Server heat dissipation module

Abstract

The utility model discloses a server heat dissipation module which comprises a first heat dissipation fin set, a base assembly provided with an installation groove and a plurality of U-shaped heat pipes. The U-shaped heat pipe comprises an installation end making contact with the base assembly, a heat dissipation end making contact with the first heat dissipation fin set and a connecting part connecting the installation end and the heat dissipation end, and the installation end of the U-shaped heat pipe is arranged to be in a flat shape. A second heat dissipation fin set is further arranged beside the first heat dissipation fin set, the size of the second heat dissipation fin set is smaller than that of the first heat dissipation fin set, and the first heat dissipation fin set and the second heat dissipation fin set are fixedly connected with the base assembly. Through the innovative design of tight arrangement of the U-shaped heat pipes, combined layout of the double fins and the layered composite base structure, the high-heat-flux heat dissipation problem of the server CPU is effectively solved, the heat dissipation efficiency and uniformity are remarkably improved, and the heat dissipation device has the advantages of being compact in structure, light in weight and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of server heat dissipation, and in particular to a server heat dissipation module. Background Art

[0002] As the computing power of server CPUs continues to increase, the heat generated is also increasing, which brings huge challenges to the CPU cooling system. The traditional air-cooling cooling mode can no longer meet the cooling needs of high heat flux. Developing efficient cooling technology to ensure stable CPU operation has become a key issue that needs to be solved in server design.

[0003] At present, common CPU cooling solutions mainly include copper tube heat pipe radiators, thermal aluminum block radiators and thermal fan radiators. Among them, heat pipe radiators use the phase change heat transfer principle of the working fluid in the heat pipe, have the advantages of high thermal conductivity and fast heat transfer, and are considered to be a more advanced heat dissipation method. However, there are still some shortcomings in the structural design of existing heat pipe radiators, such as the single heat pipe layout form, the insufficient connection between the heat pipe and the cooling fins, etc., which restricts the further improvement of the overall heat dissipation performance.

[0004] In addition, as the heat generation of the CPU continues to increase, a single heat pipe structure will be difficult to meet the higher heat dissipation requirements in the future. Therefore, it is necessary to innovate the shape, layout and integration of heat pipes with heat dissipation fins based on the existing heat pipe heat dissipation technology to further improve the overall heat dissipation capacity of the heat dissipation module.

[0005] The above analysis of the prior art shows that the development of a new type of heat dissipation module with compact structure, reasonable layout and excellent heat dissipation performance is of great significance for solving the high heat flux density heat dissipation problem of server CPU. Utility Model Content

[0006] The utility model provides a server heat dissipation module, aiming to solve the problems of unreasonable heat pipe structure layout and poor heat dissipation effect existing in the prior art.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a server heat dissipation module, comprising a first heat dissipation fin group, a base assembly with a mounting groove, and a plurality of U-shaped heat pipes, wherein the U-shaped heat pipe comprises a mounting end in contact with the base assembly, a heat dissipation end in contact with the first heat dissipation fin group, and a connecting portion connecting the mounting end and the heat dissipation end, the mounting end of the U-shaped heat pipe is arranged in a flat shape, a second heat dissipation fin group is further arranged beside the first heat dissipation fin group, and the size of the second heat dissipation fin group is smaller than the size of the first heat dissipation fin group, and the first heat dissipation fin group and the second heat dissipation fin group are fixedly connected to the base assembly.

[0008] Preferably, the first heat dissipation fin group includes a plurality of first heat dissipation fins arranged side by side along a first direction; the second heat dissipation fin group includes a plurality of second heat dissipation fins arranged side by side along a second direction, and the first direction and the second direction are perpendicular to each other.

[0009] Preferably, the base assembly comprises a first metal plate, a second metal plate and a third metal plate stacked in sequence, the first heat dissipation fin group is fixedly connected to the first metal plate, and the second heat dissipation fin group is fixedly connected to the second metal plate.

[0010] Preferably, the first metal plate and the second metal plate are an aluminum pressure plate and an aluminum bottom plate that cooperate with each other, and the aluminum bottom plate is provided with a mounting groove.

[0011] Preferably, the third metal plate is a heat spreader or a copper bottom plate.

[0012] Preferably, the mounting ends of the U-shaped heat pipes are closely arranged along the length direction of the cross section of the base assembly to form a heat conduction plane.

[0013] Preferably, the mounting ends of the U-shaped heat pipe include a first mounting end, a second mounting end and a third mounting end, the first mounting end is U-shaped and arranged outside the second mounting end and the third mounting end, the second mounting end is linear or slightly arc-shaped and arranged in parallel with the closed end of the first mounting end, the third mounting end is U-shaped and arranged at the open end of the first mounting end, and the open ends of the first mounting end and the third mounting end are located on the same side.

[0014] Preferably, the heat dissipation ends of the U-shaped heat pipe located on both sides of the base assembly are bent and extended upward.

[0015] Preferably, the first heat sink fin group is provided with a through hole for inserting the U-shaped heat pipe heat dissipation end, the shape of the through hole is adapted to the cross-section of the U-shaped heat pipe heat dissipation end, and the cross-sections of the through hole and the U-shaped heat pipe heat dissipation end are both oblate.

[0016] Preferably, the number of the U-shaped heat pipes is 3-10.

[0017] The beneficial effects of the utility model are as follows: 1. A plurality of U-shaped heat pipes are provided with flat mounting ends and are closely arranged to form a heat conduction plane, which fits the heating zone of the server. The two ends of the U-shaped heat pipe extend into the heat dissipation fin group respectively, which has stronger heat dissipation performance and higher heat dissipation efficiency than the traditional L-shaped heat pipe; 2. A second heat dissipation fin group of slightly smaller size is arranged next to the first heat dissipation fin group to assist in heat dissipation. The first heat dissipation fin group close to the fan directly receives the heat transferred by the heat pipe, and dissipates heat quickly under the direct blowing of the airflow. The aluminum pressure plate below and the second heat dissipation fin group at the rear play an auxiliary heat dissipation role through close contact with the base assembly and the first heat dissipation fin group; 3. The heat pipe mounting end forms a closely arranged heat conduction plane through the first mounting end, the second mounting end and the third mounting end, which effectively improves the heat conduction efficiency; 4. The close cooperation between the aluminum pressure plate and the aluminum bottom plate can not only fix the heat pipe but also play an auxiliary heat dissipation role. The layered and composite base structure design ensures the overall heat dissipation performance of the base while also effectively controlling the weight of the heat dissipation module. In summary, the utility model proposes an efficient server cooling module, which effectively solves the technical problem of high heat flux density cooling of the server CPU by adopting an innovative U-shaped heat pipe design, a layered composite base structure and a double fin combination layout. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the explosion structure of the utility model;

[0020] Figure 2 It is a structural schematic diagram of the U-shaped heat pipe of the utility model;

[0021] Figure 3 It is a three-dimensional structural schematic diagram of the utility model.

[0022] In the figure: 1. first heat sink fin group; 11. through hole; 2. base assembly; 21. aluminum pressure plate; 22. aluminum bottom plate; 23. copper bottom plate; 3. U-shaped heat pipe; 31. mounting end; 311. first mounting end; 312. second mounting end; 313. third mounting end; 32. heat sink end; 33. connecting portion; 4. second heat sink fin group; 5. mounting groove. DETAILED DESCRIPTION

[0023] In the description of the present utility model, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0024] In the present invention, unless otherwise clearly defined and specified, the terms "installed", "connected", "connected", "fixedly connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0026] With the rapid development of server technology, the computing speed and processing power of CPU have been significantly improved. But at the same time, the heat generated by CPU has also been rising, which has put forward higher requirements for the cooling system. Traditional air cooling has been unable to keep up with the cooling needs of high heat flux. How to ensure the stable operation of CPU through innovative cooling technology has become a difficult problem to be solved in the field of server cooling.

[0027] Common CPU cooling solutions on the market include copper tube heat pipe radiators, aluminum heat block radiators, and thermal fan radiators. Among them, the heat pipe radiator based on the principle of phase change heat transfer of the working fluid in the heat pipe is recognized by the industry as one of the most promising advanced cooling technologies for its excellent thermal conductivity and rapid heat transfer capability. However, the existing heat pipe radiators still have some shortcomings in structural design and layout optimization, such as the relatively single arrangement of heat pipes and the insufficient connection with the cooling fins, which to a certain extent limits the further improvement of the overall heat dissipation performance. In addition, with the continuous increase in CPU heating power, a single heat pipe structure can no longer fully meet the higher heat dissipation requirements in the future. Therefore, it is urgent to make innovative breakthroughs in terms of heat pipe shape, layout method, and integration method with cooling fins on the basis of existing heat pipe cooling technology, so as to significantly improve the overall heat dissipation efficiency of the heat dissipation module.

[0028] The utility model adopts a plurality of U-shaped heat pipes arranged closely at one end near the CPU heating area, forming an efficient heat conduction plane, which can quickly and evenly absorb the heat generated by the CPU. Compared with the traditional L-shaped heat pipe, the U-shaped design enables each heat pipe to have two heat dissipation ends, and the heat dissipation efficiency is greatly improved, which is 1.5-2 times higher than the heat dissipation performance of the ordinary L-shaped heat pipe. In the design of the heat dissipation fins, the utility model adopts a double fin combination layout, and a first heat dissipation fin group with a larger size is set in the main heat dissipation area near the fan, which directly receives the heat conducted by the heat pipe and realizes rapid heat dissipation under the direct airflow. At the same time, a second heat dissipation fin group with a slightly smaller size is arranged on the side of the first heat dissipation fin group, which plays a role of auxiliary heat dissipation through close contact with the bottom plate and the first heat dissipation fin group, and further strengthens the heat dissipation effect of the entire heat dissipation module. At the same time, the utility model also adopts a layered composite base structure, which is composed of a copper bottom plate, an aluminum bottom plate and an aluminum pressure plate. The close cooperation of the aluminum pressure plate and the aluminum bottom plate can not only firmly fix the heat pipe, but also assist heat transfer and give full play to the heat dissipation capacity of each component. Compared with the prior art, the utility model not only has higher heat dissipation efficiency and more uniform heat dissipation, but also has a more compact structure and lighter weight, and has broad market application prospects.

[0029] The present invention will be further described and illustrated below in conjunction with specific embodiments and drawings.

[0030] Example 1

[0031] like Figure 1-3As shown, this embodiment provides a server heat dissipation module, including a first heat dissipation fin group 1, a base component 2 with a mounting groove 5, and 3-10 U-shaped heat pipes 3. This embodiment uses seven U-shaped heat pipes 3. Each U-shaped heat pipe 3 is made of metal copper material, and includes a mounting end 31 in contact with the base component 2, a heat dissipation end 32 in contact with the first heat dissipation fin group 1, and a connecting portion 33 connecting the mounting end 31 and the heat dissipation end 32. The mounting end 31 is stamped into a flat shape by a hydraulic mold, and is tightly attached to and arranged in the mounting groove 5 of the base component 2, so as to form a good contact with the CPU surface. The heat dissipation end 32 of the U-shaped heat pipe 3 is a circular cross-section.

[0032] In order to improve the heat dissipation efficiency and further optimize the arrangement layout of the cooling fins, a second cooling fin group 4 is provided next to the first cooling fin group 1. The first cooling fin group 1 includes a plurality of first cooling fins arranged side by side along a first direction; the second cooling fin group 4 includes a plurality of second cooling fins arranged side by side along a second direction, and the first direction is perpendicular to the second direction.

[0033] Specifically, the first heat sink fin group 1 is composed of a number of aluminum heat sinks of the same shape and size that are arranged in the longitudinal direction and are equidistant and parallel to each other and are stacked horizontally. The second heat sink fin group 4 is composed of a number of identical aluminum heat sinks of slightly smaller size that are arranged in the horizontal direction and are equidistant and parallel to each other and are stacked. The longitudinal direction is perpendicular to the horizontal direction. The two groups of heat sink fins are fastened to the base assembly 2 by bolts and nuts respectively. This orthogonal layout is conducive to forming a three-dimensional heat dissipation channel, which increases the flow range of the airflow and thus improves the heat dissipation efficiency.

[0034] Example 2

[0035] Based on Example 1, the base assembly 2 includes a first metal plate, a second metal plate and a third metal plate stacked in sequence, the first heat sink fin group 1 is fixedly connected to the first metal plate, and the second heat sink fin group 4 is fixedly connected to the second metal plate.

[0036] Specifically, the base assembly 2 is formed by three layers of metal plates fastened and superimposed by bolts, which are, from top to bottom, an aluminum pressure plate 21, an aluminum bottom plate 22, and a copper bottom plate 23. A mounting groove 5 is provided on the aluminum bottom plate 22 to accommodate and position the mounting end 31 of the U-shaped heat pipe 3. The first heat sink fin group 1 is fixedly connected to the aluminum pressure plate by bolts, and the second heat sink fin group 4 is fixedly connected to the aluminum bottom plate 22 by bolts. The copper bottom plate 23 is in direct contact with the CPU, and the excellent thermal conductivity of the copper material is utilized to help balance heat absorption and conduct heat upward. In other embodiments, the copper bottom plate 23 of this embodiment can also be replaced by a heat spreader. After the mounting end 31 of the U-shaped heat pipe 3 is installed in the mounting groove 5 of the aluminum bottom plate 22, it is closely arranged along the length direction of the cross section of the base assembly 2, contacts each other and forms a heat conduction plane, and promotes uniform heat dissipation in the horizontal direction.

[0037] Furthermore, if Figure 2 As shown, the mounting end 31 includes a first mounting end 311, a second mounting end 312 and a third mounting end 313. The first mounting end is U-shaped and arranged outside the second mounting end 312 and the third mounting end 313. The second mounting end 312 is linear or slightly arc-shaped and arranged in parallel at the closed end of the first mounting end 311. The third mounting end 313 is U-shaped and arranged at the open end of the first mounting end 311. The open ends of the first mounting end 311 and the third mounting end 313 are located on the same side. By closely arranging multiple U-shaped heat pipe mounting ends at one end close to the CPU heating area, a more efficient heat conduction plane is formed, which can quickly and evenly absorb the heat generated by the CPU, and the heat dissipation efficiency is greatly improved compared with the traditional L-shaped heat dissipation efficiency.

[0038] The heat dissipation ends 32 of the U-shaped heat pipe 3 located on both sides of the base assembly 2 are bent and extended upward and inserted into the first heat dissipation fin group 1. The first heat dissipation fin group 1 is provided with a circular through hole 11, and the size of the circular through hole 11 matches the size of the heat dissipation end 32 of the U-shaped heat pipe 3. The heat dissipation end 32 passes through the stacked heat sinks and is in close contact with the through hole 11. The heat dissipation end 32 of the U-shaped heat pipe 3 is fixed to the through hole 11 by welding.

[0039] Example 3

[0040] The difference between this embodiment and the above embodiment is that a through hole 12 is provided on the first heat sink fin 11 for inserting the heat sink end 32 of the U-shaped heat pipe 3. The shape of the through hole 12 matches the cross section of the heat sink end 32 of the heat pipe to achieve a close fit and full contact. In this embodiment, the shape of the heat sink end 32 of the U-shaped heat pipe 3 and the through hole 12 are matched and set to be an oblate circle. Compared with the standard circular shape, the oblate circle setting can obtain a larger heat dissipation circumference and enhance the convection heat exchange effect between the heat pipe and the heat sink fin. The heat sink end 32 of the U-shaped heat pipe 3 and the through hole 12 are sealed and fixed by welding.

[0041] The server heat dissipation module provided by the utility model significantly improves the heat dissipation efficiency and heat dissipation uniformity through system optimization design in terms of heat pipe shape, quantity, fin arrangement, base structure, etc., while achieving good mechanical strength and assembly convenience, and can effectively solve the technical problem of high heat flux density heat dissipation of current server CPUs, realize safe and stable operation of servers, and has broad application prospects.

[0042] Those skilled in the art can further optimize and improve based on the actual application requirements under the guidance of the present utility model, and these should be regarded as the protection scope of the present utility model. The above is a detailed introduction to a server heat dissipation module provided by the present utility model. This article uses specific examples to illustrate the principle and implementation method of the present utility model. The description of the above embodiments is only used to help understand the core idea of ​​the present utility model; at the same time, for general technicians in this field, according to the ideas and methods of the present utility model, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present utility model.

Claims

1. A server heat dissipation module, characterized in that , including a first heat dissipation fin group, a base component with a mounting groove, and a plurality of U-shaped heat pipes, the U-shaped heat pipe including a mounting end in contact with the base component, a heat dissipation end in contact with the first heat dissipation fin group, and a connecting portion connecting the mounting end and the heat dissipation end, the mounting end of the U-shaped heat pipe is arranged in a flat shape, a second heat dissipation fin group is also arranged next to the first heat dissipation fin group, and the size of the second heat dissipation fin group is smaller than the size of the first heat dissipation fin group, the first heat dissipation fin group, the second heat dissipation fin group and the base component are fixedly connected.

2. The server heat dissipation module according to claim 1, characterized in that: The first heat dissipation fin group includes a plurality of first heat dissipation fins arranged side by side along a first direction; the second heat dissipation fin group includes a plurality of second heat dissipation fins arranged side by side along a second direction, and the first direction and the second direction are perpendicular to each other.

3. The server heat dissipation module according to claim 1, characterized in that: The base assembly includes a first metal plate, a second metal plate and a third metal plate which are stacked in sequence, the first heat dissipation fin group is fixedly connected to the first metal plate, and the second heat dissipation fin group is fixedly connected to the second metal plate.

4. The server heat dissipation module according to claim 3, characterized in that: The first metal plate and the second metal plate are an aluminum pressure plate and an aluminum bottom plate that cooperate with each other, and the aluminum bottom plate is provided with a mounting groove.

5. The server heat dissipation module according to claim 4, characterized in that: The third metal plate is a heat spreader or a copper bottom plate.

6. The server heat dissipation module according to claim 1, characterized in that The mounting ends of the U-shaped heat pipes are closely arranged along the length direction of the cross section of the base assembly to form a heat conduction plane.

7. The server heat dissipation module according to claim 6, characterized in that: The mounting ends of the U-shaped heat pipe include a first mounting end, a second mounting end and a third mounting end. The first mounting end is U-shaped and arranged outside the second mounting end and the third mounting end. The second mounting end is linear or slightly arc-shaped and arranged in parallel with the closed end of the first mounting end. The third mounting end is U-shaped and arranged at the open end of the first mounting end, and the open ends of the first mounting end and the third mounting end are located on the same side.

8. The server heat dissipation module according to claim 1, characterized in that The heat dissipation ends of the U-shaped heat pipe located on both sides of the base assembly are bent and extended upward.

9. The server heat dissipation module according to claim 1, characterized in that The first heat sink fin group is provided with a through hole for inserting the U-shaped heat pipe heat dissipation end, the shape of the through hole is adapted to the cross-section of the U-shaped heat pipe heat dissipation end, and the cross-sections of the through hole and the U-shaped heat pipe heat dissipation end are both oblate.

10. The server heat dissipation module according to any one of claims 1 to 9, characterized in that: The number of the U-shaped heat pipes is 3-10.

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