Hot container of in-line semiconductor

Abstract

The utility model discloses a hot liner of a direct insertion type semiconductor, which comprises a water inlet base, a silicon controlled rectifier arranged on the water inlet base, and a heat conduction piece arranged in the water inlet base, the heat conduction piece is contacted with the silicon controlled rectifier to form heat conduction, a water inlet channel is arranged in the water inlet base, and the heat conduction piece is tightly matched with the water inlet channel; the pressure seat is arranged corresponding to the silicon controlled rectifier and the heat conduction piece, the pressure seat is integrally formed on the water inlet base, and the silicon controlled rectifier is inserted and restrained in the pressure seat.

Description

Technical Field

[0001] The utility model relates to the technical field of electric water heaters, in particular to a direct-insertion semiconductor heat bulb. Background Art

[0002] At present, electric heating bulbs are commonly used in water heaters, kitchen appliances and electric water faucets. They are widely favored by the market due to their ease of use and high heating efficiency. In recent years, with the technological improvement of electric water faucets, in order to ensure that the heating function is turned on during normal water inflow, a pressure switch is usually installed in the water inlet channel. The pressure switch is used to withstand the water inlet pressure, thereby ensuring that the heating function is turned on normally.

[0003] In the prior art, an electric water faucet has a water outlet cavity at the bottom due to its bottom water outlet mode, and thus a control component is arranged at the top, such as a thyristor connected to an electric control panel, and a heat dissipation mode of the thyristor is provided, specifically, a cooling channel is shunted in the water inlet channel, the inlet water flow is shunted to the cooling channel, the thyristor is arranged at the cooling channel for heat dissipation, and a connecting channel is provided below the thyristor to downwardly connect to the water outlet cavity, and the water flow after passing through the thyristor flows downward to the water outlet cavity through the connecting channel. However, in this water outlet mode, the thyristor is in direct contact with the inlet water flow, and there is a risk of water leakage;

[0004] Another electric water faucet in the prior art has a thyristor installed at the water inlet pipe of the electric water faucet. The thyristor is in indirect contact with the incoming cold water flow through a metal sheet, thereby achieving heat conduction and heat dissipation. This method still has the following defects:

[0005] 1. The installation of thyristor is inconvenient. The installation position is set on the base. After the thyristor is placed, it needs to be pressed by a pressure plate, and the pressure plate is locked on the installation position by at least two bolts to fix the position of the thyristor, which makes the installation inconvenient. In addition, the volume of the thyristor and the pressure plate is small, which is very inconvenient for workers to hold during installation, which increases the difficulty of assembly work;

[0006] 2. This type of thyristor contacts the water flow channel through a metal sheet, has poor sealing, and there is a risk of water leakage. Utility Model Content

[0007] In view of the shortcomings of the prior art, the utility model aims to provide a direct-insertion semiconductor heat bulb.

[0008] The above technical objectives of the utility model are achieved through the following technical solutions: A direct-insertion semiconductor heat bulb, comprising: a water inlet base, a thyristor arranged on the water inlet base, and a heat conducting member arranged in the water inlet base, the heat conducting member contacts the thyristor and forms heat conduction, a water inlet channel is arranged in the water inlet base, and the heat conducting member and the water inlet channel are closely matched;

[0009] It also includes a pressure seat arranged corresponding to the thyristor and the heat conducting member, the pressure seat is integrally formed on the water inlet base, and the thyristor is inserted into and constrained in the pressure seat.

[0010] Furthermore, the end of the pressure seat has a first opening, and an assembly channel is formed on the water inlet base, and the thyristor is placed in the assembly channel through the first opening.

[0011] Furthermore, the other end of the pressure seat has a limiting portion, and the end of the thyristor abuts against the limiting portion.

[0012] Furthermore, the other end of the pressure seat has a second opening spaced from the end of the pressure seat, and the thyristor is at least partially exposed in the second opening.

[0013] Furthermore, a mounting platform is provided on the water inlet base, a second assembly channel for embedding the heat conductor is provided on the mounting platform, the second assembly channel is connected to the water inlet channel, the heat conductor seals the second assembly channel, and the thyristor is shielded on the second assembly channel.

[0014] Furthermore, the pressure seat is a hollow frame closed on the mounting platform in the circumferential direction, the thyristor is inserted in the hollow frame, and the hollow frame restricts the movement of the thyristor at least in the vertical direction.

[0015] Furthermore, the thyristor is provided with electrical connection pins corresponding to the assembly direction.

[0016] Furthermore, a sealing ring is integrally formed on the outer circumference of the heat conducting member, a sealing ring groove is provided between the inner surface of the second assembly channel and the outer surface of the heat conducting member, and the sealing ring is squeezed between the sealing ring grooves.

[0017] Furthermore, the heat conducting member is provided with a first heat conducting surface in contact with the thyristor, and the first heat conducting surface is flush with the surface of the mounting platform.

[0018] Furthermore, the end of the heat conducting member facing the water inlet channel is provided with a second heat conducting surface which is concave toward the thyristor side.

[0019] Compared with the prior art, the utility model has the following advantages and beneficial effects: the utility model provides a heat conducting member on the water inlet channel of the water inlet base, and the heat of the thyristor is conducted to the water inlet flow in real time through the heat conducting member, thereby achieving sufficient heat dissipation; in addition, the pressure seat is integrally formed on the water inlet base, and forms a first assembly channel for the thyristor to be fitted into; during the assembly process, it is only necessary to insert the thyristor directly into the first assembly channel, and engage it to the extreme position at the end of the pressure seat, thereby achieving rapid assembly of the thyristor, without the need for additional connectors, and the operation is convenient and quick; and after the thyristor is connected to the electric control board, the temperature stability of the thyristor between the water inlet base and the pressure seat is further maintained. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 It is a cross-sectional view of the pressure seat of the utility model;

[0022] Figure 3 for Figure 2 The enlarged view of point A in the middle;

[0023] Figure 4 It is a cross-sectional view of the pressure seat of the utility model from another angle;

[0024] Figure 5 It is a schematic diagram of the water inlet channel of the utility model;

[0025] Figure 6 It is a schematic diagram of the coordination of the thyristor and the heat conducting member of the utility model;

[0026] Figure 7 This is a schematic diagram of the structure of the utility model after the water inlet base is removed from the thyristor;

[0027] Figure 8 This is a structural schematic diagram of another angle of the utility model after the water inlet base is removed from the thyristor;

[0028] In the figure:

[0029] 1. Water inlet base;

[0030] 2. Silicon controlled rectifier; 2.1. Electrical connection pin;

[0031] 3. Heat conducting member; 3.1. Sealing ring; 3.2. Sealing ring groove; 3.3. First heat conducting surface; 3.4. Second heat conducting surface;

[0032] 4. Water inlet channel; 4.1. First section; 4.2. Second section; 4.3. Third section;

[0033] 5. Press seat; 5.1. First opening; 5.2. Second opening; 5.3. Limiting part; 5.4. First assembly channel; 5.5. Side rib;

[0034] 6. Installation platform; 6.1. Second assembly channel; 6.2. Installation steps; DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] It should be understood that although the terms upper, middle, lower, top, end, etc. appear in this article to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish elements from each other for easy understanding, and are not used to define any direction or order limitation.

[0037] like Figure 1-8 As shown, a direct-plug semiconductor heat sink comprises:

[0038] A water inlet base 1, a thyristor 2 arranged on the water inlet base 1, and a heat conductive member 3 arranged in the water inlet base 1, the heat conductive member 3 contacts the thyristor 2 and forms heat conduction, a water inlet channel 4 is arranged in the water inlet base 1, the heat conductive member 3 and the water inlet channel 4 are closely matched, and during the water inlet process, the inlet water flows through the heat conductive member 3, so that the heat of the thyristor 2 is dissipated by means of the heat conductive member 3;

[0039] The water inlet base 1 serves as the base of the heat tank, and a heating element is provided above the water inlet base 1 in the heat tank to heat the water flow, or the heating element does not work to allow the inlet water flow to be directly output.

[0040] In the utility model, in order to facilitate the assembly of the thyristor 2, a pressure seat 5 is also included corresponding to the thyristor 2 and the heat conductor 3. The pressure seat 5 is integrally formed on the water inlet base 1, and a space for inserting the thyristor 2 is formed between the pressure seat 5 and the water inlet base 1, and the thyristor 2 can be constrained in the pressure seat 5.

[0041] Preferably, the arrangement of the inner cavity space of the pressing seat 5 is the same as the length direction of the thyristor 2, so that the staff only needs to perform linear plug-in operations.

[0042] In this embodiment, the heat conductor 3 is made of a material with high thermal conductivity, such as a metal part, so as to improve the heat dissipation effect on the thyristor 2. In fact, the heat conductor 3 is blocked between the water inlet channel 4 and the thyristor 2. During the water inlet process, the heat conductor 3 is able to fully contact the flowing water flow to release the heat of the thyristor 2.

[0043] like Figure 4 and Figure 7 As shown, specifically, the end of the pressure seat 5 has a first opening 5.1, which is used for inserting the thyristor 2 and forms a first assembly channel 5.4 on the water inlet base 1 together with the pressure seat 5. The thyristor 2 is placed in the first assembly channel 5.4 through the first opening 5.1.

[0044] The caliber of the first assembly channel 5 . 4 matches the profile of the thyristor 2 , thereby improving the position stability of the thyristor 2 .

[0045] As a further improvement to the pressure seat 5, a limiting portion 5.3 is provided at the other end of the pressure seat 5. The limiting portion 5.3 is specifically a rib at the end of the first assembly channel 5.4. When the thyristor 2 is inserted into place, the end of the thyristor 2 abuts against the limiting portion 5.3.

[0046] like Figure 2 and Figure 3 As shown, as a further improvement of the pressure seat 5, the other end of the pressure seat 5 has a second opening 5.2 spaced from the end of the pressure seat 5, and the thyristor 2 is at least partially exposed in the second opening 5.2, wherein the two sides of the limit portion 5.3 extend corresponding to the two side contours of the thyristor 2 and form side retaining ribs 5.5, and the side retaining ribs 5.5 are connected to the pressure seat 5 and integrally connected to the pressure seat 5, so that the limit portion 5.3 and the pressure seat 5 are integrally formed, and the second opening 5.2 can be an opening formed between the side retaining ribs 5.5 and the ribs, as shown in FIG. Figure 1 As shown in the upward opening, the pressure seat 5 forms a semi-enclosed installation structure for the thyristor 2, and the thyristor 2 can still release heat through the second opening 5.2, thereby meeting the heat dissipation effect of the end face of the thyristor 2 away from the heat conductor 3.

[0047] from Figure 7 It can be seen that in the above embodiment, a mounting platform 6 is provided on the water inlet base 1 , and the above-mentioned pressure seat 5 , the ribs constituting the limiting portion 5 . 3 and the side retaining ribs 5 . 5 are all integrally formed on the mounting platform 6 .

[0048] like Figure 4 and Figure 5As shown, specifically, the bottom of the mounting platform 6 constitutes a water inlet channel 4, and the water inlet channel 4 includes a first section 4.1 extending vertically upward, a second section 4.2 extending at the bottom of the mounting platform 6, and a third section 4.3 vertically arranged on the mounting platform 6, wherein the second section 4.2 passes through the mounting platform 6, and the end of the second section 4.2 is connected to a control valve, i.e., a water control switch.

[0049] Among them, the pressure seat 5 and the thyristor 2 are specifically located on the first section 4.1 of the water inlet channel 4, and a second assembly channel 6.1 for embedding the heat conductor 3 is provided on the installation platform 6. The second assembly channel 6.1 is connected to the first section 4.1 of the water inlet channel 4, the heat conductor 3 is embedded in and seals the second assembly channel 6.1, and the thyristor 2 is shielded on the second assembly channel 6.1, so as to ensure that the water flow from the first section 4.1 into the lateral second section 4.2 can fully contact with the heat conductor 3 during the water intake process.

[0050] Further references Figure 7 As shown, as a further implementation of the pressure seat 5, the pressure seat 5 is a hollow frame closed on the mounting platform 6 in the circumferential direction, specifically an inverted upright "concave" shaped structure, the thyristor 2 is inserted in the hollow frame, and the hollow frame limits the movement of the thyristor 2 at least in the vertical direction, and the above-mentioned side guard ribs 5.5 and the ribs are integrally connected to the back of the central control frame, forming a horizontally lying "concave" shaped structure.

[0051] Specifically, the thyristor 2 is provided with three electrical connection pins corresponding to the assembly direction, and is electrically connected to the electrical control board of the thermal bulb, or to the wiring terminals inside the thermal bulb, which not only realizes the electrical control connection, but also maintains the installation position of the thyristor 2.

[0052] like Figure 3 and Figure 4 and Figure 6 As shown, as a further embodiment of the heat conducting member 3, a sealing ring 3.1 is integrally formed on the outer periphery of the heat conducting member 3, a sealing ring groove 3.2 is provided between the inner surface of the second assembly channel 6.1 and the outer surface of the heat conducting member 3, and the sealing ring 3.1 is squeezed between the sealing ring grooves 3.2.

[0053] Among them, the sealing ring 3.1 can be formed directly on the heat conductive part 3 by placing the heat conductive part 3 in the mold cavity, thereby improving the integrity of the sealing ring 3.1 and the metal part, ensuring that when the heat conductive part 3 is assembled to the second assembly channel 6.1, the sealing ring 3.1 can be in stable contact and fit between the second assembly channel 6.1 and the heat conductive part 3 to ensure sealing.

[0054] Specifically, a mounting step 6.2 is formed between the bottom of the second assembly channel 6.1 and the first section 4.1, and the metal part abuts against the upper limit of the mounting step 6.2 after being embedded in the second assembly channel 6.1.

[0055] Specifically, the heat conducting member 3 is provided with a first heat conducting surface 3 . 3 in contact with the thyristor 2 , and the first heat conducting surface 3 . 3 is flush with the surface of the mounting platform 6 .

[0056] Specifically, the end of the heat conducting member 3 facing the water inlet channel 4 is provided with a second heat conducting surface 3.4 which is concave toward the side of the thyristor 2. The concave setting of the second heat conducting surface 3.4 effectively increases the contact area between the inlet water flow and the heat conducting member 3, thereby improving the heat exchange efficiency.

[0057] In other embodiments, a matching structure with the thyristor 2 may be provided at the end of the pressure seat 5, so as to further limit the position of the thyristor 2 after it is assembled in place in the pressure seat 5, so as to prevent the thyristor 2 from falling out.

[0058] As an example, a protrusion is set in the space enclosed by the end of the pressure seat 5, and a positioning hole is provided on the end of the thyristor 2. When the thyristor 2 is inserted into place, the positioning hole cooperates with the protrusion for positioning. The protrusion can be provided with a guide slope or a guide arc surface opposite to the assembly direction of the thyristor 2.

[0059] The bumps may be arranged on an end surface flush with the first heat conducting surface 3.3 of the heat conducting member 3, or may be arranged on both sides of the end of the thyristor 2, namely, on the side ribs 5.5.

[0060] As an option, Figure 6 As shown, a corresponding protrusion mating position is provided at the end of the thyristor 2 .

[0061] The utility model arranges a heat conducting member 3 on the water inlet channel 4 of the water inlet base 1, and the heat of the thyristor 2 is conducted to the water inlet flow in real time through the heat conducting member 3, so as to achieve sufficient heat dissipation. In addition, the pressure seat 5 is integrally formed on the water inlet base 1, and forms a first assembly channel 5.4 for the thyristor 2 to be assembled. During the assembly process, it is only necessary to directly insert the thyristor 2 into the first assembly channel 5.4, and engage the end of the pressure seat 5 to the extreme position, so as to achieve rapid assembly of the thyristor 2 without additional connectors, and the operation is convenient and quick. Moreover, after the thyristor 2 is connected to the electric control board, the temperature stability of the thyristor 2 between the water inlet base 1 and the pressure seat 5 is specifically maintained.

[0062] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A direct-insertion semiconductor heat bulb, characterized in that: include: A water inlet base (1), a thyristor (2) arranged on the water inlet base (1), and a heat conducting member (3) arranged in the water inlet base (1), wherein the heat conducting member (3) contacts the thyristor (2) and forms heat conduction, a water inlet channel (4) is arranged in the water inlet base (1), and the heat conducting member (3) and the water inlet channel (4) are closely matched; It also comprises a pressure seat (5) arranged corresponding to the thyristor (2) and the heat conducting member (3); the pressure seat (5) is integrally formed on the water inlet base (1), and the thyristor (2) is inserted into and constrained in the pressure seat (5).

2. A direct-insertion semiconductor heat bulb as claimed in claim 1, characterized in that: The end of the pressure seat (5) has a first opening (5.1), and a first assembly channel (5.4) is formed on the water inlet base (1), and the thyristor (2) is placed in the first assembly channel (5.4) through the first opening (5.1).

3. A direct-insertion semiconductor heat bulb as claimed in claim 1, characterized in that: The other end of the pressure seat (5) has a limiting portion (5.3), and the end of the thyristor (2) abuts against the limiting portion (5.3).

4. A direct-insertion semiconductor heat bulb as claimed in claim 1, characterized in that: The other end of the pressure seat (5) has a second opening (5.2) spaced from the end of the pressure seat (5), and the thyristor (2) is at least partially exposed in the second opening (5.2).

5. The direct-insertion semiconductor heat bulb according to claim 1, characterized in that: The water inlet base (1) is provided with a mounting platform (6), the mounting platform (6) is provided with a second assembly channel (6.1) for embedding the heat conducting component (3), the second assembly channel (6.1) is connected to the water inlet channel (4), the heat conducting component (3) seals the second assembly channel (6.1), and the thyristor (2) is shielded on the second assembly channel (6.1).

6. A direct-insertion semiconductor heat bulb as claimed in claim 5, characterized in that: The pressure seat (5) is a hollow frame closed on the mounting platform (6) in the circumferential direction, the thyristor (2) is inserted in the hollow frame, and the hollow frame restricts the movement of the thyristor (2) at least in the vertical direction.

7. The direct-insertion semiconductor heat bulb according to claim 1, characterized in that: The thyristor (2) is provided with an electrical connection pin (2.1) corresponding to the assembly direction.

8. The direct-insertion semiconductor heat bulb according to claim 5, characterized in that: A sealing ring (3.1) is integrally formed on the outer circumference of the heat conducting member (3), a sealing ring groove (3.2) is provided between the inner surface of the second assembly channel (6.1) and the outer surface of the heat conducting member (3), and the sealing ring (3.1) is squeezed between the sealing ring grooves (3.2).

9. The direct-insertion semiconductor heat bulb according to claim 5, characterized in that: The heat conducting member (3) is provided with a first heat conducting surface (3.3) in contact with the thyristor (2), and the first heat conducting surface (3.3) is flush with the surface of the mounting platform (6).

10. The direct-insertion semiconductor heat bulb according to claim 1, characterized in that: The end of the heat conducting member (3) facing the water inlet channel (4) is provided with a second heat conducting surface (3.4) which is concave toward the side of the thyristor (2).

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