Automatic ring pasting equipment for chip semiconductor brazing processing

Abstract

The utility model discloses automatic ring pasting equipment for chip semiconductor brazing processing. The automatic ring pasting equipment comprises a feeding unit and a ring pasting unit, wherein the feeding unit is used for realizing processing feeding and discharging; the ring pasting unit is used for realizing ring pasting processing; the feeding unit comprises a product feeding set used for feeding of to-be-machined products, a product discharging set used for discharging of machined products and a product transferring set used for transferring. The ring pasting unit comprises a ring pasting feeding set used for ring pasting raw material feeding work, a dispensing machining set used for achieving ring pasting dispensing work and a machining material transferring set used for driving a product to be machined to be switched among the machining positions of the ring pasting feeding set, the dispensing machining set and the product material transferring set. In the ring pasting processing work of the chip semiconductors, the automatic feeding and ring pasting processing action of the chip semiconductors is achieved by arranging the ring pasting feeding set and the dispensing processing set in the ring pasting unit, accurate ring pasting processing can be achieved, and the high-quality ring pasting processing effect is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip semiconductor processing and relates to automatic ring pasting equipment for chip semiconductor brazing processing. Background Art

[0002] The integrated circuit (IC) industry is a high-speed growth point in the current global economic development. Among them, the advancement of semiconductor manufacturing technology and the rapid growth of market demand for tiny chips have made the chip I / O density higher and higher, and the chip lead spacing and pad diameter continue to decrease. At the same time, in order to improve production efficiency, the packaging speed has increased year by year, which has put forward extremely high requirements on the positioning accuracy and operating speed of post-packaging equipment. The ring bonding equipment determines the accuracy, efficiency and stability of the chip ring bonding process and is a key equipment in the chip packaging process.

[0003] At present, the common glue dispensing ring pasting processing technology is mainly realized by the combination of manual and semi-automatic ring pasting equipment, but the overall automation degree of this processing method is low, and the production efficiency is greatly related to the operation level of the workers. Especially when the product to be processed is a tiny device that is difficult to locate, the consistency of the glue amount, position and position of the glue droplet and the position of the ring pasting is difficult to ensure, so the reliability is poor; therefore, for this field, how to automate the ring pasting process of semiconductor products is one of the technical problems that the technicians in this field urgently need to solve. Utility Model Content

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0005] An automatic ring pasting device for chip semiconductor brazing processing comprises: a processing machine, on which are arranged: a feeding unit for realizing loading and unloading of processing, and a ring pasting unit for realizing ring pasting processing;

[0006] The feeding unit includes: a product loading group for loading products to be processed, a product unloading group for unloading processed products, and a product transfer group for transferring materials;

[0007] The ring sticking unit includes: a ring sticking feeding group for feeding the ring sticking raw materials, a glue dispensing processing group for realizing the ring sticking glue dispensing work, and a processing transfer group for driving the product to be processed to switch between the processing positions of the ring sticking feeding group, the glue dispensing processing group and the product transfer group.

[0008] As a further solution of the utility model: both the product loading group and the product unloading group adopt a clip-type silo structure.

[0009] As a further solution of the utility model: the glue dispensing processing group includes: a glue dispensing lateral movement module arranged at the upper end of the processing material transfer group and a glue dispensing mechanism installed on the glue dispensing lateral movement module, and the glue dispensing lateral movement module is arranged vertically to the material transfer working direction of the processing material transfer group;

[0010] The dispensing mechanism includes: a group of Z-axis dispensing modules, a dispensing module installed on the Z-axis dispensing module, and a dispensing visual positioning module.

[0011] As a further solution of the utility model: a plurality of groups of glue dispensing mechanisms are arranged on the glue dispensing transverse shift module of the glue dispensing processing group, and the number of the processing and material transfer groups corresponds to the number of the glue dispensing mechanisms.

[0012] As a further solution of the utility model: the dispensing mechanism also includes: a group of needle correction sensors, which are arranged in the working formation area of ​​the dispensing lateral movement module.

[0013] As a further solution of the utility model: the ring sticking feeding group includes: a feeding vibration plate, a ring sticking transverse movement module and a ring sticking module installed on the ring sticking transverse movement module.

[0014] As a further solution of the utility model: the ring sticking feeding group also includes: a ring sticking visual module arranged between the feeding vibration plate and the processing transfer group.

[0015] As a further solution of the utility model: a plurality of groups of ring sticking modules are installed on the ring sticking transverse movement module of the ring sticking feeding group.

[0016] As a further solution of the utility model: the processing material transfer group includes: a group of material transfer moving modules starting from the product material transfer group, extending to the ring pasting material group position through the glue dispensing processing group, and the material transfer moving module is equipped with a material placement table for placing the products to be processed.

[0017] As a further solution of the utility model: the product transfer group includes: a material taking device for realizing product material taking;

[0018] An X-axis material transfer module extending from the product loading group to the product unloading group, a Y-axis material transfer module extending from the product loading group and the product unloading group to the processing material transfer group, and a Z-axis material transfer module used to realize lifting and picking up materials.

[0019] The beneficial effects of the utility model are as follows: in the ring pasting processing of chip semiconductors, the ring pasting feeding group and the glue dispensing processing group in the ring pasting unit are arranged to realize the automatic feeding and ring pasting processing action of the chip semiconductor, so that accurate ring pasting processing can be realized and the effect of high-quality ring pasting processing can be achieved;

[0020] In addition, by setting up a product loading group in the feeding unit and the product loading group cooperating with the product transfer, the automatic loading of the semiconductor products to be processed and the automatic unloading and collection after the processing are completed can be realized, so as to achieve the processing effect of automatic loading and unloading in the ring pasting process; it can effectively improve the processing efficiency of the glue pasting work, reduce the labor cost, and achieve the processing purpose of efficient and automated production. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the utility model.

[0022] Figure 2 It is a structural schematic diagram of the feeding unit in the utility model.

[0023] Figure 3 It is a structural schematic diagram of the sticking ring unit in the utility model.

[0024] Figure 4 It is a structural schematic diagram of a product transfer group in the utility model. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. It should be understood that the present application is not limited to the example embodiments disclosed herein. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0026] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0028] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] The utility model provides Figures 1 to 4 In the embodiment of the utility model, an automatic ring-attaching device for chip semiconductor brazing processing includes: a processing machine 1, on which are provided: a feeding unit 2 for realizing loading and unloading of processing, and a ring-attaching unit 3 for realizing ring-attaching processing;

[0030] The feeding unit 2 includes: a product loading group 22 for loading products to be processed, a product unloading group 23 for unloading processed products, and a product transfer group 21 for transferring materials;

[0031] The ring sticking unit 3 includes: a ring sticking material feeding group 32 for feeding the ring sticking raw materials, a glue dispensing processing group 31 for realizing the ring sticking glue dispensing work, and a processing transfer group 33 for driving the product to be processed to switch between the processing positions of the ring sticking material feeding group 32, the glue dispensing processing group 31 and the product transfer group 21;

[0032] During processing, the product to be processed is loaded by the product loading group 22, and the product transfer group 21 delivers the loaded product to be processed to the processing transfer group 33, completing the loading action of the product to be processed;

[0033] Then, the processing material transfer group 33 drives the product to be processed into the processing position of the glue dispensing processing group 31, and the glue dispensing processing group 31 performs glue dispensing at the corresponding processing position, and then the processing material transfer group 33 drives the product to be processed into the processing position of the ring pasting material feeding group 32, and the ring pasting material feeding group 32 pastes the ring pasting material to the glue dispensing position of the product to be processed to achieve the processing effect of the ring pasting, and completes the processing action of glue pasting the ring;

[0034] Finally, the product transfer group 21 delivers the processed products in the processing transfer group 33 to the product unloading group 23, and the product unloading group 23 collects and unloads the products to complete the overall processing action.

[0035] Furthermore, both the product loading group 22 and the product unloading group 23 adopt a clip-type silo structure. During processing, the products are loaded through the material tray, realizing loading and unloading processing actions in the loading group and the unloading group.

[0036] Furthermore, the glue dispensing processing group 31 includes: a glue dispensing lateral shifting module 312 disposed at the upper end of the processing material transfer group 33 and a glue dispensing mechanism 311 installed on the glue dispensing lateral shifting module 312, and the glue dispensing lateral shifting module 312 is arranged vertically to the material transfer working direction of the processing material transfer group 33;

[0037] The glue dispensing mechanism 311 includes: a group of Z-axis glue dispensing modules 313, a glue dispensing module 314 installed on the Z-axis glue dispensing module 313, and a glue dispensing visual positioning module 315315; during processing, the glue dispensing module 314 is driven by the glue dispensing lateral movement module 312 and the Z-axis glue dispensing module 313 to approach the processing position of the product to be processed, and the glue visual positioning module 315 is first used to accurately identify the glue dispensing position, and the glue dispensing module 314 performs glue dispensing processing according to the visual information.

[0038] In order to improve the processing efficiency of the dispensing process, a plurality of dispensing mechanisms 311 are provided on the dispensing lateral movement module 312 of the dispensing processing group 31. During processing, each dispensing mechanism 311 adopts a staggered processing method to realize the processing action. In order to achieve this technical purpose, the number of the processing transfer groups 33 corresponds to the number of the dispensing mechanisms 311.

[0039] Among them, the structure of using two sets of dispensing mechanisms 311 for dislocation processing is more reasonable and efficient.

[0040] Furthermore, the dispensing mechanism 311 also includes: a group of needle correction sensors 316, which are arranged in the working forming area of ​​the dispensing lateral movement module 312; during the dispensing process, the dispensing module 314 is driven to the position of the needle correction sensor 316 by the dispensing lateral movement module 312, and the position of the dispensing needle in the dispensing module 314 is corrected by the needle correction sensor 316 to improve the accuracy of the dispensing process.

[0041] Furthermore, the ring sticking feeding group 32 includes: a feeding vibration plate 324, a ring sticking transverse movement module 321, and a ring sticking module 323 installed on the ring sticking transverse movement module 321;

[0042] During the ring sticking processing, the ring sticking raw material is sent out through the feeding vibration plate 324, and the ring sticking module 323 is driven by the ring sticking transverse movement module 321 to the discharging position of the feeding vibration plate 324 to pick up the material, and then the ring sticking module 323 is driven by the ring sticking transverse movement module 321 to move to the processing position to be processed, thereby realizing the ring sticking processing.

[0043] Furthermore, the ring sticking feeding group 32 also includes: a ring sticking vision module 322 arranged between the feeding vibration plate 324 and the processing and transferring group 33; when the ring sticking transverse movement module 321 drives the ring sticking module 323 to perform the ring sticking work, the ring sticking module 323 will pass through the upper end of the ring sticking vision module 322, and perform the flying shooting work through the ring sticking vision module 322. The ring sticking transverse movement module 321, the ring sticking module 323 and the processing and transferring group 33 will make corresponding position adjustments according to the flying shooting information to ensure the accurate ring sticking work.

[0044] Furthermore, a plurality of groups of ring sticking modules 323 are installed on the ring sticking transverse movement module 321 of the ring sticking feeding group 32. During the ring sticking processing, each group of ring sticking modules 323 can realize independent material taking and ring sticking processing actions, which can effectively improve the working efficiency of the ring sticking processing.

[0045] Furthermore, the processing material transfer group 33 includes: a group of material transfer moving modules 331 starting from the product material transfer group 21, extending through the glue dispensing processing group 31 to the position of the ring loading group 32, and the material transfer moving module 331 is equipped with a material placement table 332 for placing the products to be processed; during processing, the material transfer moving module 331 drives the material placement table 332 to switch positions between the processing positions of the product material transfer group 21, the glue dispensing processing group 31 and the material transfer moving module 331, thereby realizing the material transfer processing action.

[0046] Furthermore, the product transfer group 21 includes: a material taking device 213 for realizing product material taking, and the material taking device 213 can select device structures of different material taking types according to the requirements of products of different processing types, such as: magnetic suction, vacuum adsorption, clamping and other material taking methods;

[0047] An X-axis material transfer module 212 extending from the product loading group 22 to the product unloading group 23, a Y-axis material transfer module 211 extending from the product loading group 22 and the product unloading group 23 to the processing material transfer group 33, and a Z-axis material transfer module 214 for realizing lifting and picking up materials;

[0048] During the processing, the cooperation of the X-axis material transfer module 212, the Y-axis material transfer module 211 and the Z-axis material transfer module 214 can drive the material picking device 213 to carry out product feeding work to the product loading group 22, the processing material transfer group 33 and between the processing material transfer group 33 and the product unloading group 23.

[0049] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "including a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0050] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An automatic ring-attaching equipment for chip semiconductor brazing processing, characterized in that: include: A processing machine, which is provided with: a feeding unit for realizing loading and unloading of materials during processing, and a ring sticking unit for realizing ring sticking processing; The feeding unit includes: a product loading group for loading products to be processed, a product unloading group for unloading processed products, and a product transfer group for transferring materials; The ring sticking unit includes: a ring sticking feeding group for feeding the ring sticking raw materials, a glue dispensing processing group for realizing the ring sticking glue dispensing work, and a processing transfer group for driving the product to be processed to switch between the processing positions of the ring sticking feeding group, the glue dispensing processing group and the product transfer group.

2. The chip semiconductor brazing processing automatic ring pasting equipment according to claim 1 is characterized in that: Both the product loading group and the product unloading group adopt a clip-type silo structure.

3. The chip semiconductor brazing processing automatic ring pasting equipment according to claim 1 is characterized in that: The glue dispensing processing group includes: a glue dispensing transverse shifting module arranged at the upper end of the processing material transfer group and a glue dispensing mechanism installed on the glue dispensing transverse shifting module, and the glue dispensing transverse shifting module is arranged vertically to the material transfer working direction of the processing material transfer group; The dispensing mechanism includes: a group of Z-axis dispensing modules, a dispensing module installed on the Z-axis dispensing module, and a dispensing visual positioning module.

4. The chip semiconductor brazing processing automatic ring pasting equipment according to claim 3 is characterized in that: A plurality of dispensing mechanisms are arranged on the dispensing transverse shift module of the dispensing processing group, and the number of the processing and material transfer groups corresponds to the number of the dispensing mechanisms.

5. The chip semiconductor brazing processing automatic ring pasting equipment according to claim 3 is characterized in that: The glue dispensing mechanism also includes: a group of needle correction sensors, which are arranged in the working forming area of ​​the glue dispensing lateral movement module.

6. The chip semiconductor brazing processing automatic ring pasting equipment according to any one of claims 3 or 4, characterized in that: The ring sticking feeding group comprises: a feeding vibration plate, a ring sticking transverse movement module and a ring sticking module installed on the ring sticking transverse movement module.

7. The chip semiconductor brazing processing automatic ring pasting equipment according to claim 6 is characterized in that: The ring sticking feeding group also includes: a ring sticking visual module arranged between the feeding vibration plate and the processing transfer group.

8. The chip semiconductor brazing processing automatic ring pasting equipment according to claim 6 is characterized in that: A plurality of groups of ring sticking modules are installed on the ring sticking transverse shifting module of the ring sticking feeding group.

9. The chip semiconductor brazing processing automatic ring pasting equipment according to claim 1 is characterized in that: The processing material transfer group includes: a group of material transfer moving modules starting from the product material transfer group, extending to the ring pasting material group position through the dispensing processing group, and a material placement table for placing the products to be processed is installed on the material transfer moving module.

10. The chip semiconductor brazing processing automatic ring pasting equipment according to claim 1 is characterized in that: The product transfer group includes: a material taking device for realizing product taking; An X-axis material transfer module extending from the product loading group to the product unloading group, a Y-axis material transfer module extending from the product loading group and the product unloading group to the processing material transfer group, and a Z-axis material transfer module used to realize lifting and picking up materials.

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