Lighting device and lighting system

Abstract

The utility model provides a lighting device and a lighting system, the lighting device comprises a heat conduction base, a light-emitting chip, a plurality of radiating fins and a plurality of heat conduction welding layers, the light-emitting chip is directly welded on the heat conduction base through the heat conduction welding layers, the radiating fins are welded on the heat conduction base through the heat conduction welding layers, and the radiating fins are welded on the heat conduction base through the heat conduction welding layers. The heat dissipation fins are arranged at intervals in the length direction or the width direction of the heat conduction base, and the heat conductivity of the heat conduction welding layer is larger than or equal to 200 W / (m.K). Therefore, compared with the lighting device of the related technology, the lighting device provided by the embodiment of the utility model has the advantages that the light-emitting chip can be directly welded on the heat-conducting base through the heat-conducting welding layer, a middle ceramic substrate is omitted, the assembly process is simplified, the production cost is reduced, and the production efficiency is improved. In addition, due to the fact that the light-emitting chip is directly welded to the heat conduction base, the light-emitting chip can rapidly conduct heat to the heat dissipation fins for heat dissipation, and therefore the heat dissipation effect of the lighting device can be improved.

Description

Technical Field

[0001] The present application relates to the field of lighting technology, and in particular to a lighting device and a lighting system. Background Art

[0002] The lighting device has the function of lighting. However, the light-emitting chip of the lighting device in the related art is generally soldered to a ceramic substrate through solder paste, and then the ceramic substrate is soldered to a thermal conductive substrate through solder paste, which makes the assembly process of the lighting device more complicated and the heat dissipation effect is poor. Utility Model Content

[0003] The embodiments of the present invention provide a lighting device and a lighting system to improve at least one of the above problems.

[0004] The implementation method of the utility model achieves the above-mentioned purpose through the following technical solutions.

[0005] In a first aspect, an embodiment of the utility model provides a lighting device, which includes a thermally conductive base, a light-emitting chip, a plurality of heat-dissipating fins and a plurality of heat-dissipating welding layers, wherein the light-emitting chip is directly welded to the thermally conductive base through the heat-dissipating welding layer, and the plurality of heat-dissipating fins are welded to the thermally conductive base through the heat-dissipating welding layer, and the plurality of heat-dissipating fins are arranged at intervals along the length direction or the width direction of the thermally conductive base, and the thermal conductivity of the heat-dissipating welding layer is greater than or equal to 200 W / (m·K).

[0006] In some embodiments, the thermal conductivity of the thermally conductive solder layer is greater than or equal to 200 W / (m·K).

[0007] In some embodiments, the shear strength of the thermally conductive welding layer is greater than 60 MPa; and / or the Young's modulus of the thermally conductive welding layer is greater than or equal to 21 GPa.

[0008] In some embodiments, the thermal expansion coefficient of the thermally conductive welding layer is greater than or equal to 10 ppm / °C and less than or equal to 25 ppm / °C; and / or the service temperature of the thermally conductive welding layer is greater than or equal to 800°C.

[0009] In some embodiments, the thermally conductive soldering layer is a pressureless sintered silver layer, and the thermally conductive base is selected from one of a gold thermally conductive base, a silver thermally conductive base, or a copper thermally conductive base.

[0010] In some embodiments, the thermally conductive base includes a thermally conductive base body and a thermally conductive boss connected to each other, and the light emitting chip is located at an end of the thermally conductive boss away from the thermally conductive base body.

[0011] In some embodiments, there are multiple thermal conductive bosses, and two adjacent thermal conductive bosses are arranged at intervals. There are multiple light-emitting chips, and the multiple light-emitting chips are respectively installed on the multiple thermal conductive bosses.

[0012] In some embodiments, a plurality of heat dissipation fins are mounted on a side of the thermal conductive base facing away from the light emitting chip.

[0013] In a second aspect, an embodiment of the utility model provides a lighting system, which includes a housing and a lighting device according to any of the above embodiments, wherein the lighting device is installed in the housing.

[0014] In some embodiments, the lighting system further includes a light collecting device and a light focusing device, which are installed on the housing, and the light collecting device is used to collect light emitted by the light emitting chip and emit it to the light focusing device.

[0015] In some embodiments, the lighting system further includes a light homogenizing device, which is installed on the housing and is used to evenly distribute the light emitted by the light emitting chip to the light focusing device after passing through the light collecting device.

[0016] In the lighting device and lighting system provided by the embodiment of the utility model, the lighting device includes a heat-conducting base, a light-emitting chip, a plurality of heat-dissipating fins and a plurality of heat-conducting welding layers, the light-emitting chip is directly welded to the heat-conducting base through the heat-conducting welding layer, the plurality of heat-dissipating fins are welded to the heat-conducting base through the heat-conducting welding layer, the plurality of heat-dissipating fins are arranged at intervals along the length direction or the width direction of the heat-conducting base, and the thermal conductivity of the heat-conducting welding layer is greater than or equal to 200W / (m·K). In this way, compared with the lighting device of the related art, the light-emitting chip of the lighting device of the embodiment of the present application can be directly welded to the heat-conducting base through the heat-conducting welding layer, eliminating the ceramic substrate in the middle, simplifying the assembly process, reducing the production cost, and improving the production efficiency. In addition, since the light-emitting chip is directly welded to the heat-conducting base, the ceramic substrate in the middle is reduced, so that the light-emitting chip can quickly conduct heat to the plurality of heat-dissipating fins for heat dissipation, thereby helping to improve the heat dissipation effect of the lighting device. Moreover, this also makes the structure of the lighting device more compact and more stable, and the connection between the light-emitting chip and the heat-conducting base is more firm and not easily affected by external vibration or impact, thereby improving the reliability of the lighting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the implementation manner will be briefly introduced below. Obviously, the drawings described below are only some implementation manners of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A schematic structural diagram of a lighting device provided in an embodiment of the utility model is shown.

[0019] Figure 2A structural schematic diagram of a lighting system provided by an embodiment of the utility model is shown.

[0020] Figure 3 A schematic diagram of the maximum junction temperature reached by the pressureless sintered silver layer of the solder paste and the lighting device provided by the embodiment of the utility model under different board temperatures is shown.

[0021] Description of Figure Numbers:

[0022] The lighting device 10, the lighting system 20, the thermally conductive base 100, the thermally conductive base body 110, the thermally conductive boss 120, the light emitting chip 200, the thermally conductive welding layer 300, the heat dissipation fins 400, the housing 500, the light collecting device 600, the focusing device 700, and the light homogenizing device 800. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the implementation of the utility model will be clearly and completely described below in conjunction with the drawings in the implementation of the utility model. Obviously, the described implementation is only a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by those skilled in the art without making creative work are within the scope of protection of the utility model.

[0024] The technical solutions in the implementation scheme of the utility model will be clearly and completely described below in conjunction with the accompanying drawings in the implementation scheme of the utility model.

[0025] See also Figure 1 and Figure 2 The embodiment of the utility model provides a lighting device 10, which can be applied to a lighting system 20, wherein the lighting system 20 can be a stage light, a beam light, a searchlight, or the like.

[0026] The lighting device 10 may include a thermally conductive base 100, a light-emitting chip 200, a plurality of heat-dissipating fins 400, and a plurality of heat-dissipating welding layers 300. The light-emitting chip 200 may be directly welded to the thermally conductive base 100 through the heat-dissipating welding layer 300. The plurality of heat-dissipating fins 400 may be welded to the thermally conductive base 100 through the heat-dissipating welding layer 300. The plurality of heat-dissipating fins 400 may be arranged at intervals along the length direction or the width direction of the thermally conductive base 100. The thermal conductivity of the heat-dissipating welding layer 300 is greater than or equal to 200 W / (m·K). Thus, compared with the lighting device 10 of the related art, the light-emitting chip 200 of the lighting device 10 of the embodiment of the present application may be directly welded to the thermally conductive base 100 through the heat-dissipating welding layer 300, eliminating the intermediate ceramic substrate, simplifying the assembly process, reducing the production cost, and improving the production efficiency.

[0027] In addition, since the light emitting chip 200 is directly welded on the thermally conductive base 100, the ceramic substrate in the middle is reduced, so that the light emitting chip 200 can quickly conduct heat to the multiple heat dissipation fins 400 for heat dissipation, thereby helping to improve the heat dissipation effect of the lighting device 10. Moreover, this also makes the structure of the lighting device 10 more compact and more stable, and the connection between the light emitting chip 200 and the thermally conductive base 100 is more secure and not easily affected by external vibration or impact, thereby improving the reliability of the lighting device 10.

[0028] There are many options for the light emitting chip 200 . For example, the light emitting chip 200 may be an LED chip. For another example, the light emitting chip 200 may be an LD chip.

[0029] In some embodiments, the lighting device 10 may include a circuit board, which can control the working state of the light-emitting chip 200 through wires, so that the light-emitting chip 200 does not need to be electrically connected to the thermal conductive base 100, which helps the lighting device 10 form a thermally and electrically separated thermal conductive channel.

[0030] In some embodiments, the thermal conductivity of the thermally conductive welding layer 300 is greater than or equal to 200W / (m·K). The thermal conductivity of the thermally conductive welding layer 300 may be, but is not limited to, 200W / (m·K), 250W / (m·K), 300W / (m·K), or 350W / (m·K). Thus, by directly welding the light emitting chip 200 to the thermally conductive base 100 using the thermally conductive welding layer 300, the thermal conductivity of the thermally conductive welding layer 300 is greater than or equal to 200W / (m·K), which can significantly improve the thermal conductivity efficiency of the thermally conductive welding layer 300, reduce thermal resistance, and enable the heat generated by the light emitting chip 200 to be more quickly transferred to the thermally conductive base 100 through the thermally conductive welding layer 300 and dissipated, thereby ensuring the stability and long life of the lighting device 10.

[0031] In some embodiments, the shear strength of the thermally conductive welding layer 300 is greater than 60 MPa. When the thermally conductive welding layer 300 is subjected to shear force, corresponding shear stress will be generated inside the thermally conductive welding layer 300. The shear strength of the thermally conductive welding layer 300 is the maximum stress value that the thermally conductive welding layer 300 can withstand under the shear stress until irreversible plastic deformation or local rupture occurs. In simple terms, the shear strength of the thermally conductive welding layer 300 is a measure of the tolerance limit of the thermally conductive welding layer 300 under shear state, that is, the maximum shear stress level that the thermally conductive welding layer 300 can withstand without being damaged. Among them, the shear strength of the thermally conductive welding layer 300 can be but is not limited to 61 MPa, 65 MPa, 70 MPa, 75 MPa or 80 MPa, etc. In this way, the shear strength of the thermal conductive welding layer 300 is relatively large, so that the thermal conductive welding layer 300 has sufficient mechanical strength to support and fix the light-emitting chip 200, and ensure that the light-emitting chip 200 will not be displaced or damaged due to mechanical vibration or external force during operation, thereby ensuring the mechanical stability of the lighting device 10.

[0032] In some embodiments, the Young's modulus of the thermally conductive welding layer 300 is greater than or equal to 21 GPa. The Young's modulus of the thermally conductive welding layer 300 reflects the ability of the thermally conductive welding layer 300 to resist deformation. Among them, the Young's modulus of the thermally conductive welding layer 300 can be but is not limited to 21 GPa, 25 GPa, 30 GPa or 35 GPa, etc. In this way, the Young's modulus of the thermally conductive welding layer 300 is large, so that the material properties of the thermally conductive welding layer 300 are relatively hard and not easy to deform under the action of external force.

[0033] In some embodiments, the thermal expansion coefficient of the thermally conductive welding layer 300 is greater than or equal to 10ppm / °C and less than or equal to 25ppm / °C. The thermal expansion coefficient of the thermally conductive welding layer 300 refers to the relative increase in volume or length of the thermally conductive welding layer 300 under a unit temperature change. Among them, the thermal expansion coefficient of the thermally conductive welding layer 300 can be 10ppm / °C, 15ppm / °C, 19ppm / °C, 20ppm / °C or 25ppm / °C, etc. In this way, the thermal expansion coefficient of the thermally conductive welding layer 300 is small, which helps to reduce the risk of cracking or failure of the thermally conductive welding layer 300 due to thermal stress.

[0034] In some embodiments, the service temperature of the thermally conductive welding layer 300 is greater than or equal to 800°C. The service temperature of the thermally conductive welding layer 300 reflects the highest or lowest temperature range in which the thermally conductive welding layer 300 can stably, effectively, and non-destructively perform its functions within its expected service life. The service temperature of the thermally conductive welding layer 300 may be, but is not limited to, 800°C, 850°C, or 900°C. In this way, the service temperature of the thermally conductive welding layer 300 is relatively high, so that the thermally conductive welding layer 300 has sufficient high-temperature stability, so that the lighting device 10 can work normally in a high-temperature working environment.

[0035] In some embodiments, the thermally conductive soldering layer 300 is a pressureless sintered silver layer, which has the advantages of thermal and electrical conductivity, excellent interface adaptability and reliability, high temperature service characteristics, excellent process operability, ultra-long waiting time for chip loading, lead-free and halogen-free, no flux and no cleaning. The pressureless sintered silver layer can achieve good bonding with the light-emitting chip 200 and the thermally conductive base 100 at a relatively low temperature through a pressureless sintering process to form a uniform and dense thermally conductive soldering layer 300. In addition, such a thermally conductive soldering layer 300 not only has high heat conduction efficiency, but also can effectively reduce the void rate during the soldering process.

[0036] The pressureless sintered silver layer can be disposed between the light emitting chip 200 and the thermal conductive base 100 by pneumatic dispensing, screw dispensing or dipping, and then solidified between the light emitting chip 200 and the thermal conductive base 100 at a relatively low temperature by a pressureless sintering process. In addition, the pressureless sintered silver layer can be formed into a star-shaped or cross-shaped pattern by dispensing to reduce the occurrence of void problems.

[0037] like Figure 3 As shown, when the solder paste and the pressureless sintered silver layer have a current load of 5A and the same board temperature, the junction temperature of the pressureless sintered silver layer is lower than the junction temperature of the solder paste, indicating that the pressureless sintered silver layer has a good thermal conductivity, which helps the light-emitting chip 200 to transfer heat to the thermal conductive base 100 through the pressureless sintered silver layer.

[0038] The thermally conductive base 100 is selected from one of a gold thermally conductive base, a silver thermally conductive base or a copper thermally conductive base, so that the thermally conductive welding layer 300 and the thermally conductive base 100 have a good contact interface, which helps the thermally conductive welding layer 300 and the thermally conductive base 100 to form a good welding connection, thereby helping to reduce the risk of the thermally conductive welding layer 300 falling off the thermally conductive base 100. Of course, when the thermally conductive welding layer 300 is disposed on the copper thermally conductive base, impurities on the surface of the copper thermally conductive base can be removed by a plasma process, and nitrogen can be used for protection during the tilting process to reduce the risk of oxidation of the copper thermally conductive base.

[0039] In some embodiments, the thermally conductive base 100 may include a thermally conductive base body 110 and a thermally conductive boss 120 connected to each other, wherein the volume of the thermally conductive base body 110 is larger than that of the thermally conductive boss 120 and has good thermal conductivity. The thermally conductive boss 120 may be a smaller, more protruding portion extending from the thermally conductive base body 110, and is used to directly position, support and fix the light emitting chip 200.

[0040] The heat-conducting base body 110 and the heat-conducting boss 120 can be made of materials with high thermal conductivity, such as copper, aluminum or aluminum alloy, etc. At the same time, the formation and size of the heat-conducting boss 120 can also be optimized according to specific application requirements and heat dissipation requirements.

[0041] The light-emitting chip 200 can be located on the side of the thermally conductive boss 120 away from the thermally conductive base body 110, that is, the light-emitting chip 200 can be placed on the top or end surface of the thermally conductive boss 120, and the light-emitting chip 200 can be directly welded to the thermally conductive base 100 through the thermally conductive welding layer 300, so that the heat generated by the light-emitting chip 200 can be directly and quickly conducted to the thermally conductive base body 110 through the thermally conductive boss 120, and the thermally conductive base body 110 can be further dissipated into the environment.

[0042] In some embodiments, the number of the heat-conducting bosses 120 may be multiple, and the multiple heat-conducting bosses 120 may be arranged in a matrix, and two adjacent heat-conducting bosses 120 may be arranged at intervals. The heat-conducting bosses 120 are arranged at intervals on the heat-conducting base body 110 and may be arranged in a matrix. A certain distance is maintained between two adjacent heat-conducting bosses 120, which helps to reduce the risk of thermal interference between the two adjacent heat-conducting bosses 120.

[0043] Corresponding to the thermal conductive boss 120, the number of the light-emitting chips 200 can be multiple, and the multiple light-emitting chips 200 are respectively installed on the multiple thermal conductive bosses 120, that is, a light-emitting chip 200 is installed on each thermal conductive boss 120, and the multiple light-emitting chips 200 correspond to the multiple thermal conductive bosses 120 one by one, thereby helping each light-emitting chip 200 to effectively transfer heat to the corresponding thermal conductive boss 120, and then further dissipate it through the thermal conductive base body 110.

[0044] The heat dissipation fins 400 are connected to the thermally conductive base 100 through the thermally conductive welding layer 300 , so that the heat dissipation fins 400 are helpful to dissipate heat from the thermally conductive base 100 .

[0045] In some embodiments, a plurality of heat sink fins 400 may be mounted on a side of the thermally conductive base 100 away from the light emitting chip 200. In this way, the heat sink fins 400 and the light emitting chip 200 are respectively disposed on opposite sides of the thermally conductive base 100, so that the light emitting chip 200 of the lighting device 10 is spatially separated from the heat sink fins 400, which simplifies the packaging structure of the lighting device 10 and helps to improve the space utilization of the lighting device 10.

[0046] The plurality of heat dissipation fins 400 may be made of a metal material with high thermal conductivity, such as aluminum or copper, so as to effectively take away the heat conducted from the thermal conductive base 100 and release it into the surrounding environment.

[0047] Two adjacent heat sink fins 400 may be spaced apart to facilitate air circulation, thereby helping to reduce the risk of heat accumulation, and further facilitating rapid heat exchange between the multiple heat sink fins 400 and the air, thereby achieving rapid heat dissipation.

[0048] In some embodiments, the lighting device 10 may further include one or more cooling fans, which may drive air to flow toward the cooling fins 400 , so that the lighting device 10 may promote air flow near the cooling fins 400 through the operation of the cooling fans to improve the cooling effect of the cooling fins 400 .

[0049] See also Figure 1 and Figure 2 The embodiment of the utility model further proposes a lighting system 20, which may include a housing 500 and a lighting device 10. The lighting device 10 may be installed in the housing 500, which helps the housing 500 to protect the lighting device 10, thereby helping to ensure the normal operation of the lighting system 20 and improve the service life of the lighting system 20. In addition, the housing 500 may also be designed in consideration of factors such as visual beauty, safety, and convenience.

[0050] The specific structure of the lighting device 10 can refer to the above embodiments. Since the lighting system 20 adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0051] In some embodiments, the lighting system 20 may further include a light focusing device 700, which may be a light focusing lens. The light focusing device 700 is generally made of a transparent material (such as glass or plastic) and has a special surface curvature and shape. These special curvatures and shapes can be customized according to the requirements of use to achieve specific beam shapes and characteristics.

[0052] The light collecting device 700 may be installed on the housing 500, and may be used to collect the light emitted by the light emitting chip 200 to generate a concentrated light beam. The light collecting device 700 may adjust the divergence angle and focusing degree of the light.

[0053] The lighting system 20 may further include a light collecting device 600, which may be mounted on the housing 500, and which may be disposed between the light emitting chip 200 and the light collecting device 700, and which may be used to collect light emitted from the light emitting chip 200 and emit it to the light collecting device 700. In addition, the light collecting device 600 may collect light emitted from the light emitting chip 200 into a small-angle light beam.

[0054] The light collecting device 600 may be a lens, and one lens may be provided corresponding to one light emitting chip 200, and the lens may collect and focus light to a desired direction. When the light emitted by the light emitting chip 200 passes through the cylindrical lens group, the cylindrical lens in the lens group may focus the light.

[0055] In some embodiments, the lighting system 20 may further include a light homogenizing device 800 , which may be installed in the housing 500 . The light homogenizing device 800 may be used to evenly distribute the light emitted by the light emitting chip 200 to the focusing device 700 after passing through the light collecting device 600 .

[0056] In some embodiments, the light homogenizing device 800 can be selected from one of a double compound eye, a single compound eye, a diffuser, a prism, or a Fresnel lens.

[0057] For example, the light homogenizing device 800 may be a diffuser, wherein the diffuser is a thin sheet made of a transparent material, and has a special texture or structure on the surface, which can evenly diffuse and disperse the light. When the light emitted by the light emitting chip 200 passes through the light collecting device 600 and then passes through the diffuser, the light is evenly dispersed by the texture or structure, so as to evenly distribute the light to the focusing device 700.

[0058] For another example, the light homogenizing device 800 may be a double compound eye, wherein the double compound eye is an optical device composed of multiple lenses, which is used to evenly disperse and diffuse light. When the light emitted by the light emitting chip 200 passes through the light collecting device 600 and then passes through the double compound eye, the shape and arrangement of the lens surface will scatter the light, so that the light is evenly distributed.

[0059] For another example, the light homogenizing device 800 may be a single compound eye, wherein the single compound eye is an optical device composed of a single lens, which is used to evenly scatter light. When the light emitted by the light emitting chip 200 passes through the light collecting device 600 and then passes through the single compound eye, the shape and refractive properties of the lens will scatter the light to achieve uniform distribution of light.

[0060] For another example, the light homogenizing device 800 may be a prism, wherein the prism can decompose a beam of light into multiple light rays, which are finally emitted from the other side of the prism after multiple refractions and reflections inside the prism. Due to the special design of the prism, these emitted light rays are evenly distributed in space.

[0061] In addition, prisms can also use optical coatings or special optical designs to further improve the uniformity of light. For example, coating certain surfaces of the prism with a reflective film or an anti-reflection film can reduce the reflection and scattering of light, thereby improving the utilization and uniformity of light.

[0062] In the utility model, unless otherwise clearly specified or limited, the terms "installation", "connection" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements, it can be only surface contact, or it can be connected through surface contact of an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to the specific circumstances.

[0063] In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as specific or special structures. The description of the term "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the utility model, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the utility model and the features of different embodiments or examples without contradiction.

[0064] The above implementation modes are only used to illustrate the technical solutions of the utility model, rather than to limit them. Although the utility model is described in detail with reference to the aforementioned implementation modes, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned implementation modes, or replace some of the technical features therein by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various implementation modes of the utility model, and should all be included in the protection scope of the utility model.

Claims

1. A lighting device, characterized in that: include: Thermally conductive base; as well as A light-emitting chip, a plurality of heat-dissipating fins and a plurality of heat-conductive welding layers, wherein the light-emitting chip is directly welded to the heat-conductive base through the heat-conductive welding layer, a plurality of heat-dissipating fins are welded to the heat-conductive base through the heat-conductive welding layer, a plurality of heat-dissipating fins are arranged at intervals along the length direction or the width direction of the heat-conductive base, and the thermal conductivity of the heat-conductive welding layer is greater than or equal to 200 W / (m·K).

2. The lighting device according to claim 1, characterized in that: The shear strength of the thermally conductive welding layer is greater than 60Mpa; And / or, the Young's modulus of the thermally conductive welding layer is greater than or equal to 21 GPa.

3. The lighting device according to claim 1, characterized in that: The thermal expansion coefficient of the thermally conductive welding layer is greater than or equal to 10 ppm / °C and less than or equal to 25 ppm / °C; And / or, the service temperature of the thermally conductive welding layer is greater than or equal to 800°C.

4. The lighting device according to claim 1, characterized in that: The thermally conductive welding layer is a pressureless sintered silver layer, and the thermally conductive base is selected from one of a gold thermally conductive base, a silver thermally conductive base or a copper thermally conductive base.

5. The lighting device according to any one of claims 1 to 4, characterized in that: The heat-conducting base comprises a heat-conducting base body and a heat-conducting boss connected to each other, and the light-emitting chip is located at an end of the heat-conducting boss away from the heat-conducting base body.

6. The lighting device according to claim 5, characterized in that: There are multiple thermal conductive bosses, and two adjacent thermal conductive bosses are arranged at intervals. There are multiple light-emitting chips, and the multiple light-emitting chips are respectively mounted on the multiple thermal conductive bosses.

7. The lighting device according to any one of claims 1 to 4, characterized in that: The plurality of heat dissipation fins are mounted on a side of the heat conductive base away from the light emitting chip.

8. A lighting system, characterized in that: include: case; as well as According to any one of claims 1 to 7, the lighting device is installed in the housing.

9. The lighting system according to claim 8, characterized in that The lighting system further comprises a light collecting device and a light focusing device, wherein the light collecting device and the light focusing device are installed on the housing, and the light collecting device is used to collect the light emitted by the light emitting chip and emit it to the light focusing device.

10. The lighting system according to claim 9, characterized in that The lighting system further comprises a light homogenizing device, which is mounted on the housing and is used to evenly distribute the light emitted by the light emitting chip to the light focusing device after passing through the light collecting device.

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