Energy storage power supply

Abstract

The utility model discloses an energy storage power supply, which comprises a shell, a battery module, a circuit assembly, a heat dissipation cover and a heat conduction structure, and is characterized in that the shell is provided with a mounting cavity and a mounting opening, and the mounting opening is communicated with the mounting cavity; the battery module is arranged in the mounting cavity; the circuit assembly is arranged at the mounting opening; the heat dissipation cover covers the mounting opening and is provided with a heat dissipation plate opposite to the mounting opening, and a heat dissipation structure is arranged on the side, away from the circuit assembly, of the heat dissipation plate; and the heat conduction structure is arranged between the circuit assembly and the heat conduction plate, is in heat conduction connection with the heat dissipation plate, and is used for absorbing heat generated by the circuit assembly and performing heat exchange with the heat dissipation plate. The energy storage power supply provided by the technical scheme of the utility model can realize heat dissipation and improve the waterproof performance at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of power supply, in particular to an energy storage power supply. Background Art

[0002] During the use of energy storage power supplies, a large amount of heat will be generated, and a heat dissipation structure is usually set up. At present, in the air-cooling heat dissipation solution, the airflow inside the energy storage power supply is generally exchanged with the external airflow for heat dissipation. However, the heat dissipation method of the device is not convenient for use in outdoor environments. Even if the energy storage power supply is waterproofed, it is easy to cause water ingress failure in the energy storage power supply. Utility Model Content

[0003] The main purpose of the utility model is to provide an energy storage power supply, aiming to achieve heat dissipation while improving waterproof performance.

[0004] To achieve the above-mentioned purpose, the energy storage power supply proposed by the utility model comprises:

[0005] A housing, provided with a mounting cavity and a mounting opening, wherein the mounting opening is communicated with the mounting cavity;

[0006] A battery module is arranged in the installation cavity;

[0007] A circuit assembly is arranged at the installation opening;

[0008] a heat dissipation cover, covering the installation opening and having a heat dissipation plate opposite to the installation opening, wherein a heat dissipation structure is provided on a side of the heat dissipation plate away from the circuit assembly; and

[0009] The heat-conducting structure is arranged between the circuit assembly and the heat sink and is connected to the heat sink by thermal conduction. The heat-conducting structure is used to absorb the heat generated by the circuit assembly and perform heat exchange with the heat sink.

[0010] Optionally, the heat dissipation structure includes a plurality of heat dissipation ribs, and the plurality of heat dissipation ribs are all arranged on a side of the heat dissipation plate away from the circuit component, and a heat dissipation gap is formed between any two adjacent heat dissipation ribs.

[0011] Optionally, the heat dissipation structure also includes an annular frame arranged around the periphery of the heat conducting plate, and the plurality of heat dissipation ribs are located on the inner side of the annular frame, and the height of the annular frame relative to the surface of the heat conducting plate is greater than or equal to the height of the heat dissipation ribs.

[0012] Optionally, the heat dissipation cover further comprises an annular baffle arranged around the periphery of the heat dissipation plate, an end of the annular baffle away from the heat dissipation plate is correspondingly mounted at the mounting opening, and the circuit assembly is at least partially located in the space formed by the annular baffle and the heat dissipation plate.

[0013] Optionally, a plurality of grooves are provided on the outer side surface of the annular baffle, and the plurality of grooves are distributed at intervals along the circumference of the annular baffle.

[0014] Optionally, the circuit component includes a MOS tube, and the MOS tube is mounted on the heat-conducting structure and is thermally connected to the heat-conducting structure.

[0015] Optionally, the heat-conducting structure includes a heat-conducting block, which includes an integrally formed mounting plate and a heat-conducting plate, the mounting plate is vertically mounted on the surface of the heat-conducting plate, the MOS tube is thermally connected to the mounting plate, and the heat-conducting plate is attached to the surface of the heat sink with the back side facing away from the mounting plate.

[0016] Optionally, the heat-conducting structure includes at least two heat-conducting blocks, the two heat-conducting blocks are arranged at an interval from each other and are both thermally connected to the heat sink, and the circuit assembly also includes a transformer, which is arranged between the two heat-conducting blocks.

[0017] Optionally, a mounting structure is provided on a side of the energy storage power supply facing away from the heat dissipation cover, and the energy storage power supply is installed on the communication base station through the mounting structure to be used as a backup power supply.

[0018] Optionally, the heat dissipation cover is provided with a handle.

[0019] Optionally, the energy storage power supply further includes a back cover, and an assembly and disassembly port is provided at one end of the shell away from the installation port, and the back cover covers the assembly and disassembly port.

[0020] The energy storage power supply of the technical solution of the utility model is provided with an installation cavity and an installation opening in the shell, the installation opening and the installation cavity are connected, the battery module is installed in the installation cavity, the circuit assembly is installed at the installation opening, the heat dissipation cover is closed on the installation opening, and a heat sink having a heat dissipation plate opposite to the installation opening is provided, a heat dissipation structure is provided on the side of the heat sink away from the circuit assembly, and a heat conduction structure for absorbing the heat generated by the circuit assembly is provided between the circuit assembly and the heat conduction plate, and heat exchange is performed with the heat dissipation plate. In this way, when the energy storage power supply is in use, the heat generated by the circuit assembly can be conducted to the heat conduction structure, the heat conduction structure conducts the absorbed heat to the heat dissipation plate, and the heat dissipation plate can disperse the heat to the heat dissipation structure, so as to dissipate the heat of the heat dissipation structure and the heat dissipation plate through the external airflow. When heat dissipation is performed in this way, the airflow in the safety cavity does not need to be exchanged with the external airflow for heat dissipation, and the external airflow can be prevented from entering the installation cavity, thereby preventing the external water vapor, liquid, etc. from entering the closed inner cavity, thereby achieving heat dissipation while also improving the waterproofness of the power converter. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 This is a schematic diagram of the structure of an embodiment of the energy storage power supply of the utility model;

[0023] Figure 2 for Figure 1 Exploded diagram of the medium energy storage power supply;

[0024] Figure 3 for Figure 2 The enlarged view of point A in the middle;

[0025] Figure 4 for Figure 1 A cross-sectional view of the medium energy storage power supply;

[0026] Figure 5 for Figure 4 Enlarged view of point B in the middle.

[0027] Description of Figure Numbers:

[0028] 10. Shell; 11. Installation opening; 12. Installation cavity; 20. Battery module; 30. Circuit assembly; 31. MOS tube; 32. Transformer; 40. Heat dissipation cover; 41. Heat dissipation plate; 42. Heat dissipation structure; 421. Heat dissipation ribs; 422. Annular frame; 43. Annular baffle; 431. Groove; 50. Heat conduction structure; 51. Heat conduction block; 511. Installation plate; 512. Heat conduction plate; 52. Heat conduction medium; 53. Heat dissipation cover; 54. Insulation plate; 60. Handle; 80. Back cover

[0029] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0032] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or a solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0033] The utility model provides an energy storage power supply.

[0034] In the embodiment of the present utility model, Figures 1 to 5 As shown, the energy storage power supply includes a housing 10 , a battery module 20 , a circuit assembly 30 , a heat dissipation cover 40 and a heat conductive structure 50 .

[0035] The shell 10 is provided with an installation cavity 12 and an installation opening 11, and the installation opening 11 is communicated with the installation cavity 12; the battery module 20 is arranged in the installation cavity 12; the circuit assembly 30 is arranged at the installation opening 11; the heat dissipation cover 40 covers the installation opening 11, and has a heat dissipation plate 41 opposite to the installation opening 11, and the heat dissipation plate 41 is provided with a heat dissipation structure 42 on the side away from the circuit assembly 30; the heat conductive structure 50 is arranged between the circuit assembly 30 and the heat dissipation plate 41, and is thermally connected to the heat dissipation plate 41, and the heat conductive structure 50 is used to absorb the heat generated by the circuit assembly 30 and perform heat exchange with the heat dissipation plate 41.

[0036] Specifically, the heat generated by the circuit assembly 30 during operation can be absorbed by the heat-conducting structure 50, and the heat-conducting structure 50 conducts the absorbed heat to the heat sink 41, and the heat sink 41 can transmit the heat to the heat-dissipating structure 42, so that the heat-dissipating structure 42 and the heat-dissipating plate 41 are simultaneously dissipated by the external airflow. In some embodiments, the circuit assembly 30 is thermally connected to the heat-conducting structure 50, so that the heat generated by the circuit assembly 30 can be directly conducted to the heat-conducting structure 50, thereby improving the heat dissipation efficiency of the circuit assembly 30. Of course, in other embodiments, the heat-conducting structure 50 is spaced apart from the circuit assembly 30, and is used to absorb the heat generated by the circuit assembly 30 and then conduct it to the heat sink 41.

[0037] The heat-conducting structure 50 may directly contact the heat sink 41 for heat conduction, or may conduct heat conduction with the heat sink 41 through the heat-conducting medium 52 , and this application does not make any specific limitation on this.

[0038] The energy storage power supply of the present application is used to store electrical energy and supply power. It can act on outdoor communication base stations and can also be used as an energy storage battery indoors. When the energy storage power supply acts on outdoor communication base stations, it can be used as a backup power supply in the event of power outages or failures. When the power is normal, the communication base station can charge the energy storage power supply so that the energy storage power supply can provide electrical energy in the event of power outages or failures. Among them, the number of energy storage power supplies required to be set up in the communication base station can be set according to actual conditions, and this application does not make specific restrictions on this.

[0039] The energy storage power supply of the technical solution of the utility model is provided with an installation cavity 12 and an installation opening 11 in a shell 10, the installation opening 11 and the installation cavity 12 are connected, the battery module 20 is installed in the installation cavity 12, the circuit assembly 30 is installed at the installation opening 11, the heat dissipation cover 40 is covered on the installation opening 11, and a heat dissipation plate 41 opposite to the installation opening 11 is provided, a heat dissipation structure 42 is provided on the side of the heat dissipation plate 41 away from the circuit assembly 30, and a heat conductive structure 50 for absorbing the heat generated by the circuit assembly 30 is provided between the circuit assembly 30 and the heat conductive plate 512, and heat exchange is performed with the heat dissipation plate 41. In this way, when the energy storage power supply is in use, the heat generated by the circuit component 30 can be absorbed by the heat-conducting structure 50, and the heat-conducting structure 50 conducts the absorbed heat to the heat sink 41. The heat sink 41 can disperse the heat to the heat dissipation structure 42, so as to dissipate the heat of the heat dissipation structure 42 and the heat sink 41 through the external airflow. When heat is dissipated in this way, the airflow in the safety cavity does not need to be exchanged with the external airflow for heat dissipation, and the external airflow can be prevented from entering the installation cavity 12, thereby preventing external water vapor, liquid, etc. from entering the closed inner cavity, thereby achieving heat dissipation while also improving the waterproofness of the power converter.

[0040] In some embodiments, the heat dissipation structure 42 includes a plurality of heat dissipation ribs 421 . The plurality of heat dissipation ribs 421 are all disposed on a side of the heat dissipation plate 41 away from the circuit assembly 30 . A heat dissipation gap is formed between any two adjacent heat dissipation ribs 421 .

[0041] Specifically, the heat dissipation plate 41 can conduct the heat received from the heat-conducting structure 50 to the multiple heat dissipation ribs 421, so that the multiple heat dissipation ribs 421 are simultaneously cooled by the external airflow, thereby increasing the heat dissipation area, that is, improving the heat dissipation efficiency of the heat dissipation cover 40. Among them, the multiple heat dissipation ribs 421 include but are not limited to two, three, four or more. Of course, in other embodiments, the heat dissipation structure 42 can also be provided with only one heat dissipation rib 421.

[0042] The plurality of heat dissipation ribs 421 may be arranged in various ways. For example, in one embodiment, the plurality of heat dissipation ribs 421 are spaced apart along the width direction of the heat dissipation plate 41. In another embodiment, the plurality of heat dissipation ribs 421 are spaced apart along the length direction of the heat dissipation plate 41.

[0043] In some embodiments, the heat dissipation structure 42 also includes an annular frame 422 arranged around the periphery of the heat conducting plate 512, and multiple heat dissipation ribs 421 are located on the inner side of the annular frame 422, and the height of the annular frame 422 relative to the surface of the heat conducting plate 512 is greater than or equal to the height of the heat dissipation ribs 421.

[0044] Specifically, due to the structural requirements of heat dissipation, the heat dissipation rib 421 is set to a thinner sheet, and the heat dissipation rib 421 of the sheet structure has a low strength and is easily deformed or damaged after a collision. The annular frame 422 at the periphery of the heat conducting plate 512 is thicker than the heat dissipation rib 421, and the heat dissipation rib 421 is set in the annular frame 422 to provide protection for the heat dissipation rib 421 through the annular frame 422 to prevent the heat dissipation rib 421 from being deformed or damaged during a collision. Among them, when the height of the annular frame 422 relative to the surface of the heat conducting plate 512 is greater than the height of the heat dissipation rib 421, the top surface of the annular frame 422 is higher than the top surface of the heat dissipation rib 421. When the height of the annular frame 422 relative to the surface of the heat conducting plate 512 is equal to the height of the heat dissipation rib 421, the top surface of the annular frame 422 is flush with the top surface of the heat dissipation rib 421. Of course, in other embodiments, the heat dissipation structure 42 may not be provided with an annular frame 422.

[0045] In some embodiments, the heat dissipation cover 40 also includes an annular baffle 43 arranged around the periphery of the heat dissipation plate 41, and one end of the annular baffle 43 away from the heat dissipation plate 41 is correspondingly installed at the installation opening 11, and the circuit component 30 is at least partially located in the space formed by the annular baffle 43 and the heat dissipation plate 41.

[0046] Specifically, the annular baffle 43 is disposed on the side of the heat sink 41 away from the heat dissipation structure 42. When a part of the circuit assembly 30 is located inside the annular baffle 43, the other part is located inside the installation cavity 12; or, the circuit assembly 30 is entirely located inside the annular baffle 43. It can be understood that by arranging the circuit assembly 30 in the space formed by the annular baffle 43 and the heat sink 41, the heat sink 41 and the annular baffle 43 can simultaneously absorb the heat generated by the circuit assembly 30, and the heat conduction area between the circuit assembly 30 and the heat dissipation cover 40 can be increased. This is equivalent to being able to dissipate heat from the heat sink 41 and the annular baffle 43 at the same time when heat is dissipated through external airflow, that is, the heat dissipation efficiency is improved. Of course, in other embodiments, the heat dissipation cover 40 may not be provided with the annular baffle 43.

[0047] In some embodiments, a plurality of grooves 431 are disposed on the outer side surface of the annular baffle 43 , and the plurality of grooves 431 are distributed at intervals along the circumference of the annular baffle 43 .

[0048] Specifically, the annular baffle 43 can conduct the received heat to the groove walls of the multiple grooves 431, so that the groove walls of the multiple grooves 431 are simultaneously cooled by the external airflow, thereby increasing the heat dissipation area, that is, improving the heat dissipation efficiency of the heat dissipation cover 40. Among them, the multiple grooves 431 include but are not limited to two, three, four or more. Of course, in other embodiments, the annular baffle 43 can also be provided with only a plurality of convex portions, and the plurality of convex portions are distributed at intervals along the circumference of the annular baffle 43.

[0049] In some embodiments, a heat-conducting medium 52 is provided between the heat-conducting structure 50 and the heat sink 41. Specifically, the heat-conducting medium 52 can be provided on the surface of the heat-conducting structure 50, and the heat-conducting medium 52 can also be provided on the surface of the heat sink 41, so that when the heat-conducting medium 52 and the heat sink 41 are thermally connected, they can be seamlessly fitted, so that the heat of the heat-conducting structure 50 can be better transferred to the heat sink 41, thereby improving the heat dissipation efficiency. Among them, the heat-conducting medium 52 can be: thermal grease, thermal silica gel, thermal pads, etc., which are not specifically limited in this application. Of course, in other embodiments, the heat-conducting medium 52 may not be provided between the heat-conducting structure 50 and the heat sink 41.

[0050] In some embodiments, the circuit component 30 includes a MOS transistor 31 (MOS: MOSFET metal, oxide semiconductor field effect transistor), and the MOS transistor 31 is mounted on the heat-conducting structure 50 and is thermally connected to the heat-conducting structure 50 .

[0051] Specifically, the MOS tube 31 is a device that generates a large amount of heat in the circuit assembly 30. The MOS tube 31 is installed on the heat-conducting structure 50 so that the heat generated by the MOS tube 31 can be directly transferred to the heat-conducting structure 50, thereby improving the heat transfer speed and thus improving the heat dissipation efficiency. Among them, the MOS tube 31 can directly contact the heat-conducting structure 50 for heat conduction, or it can contact the heat-conducting structure 50 for heat conduction through the heat-conducting medium 52. This application does not make specific limitations. Of course, in other embodiments, the MOS tube 31 is installed beside the heat-conducting structure 50.

[0052] In some embodiments, the heat-conducting structure 50 includes a heat-conducting block 51, which includes an integrally formed mounting plate 511 and a heat-conducting plate 512. The mounting plate 511 is vertically mounted on the surface of the heat-conducting plate 512. The MOS tube 31 is thermally connected to the mounting plate 511, and the heat-conducting plate 512 is attached to the surface of the heat sink 41 with the back side of the mounting plate 511 facing away from the mounting plate 511.

[0053] Specifically, the heat-conducting block 51 is roughly T-shaped, and the MOS tube 31 is installed on the mounting plate 511, so that the heat generated by the MOS tube 31 is transmitted to the mounting plate 511, and the mounting plate 511 conducts the absorbed heat to the heat-conducting plate 512, and the heat-conducting plate 512 conducts the heat to the heat sink 41 for heat exchange, so that while achieving heat conduction, the installation difficulty of the MOS tube 31 is also reduced. Among them, the back of the heat-conducting plate 512 away from the mounting plate 511 can be directly attached to the surface of the heat sink 41, or it can be attached to the surface of the heat sink 41 through the heat-conducting medium 52, and this application does not make specific restrictions. Of course, in other embodiments, the mounting plate 511 and the heat-conducting plate 512 can also be connected by welding, threaded fasteners, etc.

[0054] In some embodiments, the heat-conducting structure 50 includes at least two heat-conducting blocks 51 , which are spaced apart from each other and are both thermally connected to the heat sink 41 . The circuit assembly 30 also includes a transformer 32 , which is disposed between the two heat-conducting blocks 51 .

[0055] Specifically, the transformer 32 is a device that generates a large amount of heat in the circuit assembly 30. When the transformer 32 is installed between the two heat-conducting blocks 51, that is, the two heat-conducting blocks 51 are located beside the transformer 32, so that the outer walls of the two heat-conducting blocks 51 can absorb the heat emitted by the transformer 32, that is, the contact area between the transformer 32 and the heat-conducting blocks 51 is increased, so that the heat of the transformer 32 can be better transferred to the heat-conducting blocks 51, thereby improving the heat dissipation efficiency of the transformer 32. Among them, the heat-conducting structure 50 can also be provided with multiple heat-conducting blocks 51, for example: two, three, four, five or more, and this application does not make specific limitations on this. Of course, in other embodiments, the heat-conducting structure 50 can also be provided with only one heat-conducting block 51.

[0056] In some embodiments, a mounting structure (not shown) is provided on the side of the energy storage power supply facing away from the heat dissipation cover 40, and the energy storage power supply is installed in the communication base station through the mounting structure to be used as a backup power supply.

[0057] Specifically, when it is necessary to install the energy storage power supply in the communication base station to be used as a backup power supply for the communication base station, the energy storage power supply can be installed on the communication base station through the installation structure on the side of the energy storage power supply away from the heat dissipation cover 40, so as to provide power to the communication base station in the event of a power outage or failure. In this way, when installing the energy storage power supply, the installation of the energy storage power supply can be completed directly through the installation structure, and there is no need to set up other structures to install the energy storage power supply, thereby reducing the difficulty of installing the energy storage power supply. Among them, the installation structure can be a screw hole, a hook, etc., and the present application does not make specific limitations on this.

[0058] In some embodiments, a heat dissipation cover 40 plate is provided on the side of the circuit assembly 30 that is away from the heat dissipation cover 40 and faces the battery module 20, and the heat dissipation cover 40 plate is thermally connected to the heat dissipation cover 40. The circuit assembly 30 is mounted on the heat dissipation cover 40 plate and is thermally connected to the heat dissipation cover 40 plate. Specifically, the heat generated by the circuit assembly 30 can be conducted to the heat dissipation cover 40 plate, and the heat dissipation cover 40 plate conducts the absorbed heat to the heat dissipation cover 40, so that the heat conductive structure 50 and the heat dissipation cover 40 plate can absorb the heat of the circuit assembly 30 at the same time, that is, it is equivalent to increasing the heat conduction area of ​​the circuit assembly 30, that is, improving the heat dissipation efficiency. Of course, in other embodiments, the heat dissipation cover 40 plate may not be provided on the side of the circuit assembly 30 that is away from the heat dissipation cover 40 and faces the battery module 20.

[0059] In some embodiments, an insulating plate 54 is provided between the heat dissipation cover 40 and the battery module. It is understood that the provision of the insulating plate 54 can better separate the circuit assembly 30 and the battery module 20, and prevent the circuit assembly 30 and the battery module from directly contacting each other and causing a circuit short circuit, that is, the circuit assembly 30 and the battery module 20 can work more stably.

[0060] In some embodiments, the heat dissipation cover 40 is provided with a handle 60. Specifically, the user can hold the handle 60 to carry the energy storage power supply, which can improve the user's experience and improve the practicality of the communication power converter.

[0061] In some embodiments, the energy storage power supply further includes a back cover 80 , and a disassembly opening is provided at one end of the housing 10 away from the installation opening, and the back cover 80 covers the disassembly opening.

[0062] Specifically, the battery module is installed at the disassembly and assembly port. When assembling the backup power supply of the communication base station, the battery module can be installed through the disassembly and assembly port. Compared with the installation method from the installation port, the installation from the disassembly and assembly port can reduce the difficulty of installing the battery module. Among them, the back cover can be installed at the disassembly and assembly port by bolt fasteners, and can also be installed at the disassembly and assembly port by snap-on. The specific installation method is not limited and can be selected according to actual conditions. Of course, in other embodiments, the housing 10 and the back cover 80 are integrally formed.

[0063] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An energy storage power supply, characterized in that: include: A housing, provided with a mounting cavity and a mounting opening, wherein the mounting opening is communicated with the mounting cavity; A battery module is arranged in the installation cavity; A circuit assembly is arranged at the installation opening; A heat dissipation cover, covering the installation opening and having a heat dissipation plate opposite to the installation opening, wherein a heat dissipation structure is provided on a side of the heat dissipation plate away from the circuit assembly; as well as The heat-conducting structure is arranged between the circuit assembly and the heat sink and is connected to the heat sink by thermal conduction. The heat-conducting structure is used to absorb the heat generated by the circuit assembly and perform heat exchange with the heat sink.

2. The energy storage power supply according to claim 1, characterized in that: The heat dissipation structure comprises a plurality of heat dissipation ribs, and the plurality of heat dissipation ribs are all arranged on a side of the heat dissipation plate away from the circuit assembly, and a heat dissipation gap is formed between any two adjacent heat dissipation ribs.

3. The energy storage power supply according to claim 2, characterized in that: The heat dissipation structure also includes an annular frame arranged around the periphery of the heat-conducting structure, and a plurality of heat-dissipating ribs are located inside the annular frame. The height of the annular frame relative to the surface of the heat-conducting structure is greater than or equal to the height of the heat-dissipating ribs.

4. The energy storage power supply according to claim 1, characterized in that: The heat dissipation cover also includes an annular baffle arranged around the periphery of the heat dissipation plate, and one end of the annular baffle away from the heat dissipation plate is correspondingly installed at the installation opening, and the circuit component is at least partially located in the space formed by the annular baffle and the heat dissipation plate.

5. The energy storage power supply according to claim 4, characterized in that: The outer side surface of the annular baffle is provided with a plurality of grooves, and the plurality of grooves are distributed at intervals along the circumference of the annular baffle.

6. The energy storage power supply according to claim 1, characterized in that: The circuit component comprises a MOS tube, and the MOS tube is mounted on the heat-conducting structure and is thermally connected to the heat-conducting structure.

7. The energy storage power supply according to claim 6, characterized in that: The heat-conducting structure includes a heat-conducting block, which includes an integrally formed mounting plate and a heat-conducting plate. The mounting plate is vertically mounted on the surface of the heat-conducting plate. The MOS tube is thermally connected to the mounting plate. The heat-conducting plate is attached to the surface of the heat sink with its back side facing away from the mounting plate.

8. The energy storage power supply according to claim 7, characterized in that: The heat-conducting structure includes at least two heat-conducting blocks, which are spaced apart from each other and are both thermally connected to the heat sink, and the circuit assembly also includes a transformer, which is disposed between the two heat-conducting blocks; and / or, A mounting structure is provided on a side of the energy storage power supply away from the heat dissipation cover, and the energy storage power supply is mounted on a communication base station through the mounting structure to be used as a backup power supply.

9. The energy storage power supply according to claim 1, characterized in that: The heat dissipation cover is provided with a handle.

10. The energy storage power supply according to claim 9, characterized in that: The energy storage power supply further comprises a rear cover, an end of the shell away from the installation opening is provided with a disassembly opening, and the rear cover is covered on the disassembly opening.

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