Multilayer integrated lamp panel

Abstract

The utility model relates to a multi-layer integrated lamp panel, which comprises a circuit substrate, the circuit substrate comprises an outer layer plate and an inner layer plate which are arranged up and down; the inner-layer plate is connected with the outer-layer plate through a connecting plate; the back of the inner board is provided with an integrated circuit; at least one inner-layer lamp bead is arranged on the inner-layer plate, a plurality of outer-layer lamp beads are arranged on the side edge of the outer-layer plate, a lamp bead ring is arranged on the surface of the middle of the outer-layer plate, and the inner-layer lamp beads, the outer-layer lamp beads and the lamp bead ring are all electrically connected with the integrated circuit. According to the lamp panel, the circuit substrate is integrally stamped and processed, so that the circuit substrate is stamped and divided into a double-layer structure of the inner-layer plate and the outer-layer plate which are arranged up and down, the integrated circuit and the inner-layer lamp beads are arranged on the inner-layer plate, and the lamp bead ring and the outer-layer lamp beads are arranged on the outer-layer plate, so that the heat distribution of the inner-layer plate and the outer-layer plate can be separated, and the heat dissipation effect is better; and the inner-layer lamp beads, the lamp bead ring and the outer-layer lamp beads respectively display three different modes of lighting effects, so that the lighting effects can be freely switched and selected, and the lighting effects are enriched.

Description

Technical Field

[0001] The utility model relates to the technical field of lamps, in particular to a multi-layer integrated lamp panel. Background Art

[0002] The lamp board is used to provide installation support for lamp beads and circuits. The utility model of the existing application number CN201822092581.2 discloses an LED lamp board, including a lamp board, a circuit board, an LED assembly, and an LED driving assembly for connecting a power supply. The LED assembly includes LED lamp beads, and the LED lamp beads are installed on the lamp board. The LED driving assembly includes a diode, a resistor, an inductor, an electrolytic capacitor, and a wire connected to the power supply. The diode and the resistor are installed on the lamp board, and the inductor and the electrolytic capacitor are installed on the circuit board. The lamp board and the circuit board are plugged and fixed, and the LED assembly and the LED driving assembly are electrically connected. The utility model installs the main heat-generating electronic components on the lamp board through the LED lamp board, and the overall heat dissipation effect is good, the power supply efficiency is high, and the lamp board and the circuit board are plugged and fixed, which simplifies the entire assembly and production process, greatly reduces the assembly cost of production, and improves the assembly efficiency. However, since the lamp board is only a single-layer board, the LED lamp beads on the lamp board are only arranged in a single mode, and can only support one lighting display mode, and the lighting effect is relatively simple. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, the purpose of the utility model is to provide a multi-layer integrated light panel, comprising:

[0004] a circuit substrate;

[0005] The circuit substrate comprises an outer layer board and an inner layer board arranged in upper and lower layers;

[0006] The inner plate and the outer plate are connected via a connecting plate;

[0007] The back of the inner layer board is provided with an integrated circuit connected without wires;

[0008] At least one inner lamp bead is arranged on the inner plate, a plurality of outer lamp beads are arranged on the side of the outer plate, a lamp bead ring is arranged on the middle surface of the outer plate, and the inner lamp bead, the outer lamp bead and the lamp bead ring are all electrically connected to the integrated circuit.

[0009] Furthermore, in the utility model, the inner layer plate is located inside the outer layer plate.

[0010] Furthermore, in the present invention, the circuit substrate is formed by integral stamping and segmented bending.

[0011] Furthermore, in the present invention, the circuit substrate is a circular plate, and the inner layer plate is divided out along a circular path.

[0012] Furthermore, in the present utility model, when there is one inner layer lamp bead, it is arranged at the center of the other side of the inner layer board away from the integrated circuit.

[0013] Furthermore, the utility model provides that the lamp bead ring and the inner layer lamp beads are on the same side, and when the lamp bead ring faces upward, the inner layer plate is located at the lower layer of the lower layer plate.

[0014] Furthermore, the utility model provides that the plurality of outer layer lamp beads are evenly arranged along the center of the outer layer plate and protrude toward the back side of the outer layer plate.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] This lamp board is punched out as a whole on the circuit substrate, thereby punching and dividing it into a double-layer structure of an inner plate and an outer plate arranged in the upper and lower layers. The integrated circuit and inner lamp beads are arranged on the inner plate, and the lamp bead ring and outer lamp beads are arranged on the outer plate, thereby being able to separate the heat distribution of the inner plate and the outer plate, and the heat dissipation effect is better. In addition, the inner lamp beads, lamp bead ring and outer lamp beads respectively display three different modes of lighting effects, which can be switched arbitrarily to enrich the lighting effects.

[0017] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of a double-layer integrated light panel;

[0019] Figure 2 It is a top view schematic diagram of a double-layer integrated light panel. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0021] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] This embodiment provides a multi-layer integrated light board, including: a circuit substrate 1, wherein the circuit substrate 1 is a circular plate.

[0025] In particular, Figure 1 and Figure 2 As shown, the circuit substrate 1 includes an outer layer board 10 and an inner layer board 11 arranged in upper and lower layers, the inner layer board 11 is connected to the outer layer board 10 by a connecting board 12, and the circuit substrate 1 is integrally stamped and split and bent, that is, the circuit substrate 1 is processed as a whole, preferably split into a double-layer structure of an outer layer board 10 and an inner layer board 11 by stamping.

[0026] In this embodiment, preferably, the inner plate 11 is located inside the outer plate 10, and the inner plate 11 is divided along a circular path.

[0027] Secondly, an integrated circuit with no wire connection is provided on the back of the inner layer board 11 .

[0028] In the present embodiment, more specifically, at least one inner layer lamp bead 2 is provided on the inner layer board 11. When there is only one inner layer lamp bead 2, it is provided at the center of the other side of the inner layer board 11 away from the integrated circuit. When there are multiple inner layer lamp bead 2, there are countless arrangements, which can be arbitrarily designed and arranged according to needs, and this embodiment will not be elaborated further.

[0029] Furthermore, a plurality of outer lamp beads 3 are provided on the side of the outer plate 10, and the plurality of outer lamp beads 3 are evenly arranged along the center of the outer plate 10 and protrude toward the back side of the outer plate 10. When the outer lamp beads 3 are lit, light is emitted from the side.

[0030] In addition, a lamp bead ring 4 is provided on the middle surface of the outer layer board 10, and the inner layer lamp beads 2, the outer layer lamp beads 3 and the lamp bead ring 4 are all electrically connected to the integrated circuit. Preferably, the lamp bead ring 4 and the inner layer lamp beads 2 are on the same side, and when the lamp bead ring 4 is facing upward, the inner layer board 11 is located at the lower layer of the lower layer board.

[0031] The integrated circuit and the inner lamp beads 2 are arranged on the inner plate 11, and the lamp bead ring 4 and the outer lamp beads 3 are arranged on the outer plate 10, thereby separating the heat distribution of the inner plate 11 and the outer plate 10, and achieving a better heat dissipation effect.

[0032] In addition, the inner lamp beads 2, the lamp bead ring 4 and the outer lamp beads 3 respectively display three different modes of lighting effects, which can be switched at will to enrich the lighting effects.

[0033] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A multi-layer integrated light panel, It is characterized in that include: a circuit substrate; The circuit substrate comprises an outer layer board and an inner layer board arranged in upper and lower layers; The inner plate and the outer plate are connected via a connecting plate; The back of the inner layer board is provided with an integrated circuit connected without wires; At least one inner lamp bead is arranged on the inner plate, a plurality of outer lamp beads are arranged on the side of the outer plate, a lamp bead ring is arranged on the middle surface of the outer plate, and the inner lamp bead, the outer lamp bead and the lamp bead ring are all electrically connected to the integrated circuit.

2. A multi-layer integrated light panel according to claim 1, It is characterized in that The inner layer plate is located inside the outer layer plate.

3. The multi-layer integrated light panel according to claim 1, It is characterized in that The circuit substrate is formed by integral stamping and segmentation and bending.

4. The multi-layer integrated light panel according to claim 1, It is characterized in that The circuit substrate is a circular plate, and the inner layer plate is divided out along a circular path.

5. The multi-layer integrated light panel according to claim 1, It is characterized in that When there is one inner lamp bead, it is arranged at the center of the other side of the inner layer board away from the integrated circuit.

6. The multi-layer integrated light panel according to claim 1, It is characterized in that The lamp bead ring and the inner layer lamp beads are on the same side, and when the lamp bead ring faces upward, the inner layer plate is located at the lower layer of the lower layer plate.

7. The multi-layer integrated light panel according to claim 1, It is characterized in that The plurality of outer layer lamp beads are evenly arranged along the center of the outer layer plate and protrude toward the back side of the outer layer plate.

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