Cleaning nozzle

Abstract

The utility model relates to the technical field of wafer cleaning, and discloses a cleaning nozzle which comprises a liquid inlet pipe, a nozzle main body, a connecting pipe and a spray pipe which are sequentially communicated, a liquid passing cavity is arranged in the nozzle main body, and the liquid passing cavity is communicated with a liquid outlet of the liquid inlet pipe. A first step face and a second step face which are coaxial with the liquid inlet pipe are sequentially arranged on the inner wall of the liquid passing cavity from top to bottom, the connecting pipes are symmetrically arranged at the bottom of the spray head body, the inner side walls of the connecting pipes are connected with the second step face, the connecting pipes are bent inwards in the radial direction of the spray head body to form the spray pipe, and the spray pipe is connected with the spray head body. And liquid dropping holes are formed in the inner side walls of the first step surface, the second step surface, the connecting pipe and the spray pipe. The wafer cleaning device has the advantages that the surface, the edge and the back face of the wafer can be comprehensively cleaned, liquid medicine is evenly distributed in the cleaning process, impact of the liquid medicine on the surface of the wafer is reduced, and central rings and spots on the surface of the wafer are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a cleaning nozzle. Background Art

[0002] With the development of semiconductor substrate wafer cleaning technology, most semiconductor substrates are currently cleaned by automatic cleaning machines. Cleaning in the semiconductor industry refers to the process of using a series of physical and chemical methods to remove dirt, contaminants, oxides, etc. on the surface of the wafer before oxidation, photolithography, and epitaxy processes, so that the surface reaches a wafer with a cleanliness level that meets the requirements.

[0003] During the cleaning process of the wafer using a cleaning machine, refer to Figure 1 , generally, the chemical liquid is dripped onto the surface of the wafer through the liquid inlet pipe, and the cleaning effect is achieved by rotating the wafer. The traditional cleaning machine drips the cleaning liquid directly onto the middle surface of the wafer through the pipe, and then the liquid flows to the edge of the wafer under the action of centrifugal force. In this cleaning method, the liquid is directly discharged from the liquid inlet pipe, the liquid flow rate is large, and the impact on the wafer is strong. Moreover, the liquid only drips into the middle of the wafer, and the liquid disperses to the edge of the wafer under the action of centrifugal force, which takes a long time. At the same time, because the centrifugal force in the middle of the wafer is smaller than that at the edge, the liquid tends to stay in the middle for a long time, causing excessive corrosion to the wafer, resulting in the phenomenon of center rings and irregular spots. In addition, each cleaning can only clean the surface of the wafer, and the back of the wafer cannot be cleaned, so the cleaning efficiency is low. Utility Model Content

[0004] The utility model aims to provide a cleaning nozzle which can fully clean the surface, edge and back of a wafer, distribute the liquid medicine evenly during the cleaning process, reduce the impact of the liquid medicine on the wafer surface, and avoid the appearance of center circles and spots on the wafer surface.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a cleaning nozzle, comprising a liquid inlet pipe, a nozzle body, a connecting pipe and a nozzle connected in sequence, wherein a liquid passage cavity is provided inside the nozzle body, the liquid passage cavity is connected with a liquid outlet of the liquid inlet pipe, the inner wall of the liquid passage cavity is provided with a first step surface and a second step surface coaxial with the liquid inlet pipe from top to bottom, the connecting pipe is symmetrically provided at the bottom of the nozzle body, the inner side wall of the connecting pipe is connected with the second step surface, the connecting pipe is bent inwardly along the radial direction of the nozzle body to form the nozzle, and the first step surface, the second step surface, the connecting pipe and the inner side wall of the nozzle are all provided with drip holes.

[0006] Furthermore, the distance between the first step surface and the liquid outlet of the liquid inlet pipe is 10 mm-12 mm.

[0007] Furthermore, the distance between the first step surface and the second step surface is 5mm-10mm.

[0008] Furthermore, the diameter of the drip hole is between 0.8 mm and 1.2 mm.

[0009] Furthermore, the spacing between the drip holes is between 2.5 mm and 3.5 mm.

[0010] Furthermore, the angle between the connecting pipe and the nozzle is between 60° and 90°.

[0011] Furthermore, the diameters of the dripping holes on the connecting pipe and the nozzle are smaller than the diameters of the dripping holes on the first step surface and the second step surface.

[0012] Furthermore, a buffer cone surface is connected between the first step surface and the second step surface.

[0013] Furthermore, the cross section of the nozzle body is V-shaped, the top angle of the nozzle body is between 120° and 150°, and the liquid inlet pipe is arranged at the top of the nozzle body and coaxially with the nozzle body.

[0014] Furthermore, an arc-shaped transition section is provided between the connecting pipe and the nozzle.

[0015] Compared with the prior art, the cleaning nozzle of the utility model embodiment has the following beneficial effects: the first step surface, the second step surface, the connecting pipe and the inner wall of the nozzle are all provided with drip holes; the drip holes on the first step surface can divert the medicine dripping from the liquid inlet pipe, thereby reducing the impact of the medicine on the surface of the chip; the drip holes on the second step surface can distribute the medicine on the edge of the chip, and can quickly distribute the medicine evenly on the surface of the chip, thereby avoiding the medicine staying in the middle of the chip for a long time, thereby avoiding the appearance of center circles and spots on the surface of the chip; in addition, the back of the chip can be cleaned synchronously through the connecting pipe and the nozzle, thereby improving the cleaning efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of wafer cleaning in the prior art;

[0017] Figure 2 This is a schematic diagram of the structure of the cleaning nozzle of the utility model embodiment;

[0018] Figure 3 This is a front view of the cleaning nozzle of the utility model embodiment;

[0019] Figure 4 It is a reference diagram of the applicable state of the cleaning nozzle of the embodiment of the utility model.

[0020] In the figure, 1, liquid inlet pipe; 2, nozzle body; 3, connecting pipe; 4, nozzle; 21, liquid chamber; 211, first step surface; 212, second step surface; 5, drip hole; a, support rod; b, chip. DETAILED DESCRIPTION

[0021] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0022] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "inside", "outside", etc. used in the present invention to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred devices and elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but these information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0024] like Figure 1 As shown, in the prior art, in order to achieve the cleaning of the wafer, the support rod a is a component on the cleaning equipment, which is used to fix the wafer b during cleaning and can drive the wafer b to rotate synchronously. The liquid medicine in the liquid inlet pipe 1 directly drips onto the surface of the wafer b. The liquid medicine flow is large, which has a large impact on the wafer b. At the same time, the liquid medicine is distributed on the surface of the wafer b through centrifugal force, which easily causes the liquid medicine to stay on the surface of the wafer b for too long, causing excessive corrosion to the wafer b, resulting in the phenomenon of a center circle and irregular spots. Moreover, each cleaning can only clean the surface of the wafer b, and the back of the wafer b cannot be cleaned, so the cleaning efficiency is low.

[0025] See also Figures 2 to 4 A cleaning nozzle of a preferred embodiment of the utility model can solve the above problems. It includes a liquid inlet pipe 1, a nozzle body 2, a connecting pipe 3 and a nozzle 4 which are connected in sequence. The liquid inlet pipe 1 is used to introduce external liquid medicine into the nozzle. In order to facilitate the delivery of liquid medicine to the nozzle body 2, a liquid passage cavity 21 is provided inside the nozzle body 2. The liquid passage cavity 21 is connected to the liquid outlet of the liquid inlet pipe 1. Figure 2 , Figure 4, the inner wall of the liquid chamber 21 is provided with a first step surface 211 and a second step surface 212 coaxial with the liquid inlet pipe 1 from top to bottom. Further, in order to realize synchronous cleaning of the back of the wafer, a connecting pipe 3 is symmetrically provided at the bottom of the nozzle body 2, the inner side wall of the connecting pipe 3 is connected to the second step surface 212, and the connecting pipe 3 is bent inwardly along the radial direction of the nozzle body 2 to form a nozzle 4. The first step surface 211, the second step surface 212, the connecting pipe 3 and the inner side wall of the nozzle 4 are all provided with a drip hole 5. Among them, in order to prevent the liquid from being directly sprayed from the liquid inlet pipe 1 and having a large impact on the wafer, the drip hole 5 on the first step surface 211 can divert the liquid input from the liquid inlet pipe 1 to reduce the impact on the wafer surface. The dripping hole 5 on the second step surface 212 can evenly drop the liquid medicine on the edge of the chip, which can shorten the time required for the liquid medicine to cover the entire chip surface, allowing the liquid medicine to be quickly and evenly distributed on the chip surface, thereby preventing the liquid medicine from staying in the middle of the chip for a long time and preventing the appearance of center circles and spots on the chip surface. The connecting tube 3 and the nozzle 4 can spray the liquid medicine to the back of the chip through the dripping hole 5, so as to achieve simultaneous cleaning of the chip surface and back, thereby improving the cleaning efficiency.

[0026] In some embodiments, in order to facilitate the flow of the liquid medicine from the liquid outlet of the liquid inlet pipe 1 to the dripping hole 5 on the first step surface 211 to divert the liquid medicine and reduce the impact force of the liquid medicine, the spacing between the first step surface 211 and the liquid outlet of the liquid inlet pipe 1 is 10mm-12mm, and the spacing between the first step surface 211 and the second step surface 212 is 5mm-10mm. In order to facilitate the formation of a buffer for the liquid medicine and to allow the edge of the wafer to be located with sufficient liquid medicine to drip, a buffer cone surface is connected between the first step surface 211 and the second step surface 212. In order to evenly distribute the liquid medicine on the wafer, the aperture of the dripping hole 5 is between 0.8mm-1.2mm. Preferably, in this embodiment, the aperture of the dripping hole 5 is 1mm. In some embodiments, the spacing between the dripping holes 5 is between 2.5mm-3.5mm. Preferably, in this embodiment, the spacing between the dripping holes 5 is 3mm.

[0027] In some embodiments, the cross section of the nozzle body 2 is V-shaped, and the liquid inlet pipe 1 is arranged on the top of the nozzle body 2 and is coaxially arranged with the nozzle body 2. In order to facilitate the synchronous cleaning of the back side of the wafer, refer to Figure 2 , Figure 3, the angle between the connecting pipe 3 and the nozzle 4 is 60°-90°. Furthermore, in order to facilitate a smooth transition between the connecting pipe 3 and the nozzle 4, an arc-shaped transition section is provided between the connecting pipe 3 and the nozzle 4. In addition, a dripping hole 5 is provided on the inner side wall of the connecting pipe 3 and the nozzle 4 near the second step surface 212. In order to increase the pressure at the nozzle 4, so that the liquid medicine is sprayed farther and faster, and the liquid medicine is sprayed to the back of the wafer, the aperture of the dripping hole 5 on the connecting pipe 3 and the nozzle 4 is smaller than the aperture of the dripping hole 5 on the first step surface 211 and the second step surface 212. In this embodiment, the aperture of the dripping hole 5 on the connecting pipe 3 and the nozzle 4 is about 0.5 mm, and the spacing between the dripping holes 5 is 2 mm.

[0028] The working process of the utility model is: Figure 4 , fix the wafer on the support rod on the cleaning equipment, and place the wafer under the nozzle so that the liquid outlet of the nozzle 4 is located below the back of the wafer. Then the cleaning equipment starts to drive the wafer to rotate, and the first step surface 211, the second step surface 212, the connecting pipe 3 and the drip hole 5 on the nozzle 4 discharge liquid synchronously, so that the liquid is evenly distributed on the surface and back of the wafer, thereby improving the cleaning efficiency of the wafer and avoiding the liquid from staying in the middle of the wafer for a long time to form a center circle and spots.

[0029] In summary, the embodiment of the utility model provides a cleaning nozzle, which has the following beneficial effects compared with the prior art: the first step surface 211, the second step surface 212, the connecting tube 3 and the inner wall of the nozzle 4 are all provided with a dripping hole 5, the dripping hole 5 on the first step surface 211 can divert the liquid dripping from the liquid inlet tube 1, thereby reducing the impact of the liquid on the surface of the chip, the dripping hole 5 on the second step surface 212 can distribute the liquid at the edge of the chip, and can quickly distribute the liquid evenly on the surface of the chip, avoiding the liquid staying in the middle of the chip for a long time, thereby avoiding the appearance of a center circle and spots on the surface of the chip, and in addition, the back of the chip can be cleaned synchronously through the connecting tube 3 and the nozzle 4, thereby improving the cleaning efficiency of the chip.

[0030] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A cleaning nozzle, characterized in that: It includes a liquid inlet pipe, a nozzle body, a connecting pipe and a nozzle which are connected in sequence. A liquid passage cavity is provided inside the nozzle body. The liquid passage cavity is connected with a liquid outlet of the liquid inlet pipe. The inner wall of the liquid passage cavity is provided with a first step surface and a second step surface which are coaxial with the liquid inlet pipe in sequence from top to bottom. The connecting pipe is symmetrically provided at the bottom of the nozzle body. The inner side wall of the connecting pipe is connected with the second step surface. The connecting pipe is bent radially inwardly along the nozzle body to form the nozzle. The first step surface, the second step surface, the connecting pipe and the inner side wall of the nozzle are all provided with drip holes.

2. The cleaning nozzle according to claim 1, characterized in that: The distance between the first step surface and the liquid outlet of the liquid inlet pipe is 10 mm-12 mm.

3. The cleaning nozzle according to claim 1, characterized in that: The distance between the first step surface and the second step surface is 5mm-10mm.

4. The cleaning nozzle according to claim 1, characterized in that: The diameter of the drip hole is between 0.8 mm and 1.2 mm.

5. The cleaning nozzle according to claim 1, characterized in that: The spacing between the drip holes is between 2.5 mm and 3.5 mm.

6. The cleaning nozzle according to claim 1, characterized in that: The angle between the connecting pipe and the nozzle is between 60° and 90°.

7. The cleaning nozzle according to claim 1, characterized in that: The diameters of the dripping holes on the connecting pipe and the nozzle are smaller than the diameters of the dripping holes on the first step surface and the second step surface.

8. The cleaning nozzle according to claim 1, characterized in that: A buffer conical surface is connected between the first step surface and the second step surface.

9. The cleaning nozzle according to claim 1, characterized in that: The cross section of the nozzle body is V-shaped, the top angle of the nozzle body is between 120° and 150°, and the liquid inlet pipe is arranged at the top of the nozzle body and coaxially with the nozzle body.

10. The cleaning nozzle according to claim 1, characterized in that: An arc-shaped transition section is provided between the connecting pipe and the nozzle.

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