Polishing pad trimmer and chemical mechanical polishing equipment

Abstract

The utility model provides a polishing pad trimmer and chemical mechanical polishing equipment, which comprises a trimming disc and a pressure regulating system, the trimming disc is provided with different trimming areas, N is an integer greater than or equal to 2, isolation grooves are arranged among the trimming areas, and different trimming areas provide different roughness; the pressure adjusting system comprises an adjusting type air pressure chamber, a roughness sensor and a pressure controller, and the adjusting type air pressure chamber is arranged above the finishing disc and corresponds to the finishing areas; the roughness sensor is arranged above the grinding pad to be trimmed so as to obtain the roughness of the grinding pad; the adjustable air pressure chamber and the roughness sensor are communicated with the pressure controller; the cleaning structure is used for providing cleaning liquid; diversified requirements of the grinding pad on the dressing disc can be met, and normalization of the dressing disc is achieved; pressure partition adjustment can be carried out to adapt to the dynamic change of the roughness of the grinding pad; and abrasion objects can be cleaned in time.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor equipment and relates to a grinding pad dresser and chemical mechanical grinding equipment. Background Art

[0002] With the continuous development of semiconductor technology, the semiconductor process has higher and higher requirements for the flatness of the wafer surface, and the position of chemical mechanical polishing (CMP) in semiconductor technology has become more and more prominent.

[0003] CMP is a process for achieving comprehensive planarization in semiconductor manufacturing. It removes excess material from the wafer surface by combining chemical etching and mechanical grinding to ensure the smooth progress of subsequent manufacturing steps. The existing CMP process has increasingly stringent requirements for CMP consumables. This is because during the CMP grinding process, the wafer surface needs to be in close contact with the grinding pad, so the roughness (RA) of the pad surface determines the removal rate (RR) of the wafer surface film and the RA of the wafer surface.

[0004] Among them, the factor that determines the RA of the pad surface is mainly determined by the dressing disk in the polishing pad dresser. However, the existing disk has many disadvantages and is difficult to meet the requirements of the existing process. For example, the existing disk mainly has the following disadvantages:

[0005] 1) Different types of pads need to be matched with different types of disks, which makes the disk types complicated.

[0006] 2) There are changes in surface RA between pads of the same type in different batches, but the disk cannot adapt to the changes in pad RA, resulting in changes in film RR and wafer profile.

[0007] 3) Disks of the same type but in different batches have changes in surface PCR (pad wear rate per unit time) and U value (surface flatness), which causes changes in RA on the pad surface, and further causes changes in film RR and wafer profile.

[0008] 4) As the pad surface changes with its lifetime, the RA of the pad surface changes, and existing disks cannot be dynamically trimmed.

[0009] Therefore, it is necessary to provide a polishing pad conditioner and a chemical mechanical polishing device. Utility Model Content

[0010] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a polishing pad conditioner and a chemical mechanical polishing device, which are used to solve the application drawbacks of the polishing pad conditioner in the prior art.

[0011] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a grinding pad dresser, the grinding pad dresser comprising:

[0012] A trimming disc, wherein the trimming disc comprises N different trimming areas, where N is greater than or equal to 2 and is an integer, isolation grooves are provided between the trimming areas, and different trimming areas provide different roughnesses;

[0013] A pressure regulating system, the pressure regulating system includes an adjustable air pressure chamber, a roughness sensor and a pressure controller, the adjustable air pressure chamber is arranged above the dressing disk and is arranged corresponding to each of the dressing areas to perform zone-by-zone air pressure regulation on each of the dressing areas; the roughness sensor is arranged above the grinding pad to be dressed to obtain the roughness of the grinding pad; the adjustable air pressure chamber and the roughness sensor are both in communication with the pressure controller.

[0014] Optionally, the pressure regulating system further includes an air pressure monitor, which is arranged corresponding to the adjustable air pressure chamber to monitor the air pressure of the adjustable air pressure chamber, and the air pressure monitor communicates with the pressure controller.

[0015] Optionally, the adjustable air pressure chamber comprises a piston-adjustable air pressure chamber.

[0016] Optionally, the morphology formed by the N different trimming areas includes a concentric ring shape surrounding the center of the trimming disk, a fan shape diverging outward from the center of the trimming disk, or an arc shape diverging outward from the center of the trimming disk; each of the trimming areas is a detachable trimming area.

[0017] Optionally, the trimming areas providing different roughness are arranged periodically.

[0018] Optionally, different trimming areas have different trimming particles, wherein the different trimming particles include one or a combination of trimming particles with different particle sizes and trimming particles with different distributions.

[0019] Optionally, a cleaning structure is further included, wherein the cleaning structure includes a nozzle, and the nozzle is arranged in the isolation groove to provide a cleaning liquid.

[0020] Optionally, the cleaning structure includes a water volume regulator connected to the nozzle, and the water volume regulator is arranged corresponding to the isolation groove; the nozzle is an adjustable nozzle, and the spray direction of the cleaning liquid provided by the nozzle is changed by the adjustable nozzle.

[0021] Optionally, the trimming areas with different roughness are provided and adjacent to each other and a trimming buffer area is also provided at the edge adjacent to the isolation groove to achieve a gradient change in roughness.

[0022] The present application also provides a chemical mechanical polishing device, which includes any of the above-mentioned polishing pad dressers.

[0023] As described above, the polishing pad dresser and chemical mechanical polishing equipment of the utility model include a dressing disk with different dressing areas and a pressure regulating system, wherein the dressing disk includes N different dressing areas, N ≥ 2 and is an integer, each dressing area has an isolation groove, and different dressing areas provide different roughness; the pressure regulating system includes an adjustable air pressure chamber, a roughness sensor and a pressure controller, the adjustable air pressure chamber is arranged above the dressing disk, and is arranged corresponding to each dressing area to adjust the air pressure of each dressing area in a zoned manner; the roughness sensor is arranged above the polishing pad to be dressed to obtain the roughness of the polishing pad; the adjustable air pressure chamber and the roughness sensor are both in communication with the pressure controller; further, it can also include a cleaning structure to provide a cleaning liquid.

[0024] The grinding pad dresser and chemical mechanical grinding equipment of the utility model can meet the diverse demands of the grinding pad for the dressing disk and realize the normalization of the dressing disk; the pressure partition adjustment can be performed to adapt to the dynamic change of the roughness of the grinding pad; and the wear objects can be cleaned in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the cross-sectional structure of the grinding pad dresser of the present invention which is distributed in concentric annular shapes.

[0026] Figure 2 Display as Figure 1 Schematic diagram of the structure of the trimming disk.

[0027] Figure 3 Display as Figure 1 Schematic diagram of the distribution of the adjustable air pressure chamber.

[0028] Figure 4 Display as Figure 1 Schematic diagram of the distribution of the pressure regulation system.

[0029] Figure 5 Display as Figure 1 Schematic diagram of the partial structure of the pressure regulation system.

[0030] Figure 6 It is a schematic structural diagram of a concentric annular trimming disk provided with a trimming buffer zone in the utility model.

[0031] Figure 7It is a schematic structural diagram of the fan-shaped trimming discs in the present invention.

[0032] Figure 8 It is a schematic structural diagram of the arc-shaped trimming disk in the present invention.

[0033] Fig. 9 It is a schematic diagram showing the structure of a trimming disk in which the trimming areas are arranged periodically in the present invention.

[0034] Component number description

[0035] 100 Trimming disc

[0036] 110 First Repair Area

[0037] 120 Second Repair Area

[0038] 130 Third Repair Area

[0039] 140 First trimming buffer

[0040] 150 Second trimming buffer

[0041] 111 First trimming particles

[0042] 121 Second trimming particle

[0043] 131 Third trimming particles

[0044] 141 First trimming buffer particles

[0045] 151 Second trimming buffer particles

[0046] 161 First isolation slot

[0047] 162 Second isolation slot

[0048] 200 Cleaning structure

[0049] 211 First Nozzle

[0050] 212 Second Nozzle

[0051] 221 First water regulator

[0052] 222 Second water regulator

[0053] 311 First Regulated Air Pressure Chamber

[0054] 312 Second Regulated Air Pressure Chamber

[0055] 313 Third Regulated Air Pressure Chamber

[0056] 3131 Gas Channel

[0057] 3132 Piston

[0058] 3133 Air Pressure Chamber

[0059] 3134 Air Pressure Monitor

[0060] 320 Roughness Sensor

[0061] 330 Pressure Controller

[0062] 400 Abrasive Pad DETAILED DESCRIPTION

[0063] The following is an explanation of the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0064] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0065] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0066] like Figure 1 to Figure 4 This embodiment provides a polishing pad conditioner, the polishing pad conditioner includes a conditioning disc 100 and a pressure regulating system, the conditioning disc 100 includes N different conditioning areas, N ≥ 2 and is an integer, Figure 1 and Figure 2, which illustrates the case where N is 3, that is, the dressing disk 100 includes a first dressing area 110, a second dressing area 120 and a third dressing area 130, and there are isolation grooves between each of the dressing areas, that is, there is a first isolation groove 161 between the first dressing area 110 and the second dressing area 120, and there is a second isolation groove 162 between the second dressing area 120 and the third dressing area 130, and different dressing areas can provide different roughness when acting on the polishing pad 400; the pressure regulation system includes an adjustable air pressure chamber, a roughness sensor 320 and a pressure controller 330, and the adjustable air pressure chamber is arranged above the dressing disk 100 and is arranged corresponding to each of the dressing areas to adjust the air pressure of each of the dressing areas by zone, that is, Figure 3 In the embodiment shown, three adjustable air pressure chambers are provided corresponding to the trimming areas, wherein the first adjustable air pressure chamber 311 is provided corresponding to the first trimming area 110, the second adjustable air pressure chamber 312 is provided corresponding to the second trimming area 120, and the third adjustable air pressure chamber 313 is provided corresponding to the third trimming area 130; the roughness sensor 320 is provided above the polishing pad 400 to be trimmed to obtain the roughness of the polishing pad 400; the adjustable air pressure chamber and the roughness sensor 320 are both in communication with the pressure controller 330, so that the roughness sensor The roughness of the grinding pad 400 obtained by the device 320 can be fed back to the pressure controller 330 in time, so that the pressure of each of the adjustable air pressure chambers can be adjusted by the pressure controller 330, so as to achieve independent pressure control of each dressing area, so that each dressing area can provide different pressures when acting on the grinding pad 400, thereby achieving partitioning and dynamic pressure adjustment of the dressing disk 100, so as to quickly and efficiently dress the roughness of the grinding pad 400, and solve the change of surface roughness of the grinding pad 400 caused by the change of service life (lifetime).

[0067] Regarding the number of the roughness sensors 320 and the pressure controller 330, it can be selected according to needs. For example, the roughness sensors 320 and the pressure controller 330 can be set to correspond one to one with the adjustable air pressure chamber, or it can be set that multiple adjustable air pressure chambers share a set of roughness sensors 320 and the pressure controller 330. No excessive restrictions are made here.

[0068] Wherein, each of the adjustable air pressure chambers is provided with an air inlet and an air outlet to adjust the air pressure in each chamber. Figure 4 , 5 , which illustrates the structure of a piston-regulated air pressure chamber, but the specific type and structure of the regulated air pressure chamber are not limited thereto.

[0069] Specifically, the piston-adjustable air pressure chamber includes a gas channel 3131, a piston 3132, and an air pressure chamber 3133, wherein the gas enters the air pressure chamber 3133 through the gas channel 3131, and the gas channel 3131 can be provided with a switch valve, etc. The air pressure chamber 3133 can expand and contract under the action of the piston 3132, and the structure of the piston 3132 can be a common piston structure, which can not only ensure the air tightness between the components, but also realize the adjustment of the space size of the air pressure chamber 3133, and the trimming disk can be as Figure 5 The third trimming area 130 is fixed to the bottom of the air pressure chamber 3133, so that the pressure of the third trimming area 130 can be adjusted by the expansion and contraction of the air pressure chamber 3133. Other air pressure chambers may also have the same structure and working principle, which will not be elaborated here.

[0070] Furthermore, you can also set Figure 5 The air pressure monitor 3134 is arranged in a one-to-one correspondence with the adjustable air pressure chamber to sense and monitor the air pressure of the adjustable air pressure chamber, and the air pressure monitor 3134 communicates with the pressure controller 330, so that the air pressure of the air pressure chamber 3133 can be obtained in time through the air pressure monitor 3134, and fed back to the pressure controller 330 in time, so that the pressure can be adjusted in time and effectively through the pressure controller 330.

[0071] Furthermore, a cleaning structure 200 may be included. The cleaning structure 200 includes a nozzle. The nozzle is arranged in the isolation groove to provide a cleaning liquid. Thus, the cleaning structure 200 can be used to clean the wear objects in time.

[0072] Specifically, Figure 1 and Figure 2 The cleaning structure 200 includes a first nozzle 211 disposed in the first isolation groove 161 and a second nozzle 212 disposed in the second isolation groove 162, so that when the dressing disc 100 acts on the grinding pad 400, the cleaning liquid can be provided in time to achieve timely cleaning of the wear objects, so as to avoid the influence of the wear objects on the grinding particles and ensure the accuracy of the roughness of the grinding pad 400 after dressing.

[0073] In order to meet the changing requirements of the surface roughness of the polishing pad, it is often necessary to provide different dressing discs with different PCR (pad wear rate per unit time) and U values ​​(surface flatness) to provide different roughnesses, so that the dressing discs can meet the different roughness requirements of different polishing pads when dressing the polishing pads. However, this will undoubtedly result in a wide variety of dressing discs, and may not necessarily meet the diverse roughness requirements of the polishing pads.

[0074] In addition, during the use of the same polishing pad, as its lifetime changes, the surface roughness of the polishing pad will also change. In order to ensure the accuracy of the roughness, the polishing pad also needs to be dynamically trimmed.

[0075] In this embodiment, different dressing areas are set in the same dressing disc 100, so that different dressing areas in the dressing disc 100 can have different PCR and U values, that is, different dressing areas can provide different roughness, so that when the dressing disc 100 acts on the polishing pad 400, by changing the pressure applied to the dressing disc 100, the same dressing disc 100 can be applied to different polishing pads 400, which can meet the diversified requirements of the polishing pad for the dressing disc 100; when the adjustable air pressure chamber is correspondingly set in the dressing area, the pressure regulating system can be used to adjust the dressing area. The pressure of each dressing area is independently controlled, so that when the dressing disk 100 acts on the grinding pad 400, by changing the pressure applied to each area of ​​the dressing disk 100, the pressure of each area in the dressing disk 100 can be independently controlled, which can solve the change in the surface roughness of the grinding pad 400 as the service life of the grinding pad 400 changes; and when the dressing disk 100 acts on the grinding pad 400, the cleaning liquid can also be provided through the cleaning structure 200, so that the debris worn off the dressing disk 100 can be cleaned in time to avoid the influence of the debris on the grinding process.

[0076] The trimming areas with different PCR and U values ​​can be realized by arranging different trimming particles in different trimming areas, and the different trimming particles may include one or a combination of trimming particles with different particle sizes and trimming particles with different distributions. Figure 2 The first trimming area 110 is provided with first trimming particles 111, the second trimming area 120 is provided with second trimming particles 121 and the third trimming area 130 is provided with third trimming particles 131, and the first trimming particles 111, the second trimming particles 121 and the third trimming area 130 may have different particle sizes and / or different distributions, such as including different density distributions, or different arrangement patterns, etc., so that each trimming area can provide different roughness.

[0077] As an example, the adjacent trimming areas with different roughness may be provided with a trimming buffer area adjacent to the edge of the isolation groove to achieve a gradient change in roughness.

[0078] Specifically, Figure 6 The morphology of a trimming disk with a trimming buffer zone is illustrated, wherein a first trimming buffer particle 141 different from the second trimming particle 121 is arranged at the edge of the second trimming zone 120 adjacent to the first isolation groove 161, and the first trimming buffer particle 141 constitutes a first trimming buffer zone 140 located between the first trimming zone 110 and the second trimming zone 120, and the roughness provided by the first trimming buffer zone 140 is between the roughness provided by the first trimming zone 110 and the roughness provided by the second trimming zone 120, so that through the setting of the first trimming buffer zone 140, a buffering effect can be achieved, and the span of the PCR and U values ​​of each trimming zone can be reduced.

[0079] The first trimming buffer area 140 may also be disposed at an edge of the first trimming area 110 adjacent to the first isolation groove 161 , or the first trimming buffer area 140 may be disposed on both sides of the first isolation groove 161 , that is, distributed at the edges of the first trimming area 110 and the second trimming area 120 .

[0080] Similarly, second trimming buffer particles 151 different from the third trimming particles 131 are arranged at the edge of the third trimming area 130 adjacent to the edge of the second isolation groove 162 to form a second trimming buffer area 150 to achieve a buffering effect. Therefore, by setting the trimming buffer area, a gradient change in roughness can be achieved.

[0081] As an example, the morphology formed by the N different trimming zones may include concentric rings around the center of the trimming disk 100; the morphology formed by the N different trimming zones may also include a fan shape diverging outward from the center of the trimming disk 100 or an arc shape diverging outward from the center of the trimming disk 100.

[0082] Specifically, Figure 2 Schematic diagram of the morphology of the concentric annular trimming disk formed by the first trimming area 110, the second trimming area 120 and the third trimming area 130 when N is 3, but the morphology of the trimming disk 100 is not limited thereto; Figure 7 In another embodiment, when N is 3, different trimming zones may also constitute fan-shaped trimming disks that radiate outward from the center of the trimming disk 100; Figure 8 In yet another embodiment, when N is 3, different trimming zones may also constitute an arc-shaped trimming disk radiating outward from the center of the trimming disk 100 .

[0083] The value of N in the trimming disk 100 is not limited to 3, and the value of N may also be 2, 4, 5, etc., which is not limited here.

[0084] As an example, the trimming areas providing different roughnesses may be arranged periodically.

[0085] For details, see Fig. 9 The figure shows the morphology of the concentric annular trimming disk formed by the first trimming area 110 and the second trimming area 120 when N is 2, wherein the first trimming area 110 and the second trimming area 120 are arranged periodically from the outside to the inside, and the number of repeated cycles can be selected as needed and is not limited here. Similarly, the trimming disk 100 in a fan shape or an arc shape can also be arranged periodically.

[0086] As an example, each of the trimming areas may be a removable trimming area.

[0087] Specifically, in order to further expand the application scope and operational flexibility of the polishing pad dresser, each dressing area in the dressing disc 100 can be set as a detachable dressing area, so that each dressing area can be flexibly replaced as needed. The disassembly and installation methods of each dressing area are not excessively restricted here.

[0088] As an example, the cleaning structure 200 may include a water regulator connected to the nozzle, and the water regulator is disposed corresponding to the isolation groove.

[0089] Specifically, Figure 1 As shown, the cleaning structure 200 may include a first water volume regulator 221 connected to the first nozzle 211, and a second water volume regulator 222 connected to the second nozzle 212, so that through the setting of the water volume regulator, the corresponding nozzles located in the isolation groove can be individually controlled to achieve timely cleaning of the wear and tear. For example, according to the rotation speed of the dressing disc 100 and the grinding conditions of each dressing area, the water volume of each nozzle can be adjusted separately to achieve a quick cleaning effect.

[0090] As an example, the nozzle may be an adjustable nozzle, by which a spray direction of the cleaning fluid provided by the nozzle is changed.

[0091] Specifically, when the nozzle is set as an adjustable nozzle, the spray direction of the cleaning liquid provided by the nozzle can be changed by changing the direction of the nozzle, so that the spray direction of the cleaning liquid can be flexibly adjusted according to specific grinding requirements to achieve timely and efficient cleaning effects.

[0092] Among them, in applications such as Figure 1When the grinding pad dresser is used, each of the dressing areas can be set to have a PCR and U value, so that there are three different PCR and U values ​​on the dressing disk 100, namely, the third dressing area 130 located inside, the second dressing area 120 located in the middle and the first dressing area 110 located outside, and the first dressing area 110 has the largest linear speed, the lowest PCR and the lowest U value, while the third dressing area 130 is the opposite, the linear speed, PCR and U value of the second dressing area 120 are located between the first dressing area 110 and the third dressing area 130, so that the grinding pad can be rough ground by the third dressing area 130, the second dressing area 120 performs intermediate state adjustment, and the third dressing area 130 performs further repair, so that the surface of the grinding pad can undergo three state transitions of roughness-intermediate state adjustment-repair flatness, and the combination of these three states can change the roughness of the grinding pad surface. The pressure regulating system can be used to individually control the pressures of different dressing areas, so that different dressing areas can correspond to different pressures, and thus different dressing areas can exert different pressures on the polishing pad 400. In this way, dynamic pressure regulation of the dressing disk 100 can be achieved, and the roughness of the polishing pad 400 can be dynamically repaired, thereby solving the change in surface roughness of the polishing pad 400 caused by changes in service life.

[0093] The present application also provides a chemical mechanical polishing device, which includes the above-mentioned polishing pad dresser. The specific structure of the polishing pad dresser is not described here.

[0094] In summary, the polishing pad dresser and chemical mechanical polishing equipment of the utility model include a dressing disk with different dressing areas and a pressure regulating system, wherein the dressing disk includes N different dressing areas, N ≥ 2 and is an integer, each dressing area has an isolation groove, and different dressing areas provide different roughness; the pressure regulating system includes an adjustable air pressure chamber, a roughness sensor and a pressure controller, the adjustable air pressure chamber is arranged above the dressing disk, and is arranged corresponding to each dressing area to adjust the air pressure of each dressing area in a zoned manner; the roughness sensor is arranged above the polishing pad to be dressed to obtain the roughness of the polishing pad; the adjustable air pressure chamber and the roughness sensor are both in communication with the pressure controller; further, it can also include a cleaning structure to provide a cleaning liquid.

[0095] The grinding pad dresser and chemical mechanical grinding equipment of the utility model can meet the diversified needs of grinding pads for dressing discs and realize the normalization of dressing discs; can adjust the pressure zones to adapt to the dynamic changes of the roughness of the grinding pads; and can realize the timely cleaning of wear objects. Therefore, the utility model effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0096] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A grinding pad dresser, characterized in that: The grinding pad dresser comprises: A trimming disc, wherein the trimming disc comprises N different trimming areas, where N is greater than or equal to 2 and is an integer, isolation grooves are provided between the trimming areas, and different trimming areas provide different roughnesses; A pressure regulating system, the pressure regulating system includes an adjustable air pressure chamber, a roughness sensor and a pressure controller, the adjustable air pressure chamber is arranged above the dressing disk and is arranged corresponding to each of the dressing areas to perform zone-by-zone air pressure regulation on each of the dressing areas; the roughness sensor is arranged above the grinding pad to be dressed to obtain the roughness of the grinding pad; the adjustable air pressure chamber and the roughness sensor are both in communication with the pressure controller.

2. The polishing pad dresser according to claim 1, characterized in that: The pressure regulating system further comprises an air pressure monitor, which is arranged corresponding to the adjustable air pressure chamber to monitor the air pressure of the adjustable air pressure chamber, and the air pressure monitor communicates with the pressure controller.

3. The polishing pad dresser according to claim 1, characterized in that: The adjustable air pressure chamber comprises a piston adjustable air pressure chamber.

4. The polishing pad dresser according to claim 1, characterized in that: The shapes formed by the N different trimming areas include concentric rings around the center of the trimming disk, fans radiating outward from the center of the trimming disk, or arcs radiating outward from the center of the trimming disk; each trimming area is a detachable trimming area.

5. The polishing pad dresser according to claim 1, characterized in that: The trimming areas providing different roughness are arranged periodically.

6. The polishing pad dresser according to claim 1, characterized in that: Different trimming areas have different trimming particles, wherein the different trimming particles include one or a combination of trimming particles with different particle sizes and trimming particles with different distributions.

7. The polishing pad dresser according to claim 1, characterized in that: It also includes a cleaning structure, which includes a nozzle. The nozzle is arranged in the isolation tank to provide a cleaning liquid.

8. The polishing pad dresser according to claim 7, characterized in that: The cleaning structure includes a water volume regulator connected to the nozzle, and the water volume regulator is arranged corresponding to the isolation groove; the nozzle is an adjustable nozzle, and the spray direction of the cleaning liquid provided by the nozzle is changed by the adjustable nozzle.

9. The polishing pad dresser according to claim 1, characterized in that: The trimming areas with different roughness are provided and adjacent to the isolation grooves are also provided with trimming buffer areas at their edges to achieve a gradient change in roughness.

10. A chemical mechanical polishing device, characterized in that: The chemical mechanical polishing equipment comprises the polishing pad dresser according to any one of claims 1 to 9.

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