Heat dissipation structure of high-stability PCB
By introducing components such as support seat, movable seat and adjustment shaft into the PCB board heat dissipation structure, the problems of unstable fan installation and connection fall off are solved, and efficient heat dissipation and rapid disassembly are achieved, which facilitates initial installation and subsequent maintenance.
Patent Information
- Application Number
- CN202420774387.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-04-15
AI Technical Summary
In the existing multi-layer PCB board heat dissipation structure, the fan installation is unstable, easy to deviate, and the connection between the PCB board and the heat dissipation structure is easily fall off, affecting the heat dissipation effect.
A high-stability PCB board heat dissipation structure is designed, using supporting seats, movable seats, adjustment shafts and clamping boards. The PCB board is supported by the supporting seats, and the movable seats and springs are used to achieve rapid clamping between the fitting blocks and the fitting grooves. , combine the adjustment shaft and the clamp to achieve rapid disassembly and limit the heat dissipation fan, ensuring stable connection between the heat dissipation fins and the fan and the PCB board.
It improves the heat dissipation effect of the PCB board, ensures the stable installation and rapid disassembly of the fan, facilitates initial installation and subsequent maintenance, and enhances the heat dissipation effect and structural stability.
Smart Images

Figure CN222170293U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB boards, and more specifically to a heat dissipation structure of a high-stability PCB board. Background Art
[0002] PCB, or printed circuit board, is one of the important components of the electronics industry. Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, must use printed circuit boards to make electrical interconnections between the various components. The printed circuit board consists of an insulating base plate, connecting wires, and pads for assembling and welding electronic components. It has the dual functions of a conductive line and an insulating base plate.
[0003] Patent application number CN202321390783.X discloses a heat dissipation structure of a multi-layer PCB board, including a circuit board and a heat dissipation device, wherein a plurality of parts are fixedly connected to the upper surface of the circuit board; a heat dissipation device is provided at the bottom end of the circuit board, and the heat dissipation device includes a main board, which is located directly below the circuit board, and a plurality of fins are fixedly connected to the bottom end of the main board, and a sub-board is fixedly connected to the bottom ends of the plurality of fins, and a card strip is fixedly connected to the side wall of the main board, and two supporting devices are provided at the bottom end of the circuit board, and the supporting device includes a pad, which is located directly below the circuit board, and a fixed block is fixedly connected to the bottom end of the circuit board near the pad, and an insert block is fixedly connected to the side wall of the fixed block, and the insert block is inserted into the inner wall of the pad, and a jack is provided on the side wall of the pad near the insert block; heat can be exported by arranging the main board, fins and sub-board, and at the same time, the fan can increase airflow, thereby increasing the heat dissipation effect.
[0004] In this structure, heat dissipation of the PCB board is achieved through heat dissipation fins and fans, but there are certain problems in the installation of multiple sets of fans in this structure. There is a lack of stable limit for the fans, and the fans will vibrate during operation. If stable limit is not performed, the fans may deviate and thus affect the heat dissipation effect. At the same time, the installation structure between the PCB board and the heat dissipation structure of this structure is connected by sliding, which is easy to fall off.
[0005] Therefore, professionals in this field provide a heat dissipation structure of a high-stability PCB board to solve the above-mentioned problems. Utility Model Content
[0006] In view of the problems existing in the prior art, the purpose of the utility model is to provide a heat dissipation structure of a PCB board with high stability, which can achieve good heat dissipation effect on the PCB board body by cooperating with heat dissipation fins and a heat dissipation fan, and at the same time, the heat dissipation fan can be quickly disassembled and assembled by setting an adjustment shaft and a clamping plate.
[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0008] A heat dissipation structure of a high-stability PCB board, comprising a PCB board body, a mounting plate is arranged at the bottom of the PCB board body, support seats are connected to both sides of the mounting plate, a mounting hole is arranged at the bottom of the support seat, the top of the support seat contacts the bottom of the PCB board body, two mounting grooves are arranged at the top of the support seat, a movable seat is slidably connected to the inner wall of the mounting groove, a pressing block is fixedly connected to the movable seat, the pressing block passes through the mounting groove and extends to the outside of the support seat, a fitting groove is arranged at the top of the movable seat, and a fixing groove is arranged on the inner wall of the mounting groove. A spring is provided, the other end of the spring is fixedly connected to the movable seat, a fitting block is welded at the bottom of the PCB board body, the bottom of the fitting block passes through the mounting groove and fits with the inner wall of the fitting groove, evenly distributed heat dissipating fins are installed on the top of the mounting plate, the top of the heat dissipating fins is connected to the bottom of the PCB board body, an adjusting shaft is rotatably connected to the top of the mounting plate, a heat dissipating fan arranged equidistantly is installed on the top of the mounting plate, a card plate is provided on the left and right sides of the heat dissipating fan, the card plate is threadedly connected to the adjusting shaft, and the card plate is slidably connected to the top of the mounting plate.
[0009] As a further description of the above technical solution: the adjusting shaft is provided with uniformly distributed external threads, and the directions of the internal threads of two adjacent clamping plates are opposite.
[0010] As a further description of the above technical solution: a knob is fixedly connected to the left end of the adjusting shaft, and the knob is provided with evenly distributed anti-slip grooves.
[0011] As a further description of the above technical solution: two limit clamping strips are arranged on the back of the heat dissipation fan, and the limit clamping strips are fixedly connected to the top of the mounting plate.
[0012] As a further description of the above technical solution: a slider is fixedly connected to the bottom of the card plate, and the slider is slidably connected to the top of the mounting plate.
[0013] Compared with the prior art, the advantages of the present invention are:
[0014] In the utility model, the supporting seat supports the PCB board body, so that the PCB board body and the mounting plate are in a hollow state. The heat dissipation fins and the heat dissipation fan can achieve a good heat dissipation effect on the PCB board body. At the same time, the heat dissipation fan can be quickly disassembled and assembled by setting an adjustment shaft and a clamping plate, so as to facilitate initial installation and subsequent maintenance. At the same time, the movable seat can be used to realize the rapid clamping of the fitting block and the fitting groove, so that the PCB board body and the heat dissipation structure can be quickly connected. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1It is a three-dimensional structural schematic diagram of the utility model;
[0016] Figure 2 It is a schematic diagram of the side cross-sectional structure of the installation groove of the utility model;
[0017] Figure 3 For the utility model Figure 2 The enlarged structural diagram at A in the middle;
[0018] Figure 4 It is a schematic diagram of the three-dimensional structure of the card board of the present utility model.
[0019] Description of the numbers in the figure:
[0020] 1. PCB board body; 2. Mounting plate; 3. Support seat; 4. Mounting hole; 5. Mounting slot; 6. Movable seat; 7. Pressing block; 8. Fitting slot; 9. Spring; 10. Fitting block; 11. Heat dissipation fin; 12. Adjusting shaft; 13. Heat dissipation fan; 14. Card plate; 15. Knob; 16. Limiting card strip; 17. Slider. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0022] See also Figures 1 to 4 In the utility model, a heat dissipation structure of a high-stability PCB board comprises a PCB board body 1, a mounting plate 2 is arranged at the bottom of the PCB board body 1, support seats 3 are connected to both sides of the mounting plate 2, mounting holes 4 are arranged at the bottom of the support seat 3, the top of the support seat 3 contacts the bottom of the PCB board body 1, two mounting grooves 5 are arranged at the top of the support seat 3, a movable seat 6 is slidably connected to the inner wall of the mounting groove 5, a pressing block 7 is fixedly connected to the movable seat 6, the pressing block 7 passes through the mounting groove 5 and extends to the outside of the support seat 3, a fitting groove 8 is arranged at the top of the movable seat 6, and a spring is fixedly connected to the inner wall of the mounting groove 5. Spring 9, the other end of the spring 9 is fixedly connected to the movable seat 6, a fitting block 10 is welded at the bottom of the PCB board body 1, the bottom of the fitting block 10 passes through the mounting groove 5 and fits with the inner wall of the fitting groove 8, and evenly distributed heat dissipation fins 11 are installed on the top of the mounting plate 2, and the top of the heat dissipation fins 11 is connected to the bottom of the PCB board body 1, and the top of the mounting plate 2 is rotatably connected with an adjusting shaft 12, and the top of the mounting plate 2 is installed with a heat dissipation fan 13 arranged at an equal distance, and a card plate 14 is provided on the left and right sides of the heat dissipation fan 13, and the card plate 14 is threadedly connected to the adjusting shaft 12, and the card plate 14 is slidably connected to the top of the mounting plate 2.
[0023] The adjusting shaft 12 is provided with uniformly distributed external threads, and the internal threads of two adjacent clamping plates 14 are in opposite directions;
[0024] Two limit clamping strips 16 are arranged on the back of the heat dissipation fan 13 , and the limit clamping strips 16 are fixedly connected to the top of the mounting plate 2 .
[0025] The user moves the PCB body 1 to the top of the mounting plate 2. At this time, multiple groups of fitting blocks 10 are welded on the bottom of the PCB body 1. At this time, the fitting blocks 10 enter through the top of the mounting groove 5 and contact with the top of the movable seat 6. Then the user controls and presses the multiple groups of pressing blocks 7. The pressing blocks 7 are forced to enter the inside of the mounting groove 5, and the movable seat 6 moves accordingly and the spring 9 is forced to generate an opposite force. As the movable seat 6 moves, the fitting groove 8 moves to the bottom of the fitting block 10, and then under the action of gravity, the PCB body 1 moves downward and fits the top of the support seat 3 on both sides, and the fitting block 10 enters the inside of the fitting groove 8. Then the pressing block 7 is released, the spring 9 starts to rebound to reset the movable seat 6, and the fitting block 10 is engaged with the inner wall of the fitting groove 8, so that the installation of the PCB body 1 and the heat dissipation structure is completed. Then use The user places multiple groups of heat dissipation fans 13 on the top of the mounting plate 2, so that the heat dissipation fans 13 are on the opposite side of the two clamping plates 14, and the heat dissipation fans 13 are in contact with the limiting clamping strips 16 to achieve limiting. Then the user rotates the adjusting shaft 12, and the multiple groups of clamping plates 14 threadedly connected to the adjusting shaft 12 begin to move synchronously until the multiple groups of heat dissipation fans 13 are stably limited. At this time, the multiple groups of heat dissipation fins 11 are in contact with the bottom of the PCB board body 1, and the user can install the PCB board body 1 through the mounting holes 4 at the bottom of the support seat 3. In the subsequent use process, the heat generated by the PCB board body 1 will be discharged through the heat dissipation fins 11, and the PCB board body 1 and the mounting plate 2 are in a hollow state, and the airflow circulation speed is faster. With the operation of the heat dissipation fan 13, the heat is quickly discharged, thereby improving the heat dissipation effect.
[0026] In the utility model, the support seat 3 supports the PCB board body 1, so that the PCB board body 1 and the mounting plate 2 are in a hollow state. The heat dissipation fins 11 and the heat dissipation fan 13 can achieve a good heat dissipation effect on the PCB board body 1. At the same time, by setting the adjustment shaft 12 and the clamping plate 14, the heat dissipation fan 13 can be quickly disassembled and assembled to facilitate initial installation and subsequent maintenance. At the same time, the movable movable seat 6 is used to realize the rapid clamping of the fitting block 10 and the fitting groove 8, so that the PCB board body 1 and the heat dissipation structure can be quickly connected.
[0027] See also Figure 1 and 4 , wherein: the left end of the adjusting shaft 12 is fixedly connected with a knob 15 , and the knob 15 is provided with evenly distributed anti-slip grooves.
[0028] In the utility model, when the user needs to rotate the adjustment shaft 12, the knob 15 can provide a good fulcrum for the user, and the anti-slip pattern can prevent the user from slipping.
[0029] See also Figure 4 , wherein: a slider 17 is fixedly connected to the bottom of the clamping plate 14 , and the slider 17 is slidably connected to the top of the mounting plate 2 .
[0030] In the present invention, when the card plate 14 moves, the slider 17 will also move accordingly. The slider 17 can limit the card plate 14 so that the card plate 14 is always located on the top of the mounting plate 2 to maintain stable movement in the horizontal direction.
[0031] The above is only a preferred specific implementation of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.
Claims
1. A heat dissipation structure of a high-stability PCB board, comprising a PCB board body (1), characterized in that: A mounting plate (2) is provided at the bottom of the PCB board body (1), and support seats (3) are connected to both sides of the mounting plate (2). A mounting hole (4) is provided at the bottom of the support seat (3), and the top of the support seat (3) contacts the bottom of the PCB board body (1). Two mounting grooves (5) are provided at the top of the support seat (3), and a movable seat (6) is slidably connected to the inner wall of the mounting groove (5). A pressing block (7) is fixedly connected to the movable seat (6), and the pressing block (7) passes through the mounting groove (5) and extends to the outside of the support seat (3). A fitting groove (8) is provided at the top of the movable seat (6), and a spring (9) is fixedly connected to the inner wall of the mounting groove (5), and the other end of the spring (9) is fixedly connected to the movable seat (6); A fitting block (10) is welded to the bottom of the PCB body (1), the bottom of the fitting block (10) passes through the mounting groove (5) and fits with the inner wall of the fitting groove (8), the top of the mounting plate (2) is installed with evenly distributed heat dissipation fins (11), the top of the heat dissipation fins (11) is connected to the bottom of the PCB body (1), the top of the mounting plate (2) is rotatably connected to an adjustment shaft (12), the top of the mounting plate (2) is installed with heat dissipation fans (13) arranged at equal distances, the left and right sides of the heat dissipation fans (13) are provided with card plates (14), the card plates (14) are threadedly connected to the adjustment shaft (12), and the card plates (14) are slidably connected to the top of the mounting plate (2).
2. The heat dissipation structure of a high-stability PCB board according to claim 1, characterized in that: The adjusting shaft (12) is provided with evenly distributed external threads, and the internal threads of two adjacent clamping plates (14) are in opposite directions.
3. The heat dissipation structure of a high-stability PCB board according to claim 1, characterized in that: The left end of the adjusting shaft (12) is fixedly connected with a knob (15), and the knob (15) is provided with evenly distributed anti-slip grooves.
4. The heat dissipation structure of a high-stability PCB board according to claim 1, characterized in that: Two limit clamping strips (16) are arranged on the back of the heat dissipation fan (13), and the limit clamping strips (16) are fixedly connected to the top of the mounting plate (2).
5. The heat dissipation structure of a high-stability PCB board according to claim 1, characterized in that: The bottom of the clamping plate (14) is fixedly connected with a slider (17), and the slider (17) is slidably connected to the top of the mounting plate (2).
Citation Information
Patent Citations
Heat dissipation structure of multi-layer PCB (Printed Circuit Board)
CN220108304U
