Adjustable semiconductor pin bending mechanism

By designing an adjustable semiconductor pin bending mechanism, the fine adjustment of the bending angle is achieved using components such as gears, racks and slides, which solves the problem of cumbersome adjustment of bending devices in the prior art, and improves work efficiency and bending Accuracy.

CN222175753UInactive Publication Date: 2024-12-17NANTONG SHIXIN SEMICON EQUIP CO LTD
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Patent Information

Application Number
CN202420895970.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-28
Publication Date
2024-12-17
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing semiconductor pin bending devices have complicated ways to adjust the bending angle, which reduces working efficiency.

Method used

An adjustable semiconductor pin bending mechanism including a bending mold, adjustment assembly and limit assembly is designed. Through the cooperation of gears, racks, baffles and sliders, the bending angle can be finely adjusted and connected. The control of the electric blade and cylinder automatically completes the bending operation.

Benefits of technology

It improves the efficiency of adjusting the bending angle, simplifies the operation process, improves work efficiency, and ensures bending accuracy and safety through automated control.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductors, in particular to an adjustable semiconductor pin bending mechanism which comprises a bending die and an adjusting assembly, the adjusting assembly is arranged on the inner side of the bending die and comprises a bending groove, the bending groove is formed in the inner side of the bending die, a rotating hole is formed in one side of the bending die, and the rotating hole is connected with the adjusting assembly. And the inner side of the rotating hole is rotationally connected with a rotating rod. According to the adjustable semiconductor pin bending mechanism, by installing the adjusting assembly, a worker places a semiconductor pin on a bending mold, then a first adjusting knob is rotated to drive a gear and a rack, the rack drives a baffle to move up and down to adjust the bending angle, and during bending, a bending head can be pressed into a bending groove and makes contact with the baffle, so that the bending angle is adjusted; and power connection pieces are arranged on the surfaces of the baffle and the bending head, when the two power connection pieces make contact, a signal is sent out, the air cylinder is controlled to make the pressing plate ascend, and therefore a worker can conveniently control the bending angle, and the working efficiency is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to an adjustable semiconductor pin bending mechanism. Background Art

[0002] Semiconductor pins are metal contacts on integrated circuits (ICs) used to connect circuits. They connect internal circuits to peripheral devices or circuits. Semiconductor pins can be divided into several basic types, including straight pins, J-shaped pins, and wing-shaped pins. These different types of pins are adapted to different packaging requirements and circuit board designs.

[0003] The existing bending device can bend the semiconductor pins, but when the bending angle needs to be adjusted, the adjustment method of the existing bending device is relatively complicated, thereby reducing the work efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide an adjustable semiconductor pin bending mechanism to solve the problem that the existing bending device proposed in the above background technology has a relatively cumbersome way of adjusting the bending angle. To achieve the above purpose, the utility model provides the following technical solutions: an adjustable semiconductor pin bending mechanism, comprising a bending mold and an adjustment component, the adjustment component is arranged on the inner side of the bending mold, the adjustment component comprises a bending groove, the bending groove is arranged on the inner side of the bending mold, a rotating hole is arranged on one side of the bending mold, the inner side of the rotating hole is rotatably connected with a rotating rod, one side of the rotating rod is fixedly connected with an adjustment knob 1, the other side of the rotating rod is fixedly connected with a gear, one side of the gear is meshedly connected with a rack, the other side of the rack is fixedly connected with a baffle, the other side of the baffle is fixedly connected with a slider 1, one side of the inner wall of the bending groove is provided with a slide groove 1, the slide groove 1 is slidably connected with the slider 1, the bottom of the baffle is fixedly connected with a connecting rod, and a limiting component is arranged on the top of the bending mold.

[0005] Further preferably, the limit assembly includes a second slide groove, the second slide groove is opened at the top of the bending mold, the inner side of the second slide groove is slidably connected with a slider second, the top of the slider second is fixedly connected to a limit plate, the top of the limit plate is provided with a threaded hole one, the inner cavity of the threaded hole one is threadedly connected with a threaded rod, the top of the threaded rod is fixedly connected with an adjusting knob two, the top of the bending mold is provided with a threaded hole two, and a transmission assembly is arranged below the bending mold, and the bending mold can be transmitted by installing the transmission assembly.

[0006] Further preferably, the transmission assembly includes a transmission shaft, which is arranged below the bending mold, a driving wheel is fixedly connected to one side of the transmission shaft, a transmission belt is rotatably connected to the outer side of the driving wheel, and a driven wheel is arranged on one side of the driving wheel.

[0007] Further preferably, guard plates are provided on both sides of the conveyor belt, the bottom of the guard plates is fixedly connected to a fixing frame, and the top of the guard plates is provided with a bending component, through which the semiconductor pins can be bent.

[0008] Further preferably, the bending assembly includes a gantry, the gantry is fixedly connected to the top of the guard plate, the top of the gantry is fixedly connected to a cylinder, the bottom of the cylinder is fixedly connected to a push rod, and the bottom of the push rod is fixedly connected to a pressure plate.

[0009] Further preferably, an upper mold groove is opened at the bottom of the pressing plate, bending heads are fixedly connected to both sides of the bottom of the pressing plate, a mounting plate is fixedly connected to the top of the fixing frame, and a collection box is fixedly connected to the top of the mounting plate.

[0010] Compared with the prior art, the utility model has the following beneficial effects:

[0011] In the utility model, by installing the adjustment component, the staff puts the semiconductor pin on the bending mold, and then rotates the adjustment knob to drive the gear and the rack, and the rack drives the baffle to move up and down to adjust the bending angle. When bending, the bending head will be pressed into the bending groove and contact the baffle, and the surfaces of the baffle and the bending head are provided with power connection plates. When the two power connection plates are in contact, a signal is sent to control the cylinder to make the pressure plate rise, thereby facilitating the staff to control the bending angle and improving work efficiency.

[0012] In the utility model, by installing the limit assembly, the staff puts the semiconductor pin on the bending mold, pulls the slider 2 into the slide groove 2, so that the limit plate clamps the semiconductor pin, and then rotates the adjustment knob 2 to tighten the threaded rod into the threaded hole 1 and the threaded hole 2 to fix the limit plate to prevent the semiconductor pin from moving when bending. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The three-dimensional structure of the utility model is shown in FIG. Figure 1 ;

[0014] Figure 2 The three-dimensional structure of the utility model is shown in FIG. Figure 2 ;

[0015] Figure 3 It is a schematic diagram of the partial three-dimensional detailed structure of the utility model;

[0016] Figure 4The detailed structure of the adjustment component of the utility model is shown in FIG. Figure 1 ;

[0017] Figure 5 The detailed structure of the adjustment component of the utility model is shown in FIG. Figure 2 ;

[0018] Figure 6 This is a detailed structural diagram of the limit assembly of the utility model;

[0019] Figure 7 This is a detailed structural diagram of the transmission component of the utility model;

[0020] Figure 8 It is a detailed structural diagram of the bending component of the utility model.

[0021] Figure: 1, bending die; 2, adjustment assembly; 201, bending groove; 202, rotating hole; 203, rotating rod; 204, adjusting knob 1; 205, gear; 206, rack; 207, baffle; 208, slider 1; 209, slide 1; 210, connecting rod; 3, limit assembly; 301, slide 2; 302, slider 2; 303, limit plate; 304, threaded hole 1; 305, screw Threaded rod; 306, adjusting knob two; 307, threaded hole two; 4, transmission assembly; 401, transmission shaft; 402, driving wheel; 403, transmission belt; 404, driven wheel; 405, guard plate; 406, fixed frame; 5, bending assembly; 501, gantry; 502, cylinder; 503, push rod; 504, pressure plate; 505, upper die groove; 506, bending head; 6, mounting plate; 7, collection box. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technical personnel in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-Figure 8The utility model provides a technical solution: an adjustable semiconductor pin bending mechanism, comprising a bending mold 1 and an adjusting component 2, the adjusting component 2 is arranged on the inner side of the bending mold 1, the adjusting component 2 comprises a bending groove 201, the bending groove 201 is opened on the inner side of the bending mold 1, a rotating hole 202 is opened on one side of the bending mold 1, a rotating rod 203 is rotatably connected to the inner side of the rotating hole 202, an adjusting knob 204 is fixedly connected to one side of the rotating rod 203, a gear 205 is fixedly connected to the other side of the rotating rod 203, a rack 206 is meshedly connected to one side of the gear 205, a baffle 207 is fixedly connected to the other side of the rack 206, a slider 208 is fixedly connected to the other side of the baffle 207, a slide groove 209 is opened on one side of the inner wall of the bending groove 201, the slide groove 209 is slidably connected to the slider 208, a connecting rod 210 is fixedly connected to the bottom of the baffle 207, and a limiting component 3 is arranged on the top of the bending mold 1.

[0024] In this embodiment, Figure 1 , Figure 2 , Figure 3 and Figure 6 As shown, the limiting assembly 3 includes a second slide groove 301, the second slide groove 301 is opened at the top of the bending mold 1, the inner side of the second slide groove 301 is slidably connected with a second slider 302, the top of the second slider 302 is fixedly connected with a limiting plate 303, the top of the limiting plate 303 is opened with a threaded hole 304, the inner cavity of the threaded hole 304 is threadedly connected with a threaded rod 305, the top of the threaded rod 305 is fixedly connected with an adjusting knob 2 306, the top of the bending mold 1 is opened with a threaded hole 304, and the inner cavity of the threaded hole 304 is threadedly connected with a threaded rod 305. The top of the threaded rod 305 is fixedly connected with an adjusting knob 2 306. 07. A transmission component 4 is provided below the bending die 1. When using the device, the staff puts the semiconductor pin on the bending die 1, pulls the limit plate 303 to drive the slider 2 302 in the slide groove 2 301, uses the limit plate 303 to clamp the semiconductor pin, and then rotates the adjusting knob 2 306. The adjusting knob 2 306 drives the threaded rod 305, tightens the threaded rod 305 into the threaded hole 1 304 and the threaded hole 2 307, and fixes the limit plate 303.

[0025] In this embodiment, Figure 1 , Figure 2 , Figure 3 and Figure 7 As shown, the transmission component 4 includes a transmission shaft 401, which is arranged below the bending mold 1. A driving wheel 402 is fixedly connected to one side of the transmission shaft 401, a transmission belt 403 is rotatably connected to the outer side of the driving wheel 402, and a driven wheel 404 is arranged on one side of the driving wheel 402.

[0026] In this embodiment, Figure 1 , Figure 2 , Figure 3 and Figure 7As shown, guard plates 405 are provided on both sides of the transmission belt 403, the bottom of the guard plates 405 is fixedly connected with a fixing frame 406, and the top of the guard plates 405 is provided with a bending component 5, and then the transmission motor at the rear end of the transmission shaft 401 is turned on, the transmission motor drives the transmission shaft 401, the transmission shaft 401 drives the driving wheel 402, and the driving wheel 402 drives the transmission belt 403.

[0027] In this embodiment, Figure 1 , Figure 2 and Figure 8 As shown, the bending assembly 5 includes a gantry 501, which is fixedly connected to the top of the guard plate 405, and the top of the gantry 501 is fixedly connected to a cylinder 502, the bottom of the cylinder 502 is fixedly connected to a push rod 503, and the bottom of the push rod 503 is fixedly connected to a pressure plate 504.

[0028] In this embodiment, Figure 1 , Figure 2 and Figure 8 As shown, an upper mold groove 505 is provided at the bottom of the pressing plate 504, bending heads 506 are fixedly connected to both sides of the bottom of the pressing plate 504, a mounting plate 6 is fixedly connected to the top of the fixing frame 406, and a collecting box 7 is fixedly connected to the top of the mounting plate 6. When the bending mold 1 moves to the bottom of the gantry 501, the cylinder 502 is turned on through the control panel, the cylinder 502 pushes the push rod 503, and the push rod 503 pushes the pressing plate 504. At this time, the bending head 506 is pressed into the bending groove 201 and contacts the baffle 207, and the surfaces of the baffle 207 and the bending head 506 are provided with power strips. When the two power strips are in contact, a signal is sent to control the cylinder 502 to make the pressing plate 504 rise.

[0029] The use method and advantages of the utility model: When the adjustable semiconductor pin bending mechanism is used, the working process is as follows:

[0030] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8As shown, when using the device, the staff puts the semiconductor pin on the bending mold 1, pulls the limit plate 303 to drive the slider 2 302 in the slide groove 2 301, uses the limit plate 303 to clamp the semiconductor pin, and then rotates the adjustment knob 2 306, the adjustment knob 2 306 drives the threaded rod 305, and tightens the threaded rod 305 into the threaded hole 1 304 and the threaded hole 2 307 to fix the limit plate 303, then the staff rotates the adjustment knob 1 204, the adjustment knob 1 204 drives the rotating rod 203 to rotate, the rotating rod 203 drives the gear 205 and the rack 206, the rack 206 drives the baffle 207 to move up and down for adjustment, and the adjustment is completed. After completion, the staff puts the bending mold 1 on the conveyor belt 403, and then turns on the transmission motor at the rear end of the transmission shaft 401. The transmission motor drives the transmission shaft 401, the transmission shaft 401 drives the driving wheel 402, and the driving wheel 402 drives the conveyor belt 403. When the bending mold 1 moves to the bottom of the gantry 501, the cylinder 502 is turned on through the control panel, the cylinder 502 pushes the push rod 503, and the push rod 503 pushes the pressure plate 504. At this time, the bending head 506 is pressed into the bending groove 201 and contacts the baffle 207, and the surfaces of the baffle 207 and the bending head 506 are provided with electrical connections. When the two electrical connections are in contact, a signal is sent to control the cylinder 502 to make the pressure plate 504 rise.

[0031] The above shows and describes the basic principle, main features and advantages of the utility model. Technical staff in this industry should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model will have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. An adjustable semiconductor pin bending mechanism, comprising a bending die (1) and an adjustment component (2), characterized in that: The adjustment component (2) is arranged on the inner side of the bending mold (1), and the adjustment component (2) comprises a bending groove (201), the bending groove (201) is opened on the inner side of the bending mold (1), a rotating hole (202) is opened on one side of the bending mold (1), a rotating rod (203) is rotatably connected to the inner side of the rotating hole (202), an adjustment knob 1 (204) is fixedly connected to one side of the rotating rod (203), and a gear (205) is fixedly connected to the other side of the rotating rod (203), and the gear (205) is fixedly connected to the inner side of the rotating hole (202). One side of the wheel (205) is meshingly connected to a rack (206), the other side of the rack (206) is fixedly connected to a baffle (207), the other side of the baffle (207) is fixedly connected to a slider (208), one side of the inner wall of the bending groove (201) is provided with a slide groove (209), the slide groove (209) is slidably connected to the slider (208), the bottom of the baffle (207) is fixedly connected to a connecting rod (210), and a limit position assembly (3) is provided on the top of the bending mold (1).

2. The adjustable semiconductor pin bending mechanism according to claim 1, characterized in that: The limiting assembly (3) comprises a second slide groove (301), wherein the second slide groove (301) is provided at the top of the bending die (1), a second slider (302) is slidably connected to the inner side of the second slide groove (301), the top of the second slider (302) is fixedly connected to a limiting plate (303), a first threaded hole (304) is provided at the top of the limiting plate (303), a threaded rod (305) is threadedly connected to the inner cavity of the first threaded hole (304), an adjusting knob (306) is fixedly connected to the top of the threaded rod (305), a second threaded hole (307) is provided at the top of the bending die (1), and a transmission assembly (4) is arranged below the bending die (1).

3. The adjustable semiconductor pin bending mechanism according to claim 2, characterized in that: The transmission assembly (4) comprises a transmission shaft (401), the transmission shaft (401) being arranged below the bending die (1), a driving wheel (402) being fixedly connected to one side of the transmission shaft (401), a transmission belt (403) being rotatably connected to the outer side of the driving wheel (402), and a driven wheel (404) being arranged on one side of the driving wheel (402).

4. The adjustable semiconductor pin bending mechanism according to claim 3, characterized in that: Guard plates (405) are provided on both sides of the conveyor belt (403); a fixing frame (406) is fixedly connected to the bottom of the guard plate (405); and a bending component (5) is provided on the top of the guard plate (405).

5. The adjustable semiconductor pin bending mechanism according to claim 4, characterized in that: The bending assembly (5) comprises a gantry (501), the gantry (501) being fixedly connected to the top of the guard plate (405), the top of the gantry (501) being fixedly connected to a cylinder (502), the bottom of the cylinder (502) being fixedly connected to a push rod (503), and the bottom of the push rod (503) being fixedly connected to a pressure plate (504).

6. The adjustable semiconductor pin bending mechanism according to claim 5, characterized in that: An upper die groove (505) is provided at the bottom of the pressing plate (504), bending heads (506) are fixedly connected to both sides of the bottom of the pressing plate (504), a mounting plate (6) is fixedly connected to the top of the fixing frame (406), and a collection box (7) is fixedly connected to the top of the mounting plate (6).