Automatic cleaning and drying machine for semiconductor diode chip

Abstract

The utility model discloses an automatic semiconductor diode chip cleaning and drying machine which comprises a fixing plate, a supporting plate, a plurality of outer U-shaped frames and diode chips, a plurality of connecting grooves are formed in one side face of the fixing plate, connecting strips are arranged in the connecting grooves in a sliding mode, and the outer side faces of the connecting strips are fixedly connected with the outer U-shaped frames. Grooves are formed in the two side faces of the interior of the outer U-shaped frame, the inner U-shaped frame is inserted into the outer U-shaped frame from top to bottom, the two sides of the inner U-shaped frame extend into the grooves, channels are formed between the inner U-shaped frame and the grooves, the diode chips are vertically arranged in the inner U-shaped frame, and pins at the two ends of each diode chip are inserted into the channels. The diode chip cleaning device is simple in structure, the lifting mechanism can drive the inner U-shaped frame to move up and down, and the inner U-shaped frame moving up and down can drive the diode chips to rotate, so that the diode chips can be in comprehensive contact with an external solution, and the situation that cleaning is blocked due to stacking of the diode chips is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of diode chips, in particular to an automatic cleaning and drying machine for semiconductor diode chips. Background Art

[0002] Diode chips are essential core components of the contemporary information technology industry. Diode chip cleaning is a necessary step in diode chip processing. The traditional diode chip cleaning device is a simple rectangular transparent non-metallic material container with a simple structure. During the cleaning process, the diode chips are piled together, rubbed and collided with each other, which can easily cause obstructions and affect the cleaning effect of the diode chips. Summary of the invention

[0003] The technical problem to be solved by the utility model is to provide an automatic cleaning and drying machine for semiconductor diode chips, which can arrange the diode chips neatly and ensure the cleaning quality by rotating, thus solving the problems mentioned in the background technology.

[0004] The utility model is realized through the following technical scheme: an automatic cleaning and drying machine for semiconductor diode chips, comprising a fixing plate, a supporting plate, a plurality of outer U-shaped frames and diode chips, wherein the fixing plate is installed on one side surface of the supporting plate, a plurality of connecting grooves are arranged on one side surface of the fixing plate, connecting strips are slidably arranged in the connecting grooves, the outer side surfaces of the connecting strips are fixedly connected to the outer U-shaped frames, grooves are arranged on both side surfaces inside the outer U-shaped frames, inner U-shaped frames are inserted from top to bottom inside the outer U-shaped frames, both sides of the inner U-shaped frames extend into the grooves, channels are formed between the inner U-shaped frames and the grooves, diode chips are vertically arranged inside the inner U-shaped frames, pins at both ends of the diode chips are inserted into the channels and are in contact with the inner U-shaped frames, and a lifting mechanism for driving the inner U-shaped frames to move up and down is arranged on the upper end of the fixing plate.

[0005] As a preferred technical solution, the lifting mechanism includes a horizontal plate, an eccentric wheel, a reduction motor, multiple L-shaped plates and multiple telescopic rods. The horizontal plate is arranged behind the fixed plate, the L-shaped plates are installed on the top surface of the horizontal plate, and the other end of the L-shaped plate extends to one side of the inner U-shaped frame. One end of the telescopic rod is installed on the L-shaped plate, and the other end is inserted into the interior of the inner U-shaped frame. The eccentric wheel is arranged below the horizontal plate, and the rotating shaft of the reduction motor is installed on one side surface of the eccentric wheel and is eccentrically arranged. A fixing seat is installed between the outer wall of the reduction motor and the fixed plate.

[0006] As a preferred technical solution, a cover body is installed on the side of the support plate away from the fixed plate, an air cavity is formed between the cover body and the support plate, a plurality of air outlet holes connected to the air cavity are provided on the side of the support plate facing the fixed plate, an air inlet pipe is installed on the top surface of the cover body, a bottom plate is installed on the bottom surface of the support plate, and a plurality of fixing holes are provided on the bottom plate.

[0007] As a preferred technical solution, the cross-sections of the connecting grooves and the connecting strips are both arranged in a trapezoidal structure.

[0008] As a preferred technical solution, an anti-slip pattern is provided on one side surface of the inner U-shaped frame, and the anti-slip pattern contacts the pins on the diode chip.

[0009] The beneficial effects of the utility model are as follows: the utility model has a simple structure, the diode chips can be neatly arranged in the inner U-shaped frame, and move downward along the connecting groove until they are immersed in the ultrasonic cleaning machine, and during the cleaning process, the inner U-shaped frame can be driven to move up and down by the lifting mechanism, and the inner U-shaped frame that moves up and down can drive the rotation of the diode chips, so that the diode chips can be fully in contact with the external solution, and the cleaning of the diode chips will not be hindered due to stacking, and after the outer U-shaped frame is lifted upward, the diode chips can directly contact with the ejected hot air, so that they can be quickly dried after cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0011] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0012] Figure 2 It is a top view of the utility model;

[0013] Figure 3 It is a rear view of the utility model;

[0014] Figure 4 It is a structural schematic diagram of the outer U-shaped frame and the inner U-shaped frame in the utility model.

[0015] Among them, 1. fixed plate; 2. connecting strip; 3. outer U-shaped frame; 4. inner U-shaped frame; 5. diode chip; 6. horizontal plate; 7. L-shaped plate; 8. telescopic rod; 9. support plate; 11. bottom plate; 12. cover body; 13. air inlet pipe; 14. air outlet; 15. eccentric wheel; 16. reduction motor. DETAILED DESCRIPTION

[0016] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0017] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0018] Any feature disclosed in this specification (including any additional claims, abstract and drawings), unless otherwise stated, may be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0019] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the utility model is an automatic cleaning and drying machine for semiconductor diode chips, comprising a fixed plate 1, a support plate 9, a plurality of outer U-shaped frames 3 and a diode chip 5, wherein the fixed plate 1 is mounted on one side surface of the support plate 9, a plurality of connecting grooves are arranged on one side surface of the fixed plate 1, connecting strips 2 are slidably arranged in the connecting grooves, the outer side surfaces of the connecting strips 2 are fixedly connected to the outer U-shaped frame 3, grooves are arranged on both side surfaces inside the outer U-shaped frame 3, inner U-shaped frames 4 are inserted from top to bottom inside the outer U-shaped frame 3, both sides of the inner U-shaped frame 4 extend into the grooves, channels are formed between the inner U-shaped frame 4 and the grooves, the diode chips 5 are vertically arranged inside the inner U-shaped frame 4, the pins at both ends of the diode chip 5 are inserted into the channels, and are in contact with the inner U-shaped frame 4, and a lifting mechanism for driving the inner U-shaped frame 4 to move up and down is arranged on the upper end of the fixed plate 1.

[0020] In this embodiment, the lifting mechanism includes a transverse plate 6, an eccentric wheel 15, a reduction motor 16, a plurality of L-shaped plates 7 and a plurality of telescopic rods 8. The transverse plate 6 is arranged behind the fixed plate 1. The L-shaped plates 7 are all installed on the top surface of the transverse plate 6. The other end of the L-shaped plates 7 extends to one side of the inner U-shaped frame 4. One end of the telescopic rods 8 is installed on the L-shaped plate 7, and the other end is inserted into the interior of the inner U-shaped frame 4. The eccentric wheel 15 is arranged below the transverse plate 6. The rotating shaft of the reduction motor 16 is installed on one side surface of the eccentric wheel 15 and is eccentrically arranged. A fixing seat is installed between the outer wall of the reduction motor 16 and the fixed plate 1.

[0021] In this embodiment, a cover body 12 is installed on one side of the support plate 9 away from the fixed plate 1, an air cavity is formed between the cover body 12 and the support plate 9, a plurality of air outlet holes 14 connected to the air cavity are provided on one side of the support plate 9 facing the fixed plate 1, an air inlet pipe 13 is installed on the top surface of the cover body 12, a bottom plate 11 is installed on the bottom surface of the support plate 9, and a plurality of fixing holes are provided on the bottom plate 11, the lower end of the support plate can be put into the ultrasonic cleaning machine, so that the outer U-shaped frame can be tightly in the solution inside the ultrasonic cleaning machine, and screws can pass through the fixing holes to fix the bottom plate inside the cleaning tank, thereby increasing stability;

[0022] Among them, one end of the air inlet pipe can be connected to the hot air blower through a hose, and the hot air generated by the hot air blower can enter the air cavity along the hose and the air inlet pipe until it is ejected from the air outlet.

[0023] In this embodiment, the cross-sections of the connection groove and the connection bar 2 are both arranged in a trapezoidal structure, so that the connection bar can only move up and down along the connection groove.

[0024] In this embodiment, anti-skid patterns are provided on one side surface of the inner U-shaped frame 4 , and the anti-skid patterns are in contact with the pins on the diode chip 5 , increasing the friction between the pins and the inner U-shaped frame, thereby better driving the rotation of the pins.

[0025] During cleaning, the outer U-shaped frame can be moved upward along the connecting groove to disengage the outer U-shaped frame from the connecting groove. At this time, the diode chips can be placed one by one along the opening at the upper end of the groove from the outside, and the pins of the diode chips can be in contact with the inner U-shaped frame. After the diode chips are assembled, the connecting strip can be inserted into the cleaning tank again along the connecting groove, and the diode chips can be immersed in the solution inside the cleaning tank. During the cleaning process, the reduction motor can be started, and the start of the reduction motor drives the eccentric wheel. During the rotation of the eccentric wheel, the cross plate can be pushed upward. The movement of the cross plate drives the L-shaped plate and the telescopic rod. The movement of the telescopic rod can lift the inner U-shaped frame upward. The inner U-shaped frame that moves up and down can drive the rotation of the diode chip, so that the diode chip can be fully in contact with the external solution. The diode chips will not be blocked from cleaning due to stacking, so as to ensure the quality of cleaning.

[0026] After cleaning is completed, the outer U-shaped frame can be lifted up one by one from left to right. During the lifting process, the telescopic rod is first squeezed to move the extended end of the telescopic rod away from the inside of the inner U-shaped frame to avoid obstruction, so that the outer U-shaped frame can be moved to one side of the cover body and arranged opposite to the air outlet. The moved outer U-shaped frame can be positioned by the friction between the connecting groove and the connecting strip, so that the hot air ejected from the air outlet can contact each diode chip to ensure the quality of drying.

[0027] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. An automatic cleaning and drying machine for semiconductor diode chips, characterized in that: The invention comprises a fixing plate (1), a supporting plate (9), a plurality of outer U-shaped frames (3) and a diode chip (5), wherein the fixing plate (1) is mounted on one side surface of the supporting plate (9), a plurality of connection grooves are arranged on one side surface of the fixing plate (1), connection strips (2) are slidably arranged in the connection grooves, the outer side surfaces of the connection strips (2) are fixedly connected to the outer U-shaped frame (3), grooves are arranged on both side surfaces inside the outer U-shaped frame (3), an inner U-shaped frame (4) is inserted from top to bottom inside the outer U-shaped frame (3), both sides of the inner U-shaped frame (4) extend into the grooves, channels are formed between the inner U-shaped frame (4) and the grooves, the diode chips (5) are vertically arranged inside the inner U-shaped frame (4), the pins at both ends of the diode chip (5) are inserted into the channels and are in contact with the inner U-shaped frame (4), and a lifting mechanism for driving the inner U-shaped frame (4) to move up and down is arranged on the upper end of the fixing plate (1).

2. The automatic cleaning and drying machine for semiconductor diode chips according to claim 1, characterized in that: The lifting mechanism comprises a transverse plate (6), an eccentric wheel (15), a reduction motor (16), a plurality of L-shaped plates (7) and a plurality of telescopic rods (8); the transverse plate (6) is arranged behind a fixed plate (1); the L-shaped plates (7) are all mounted on the top surface of the transverse plate (6); the other ends of the L-shaped plates (7) extend to one side of an inner U-shaped frame (4); one end of the telescopic rods (8) is all mounted on the L-shaped plate (7) and the other end is all inserted into the inner U-shaped frame (4); the eccentric wheel (15) is arranged below the transverse plate (6); the rotating shaft of the reduction motor (16) is mounted on a side surface of the eccentric wheel (15) and is eccentrically arranged; a fixing seat is installed between the outer wall of the reduction motor (16) and the fixed plate (1).

3. The automatic cleaning and drying machine for semiconductor diode chips according to claim 1, characterized in that: A cover body (12) is installed on a side surface of the support plate (9) away from the fixed plate (1), an air cavity is formed between the cover body (12) and the support plate (9), a side surface of the support plate (9) facing the fixed plate (1) is provided with a plurality of air outlet holes (14) connected to the air cavity, an air inlet pipe (13) is installed on the top surface of the cover body (12), a bottom plate (11) is installed on the bottom surface of the support plate (9), and a plurality of fixing holes are provided on the bottom plate (11).

4. The automatic cleaning and drying machine for semiconductor diode chips according to claim 1, characterized in that: The cross sections of the connection groove and the connection strip (2) are both arranged in a trapezoidal structure.

5. The automatic cleaning and drying machine for semiconductor diode chips according to claim 1, characterized in that: An anti-slip pattern is provided on one side surface of the inner U-shaped frame (4), and the anti-slip pattern contacts the pins on the diode chip (5).

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