locking hole 145, thereby locking the driving board 140 and the second support column 170, and ensuring the firmness of the connection between the driving board 140 and the heat sink 160.

[0060] The third locking hole 145 can be a threaded through hole or a through hole without threads, and the insertion hole 134 provided in the second support column 170 can be a blind hole with threads. The third locking member 146 can be a bolt, a rivet, etc., which is not limited here.

[0061] It should be noted that in other embodiments, the third locking member 146 may not be used to lock the driving plate 140 and the second supporting column 170 .

[0062] In the solution of the present application, after the substrate 110 and the driving board 140 are fixed by the first support column 130 on the substrate 110, the force between the substrate 110 and the power device 120 can be reduced to prevent the insulating layer of the substrate 110 from breaking, thereby eliminating the need to connect the substrate 110 and the heat sink 160 before the pin 121 is welded to the driving board 140, effectively ensuring the welding efficiency and welding quality of the pin 121 and the driving board 140, and before connecting the heat sink 160 to the substrate 110, non-destructive inspection can be performed using X-RAY to further confirm the quality of the welding between the pin 121 and the driving board 140, thereby ensuring the quality of the product.

[0063] Meanwhile, during the assembly process, the substrate 110 is first fixed on the welding fixture 150, and then the substrate 110 and the driving board 140 are fixed. The welding fixture 150 can effectively reduce the fixing error of the substrate 110 and the driving board 140, thereby improving the product yield.

[0064] In order to better understand the above scheme, combined with Figures 1 to 3 , the assembly process of the electronic device 200 is described in detail below:

[0065] In one embodiment, the specific steps of preparing the electronic device 200 include:

[0066] S10: installing the power device 120 and the first support column 130 on the substrate 110;

[0067] S11: Pass the pin 121 of the power device 120 through the driving board 140 from the first through hole 141 provided on the driving board 140;

[0068] S12: Connecting the base plate 110 and the welding tool 150 through the second locking hole 113 and the second locking member 114;

[0069] S13: Connecting the driving plate 140 and the base plate 110 by inserting the first locking member 143 through the first locking hole 142 provided on the driving plate 140 and into the first supporting column 130;

[0070] S14: welding the pin 121 of the power device 120 and the driving board 140 together;

[0071] S14: Remove the second locking member 114 and the welding tool 150;

[0072] S15: Connect the base plate 110 and the heat sink 160 through the second locking hole 113 and the second locking member 114 , and insert the third locking member 146 into the second supporting column 170 from the third locking hole 145 to fix the driving plate 140 to the second supporting column 170 .

[0073] In one embodiment of the present application, Figure 4 The end surface of the heat sink 160 facing away from the driving plate 140 is provided with a connecting hole 161 for connecting with the fastener 180 penetrating through the first supporting column 130 .

[0074] In other embodiments, the end surface of the heat sink 160 facing away from the driving board 140 may not be provided with the connection hole 161 .

[0075] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electronic component, characterized in that: include: A substrate, comprising a first surface and a second surface disposed opposite to each other; A power device mounted on the first surface of the substrate; A first support column and a driving plate, wherein the first support column is connected to the substrate, and the first support column comprises a first extension portion, and the first extension portion extends from the first surface toward the driving plate; The driving board is located on the side of the power device and the first extension portion facing away from the substrate, the pins of the power device pass through the driving board from the first through holes provided on the driving board, and the pins are welded to the driving board, and the driving board is fixedly connected to the first extension portion; wherein, when preparing the electronic component, the driving board is first fixedly connected to the first extension portion, and then the pins are welded to the driving board.

2. The electronic component according to claim 1, characterized in that The driving plate is provided with a first locking hole, and the electronic component further comprises: A first locking member is inserted into the first extension portion from the first locking hole to fix the driving plate and the first extension portion.

3. The electronic component according to claim 1, characterized in that There are a plurality of power devices, a plurality of first support columns, and the plurality of first support columns are arranged at intervals around the plurality of power devices.

4. The electronic component according to claim 1, characterized in that The power device comprises a device body and the pin, wherein the device body is mounted on the first surface, one end of the pin is connected to the device body, and the other end of the pin is bent and extended in a direction away from the device body to form a second extension portion; Wherein, in a direction perpendicular to the substrate, a height of the second extension portion is greater than a height of the device body.

5. The electronic component according to claim 4, characterized in that: The extending direction of the second extending portion is perpendicular to the surface of the device body, and / or the second extending portion is in a bow-shaped K-shaped structure.

6. The electronic component according to claim 2, characterized in that: The substrate is provided with a second locking hole, and the electronic component further comprises: A second locking member, the second locking member is used to fix the base plate and the welding tool / heat sink through the second locking hole; Wherein, the driving plate is provided with a second through hole, and the orthographic projection of the second through hole on the substrate covers the second locking hole.

7. The electronic component according to claim 6, characterized in that: The strength of the second locking member connecting the base plate and the welding fixture is greater than the strength of the first locking member connecting the driving plate and the first supporting column.

8. The electronic component according to claim 7, characterized in that: The diameter of the second locking hole is greater than the diameter of the first locking hole.

9. The electronic component according to claim 1, characterized in that: The substrate is provided with a third through hole, the first support column is passed through the third through hole and fixedly connected to the substrate, and the electronic component also includes a fastener, which is passed through the third through hole and passes through the substrate from the second surface and is connected to the heat sink.

10. The electronic component according to claim 1, characterized in that The substrate material includes at least one of copper, iron, aluminum and gold.

11. An electronic device, characterized in that: The electronic device comprises the electronic component according to any one of claims 1 to 9 and a heat sink; Wherein, the heat sink is located on a side of the substrate away from the driving board, and the substrate is fixedly mounted on the heat sink.

12. The electronic device according to claim 11, characterized in that: The electronic device further comprises: The second supporting column is installed on the surface of the radiator facing the electronic component and is located between the radiator and the driving board, wherein the driving board is fixedly connected to the second supporting column.

13. The electronic device according to claim 12, characterized in that: The driving plate is provided with a third locking hole, and the electronic device further comprises: A third locking member is inserted into the second supporting column from the third locking hole to fix the driving plate and the second supporting column.

14. The electronic device according to claim 11, characterized in that: The end surface of the heat sink facing away from the driving plate is provided with a connection hole for connecting with the fastener penetrating through the first supporting column.

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