Moving mechanism and semiconductor mounting and packaging die bonder
By designing the limiting device of the moving mechanism in the crystal solid machine, the positioning and limiting of the substrate is achieved by using the electromagnet and the winding wheel, the problem of wafer fixed offset caused by substrate displacement is solved, and the stability of the crystal solid process is improved and product yield.
Patent Information
- Application Number
- CN202420992562.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-05-09
AI Technical Summary
During the process of solidifying the crystal machine, the substrate is prone to displacement when it moves, resulting in fixed deviation of the wafer, and thus damage, affecting the product yield.
A moving mechanism is designed, including a placement plate, a positioning device and a adjusting member. The positioning device is composed of an extension member, an electromagnet, a spring and a winding wheel. The positioning of the substrate is achieved by the electromagnet power-off and the motor driving the winding wheel is achieved. and limit to prevent displacement.
It effectively prevents the substrate from displaced during the crystal solidification process, improves the product yield, and ensures the stability and accuracy of the substrate during the crystal solidification process.
Smart Images
Figure CN222190701U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of die bonding machines, and in particular to a mobile mechanism and a semiconductor mounting and packaging die bonding machine. Background Art
[0002] The die bonding machine is mainly used for the lead cabinet frame pressing plate of various (WIRE BONDER) gold wire ultrasonic welding equipment, as well as various suction nozzles, ejectors, dispensing heads, porcelain nozzles, pass needles, motors, carbon brushes, encoders, transmission belts of various (DIE BONDER) chip mounting equipment, various spare parts of automation equipment, instruments, meters, etc.
[0003] During the use of the die bonder, the wafer needs to be fixed at a specific position on the bracket and then mounted on the substrate. However, when the worker places the substrate on the moving table during processing, the substrate needs to be moved to a suitable position. At the same time, if the substrate is displaced when the wafer is fixed, it is easy to cause the wafer to be offset and damage the substrate. How to invent a moving mechanism and a semiconductor mounting package die bonder to improve these problems has become an urgent problem to be solved by technicians in this field. Utility Model Content
[0004] In order to make up for the above shortcomings, the utility model provides a moving mechanism and a semiconductor mounting package die bonding machine, aiming to improve the problem that if the substrate is displaced when the wafer is fixed, it is easy to cause the wafer to be offset and the entire substrate to be damaged.
[0005] The utility model is implemented as follows: a moving mechanism includes a placement moving seat for moving a semiconductor chip, the placement moving seat includes a placement plate, and also includes
[0006] A limiting device, the limiting device includes an extension piece and an adjusting piece, the extension piece is installed on one side of the placement plate, the extension piece includes a main extension frame, an auxiliary extension frame and a tail extension plate, the auxiliary extension frame limit slides through one end of the main extension frame, the tail extension plate limit slides through one end of the auxiliary extension frame, an electromagnet is set in the middle of the main extension frame, the auxiliary extension frame and the tail extension plate, and the tail extension plate is transmission-connected to the adjusting piece.
[0007] In a preferred technical solution of the utility model, the top of the placement plate is equally divided and fixedly connected with limited spacers around it.
[0008] In a preferred technical solution of the present utility model, the extension member also includes an installation frame, one end of the main extension frame is fixedly connected to one side of the installation frame, the installation frame is limitedly connected to the limit partition plates around the placement plate, one end of the electromagnet is fixedly connected to the installation frame, and the main extension frame, auxiliary extension frame and the middle part of the tail extension plate are respectively sleeved on the outside of the electromagnet.
[0009] In a preferred technical solution of the present invention, the installation frame is U-shaped, and magnetic blocks are provided at the inner top of the installation frame and at the top of the placement plate limiting partition correspondingly.
[0010] In a preferred technical solution of the present utility model, the main extension frame and the tail extension plate are both U-shaped, and the inner walls on both sides of the main extension frame and the tail extension plate are fixedly connected to limit strips, and the outer sides of the tail extension plate are provided with sliding grooves that cooperate with the limit strips, and the tail extension plate is located inside the auxiliary extension frame, and the two sides of the tail extension plate are provided with sliding grooves that cooperate with the limit strips installed on the inner walls of the auxiliary extension frame.
[0011] In a preferred technical solution of the utility model, matching magnetic blocks are provided at the positions corresponding to the electromagnets of the main extension frame, the auxiliary extension frame and the tail extension plate, the ends of the main extension frame and the auxiliary extension frame are fixedly connected to limiting connection blocks, a limiting slider is fixedly installed below one end of the limiting connection block, and slide rails matching the limiting slider are provided on both sides above the auxiliary extension frame and the tail extension plate.
[0012] In a preferred technical solution of the present invention, the adjusting member includes a sliding rod and a rotating wheel frame, and cylindrical grooves are formed on both sides of one end of the tail extension plate close to the main extension frame. The sliding rod slides through the main extension frame, the auxiliary extension frame and the tail extension plate, and the other end of the sliding rod is fixedly connected to the mounting frame. A spring is sleeved on the outside of the sliding rod, and the spring is located inside the cylindrical groove of the tail extension plate. A sliding rod is fixedly installed on the top of the sliding rod, and a winding wheel is rotatably installed inside the rotating wheel frame, and a connecting rope is wound around the winding wheel. The other end of the connecting rope passes through the main extension frame, the auxiliary extension frame and is fixedly connected to the tail extension plate.
[0013] In a preferred technical solution of the utility model, one end of the sliding rod close to the installation frame is fixedly sleeved with a limiting ring, and the limiting ring abuts against the spring.
[0014] In a preferred technical solution of the utility model, connecting ropes are provided on both sides of the tail extension plate, and the two connecting ropes are respectively connected to two sets of winding wheels. One side of the winding wheel rotates through the rotating wheel frame, and a motor is fixedly installed on one side of the rotating wheel frame, and the motor is transmission-connected to the winding wheel.
[0015] In another preferred technical solution of the utility model, a semiconductor mounting packaging die bonding machine includes a movable component arranged at the bottom of the placement plate, the movable component includes a base frame, first slides are installed on both sides of the top of the base frame, a plate is installed above the first slide, second slides are installed on both sides of the top of the plate, the first slide and the second slide are cross-staggered, and the placement plate is installed above the second slide.
[0016] The beneficial effect of the utility model is as follows: the utility model obtains a moving mechanism and a semiconductor mounting package die bonding machine through the above design. When in use, the extension member is installed above the corresponding placement plate, and the substrate is directly placed above the placement plate. When the moving component drives the placement plate to move, the electromagnet is powered off and stops the magnetic attraction of the main extension frame, the auxiliary extension frame and the tail extension plate. At this time, one end of the spring squeezes the limit ring and the other end squeezes the inner top of the tail extension plate, so that the tail extension plate extends outward. At the same time, if the tail extension plate extends a distance that is not enough, the spring will continue to lift the tail extension plate, so that the tail extension plate drives the auxiliary extension frame, and the auxiliary extension frame is in the main extension frame. The inner part of the rear extension plate extends outward, so that the top of the rear extension plate is pressed against the substrate, the substrate is limited, and the moving component drives the placement plate to move to a suitable position. At the same time, the extension part and the adjustment part position the substrate. After the crystal is fixed, the moving component drives the placement plate to return, and the motor drives the winding wheel to rewind the connecting rope. At this time, the rear extension plate and the auxiliary extension frame are retracted into the main extension frame. At the same time, the electromagnet is energized to position the auxiliary extension frame and the rear extension plate. The substrate can be removed manually, which is convenient for limiting the position of the substrate, preventing the substrate from shifting during crystal fixing, resulting in unqualified products caused by crystal fixing offset, and improving the yield of crystal fixing. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 This is a schematic diagram of the structure of the mobile placement seat provided by the embodiment of the utility model;
[0019] Figure 2 A schematic diagram of the structure of the other side of the mobile seat provided in the embodiment of the utility model;
[0020] Figure 3 A schematic diagram of the installation structure of the limit device provided in the embodiment of the utility model;
[0021] Figure 4 A schematic diagram of the exploded structure of the extension member provided in the embodiment of the utility model;
[0022] Figure 5 This is a schematic diagram of the exploded structure of the adjustment member provided in the embodiment of the utility model.
[0023] In the figure: 100-placement moving seat; 110-placement plate; 120-moving assembly; 121-base frame; 122-first slide; 123-second slide; 200-limiting device; 210-extension member; 211-installation frame; 212-main extension frame; 213-auxiliary extension frame; 214-tail extension plate; 215-limiting strip; 216-electromagnet; 217-limiting connecting block; 218-limiting slider; 220-adjusting member; 221-slide rod; 222-limiting ring; 223-connecting rope; 224-rotating wheel frame; 225-winding wheel; 226-motor. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical solution and advantages of the implementation of the utility model clearer, the technical solution in the implementation of the utility model will be clearly and completely described below in conjunction with the drawings in the implementation of the utility model. Obviously, the described implementation is a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] See also Figure 1 and Figure 2 The utility model provides a technical solution: a moving mechanism, including a placement moving seat 100 for moving a semiconductor chip, the placement moving seat 100 includes a placement plate 110, and also includes
[0026] The limiting device 200 includes an extension member 210 and an adjusting member 220. The extension member 210 is installed on one side of the placement plate 110. The extension member 210 includes a main extension frame 212, an auxiliary extension frame 213 and a rear extension plate 214. The auxiliary extension frame 213 slides through one end of the main extension frame 212. The rear extension plate 214 slides through one end of the auxiliary extension frame 213. An electromagnet 216 is provided in the middle of the main extension frame 212, the auxiliary extension frame 213 and the rear extension plate 214. The rear extension plate 214 is connected to the adjusting member 220 in a transmission manner. The extension member 210 cooperates with the adjusting member 220 to position the substrate above the placement plate 110.
[0027] See also Figures 2 to 4 The top of the placement plate 110 is equally divided and fixedly connected with limiting partitions around it, and the partitions are used to limit the substrate.
[0028] The extension piece 210 also includes a mounting frame 211, one end of the main extension frame 212 is fixedly connected to one side of the mounting frame 211, the mounting frame 211 is limitedly connected to the limit partitions around the placement plate 110, one end of the electromagnet 216 is fixedly connected to the mounting frame 211, the main extension frame 212, the auxiliary extension frame 213 and the middle of the tail extension plate 214 are respectively sleeved on the outside of the electromagnet 216, and multiple auxiliary extension frames 213 can be provided, and the principle of multiple limited sliding stacking is the same as that of the auxiliary extension frame 213 and the main extension frame 212. The mounting frame 211 is U-shaped, and the inner top of the mounting frame 211 and the top of the limit partition of the placement plate 110 are correspondingly provided with magnetic suction blocks, which facilitates and quickly installs the extension piece 210. The extension piece 210 is placed according to the size of the substrate to prevent affecting normal use. The electromagnet 216 is electrically connected to the external power supply, and the electromagnet 216 is controlled by a single-chip microcomputer.
[0029] The main extension frame 212 and the tail extension plate 214 are both U-shaped, and the inner walls on both sides of the main extension frame 212 and the tail extension plate 214 are fixedly connected to the limit strips 215. The outer sides of the tail extension plate 214 are provided with sliding grooves that match the limit strips 215. The tail extension plate 214 is located inside the auxiliary extension frame 213, and the two sides of the tail extension plate 214 are provided with sliding grooves that match the limit strips 215 installed on the inner wall of the auxiliary extension frame 213. The limit strips 215 enable the auxiliary extension frame 213 and the tail extension plate 214 to slide in a straight line.
[0030] Matching magnetic blocks are provided at the corresponding positions of the main extension frame 212, the auxiliary extension frame 213 and the tail extension plate 214 and the electromagnet 216. The ends of the main extension frame 212 and the auxiliary extension frame 213 are fixedly connected to the limiting connection block 217. A limiting slider 218 is fixedly installed below one end of the limiting connection block 217. Slide rails matching the limiting slider 218 are provided on both sides above the auxiliary extension frame 213 and the tail extension plate 214. When the main extension frame 212, the auxiliary extension frame 213 and the tail extension plate 214 are extended, the limiting connection block 217 and the limiting slider 218 are used to prevent the auxiliary extension frame 213 and the tail extension plate 214 from derailing during extension, and are used to limit the auxiliary extension frame 213 and the tail extension plate 214.
[0031] See also Figures 3 to 5 The adjusting member 220 includes a slide bar 221 and a rotating wheel frame 224. The two sides of the end of the tail extension plate 214 close to the main extension frame 212 have cylindrical grooves. The slide bar 221 slides through the main extension frame 212, the auxiliary extension frame 213 and the tail extension plate 214. The other end of the slide bar 221 is fixedly connected to the installation frame 211. The outside of the slide bar 221 is sleeved with a spring, which is located inside the cylindrical groove of the tail extension plate 214. The top of the slide bar 221 is fixedly installed with the slide bar 221. The internal limit rotation of the rotating wheel frame 224 is installed with a winding wheel 225, and a connecting rope 223 is wound around the winding wheel 225. The other end of the connecting rope 223 penetrates the main extension frame 212, the auxiliary extension frame 213 and is fixedly connected to the tail extension plate 214. The end of the slide bar 221 close to the installation frame 211 is fixedly sleeved with a limiting ring 222, and the limiting ring 222 abuts against the spring. Connecting ropes 223 are provided on both sides of the tail extension plate 214, and the two connecting ropes 223 are respectively connected to two groups of winding wheels 225. One side of the winding wheel 225 rotates and passes through the rotating wheel frame 224. A motor 226 is fixedly installed on one side of the rotating wheel frame 224. The motor 226 is connected to the winding wheel 225 for transmission. A spring (not shown in the figure) is used to extend the auxiliary extension frame 213 and the tail extension plate 214. The winding wheel 225 drives the connecting rope 223 through the motor 226 to reel in the auxiliary extension frame 213 and the tail extension plate 214. At the same time, guide wheels are provided on both sides of the connecting rope 223 to facilitate the reeling of the reel 225.
[0032] A semiconductor mounting package die bonding machine includes a moving component 120 disposed at the bottom of a placement plate 110, the moving component 120 includes a base frame 121, first slides 122 are mounted on both sides of the top of the base frame 121, a plate is mounted above the first slide 122, second slides 123 are mounted on both sides of the top of the plate, the first slide 122 and the second slide 123 are cross-staggered, and the placement plate 110 is mounted above the second slide 123.
[0033] Working principle: When a certain substrate is solidified, the extension piece 210 is installed on the corresponding placement plate 110, and the substrate is directly placed on the placement plate 110. While the moving assembly 120 drives the placement plate 110 to move, the electromagnet 216 is powered off and stops the magnetic attraction of the main extension frame 212, the auxiliary extension frame 213 and the tail extension plate 214. At this time, one end of the spring squeezes the limit ring 222 and the other end squeezes the inner top of the tail extension plate 214, so that the tail extension plate 214 extends outward. At the same time, if the tail extension plate 214 does not extend far enough, the spring will continue to lift the tail extension plate 214, so that the tail extension plate 214 drives the auxiliary extension frame 213, and the auxiliary extension plate 214 is moved. The extension frame 213 extends outward from the inside of the main extension frame 212, so that the top of the tail extension plate 214 is pressed against the substrate, and the substrate is limited. The moving component 120 drives the placement plate 110 to move to a suitable position. At the same time, the extension member 210 and the adjustment member 220 position the substrate. After the crystal is fixed, the moving component 120 drives the placement plate 110 to return. At the same time, the motor 226 drives the winding wheel 225 to wind up the connecting rope 223. At this time, the tail extension plate 214 and the auxiliary extension frame 213 are both retracted into the main extension frame 212. At the same time, the electromagnet 216 is energized to position the auxiliary extension frame 213 and the tail extension plate 214, and the substrate can be removed manually.
[0034] The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A moving mechanism, comprising a placement moving seat for moving a semiconductor chip, wherein the placement moving seat comprises a placement plate, characterized in that: Also includes A limiting device, the limiting device includes an extension piece and an adjusting piece, the extension piece is installed on one side of the placement plate, the extension piece includes a main extension frame, an auxiliary extension frame and a tail extension plate, the auxiliary extension frame limit slides through one end of the main extension frame, the tail extension plate limit slides through one end of the auxiliary extension frame, an electromagnet is set in the middle of the main extension frame, the auxiliary extension frame and the tail extension plate, and the tail extension plate is transmission-connected to the adjusting piece.
2. A moving mechanism according to claim 1, characterized in that: The top of the placement plate is equally divided and fixedly connected with limited spacers around its periphery.
3. A moving mechanism according to claim 2, characterized in that: The extension piece also includes a mounting frame, one end of the main extension frame is fixedly connected to one side of the mounting frame, the mounting frame is limitedly connected to the limit partitions around the placement plate, one end of the electromagnet is fixedly connected to the mounting frame, and the main extension frame, the auxiliary extension frame and the middle part of the tail extension plate are respectively sleeved on the outside of the electromagnet.
4. A moving mechanism according to claim 3, characterized in that: The installation frame is U-shaped, and magnetic blocks are provided at the inner top of the installation frame and at the top of the placement plate limiting partition correspondingly.
5. A moving mechanism according to claim 3, characterized in that: The main extension frame and the tail extension plate are both U-shaped, and the inner walls on both sides of the main extension frame and the tail extension plate are fixedly connected to limit strips. The outer sides of the tail extension plate are provided with sliding grooves that match the limit strips. The tail extension plate is located inside the auxiliary extension frame, and the two sides of the tail extension plate are provided with sliding grooves that match the limit strips installed on the inner walls of the auxiliary extension frame.
6. A moving mechanism according to claim 3, characterized in that: The main extension frame, the auxiliary extension frame and the tail extension plate are provided with matching magnetic blocks at the corresponding positions of the electromagnets. The ends of the main extension frame and the auxiliary extension frame are fixedly connected to the limiting connection blocks. A limiting slider is fixedly installed below one end of the limiting connection block. Slide rails matching the limiting slider are provided on both sides above the auxiliary extension frame and the tail extension plate.
7. A moving mechanism according to claim 3, characterized in that: The adjusting member includes a sliding rod and a rotating wheel frame, and cylindrical grooves are formed on both sides of one end of the tail extension plate close to the main extension frame. The sliding rod slides through the main extension frame, the auxiliary extension frame and the tail extension plate, and the other end of the sliding rod is fixedly connected to the mounting frame. A spring is sleeved on the outside of the sliding rod, and the spring is located inside the cylindrical groove of the tail extension plate. A sliding rod is fixedly installed on the top of the sliding rod, and a winding wheel is installed on the internal limiting rotation of the rotating wheel frame, and a connecting rope is wound on the winding wheel, and the other end of the connecting rope passes through the main extension frame, the auxiliary extension frame and is fixedly connected to the tail extension plate.
8. A moving mechanism according to claim 7, characterized in that: One end of the slide bar close to the installation frame is fixedly sleeved with a limiting ring, and the limiting ring abuts against the spring.
9. A moving mechanism according to claim 7, characterized in that: Connecting ropes are provided on both sides of the tail extension plate, and the two connecting ropes are respectively connected to two groups of winding wheels. One side of the winding wheel rotates and passes through the rotating wheel frame. A motor is fixedly installed on one side of the rotating wheel frame, and the motor is transmission-connected to the winding wheel.
10. A semiconductor mounting package die bonding machine, comprising a moving mechanism according to any one of claims 1 to 9, characterized in that: A moving component is arranged at the bottom of the placement plate, and the moving component includes a base frame, first slides are installed on both sides of the top of the base frame, a plate is installed above the first slide, second slides are installed on both sides of the top of the plate, the first slide and the second slide are arranged crosswise, and the placement plate is installed above the second slide.