Semiconductor silicon wafer heating device

Abstract

The utility model discloses a semiconductor silicon wafer heating device, and belongs to the technical field of semiconductor processing. The semiconductor silicon wafer heating device comprises a box body; the heating mechanism is mounted on the box body, and a heating station for placing a silicon wafer is formed on the heating mechanism; the temperature sensor is mounted on the box body, and the temperature sensor is used for detecting temperature information of the heating station; the alarm device is mounted on the box body; and the controller is installed on the box body, the controller is electrically connected with the temperature sensor and the alarm device, and the controller is used for controlling the alarm device to work according to the temperature information of the temperature sensor. The temperature sensor is arranged to detect whether the silicon wafer on the heating station is placed in place or not, and the alarm device is arranged to send alarm information when the silicon wafer is not placed in place, so that a technician is reminded to adjust the position in time, and the probability of uneven baking caused by the fact that the silicon wafer is not placed in place is reduced.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and in particular, relates to a semiconductor silicon wafer heating device. Background Art

[0002] In the processing procedure of semiconductor silicon wafers, the silicon wafers need to be placed on a hot plate for baking to remove the photoresist solvent on the silicon wafers. However, generally, silicon wafers are processed using fully automated equipment, and the silicon wafers are automatically placed on the heating plate by a robot. If the operating deviation of the robot causes the silicon wafer to be placed abnormally, the silicon wafer will not be completely placed on the hot plate and will not be completely baked, affecting the drying effect of the silicon wafer. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a semiconductor silicon wafer heating device to promptly issue an alarm message when the semiconductor silicon wafer is not placed in the correct position, thereby reducing the probability of uneven baking due to the silicon wafer not being placed in place and improving the finished product yield.

[0004] In a first aspect, the present application provides a semiconductor silicon wafer heating device, comprising:

[0005] Box;

[0006] A heating mechanism is installed on the box, and the heating mechanism forms a heating station for placing the silicon wafer;

[0007] A temperature sensor is installed on the box, and is used to detect the temperature information of the heating station;

[0008] An alarm device, installed on the box;

[0009] A controller is installed on the box body, and the controller is electrically connected to the temperature sensor and the alarm device respectively. The controller is used to control the alarm device to work according to the temperature information of the temperature sensor.

[0010] According to the semiconductor silicon wafer heating device of the present application, a temperature sensor is provided to detect whether the silicon wafer on the heating station is in place, and an alarm device is provided to send out an alarm message when the silicon wafer is not in place, so as to remind the technicians to adjust the position in time, thereby reducing the probability of uneven baking due to the silicon wafer not being in place and improving the yield of the finished product.

[0011] According to one embodiment of the present application, the heating mechanism includes:

[0012] A heating plate is installed on the upper side of the box, the upper surface of the heating plate forms the heating station, and the temperature sensor is installed in the box and located at the lower side of the heating plate;

[0013] A cover body is movably mounted on the upper side of the heating plate in the up-down direction, and when the cover body moves to the lower end, it covers the heating station;

[0014] A driving assembly is installed on the box body, and the driving assembly is connected to the cover body for driving the cover body to move in the up and down directions.

[0015] According to an embodiment of the present application, the radial dimension of the cover body is the same as the radial dimension of the heating plate.

[0016] According to one embodiment of the present application, the cover body is provided with a smoke exhaust port, and the smoke exhaust port is connected to the heating station.

[0017] According to an embodiment of the present application, a smoke exhaust channel is formed in the driving assembly, and one end of the smoke exhaust channel is connected to the smoke exhaust port.

[0018] According to one embodiment of the present application, the driving assembly includes:

[0019] A telescopic column extending in the up-down direction, wherein the telescopic column is mounted on the box body;

[0020] A support member is connected between the upper end of the telescopic column and the cover body.

[0021] According to one embodiment of the present application, the support member includes a main body section, a support section and a connecting section, the cover body is installed on the main body section, both ends of the main body section are connected to the support section, and a bending structure is formed with the support section, one end of the support section away from the main body section is connected to the connecting section, and the connecting section is connected to the upper end of the telescopic column.

[0022] According to one embodiment of the present application, the alarm device includes:

[0023] A warning light is installed on the box.

[0024] According to an embodiment of the present application, at least two warning lights are provided, and the two warning lights have different colors.

[0025] According to an embodiment of the present application, the alarm device includes a speaker installed on the box.

[0026] According to one embodiment of the present application, the temperature sensor includes a plurality of temperature sensing probes, and the plurality of temperature sensing probes are evenly distributed along the circumference of the heating station.

[0027] According to one embodiment of the present application, the controller includes:

[0028] a first comparator, the first comparator being electrically connected to the temperature sensor and configured to compare a detection value of the temperature sensor with a preset minimum threshold;

[0029] a second comparator, the second comparator being electrically connected to the temperature sensor and configured to compare a detection value of the temperature sensor with a preset maximum threshold;

[0030] A processor is electrically connected to the first comparator and the second comparator respectively, and is used to output a control instruction based on the comparison result, wherein the control instruction is used to control the alarm device.

[0031] According to one embodiment of the present application, the controller includes:

[0032] A subtractor, the subtractor being electrically connected to the temperature sensor and used for calculating a difference between a detection value of the temperature sensor and a preset temperature threshold;

[0033] a comparator, the comparator being electrically connected to the subtractor and configured to compare the difference with a target threshold;

[0034] A processor is electrically connected to the comparator and is used to output a control instruction based on the comparison result, wherein the control instruction is used to control the alarm device.

[0035] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0037] Figure 1 This is one of the structural schematic diagrams of the semiconductor silicon wafer heating device provided in the embodiment of the present application;

[0038] Figure 2 This is one of the partial cross-sectional views of the semiconductor silicon wafer heating device provided in the embodiment of the present application;

[0039] Figure 3 It is one of the structural schematic diagrams of the cover body and the drive assembly provided in the embodiment of the present application;

[0040] Figure 4 This is one of the structural block diagrams of the semiconductor silicon wafer heating device provided in the embodiment of the present application.

[0041] Reference numerals:

[0042] Semiconductor silicon wafer heating device 100;

[0043] Box 110;

[0044] Heating mechanism 120, heating plate 121, cover 122, driving assembly 123, telescopic column 124, support member 125, main body section 125a, support section 125b, connecting section 125c;

[0045] Temperature sensor 130;

[0046] Alarm device 140, warning light 141, speaker 142;

[0047] Controller 150;

[0048] Power module 160. DETAILED DESCRIPTION

[0049] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0050] Reference below Figure 1-Figure 3 A semiconductor silicon wafer heating device 100 according to an embodiment of the present application is described.

[0051] like Figure 1 and Figure 2 As shown, the semiconductor silicon wafer heating device 100 includes a box body 110 , a heating mechanism 120 , a temperature sensor 130 , an alarm device 140 and a controller 150 .

[0052] The heating mechanism 120 is installed on the box 110, and the heating mechanism 120 forms a heating station for placing the silicon wafer. The silicon wafer is placed on the heating station to heat the silicon wafer. In this embodiment, the heating method of the heating mechanism 120 is contact heating, so when the surface of the silicon wafer is completely attached to the surface of the heating station, the silicon wafer is determined to be placed in the correct position. It should be noted that the area of ​​the silicon wafer can match the size of the heating station, so that the silicon wafer is determined to be placed in the correct position when the silicon wafer completely covers the heating station; or, the area of ​​the heating station can be larger than the area of ​​the silicon wafer, and a specified area is demarcated on the heating station. The baking effect is best when the silicon wafer is placed in the specified area, and the silicon wafer is determined to be placed in the correct position when the silicon wafer is placed in the specified area.

[0053] The temperature sensor 130 is installed on the box body 110. The temperature sensor 130 is used to detect the temperature information of the heating station. When a silicon wafer is placed on the heating station, the temperature of the position where the silicon wafer is placed will be different from the temperature of the position where the silicon wafer is not placed. The temperature sensor 130 can be used to pre-collect the temperature when a semiconductor is placed on the heating station, and detect the temperature of the position where the silicon wafer should be placed on the heating station in real time.

[0054] The alarm device 140 is installed on the box 110 and can send out alarm information. The alarm information sent out by the alarm device 140 includes but is not limited to sound information, light wave information, electronic information, etc.

[0055] The controller 150 is installed in the box 110, and the controller 150 is electrically connected to the temperature sensor 130 and the alarm device 140 respectively. The controller 150 is used to control the alarm device 140 to work according to the temperature information of the temperature sensor 130. The controller 150 can obtain the temperature information of the temperature sensor 130, and determine whether the temperature information meets the preset temperature information, and control the alarm device 140 to send out an alarm message when the temperature information of the temperature sensor 130 does not meet the preset temperature information.

[0056] It is understandable that the controller 150 may also be electrically connected to the heating mechanism 120, and when it is detected that the silicon wafer is not placed in the correct position, the heating mechanism 120 is controlled to stop working.

[0057] In actual implementation, the controller 150 can control the heating mechanism 120 to work in advance for preheating, or control the heating mechanism 120 to start working after the silicon wafer is placed in the heating station. After the silicon wafer is placed in the heating station and the heating mechanism 120 starts working, the temperature sensor 130 obtains the temperature information of the heating station in real time. When the controller 150 detects that the temperature information of the position where the silicon wafer should be placed does not meet the preset temperature information, it determines that the silicon wafer is not placed in the correct position, and controls the alarm device 140 to issue an alarm message. The technicians conduct inspections in time after receiving the alarm message.

[0058] According to the semiconductor silicon wafer heating device 100 provided in the embodiment of the present application, a temperature sensor 130 is provided to detect whether the silicon wafer on the heating station is in place, and an alarm device 140 is provided to send out an alarm message when the silicon wafer is not in place, so as to remind the technicians to adjust the position in time, reduce the probability of uneven baking due to the silicon wafer not being in place, and improve the yield of the finished product.

[0059] like Figure 1-Figure 3 As shown, according to some embodiments of the present application, the heating mechanism 120 may include a heating plate 121 , a cover body 122 and a driving assembly 123 .

[0060] In this embodiment, the heating plate 121 can be installed on the upper side of the box 110, the upper surface of the heating plate 121 can form a heating station, and the temperature sensor 130 can be installed in the box 110 and located at the lower side of the heating plate 121. The silicon wafer can be placed on the upper surface of the heating plate 121, and a heating component can be provided in the heating plate 121, and the heating component can include but is not limited to a heating wire or a heating plate, etc. When the heating plate 121 performs heating work, the temperature of the heating station can be made relatively uniform, so that the surface of the silicon wafer can be dried evenly.

[0061] The temperature sensor 130 can be a contact temperature sensor 130. By arranging the temperature sensor 130 in the box 110 and at the lower side of the heating plate 121, the size of the equipment can be reduced. When the heating plate 121 heats the silicon wafer located on the upper surface of the heating plate 121, the generated temperature change will be transmitted to the box 110 through the heating plate 121, and then the temperature change of the heating plate 121 will be detected by the temperature sensor 130.

[0062] In this embodiment, the cover body 122 can be movably installed on the upper side of the heating plate 121 in the up-down direction, and the cover body 122 is arranged on the heating station when it moves to the lower end. The driving component 123 can be installed on the box body 110, and the driving component 123 is connected to the cover body 122 for driving the cover body 122 to move in the up-down direction.

[0063] The cover 122 can be placed on the processing station so that the cover 122 and the heating plate 121 define a heating space to improve the baking effect of the silicon wafer. By setting a driving component 123, the cover 122 is driven to move in the up and down directions, so that when the cover 122 moves to the upper position, it is convenient to place and take out the silicon wafer.

[0064] According to some embodiments of the present application, the temperature sensor 130 may include a plurality of temperature sensing probes, and the plurality of temperature sensing probes are evenly distributed along the circumference of the heating station.

[0065] By setting a plurality of temperature sensing probes, the temperature of each position of the area where the silicon wafer is placed in the heating station is detected. For example, the temperature sensing probe of the temperature sensor 130 can be set on the upper surface of the heating plate 121 to detect the temperature of the silicon wafer placed on the heating plate 121.

[0066] It is understandable that the more temperature sensing probes there are, the higher the detection accuracy and the more accurate the position determination. The specific number is not limited here.

[0067] like Figure 1 As shown, according to some embodiments of the present application, the radial dimension of the cover body 122 may be the same as the radial dimension of the heating plate 121 .

[0068] In this embodiment, by setting the radial dimension of the cover body 122 to be the same as the radial dimension of the heating disk 121, when the cover body 122 moves to the lower position, the upper surface of the heating disk 121 can be completely covered by the cover body 122, so that the heating station on the upper surface of the heating disk 121 is completely located in the heating space, the temperature is more uniform, and it is easier to detect and judge.

[0069] According to some embodiments of the present application, the cover body 122 may be provided with a smoke exhaust port, and the smoke exhaust port may be connected to the heating station.

[0070] In this embodiment, a smoke exhaust port connected to the heating station can be provided on the cover body 122. When the heating plate 121 bakes the silicon wafer, part of the photoresist solvent on the surface of the silicon wafer will evaporate to form smoke. The smoke can be discharged in time by setting the smoke exhaust port to prevent the smoke from adhering to the surface of the heating plate 121 or the cover body 122, which will affect the heating effect and detection accuracy of the heating plate 121 after long-term use.

[0071] According to some embodiments of the present application, a smoke exhaust channel is formed in the driving assembly 123, and one end of the smoke exhaust channel is connected to the smoke exhaust port.

[0072] In this embodiment, the driving assembly 123 and the cover body 122 drive the cover body 122 to move in the up and down directions, and a smoke exhaust passage may be formed in the driving assembly 123 .

[0073] In actual implementation, the driving component 123 can be connected to the position where the smoke exhaust port is provided in the cover body 122, and one end of the smoke exhaust channel in the driving component 123 is connected to the smoke exhaust port, so that the driving component 123 can not only drive the cover body 122 to move, but also exhaust the smoke in the heating space through the smoke exhaust channel. The other end of the smoke exhaust channel can be connected to the smoke recovery device.

[0074] like Figure 1 and Figure 3 As shown, according to some embodiments of the present application, the driving assembly 123 may include a telescopic column 124 and a support member 125, the telescopic column 124 may extend in the up and down directions, the telescopic column 124 may be installed in the box body 110, and the support member 125 may be connected between the upper end of the telescopic column 124 and the cover body 122.

[0075] In this embodiment, the telescopic column 124 can be installed on the box 110 to make the device more integrated and convenient to move and use. The telescopic column 124 can be telescopically arranged in the up-down direction to drive the support member 125 connected to the upper end of the telescopic column 124 to move in the up-down direction, thereby driving the cover body 122 to move in the up-down direction.

[0076] Exemplarily, the telescopic column 124 may be an electric telescopic rod, which is convenient for controlling the movable position of the cover body 122. In another example, the telescopic column 124 may also be a cylinder push rod, which is driven by the cylinder to move in the up and down directions.

[0077] like Figure 3 As shown, according to some embodiments of the present application, the support member 125 may include a main body section 125a, a support section 125b and a connecting section 125c, the cover body 122 is installed on the main body section 125a, both ends of the main body section 125a are connected to the support section 125b, and a bending structure is formed with the support section 125b, the end of the support section 125b away from the main body section 125a is connected to the connecting section 125c, and the connecting section 125c is connected to the upper end of the telescopic column 124.

[0078] In this embodiment, two telescopic columns 124 may be provided, and the two telescopic columns 124 are respectively disposed on both sides of the heating plate 121 .

[0079] The main section 125a extends in the horizontal direction and is arranged on the upper side of the cover body 122. To improve the overall structural strength and stability, the main section 125a passes through the center of the cover body 122 and is connected to the center of the cover body 122. Both ends of the main section 125a are connected to the upper end of the telescopic column 124 through the support section 125b and the connecting section 125c, so that the telescopic column 124 can drive the main section 125a and the cover body 122 to move in the up and down directions.

[0080] In this embodiment, the lower end of the telescopic column 124 is fixedly mounted on the upper surface of the box body 110. In order to allow the cover body 122 to have sufficient space for movement, the telescopic column 124 has a certain initial height so that when the upper end of the telescopic column 124 moves to the lowest point, it is still separated from the upper surface of the heating plate 121 by a certain distance.

[0081] The support section 125b is bent and connected to the main section 125a to form a bending structure. Specifically, the bending section is connected to the main section 125a and bent upward, the upper end of the bending section is connected to the connecting section 125c, the connecting section 125c is bent and connected to the bending section, and the connecting section 125c is bent in a horizontal direction to connect to the upper end of the telescopic column 124.

[0082] According to the support member 125 provided in the embodiment of the present application, a support section 125b extending in the up-down direction is provided so that the cover body 122 can cover the upper surface of the heating plate 121 when it moves to the lower position, and two telescopic columns 124 are provided to ensure high stability of the support structure.

[0083] In some embodiments, the main section 125a, the support section 125b, the connecting section 125c and the telescopic column 124 may be hollow, so that the main section 125a, the support section 125b, the connecting section 125c and the telescopic column 124 together define the smoke exhaust channel in the aforementioned embodiment.

[0084] like Figure 1 As shown, according to some embodiments of the present application, the alarm device 140 may include a warning light 141, and the warning light 141 is installed on the box 110. When the controller 150 determines that the silicon wafer is not placed in the correct position, the warning light 141 of the alarm device 140 may be controlled to light up to remind the technician to check in time. The warning light 141 may be set on the front side of the box 110 for the technician to observe.

[0085] like Figure 1 As shown, according to some embodiments of the present application, at least two warning lights 141 may be provided, and the colors of the two warning lights 141 may be different.

[0086] In this embodiment, at least two warning lights 141 are provided to convey different information. For example, the colors of the two warning lights 141 can be green and red, respectively. When the controller 150 detects that the silicon wafer is placed in the correct position, the green light is on and the red light is off, and the alarm device 140 does not issue an alarm message; when the controller 150 detects that the silicon wafer is not placed in the correct position, the red light is on and the green light is off, and the alarm device 140 issues an alarm message.

[0087] It is understandable that the number of warning lights 141 can be more than two, such as Figure 1 As shown, exemplarily, the number of warning lights 141 can be three, and the colors of the three warning lights 141 can be green, yellow and red respectively. The difference from the previous example is that in this example, when no silicon wafer is placed in the heating station, the equipment is in standby mode, the yellow light is on, and the red and green lights are off.

[0088] like Figure 1 As shown, according to some embodiments of the present application, the alarm device 140 may include a speaker 142, and the speaker 142 may be installed on the box 110. When the controller 150 determines that the silicon wafer is not placed in the correct position, the speaker 142 of the alarm device 140 may be controlled to emit an alarm sound to remind the technician to check in time. The speaker 142 may be set on the front side of the box 110 to facilitate the propagation of sound.

[0089] It should be noted that there may be a plurality of speakers 142, and the specific number of speakers 142 is not limited herein. For example, there may be two speakers 142, and the two speakers 142 may be arranged at the front side of the box 110 and spaced apart in the left-right direction.

[0090] In some embodiments, Figure 4 As shown, the semiconductor silicon wafer heating device 100 may further include a power module 160, which may be electrically connected to the temperature sensor 130 and the controller 150, respectively, to supply power to the temperature sensor 130 and the controller 150, and the controller 150 may be electrically connected to the alarm device 140 to send control instructions to the alarm device 140 and supply power to the alarm device 140.

[0091] It is understandable that, in another embodiment, the power module 160 may also be directly electrically connected to the alarm device 140, and the alarm device 140 may be powered directly by the power module 160. Similarly, the temperature sensor 130 may also be powered by the controller 150.

[0092] In some embodiments, the controller 150 may include a first comparator, a second comparator, and a processor.

[0093] The first comparator can be electrically connected to the temperature sensor 130, and the first comparator can be used to compare the detection value of the temperature sensor 130 with a preset minimum threshold; the second comparator can be electrically connected to the temperature sensor 130, and the second comparator can be used to compare the detection value of the temperature sensor 130 with a preset maximum threshold.

[0094] In this embodiment, the detection value of the temperature sensor 130 includes actual temperature information. A temperature threshold range can be set according to the temperature value obtained in the pre-collection process. The preset minimum threshold can be the minimum value of the temperature threshold range, and the preset maximum threshold can be the maximum value of the temperature threshold range. The first comparator is used to compare the actual temperature information with the preset minimum threshold, and the second comparator is used to compare the actual temperature information with the preset maximum threshold.

[0095] The processor may be electrically connected to the first comparator and the second comparator respectively, and the processor may be used to output a control instruction based on the comparison result, and the control instruction is used to control the alarm device 140 .

[0096] In this embodiment, when the comparison result output by the first comparator is that the detection value of the temperature sensor 130 is less than the preset minimum threshold, or the comparison result output by the second comparator is that the detection value of the temperature sensor 130 is greater than the preset maximum threshold, it is considered that the silicon wafer is not placed in the correct position, and the processor can control the alarm device 140 to issue an alarm message based on the above results.

[0097] When the comparison result output by the first comparator is that the detection value of the temperature sensor 130 is not less than the preset minimum threshold, and the comparison result output by the second comparator is that the detection value of the temperature sensor 130 is not greater than the preset maximum threshold, it is considered that the silicon wafer is placed in the correct position and the processor may not issue a control instruction.

[0098] In yet other embodiments, the controller 150 may include a subtractor, a comparator, and a processor.

[0099] The subtractor may be electrically connected to the temperature sensor 130 , and the subtractor may be used to calculate the difference between the detection value of the temperature sensor 130 and the preset temperature threshold; the comparator may be electrically connected to the subtractor, and the comparator may be used to compare the difference with the target threshold.

[0100] In this embodiment, the detection value of the temperature sensor 130 includes actual temperature information. The preset temperature threshold and the target threshold are determined based on the temperature value obtained during the pre-acquisition process. The subtractor can calculate the difference between the detection value of the temperature sensor 130 and the preset temperature threshold, and the comparator can be used to compare the difference with the target threshold.

[0101] The processor may be electrically connected to the comparator, and the processor may be used to output a control instruction based on the comparison result, and the control instruction is used to control the operation of the alarm device 140 .

[0102] In this embodiment, when a silicon wafer is placed on the heating plate 121, the temperature increase of the heating plate 121 can heat the silicon wafer to a preset temperature threshold. When the position of the silicon wafer placed on the heating plate 121 is offset, resulting in a temperature sensor probe not being in contact with the silicon wafer, the temperature detected by the temperature sensor probe is generally lower than the preset temperature threshold. Therefore, when the silicon wafer is not placed in the correct position, the actual temperature information of the position without the silicon wafer is generally lower than the preset temperature threshold.

[0103] In actual execution, when calculating, the subtractor subtracts the detection value of the temperature sensor 130 from the preset temperature threshold to obtain the difference; the comparator determines the size of the difference and the target threshold. If the difference is greater than the target threshold, it indicates that the actual temperature of the position is greater than the normal temperature and exceeds the reasonable temperature range. The silicon wafer is not placed in the correct position, and the processor outputs a control instruction to control the alarm device 140 to issue an alarm message; if the difference is not greater than the target threshold, it indicates that the actual temperature of the position is in a reasonable range, the silicon wafer is placed in the correct position, and the processor may not issue a control instruction.

[0104] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0105] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0106] In the description of this application, "first feature" or "second feature" may include one or more of the features.

[0107] In the description of the present application, “plurality” means two or more.

[0108] In the description of the present application, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0109] In the description of the present application, “above”, “over” and “above” a first feature to a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0110] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0111] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A semiconductor silicon wafer heating device, characterized in that: include: Box; A heating mechanism is installed on the box, and the heating mechanism forms a heating station for placing the silicon wafer; A temperature sensor is installed on the box, and is used to detect the temperature information of the heating station; An alarm device, installed on the box; A controller is installed on the box body, and the controller is electrically connected to the temperature sensor and the alarm device respectively. The controller is used to control the alarm device to work according to the temperature information of the temperature sensor.

2. The semiconductor silicon wafer heating device according to claim 1, characterized in that: The heating mechanism comprises: A heating plate is installed on the upper side of the box, the upper surface of the heating plate forms the heating station, and the temperature sensor is installed in the box and located at the lower side of the heating plate; A cover body is movably mounted on the upper side of the heating plate in the up-down direction, and when the cover body moves to the lower end, it covers the heating station; A driving assembly is installed on the box body, and the driving assembly is connected to the cover body for driving the cover body to move in the up and down directions.

3. The semiconductor silicon wafer heating device according to claim 2, characterized in that: The radial dimension of the cover body is the same as the radial dimension of the heating plate.

4. The semiconductor silicon wafer heating device according to claim 2, characterized in that: The cover body is provided with a smoke exhaust port, and the smoke exhaust port is connected to the heating station.

5. The semiconductor silicon wafer heating device according to claim 4, characterized in that: A smoke exhaust channel is formed in the driving component, and one end of the smoke exhaust channel is connected to the smoke exhaust port.

6. The semiconductor silicon wafer heating device according to claim 2, characterized in that: The drive assembly comprises: A telescopic column extending in the up-down direction, wherein the telescopic column is mounted on the box body; A support member is connected between the upper end of the telescopic column and the cover body.

7. The semiconductor silicon wafer heating device according to claim 6, characterized in that: The support member includes a main body section, a support section and a connecting section. The cover body is installed on the main body section. Both ends of the main body section are connected to the support section and form a bending structure with the support section. One end of the support section away from the main body section is connected to the connecting section, and the connecting section is connected to the upper end of the telescopic column.

8. The semiconductor silicon wafer heating device according to any one of claims 1 to 7, characterized in that: The alarm device comprises: A warning light is installed on the box.

9. The semiconductor silicon wafer heating device according to claim 8, characterized in that: There are at least two warning lights, and the two warning lights have different colors.

10. The semiconductor silicon wafer heating device according to any one of claims 1 to 7, characterized in that: The alarm device comprises a speaker installed on the box.

11. The semiconductor silicon wafer heating device according to any one of claims 1 to 7, characterized in that: The temperature sensor includes a plurality of temperature sensing probes, and the plurality of temperature sensing probes are evenly distributed along the circumference of the heating station.

12. The semiconductor silicon wafer heating device according to any one of claims 1 to 7, characterized in that: The controller comprises: a first comparator, the first comparator being electrically connected to the temperature sensor and configured to compare a detection value of the temperature sensor with a preset minimum threshold; a second comparator, the second comparator being electrically connected to the temperature sensor and configured to compare a detection value of the temperature sensor with a preset maximum threshold; A processor is electrically connected to the first comparator and the second comparator respectively, and is used to output a control instruction based on the comparison result, wherein the control instruction is used to control the alarm device.

13. The semiconductor silicon wafer heating device according to any one of claims 1 to 7, characterized in that: The controller comprises: A subtractor, the subtractor being electrically connected to the temperature sensor and used for calculating a difference between a detection value of the temperature sensor and a preset temperature threshold; a comparator, the comparator being electrically connected to the subtractor and configured to compare the difference with a target threshold; A processor is electrically connected to the comparator and is used to output a control instruction based on the comparison result, wherein the control instruction is used to control the alarm device.

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