Illumination module, vehicle lamp and vehicle

Abstract

The utility model discloses a lighting module, a car lamp and a car, the lighting module comprises a lamp bead, a PCB (printed circuit board) and a radiator, the lamp bead is attached to one side face of the PCB, and the other side face of the PCB is connected with the radiator in an attached mode; the first heat conduction piece is arranged on the PCB and used for transferring heat generated by the lamp beads to the radiator, and the heat conduction performance of the first heat conduction piece is higher than that of the PCB; the second heat conduction piece is arranged on the radiator, is attached to the first heat conduction piece and is used for exchanging heat with the first heat conduction piece, and the heat conduction performance of the second heat conduction piece is not lower than that of the radiator. By means of the arrangement, heat generated by the lamp beads is conducted to the radiator more rapidly, efficiently and completely, a two-stage conduction heat dissipation system is formed between the PCB and the radiator, heat dissipation of the lamp beads is accelerated, the frequency of overheating protection is effectively reduced, the lamp beads are protected, and therefore the service life of the lamp beads is prolonged; and the improvement of the heat dissipation efficiency is also beneficial to increasing the maximum use power consumption of the high-power projection headlamp.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle lamps, and in particular to a lighting module, a vehicle lamp and a vehicle. Background Art

[0002] The new integrated LED light board is a major breakthrough in car headlights. The lamp beads are concentrated and the power consumption is large, so the heat dissipation issue is particularly important.

[0003] At present, in order to improve the heat dissipation effect of the integrated LED light board, a heat sink connected to the integrated LED light board is usually set up to dissipate heat from the integrated LED light board through the heat sink to improve the use effect of the integrated LED light board. However, in the actual operation process, with the continuous expansion of the functional requirements of the car lights, the integration of the lamp beads is further increased. Simply increasing the heat dissipation capacity of the PCB board where the lamp beads are located is far from achieving the heat conduction efficiency under the current technology, which is not conducive to the rapid heat dissipation of high-power lamp beads. Therefore, overheating protection frequently occurs during the use of car lights, thus affecting normal use. At the same time, there are unfavorable factors for protecting LED lamp beads and extending their service life.

[0004] Therefore, how to provide a lighting module to improve the heat conduction efficiency, thereby improving the heat dissipation effect, reducing the frequency of overheating protection, and extending the service life of lamp beads is a technical problem that technical personnel need to solve urgently. Utility Model Content

[0005] In view of this, the utility model provides a lighting module to improve the heat conduction efficiency, thereby improving the heat dissipation effect, reducing the frequency of overheat protection, and extending the service life of the lamp beads. In addition, the utility model also provides a vehicle lamp and a vehicle having the above lighting module.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A lighting module, comprising: a lamp bead, a PCB board and a heat sink, wherein the lamp bead is attached to one side of the PCB board, and the other side of the PCB board is attached to and connected to the heat sink;

[0008] It also includes: a first heat-conducting member, which is disposed on the PCB board and is used to transfer the heat generated by the lamp beads to the heat sink, and the heat conductivity of the first heat-conducting member is higher than the heat conductivity of the PCB board;

[0009] The second heat-conducting member is arranged on the heat sink and is in contact with the first heat-conducting member for heat exchange with the first heat-conducting member, and the heat conductivity of the second heat-conducting member is not lower than that of the heat sink.

[0010] Preferably, in the above-mentioned lighting module, along the thickness direction of the PCB board, the projection of the ground pad of the lamp bead on the PCB board completely falls within the range of the first heat conductor.

[0011] Preferably, in the above-mentioned lighting module, the first heat-conducting member is at least partially embedded in or penetrates the PCB board along the thickness direction;

[0012] And / or, the second heat conducting member is at least partially embedded in the heat sink.

[0013] Preferably, in the above-mentioned lighting module, the material of the first heat-conducting member is at least one of copper, aluminum, titanium, silver and gold;

[0014] and / or,

[0015] The second heat conducting member is made of at least one of copper, aluminum, titanium, silver and gold.

[0016] Preferably, in the above-mentioned lighting module, along the thickness direction of the PCB board, the projection of the first heat-conducting member on the heat sink completely falls within the range of the second heat-conducting member.

[0017] Preferably, in the above-mentioned lighting module, a plurality of protrusions are distributed on a side of the second heat-conducting member close to the first heat-conducting member;

[0018] and / or,

[0019] The first heat-conducting member and the second heat-conducting member are bonded and connected by heat-conducting adhesive.

[0020] Preferably, in the above-mentioned lighting module, the PCB board is a multi-layer board structure arranged in stacked layers.

[0021] Preferably, in the above-mentioned lighting module, the lamp bead is detachably fixedly connected to the PCB board, the PCB board is detachably fixedly connected to the radiator, and the first heat conductor is limited in the PCB board through the lamp bead and the radiator, and the second heat conductor is limited in the radiator through the PCB board.

[0022] A vehicle lamp comprises a lighting module, wherein the lighting module is any one of the lighting modules described above.

[0023] A vehicle comprises a headlight, wherein the headlight is the headlight described above.

[0024] The utility model discloses a lighting module in an embodiment, by arranging a first heat-conducting member on a PCB board and arranging a second heat-conducting member on a heat sink, and the heat conductivity of the first heat-conducting member is greater than the heat conductivity of the PCB board, so that the heat generated by the lamp beads can be quickly transferred to the second heat-conducting member through the first heat-conducting member and dissipated through the heat sink. Through the above arrangement, the heat generated by the lamp beads is more quickly, efficiently and completely conducted to the heat sink, so that a two-level conduction heat dissipation system is formed between the PCB board and the heat sink, accelerating the heat dissipation of the lamp beads, effectively reducing the frequency of overheating protection, protecting the lamp beads and thus extending the service life of the lamp beads. In addition, the improvement of heat dissipation efficiency can also be conducive to increasing the maximum power consumption of high-power projection headlights. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a front view of the lighting module disclosed in the embodiment of the utility model;

[0027] Structural diagram;

[0028] Figure 2 A top view of the lighting module disclosed in the embodiment of the utility model;

[0029] Figure 3 This is a front view of the connection between the lamp beads and the PCB board of the lighting module disclosed in the embodiment of the utility model;

[0030] Figure 4 A top view of the connection between the lamp beads and the PCB board of the lighting module disclosed in the embodiment of the utility model;

[0031] Figure 5 A first position relationship diagram of the first heat-conducting member of the lighting module disclosed in the embodiment of the utility model on the PCB board;

[0032] Figure 6 A second position relationship diagram of the first heat-conducting member of the lighting module disclosed in the embodiment of the utility model on the PCB board;

[0033] Figure 7 It is a front view of the heat sink of the lighting module disclosed in the embodiment of the utility model;

[0034] Figure 8 It is a side view of the heat sink of the lighting module disclosed in the embodiment of the utility model.

[0035] in,

[0036] 1 is the lamp bead, 2 is the PCB board, and 3 is the heat sink;

[0037] 11 is a ground pad, 21 is a first heat conducting member, and 31 is a second heat conducting member. DETAILED DESCRIPTION

[0038] The utility model discloses a lighting module, which improves the heat conduction efficiency, thereby improving the heat dissipation effect, reducing the frequency of overheat protection, and extending the service life of the lamp beads. In addition, the utility model also discloses a vehicle lamp and a vehicle having the lighting module.

[0039] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0040] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0041] The new integrated LED light board is a major breakthrough in car headlights. The lamp beads are concentrated and the power consumption is large, so the heat dissipation issue is particularly important.

[0042] At present, in order to improve the heat dissipation effect of the integrated LED light board, a heat sink connected to the integrated LED light board is usually set up to dissipate heat from the integrated LED light board through the heat sink to improve the use effect of the integrated LED light board. However, in the actual operation process, with the continuous expansion of the functional requirements of the car lights, the integration of the lamp beads is further increased. Simply increasing the heat dissipation capacity of the PCB board where the lamp beads are located is far from achieving the heat conduction efficiency under the current technology, which is not conducive to the rapid heat dissipation of high-power lamp beads. Therefore, overheating protection frequently occurs during the use of car lights, thus affecting normal use. At the same time, there are unfavorable factors for protecting LED lamp beads and extending their service life.

[0043] Based on the above problems, combined with Figures 1 to 8 As shown, the present application discloses a lighting module, including lamp beads 1 forming a lamp board, a PCB board 2 and a heat sink 3.

[0044] The lamp bead 1 includes but is not limited to an LED lamp. The shape, size and power of the lamp bead 1 can be set according to different needs and are not specifically limited here.

[0045] The PCB board 2 is connected to the lamp bead 1, and is used to power the lamp bead 1 and control the operation of the lamp bead 1, including but not limited to the on and off of the lamp bead 1. It should be noted that the connection method and control method of the PCB board 2 and the lamp bead 1 can refer to the existing known content.

[0046] The heat sink 3 is arranged on the other side of the PCB board. The lamp bead 1 in the present application is attached to one side of the PCB board 2, and the heat sink 3 is attached to the other side of the PCB board 2. The heat generated by the lamp bead 1 can be dissipated through the heat sink 3. Based on the function of the heat sink 3, it can be known that any structure of the heat sink that can achieve heat dissipation is within the scope of the present application.

[0047] On the basis of the above technical solution, the lighting module in the present application further includes a first heat conducting member 21 and a second heat conducting member 31 .

[0048] The first heat-conducting member 21 is arranged on the PCB board 2, and can transfer the heat generated by the lamp bead 1 to the heat sink 3, and the thermal conductivity of the first heat-conducting member 21 is higher than that of the PCB board 2; the second heat-conducting member 31 is arranged on the heat sink 3, and fits with the first heat-conducting member 21, and is used for heat exchange with the first heat-conducting member 21, and the thermal conductivity of the second heat-conducting member 31 is not lower than that of the heat sink 3. The first heat-conducting member 21 can absorb the heat generated by the lamp bead 1, and transfer it to the heat sink 3 through the second heat-conducting member 31 for heat dissipation.

[0049] The thermal conductivity of the second heat-conducting member 31 is not lower than that of the heat sink 3 , so as to avoid reducing the heat exchange efficiency between the heat sink 3 and the PCB board.

[0050] In the present application, a first heat-conducting member 21 is arranged on the PCB board 2, and a second heat-conducting member 31 is arranged on the radiator 3, and the heat conductivity of the first heat-conducting member 21 is greater than the heat conductivity of the PCB board 2, so that the heat generated by the lamp bead 1 can be quickly transferred to the second heat-conducting member 31 through the first heat-conducting member 21 and dissipated through the radiator 3. Through the above arrangement, the heat generated by the lamp bead 1 is more quickly, efficiently and completely conducted to the radiator 3, so that a two-level conduction heat dissipation system is formed between the PCB board 2 and the radiator 3, which accelerates the heat dissipation of the lamp bead 1, effectively reduces the frequency of overheating protection, protects the lamp bead 1 and thus prolongs the service life of the lamp bead 1. In addition, the improvement of heat dissipation efficiency can also help increase the maximum power consumption of the high-power projection headlight.

[0051] Combination Figure 3In some embodiments, along the thickness direction of the PCB board 2, the projection of the ground pad 11 of the lamp bead 1 on the PCB board completely falls within the range of the first heat conductor 21. When the lamp bead 1 is working, a large amount of heat will be generated at the connection between the lamp bead 1 and the power supply and at the ground pad 11. In this application, the ground pad 11 of the lamp bead 1 is fitted and connected with the first heat conductor 21, so that a large amount of heat generated by the lamp bead 1 can be directly transferred to the heat sink 3 through the first heat conductor 21 at the ground pad 11, further improving the heat dissipation efficiency.

[0052] Those skilled in the art will appreciate that the position where the first heat-conducting member 21 fits with the lamp bead 1 can be set according to different heat dissipation needs. In the present application, only the grounding pad 11 fits with the first heat-conducting member 21, which can improve the heat dissipation efficiency while reducing the size of the first heat-conducting member 21, thereby avoiding the PCB board 2 from being too large.

[0053] Combination Figures 4 to 6 As shown, the first heat-conducting member 21 is at least partially embedded in the PCB board 2, and the size of the first heat-conducting member 21 embedded in the PCB board 2 can be set according to different needs. Exemplarily, the first heat-conducting member 21 can be embedded in the PCB board 2 along the thickness direction of the PCB board 2, and the upper surface of the first heat-conducting member 21 (the side close to the lamp bead 1) can be flush with the upper surface of the PCB board 2 (the side close to the lamp bead). Of course, the first heat-conducting member 21 can also be partially embedded in the PCB board 2, for example, the upper surface of the first heat-conducting member 21 protrudes from the upper surface of the PCB board 2.

[0054] In some embodiments, the first heat conducting member 21 may also be completely embedded in the PCB board 2. It can be understood that the first heat conducting member 21 is buried in the PCB board 2. Figure 6 As shown, the surface of the first heat-conducting member 21 is not exposed to the PCB board 2. The depth of the first heat-conducting member 21 relative to the PCB board 2 can be set according to different needs and is within the protection range.

[0055] Combination Figure 7 and Figure 8 As shown, the second heat-conducting member 31 in the present application is at least partially embedded in the heat sink 3. Exemplarily, the second heat-conducting member 31 is embedded in the heat sink 3, and the upper surface of the second heat-conducting member 31 (the side close to the PCB board 2) can be flush with the upper surface of the heat sink 3 (the side close to the PCB board 2). When the second heat-conducting member 31 is attached to the first heat-conducting member 21, the heat sink 3 is attached to the PCB board 2, which is conducive to reducing the size of the lighting module along the direction of the connection between the lamp bead 1 and the heat sink 3.

[0056] Those skilled in the art can understand that the embedding depth of the second heat conducting member 31 can be set according to different needs and is within the protection range.

[0057] In an optional embodiment, the material of the first heat conductor 21 is at least one of copper, aluminum, titanium, silver and gold; and / or the material of the second heat conductor 31 is at least one of copper, aluminum, titanium, silver and gold. Using a material with better thermal conductivity can help to improve the rapid heat dissipation of the lamp bead 1 and increase the service life of the lamp bead 1. When the technicians in this field make actual choices, combined with the cost requirements, the first heat conductor 21 and the second heat conductor 31 are preferably made of copper.

[0058] The sizes of the first heat-conducting member 21 and the second heat-conducting member 31 can be set according to different needs. In the embodiment of the present application, the size of the first heat-conducting member 21 is larger than the size of the ground pad 11 of the lamp bead 1. Along the thickness direction of the PCB board 2, the projection of the first heat-conducting member 21 on the heat sink 3 completely falls within the range of the second heat-conducting member 31, that is, the size of the second heat-conducting member 31 is not smaller than the size of the first heat-conducting member 21.

[0059] The shapes of the first heat conducting member 21 and the second heat conducting member 31 are not specifically limited, including but not limited to rectangular blocks, cylinders, or special shapes. Those skilled in the art can select the shapes of the first heat conducting member 21 and the second heat conducting member 31 according to different needs.

[0060] In some embodiments, a second heat-conducting member 31 has a plurality of protrusions on one side close to the first heat-conducting member 21. The size of the protrusions can be very small and can be connected to form a plurality of convex points on the second heat-conducting member 31. By increasing the convex points, it is convenient to fully contact with the first heat-conducting member 21. In addition, the first heat-conducting member 21 and the second heat-conducting member 31 are connected by thermally conductive adhesive, which can increase the stability of the connection between the first heat-conducting member 21 and the second heat-conducting member 31, so as to prevent the first heat-conducting member 21 and the second heat-conducting member 31 from being offset and affecting the heat conduction effect.

[0061] Combination Figure 5 and Figure 6 As shown, the PCB board 2 in the present application can be a multi-layer board structure arranged in layers, and of course it can also be a single-layer structure. The first heat-conducting member 21 is embedded in the PCB board along the thickness direction of the PCB board 2, and the copper block can be buried in the inner layer of the PCB board. For example, for an 8-layer PCB board, the first heat-conducting member 21 is embedded between the 2nd layer and the 7th layer.

[0062] In some embodiments, the lamp bead 1 and the PCB board 2 are detachably fixedly connected, including but not limited to a snap-on or threaded connection; the PCB board 2 and the radiator 3 are detachably fixedly connected, including but not limited to a snap-on or threaded connection; the first heat conductor 21 is limited in the PCB board 2 through the lamp bead 1 and the radiator 3, and the second heat conductor 31 is limited in the radiator 3 through the PCB board 2.

[0063] In the present application, the connection between the lamp bead 1, the PCB board 2 and the heat sink 3 is utilized to limit the connection between the first heat conductor 21 and the second heat conductor 31, which is beneficial to reducing the connecting parts when the first heat conductor 21 and the PCB board 2 are assembled, and the connecting parts when the second heat conductor 31 and the heat sink 3 are assembled, which is beneficial to reducing the number of parts, improving assembly efficiency, and can reduce the assembly requirements of the first heat conductor 21 and the second heat conductor 31.

[0064] In addition, the present application also discloses a vehicle lamp, including the lighting module disclosed in the above embodiments. Therefore, the vehicle lamp having the lighting module also has all the above technical effects, which will not be described one by one here.

[0065] In addition, the present application also discloses a vehicle, including the headlight disclosed in the above embodiment. Therefore, the vehicle with the headlight also has all the above technical effects, which will not be described one by one here.

[0066] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0067] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A lighting module, characterized in that: include: A lamp bead, a PCB board and a heat sink, wherein the lamp bead is fitted to one side of the PCB board, and the other side of the PCB board is fitted and connected to the heat sink; It also includes: a first heat-conducting member, which is disposed on the PCB board and is used to transfer the heat generated by the lamp beads to the heat sink, and the heat conductivity of the first heat-conducting member is higher than the heat conductivity of the PCB board; The second heat-conducting member is arranged on the heat sink and is in contact with the first heat-conducting member for heat exchange with the first heat-conducting member, and the heat conductivity of the second heat-conducting member is not lower than that of the heat sink.

2. The lighting module according to claim 1, characterized in that: Along the thickness direction of the PCB board, the projection of the ground pad of the lamp bead on the PCB board completely falls within the range of the first heat conducting member.

3. The lighting module according to claim 1, characterized in that: The first heat-conducting member is at least partially embedded in or penetrates the PCB board along the thickness direction; And / or, the second heat conducting member is at least partially embedded in the heat sink.

4. The lighting module according to claim 1, characterized in that: The material of the first heat conducting member is at least one of copper, aluminum, titanium, silver and gold; and / or, The second heat conducting member is made of at least one of copper, aluminum, titanium, silver and gold.

5. The lighting module according to claim 1, characterized in that: Along the thickness direction of the PCB board, the projection of the first heat-conducting member on the heat sink completely falls within the range of the second heat-conducting member.

6. The lighting module according to claim 1, characterized in that: A plurality of protrusions are distributed on a side of the second heat-conducting member close to the first heat-conducting member; and / or, The first heat-conducting member and the second heat-conducting member are bonded and connected by heat-conducting adhesive.

7. The lighting module according to any one of claims 1 to 6, characterized in that: The PCB board is a multi-layer board structure with stacked arrangements.

8. The lighting module according to claim 7, characterized in that: The lamp bead is detachably fixedly connected to the PCB board, the PCB board is detachably fixedly connected to the radiator, and the first heat conductor is limited in the PCB board through the lamp bead and the radiator, and the second heat conductor is limited in the radiator through the PCB board.

9. A vehicle lamp, comprising a lighting module, characterized in that: The lighting module is the lighting module according to any one of claims 1 to 8.

10. A vehicle, comprising a lamp, characterized in that: The vehicle lamp is the vehicle lamp as claimed in claim 9.

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