Tracking instrument and tracking type three-dimensional scanning system

Abstract

According to the tracker and the tracking type three-dimensional scanning system, the tracker comprises a tracker body and an active heat dissipation piece, the tracker body comprises a main board, the active heat dissipation piece is installed on the tracker body and is in thermal connection with the main board, and the active heat dissipation piece can actively exchange heat with the main board and is used for conducting heat dissipation on the main board. According to the technical scheme, the main board can be cooled in an active heat dissipation mode when the tracker works, so that the heat dissipation effect of the tracker on the main board can be improved when the tracker works, the use requirement for heat dissipation of components with high heating performance on the main board is met, and it is ensured that the temperature rise of the main board is within a safe range when the main board works.

Description

Technical Field

[0001] The utility model belongs to the technical field related to scanning instruments, and particularly relates to a tracker and a tracking type three-dimensional scanning system. Background Art

[0002] The tracker is an important component of the tracking 3D scanning system and generally uses a binocular system to identify the object being measured.

[0003] The integration of components on the mainboard of the tracker is becoming increasingly higher, which means that the heat dissipation efficiency requirements for the mainboard when the heat dissipation system on the tracker is working will also become increasingly higher. At present, the existing trackers usually use passive heat dissipation for the heat dissipation of the mainboard. Specifically, a thermally conductive cover is used to transfer the heat generated by the components on the mainboard when they are working to the outside air, so that the temperature rise of the components on the mainboard when the tracker is working is within a safe range and does not affect the life and performance of the components. It can be understood that the heat dissipation of the above-mentioned components on the mainboard will be affected by the contact area when the thermally conductive cover is in direct contact with the outside air. However, the miniaturization of the overall tracker equipment will limit the size of the thermally conductive cover, which will make it difficult for the above-mentioned passive heat dissipation method to meet the heat dissipation requirements of components with high heat performance on the mainboard. Utility Model Content

[0004] In view of this, it is necessary to provide a tracker and a tracking three-dimensional scanning system for solving the above technical problems.

[0005] A tracker is used in a tracking three-dimensional scanning system, and the tracker includes:

[0006] Tracker body, including motherboard;

[0007] An active heat sink is installed on the tracker body and is thermally connected to the main board. The active heat sink can actively exchange heat with the main board to dissipate heat from the main board.

[0008] It is understandable that the heat dissipation of the mainboard is achieved by using an active heat sink. In this way, the heat dissipation effect of the mainboard when the tracker is working can be improved, and the temperature rise of the mainboard when working can be ensured to be within a safe range.

[0009] In one embodiment, the active heat dissipation element is configured as a fan.

[0010] It is understandable that the active heat dissipation of the motherboard is achieved by air cooling, and the structural characteristics of the fan can be used to facilitate the assembly and application of the fan on the tracker.

[0011] In one embodiment, the tracker further comprises a heat-conducting cover, which is mounted on the tracker body and thermally connected to the main board, and the heat-conducting cover can cover the main board;

[0012] Wherein, the fan is installed on the heat-conducting housing.

[0013] It is understandable that the heat-conducting cover is used to carry the fan and act as a transfer for the heat dissipation of the motherboard. In this way, it is convenient to assemble and apply the fan on the tracker, which not only reduces the size of the fan, but also ensures the heat dissipation effect of the motherboard when the fan is working.

[0014] In one embodiment, the heat-conducting housing has a plurality of heat sinks, and the plurality of heat sinks are sequentially and spaced apart from each other on the periphery of the fan.

[0015] It can be understood that the heat-conducting housing uses the heat sink arranged on the periphery of the fan to dissipate the heat of the mainboard, so that the heat dissipation effect on the mainboard can be ensured when the fan is working.

[0016] In one of the embodiments, along the thickness direction of the mainboard, the heat sink extends outward relative to the fan, and when the fan is in operation, air can be taken in through the area where the heat sink is located.

[0017] It is understandable that when the fan is working, air enters through the heat sink, so that air cooling of the heat sink can be achieved.

[0018] In one embodiment, the tracker further includes a vibration-damping gasket, which is disposed between the fan and the heat-conducting housing, and the vibration generated when the fan is working can be transmitted to the heat-conducting housing through the vibration-damping gasket.

[0019] It is understandable that the vibration-damping gasket is used to reduce the vibration of the fan, so that the influence of the vibration of the fan when it is working on the tracker body can be avoided.

[0020] In one of the embodiments, the tracker further includes a connecting piece, and the connecting piece is arranged corresponding to the vibration-damping gasket, and the connecting piece can sequentially pass through the fan, the corresponding vibration-damping gasket, and be connected to the heat-conducting cover.

[0021] In one of the embodiments, the tracker further comprises a fan cover, wherein the fan cover is mounted on the heat conductive housing and is used to cover the fan;

[0022] Wherein, the fan can discharge air through the fan cover.

[0023] It is understandable that the fan cover shields the fan without affecting the air output of the fan, so that it can protect the fan and make the overall appearance of the fan more beautiful when assembled on the heat-conducting cover.

[0024] In one of the embodiments, the fan cover is configured as a window-type structure.

[0025] It is understandable that configuring the fan cover as a window-type structure makes the external shape of the fan cover more compatible with the heat sink on the heat-conducting cover and does not appear abrupt. In this way, the overall appearance of the fan when assembled on the heat-conducting cover can be further improved.

[0026] In addition, the present application also provides a tracking three-dimensional scanning system, including the tracker described above.

[0027] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0028] The tracker and tracking three-dimensional scanning system for which protection is sought in the present application use active heat dissipation by active heat dissipation components to achieve heat dissipation of the mainboard. This can improve the heat dissipation effect of the tracker on the mainboard when it is working, and ensure that the temperature rise of the mainboard when it is working is within a safe range. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 A schematic diagram of the structure of the tracker provided in this application;

[0031] Figure 2 An exploded view of the tracker provided for this application;

[0032] Figure 3 This is an assembly exploded view of the active heat sink, heat conductive cover, vibration damping gasket and fan cover of the tracker provided in this application.

[0033] Figure numerals: 100, tracker; 10, tracker body; 11, main board; 111, components; 20, active heat sink; 21, fan; 30, heat-conducting cover; 31, heat sink; 40, vibration-damping gasket; 50, fan cover; 101, connector; 102, screw. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] It should be noted that when an element is referred to as being "provided on" another element, it may be directly provided on the other element or there may be a central element. When an element is considered to be "provided on" another element, it may be directly provided on the other element or there may be a central element at the same time. When an element is considered to be "fixed to" another element, it may be directly fixed to the other element or there may be a central element at the same time.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0037] The tracker 100 for which protection is sought in the present application is applied in a tracking-type three-dimensional scanning system.

[0038] like Figure 1 , Figure 2 As shown, the tracker 100 provided in one embodiment of the present application includes a tracker body 10 and an active heat sink 20. The tracker body 10 includes a main board 11. The active heat sink 20 is mounted on the tracker body 10 and is thermally connected to the main board 11. The active heat sink 20 can actively exchange heat with the main board 11 to dissipate heat from the main board 11. In other words, the tracker 100 dissipates heat from the main board 11 in an active heat dissipation manner when working. Here, the main board 11 is a control circuit board of the tracker 100. Various components 111 are integrated on the main board 11 to control the operation of the tracker 100.

[0039] It can be understood that the tracker 100 of the present application uses active heat dissipation to achieve heat dissipation of the mainboard 11. In this way, the heat dissipation effect of the mainboard 11 when the tracker 100 is working can be improved to meet the use requirements of heat dissipation of components 111 with high heat performance on the mainboard 11, and ensure that the temperature rise of the mainboard 11 during operation is within a safe range. That is, the active heat sink 20 uses active heat dissipation to dissipate the heat of the mainboard 11, which can meet the use requirements of heat dissipation of the mainboard 11 when the tracker 100 device is miniaturized.

[0040] In the present application, the active heat sink 20 is configured as a fan 21, so that the tracker 100 can actively dissipate heat for the mainboard 11 by means of air cooling when working. In this way, the structural characteristics of the fan 21 are utilized to facilitate the assembly and application of the fan 21 on the tracker 100. Of course, the active heat sink 20 is not limited to the fan 21 shown in the figure. For those skilled in the art, the active heat sink 20 can also be configured as a cooling chip, etc.

[0041] It should be noted that the tracker 100 of the present application can select the model of the fan 21 according to the use requirements of the heat dissipation of the mainboard 11. Different models of fans 21 generate different air volumes when working. This makes the overall design of the tracker 100 equipped with the fan 21 flexible and diverse. At the same time, the tracker 100 can also select the model of the fan 21 according to the different heat dissipation requirements of the mainboard 11 to meet the different heat dissipation requirements of the mainboard 11.

[0042] like Figure 1 , Figure 2 As shown, the tracker 100 further includes a heat-conducting cover 30, which is mounted on the tracker body 10 and is thermally connected to the main board 11, and the heat-conducting cover 30 can cover the main board 11; wherein the fan 21 is mounted on the heat-conducting cover 30. That is, the tracker 100 of the present application uses the heat-conducting cover 30 to carry the fan 21, and uses the heat-conducting cover 30 to play a transfer role in the heat dissipation of the main board 11, so that the fan 21 can actively dissipate the heat of the main board 11 through the heat-conducting cover 30, that is, the fan 21 can timely dissipate the heat absorbed by the heat-conducting cover 30 from the main board 11. It should be noted that when the heat-conducting cover 30 is assembled on the tracker body 10, it can protect the main board 11 on the tracker body 10, wherein the specific structure of the heat-conducting cover 30 and the working principle of how to cooperate with the main board 11 and achieve thermal connection between the two can adopt the existing conventional method, which will not be elaborated here. Of course, for those skilled in the art, the fan 21 can also be directly mounted on the mainboard 11 to achieve heat dissipation for the mainboard 11 by utilizing the airflow generated when the fan 21 is working.

[0043] It can be understood that the fan 21 is assembled to the heat-conducting cover 30, so that the fan 21 can be improved on the basis of the existing tracker 100, so that the assembly and application of the fan 21 on the tracker 100 can be facilitated, thus ensuring the heat dissipation effect of the fan 21 on the mainboard 11 when the fan 21 is working.

[0044] like Figures 1 to 3As shown, the heat-conducting housing 30 has a plurality of heat sinks 31, and the plurality of heat sinks 31 are sequentially arranged at intervals on the periphery of the fan 21. That is, the heat sinks 31 on the heat-conducting housing 30 for heat dissipation are integrated into the periphery of the fan 21, so that when the fan 21 is working, the heat sinks 31 on the heat-conducting housing 30 can be effectively cooled, and the heat dissipation effect of the mainboard 11 when the fan 21 is working can be ensured. Here, the fan 21 is arranged in the middle of the heat-conducting housing 30.

[0045] Along the thickness direction of the mainboard 11, the heat sink 31 extends outward relative to the fan 21, and the fan 21 can take in air through the area where the heat sink 31 is located when the fan 21 is working. In other words, when the fan 21 is assembled on the heat-conducting housing 30, the fan 21 can be arranged inside the heat sink 31 on the heat-conducting housing 30 in a submerged manner, thereby ensuring that the fan 21 can take in air from the area where the heat sink 31 is located when the fan 21 is working, and achieve effective air cooling and heat dissipation of the heat sink 31.

[0046] like Figure 3 As shown, the tracker 100 further includes a vibration-damping gasket 40, which is disposed between the fan 21 and the heat-conducting housing 30, and the vibration generated by the fan 21 during operation can be transmitted to the heat-conducting housing 30 through the vibration-damping gasket 40. In this process, the vibration-damping gasket 40 can reduce the vibration generated by the fan 21 during operation, thereby avoiding the influence of the vibration of the fan 21 during operation on the operation of the tracker body 10. Here, the vibration-damping gasket 40 is configured as a silicone pad or a rubber pad.

[0047] like Figure 2 , Figure 3 As shown, the tracker 100 further includes a connector 101, which is arranged corresponding to the vibration-damping gasket 40, and the connector 101 can sequentially pass through the fan 21 and the corresponding vibration-damping gasket 40 and be connected to the heat-conducting housing 30. In other words, the fan 21 can be assembled to the heat-conducting housing 30 using the connector 101. Here, the connector 101 is connected to the heat-conducting housing 30 in a threaded manner, so that it is easy to assemble the fan 21 to the heat-conducting housing 30, wherein the connector 101 is configured as a screw, a bolt, a screw, etc. It should be noted that the fan 21 can be assembled to the heat-conducting housing 30 using the connectors 101 arranged diagonally.

[0048] like Figures 1 to 3As shown, the tracker 100 further includes a fan cover 50, which is mounted on the heat-conducting housing 30 and is used to cover the fan 21; wherein the fan 21 can discharge air through the fan cover 50. In other words, the fan cover 50 can shield the fan 21 without affecting the air discharge of the fan 21, so that the fan 21 can be protected and the overall appearance of the fan 21 when assembled on the heat-conducting housing 30 can be more beautiful. Here, the fan cover 50 can be fixed to the heat-conducting housing 30 by screws 102 arranged at the four corners of the fan cover 50.

[0049] The fan cover 50 is configured as a window-type structure, so that the external shape of the fan cover 50 can be more compatible with the heat sink 31 on the heat-conducting cover shell 30 and will not appear abrupt. In this way, the overall appearance of the fan 21 when assembled on the heat-conducting cover shell 30 can be further improved.

[0050] In addition, the present application also provides a tracking three-dimensional scanning system, including the tracker 100 described above.

[0051] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention. As long as they are within the spirit of the present invention, appropriate changes and modifications to the above embodiments are within the scope of protection required by the present invention.

Claims

1. A tracker, used in a tracking three-dimensional scanning system, characterized in that: The tracker (100) comprises: A tracker body (10), comprising a main board (11); An active heat sink (20) is mounted on the tracker body (10) and is thermally connected to the main board (11), and the active heat sink (20) can actively exchange heat with the main board (11) to dissipate heat from the main board (11).

2. The tracker according to claim 1, characterized in that: The active heat dissipation element (20) is configured as a fan (21).

3. The tracker according to claim 2, characterized in that: The tracker (100) further comprises a heat-conducting cover (30), wherein the heat-conducting cover (30) is mounted on the tracker body (10) and is thermally connected to the main board (11), and the heat-conducting cover (30) is capable of covering the main board (11); Wherein, the fan (21) is installed on the heat-conducting housing (30).

4. The tracker according to claim 3, characterized in that: The heat-conducting housing (30) has a plurality of heat sinks (31), and the plurality of heat sinks (31) are sequentially and spaced apart from each other on the periphery of the fan (21).

5. The tracker according to claim 4, characterized in that: Along the thickness direction of the mainboard (11), the heat sink (31) extends outward relative to the fan (21), and when the fan is in operation, air can be taken in through the area where the heat sink (31) is located.

6. The tracker according to claim 3, characterized in that: The tracker (100) further comprises a vibration-damping gasket (40), which is arranged between the fan (21) and the heat-conducting housing (30), and the vibration generated when the fan (21) is in operation can be transmitted to the heat-conducting housing (30) through the vibration-damping gasket (40).

7. The tracker according to claim 6, characterized in that: The tracker (100) further comprises a connecting piece (101), wherein the connecting piece (101) is arranged corresponding to the vibration-damping gasket (40), and the connecting piece (101) can sequentially pass through the fan (21), the corresponding vibration-damping gasket (40), and be connected to the heat-conducting cover (30).

8. The tracker according to claim 3, characterized in that: The tracker (100) further comprises a fan cover (50), wherein the fan cover (50) is mounted on the heat-conducting housing (30) and is used to cover the fan (21); Wherein, the fan (21) can discharge air through the fan cover (50).

9. The tracker according to claim 8, characterized in that: The fan cover (50) is configured as a window-type structure.

10. A tracking three-dimensional scanning system, characterized in that: The tracker (100) comprises any one of claims 1-9.

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