Mainboard and intelligent cleaning robot

Abstract

The utility model discloses a mainboard, which is applied to an intelligent cleaning robot and comprises a circuit board. The main processor is arranged on the circuit board; the plurality of interfaces are used for accessing external equipment; the plurality of interfaces are horizontally and transversely arranged, and comprise WAFER interfaces with buckles; the plurality of interface control circuits are electrically connected with the main processor, and the interface control circuits are electrically connected with at least one interface; and the main processor is electrically connected with the interface and / or the main processor is electrically connected with the interface through the interface control circuit. Compared with the prior art, the mainboard of the intelligent cleaning robot has abundant interface resources, the interface has anti-vibration design, the computing power of the main processor is sufficient, and the high efficiency, stability, intelligence and safety of the intelligent cleaning robot in the using process are improved.

Description

Technical Field

[0001] The utility model relates to the field of intelligent robots, in particular to a mainboard and an intelligent cleaning robot. Background Art

[0002] As people's demand for cleaning increases and they consider labor cost control, smart cleaning robots are gradually becoming mainstream products on the market. In the future, smart cleaning robots will be more intelligent and have more powerful computing power, but they will also face a larger cleaning range and a more complex environment. Therefore, smart cleaning robots with multi-functions, customizability, human-computer interaction, environmental protection and energy saving, compactness and flexibility, safety and reliability, and stable operation can bring people a more convenient, efficient and safe cleaning experience.

[0003] However, the core motherboards of smart cleaning robots in the current market generally have defects such as poor shock resistance, non-anti-shake interface, insufficient computing power, and insufficient interface resources. They do not support the smart cleaning robots to operate smoothly, reliably and efficiently in larger and more complex environments, and it is difficult to meet users' needs for efficiency, stability, intelligence and safety. Utility Model Content

[0004] The main purpose of the utility model is to provide a mainboard and an intelligent cleaning robot, aiming to solve the problems of poor shock resistance, non-anti-shake interface, insufficient computing power and insufficient interface resources of the existing intelligent cleaning robots.

[0005] In order to achieve the above-mentioned purpose, the utility model proposes a mainboard, which is applied to an intelligent cleaning robot. The mainboard includes:

[0006] Circuit boards;

[0007] A main processor is arranged on the circuit board;

[0008] Multiple interfaces for connecting external devices; multiple interfaces are horizontally arranged and include WAFER interfaces with buckles;

[0009] a plurality of interface control circuits, wherein the interface control circuits are electrically connected to the main processor and the interface control circuits are electrically connected to at least one interface;

[0010] The main processor is electrically connected to the interface and / or the main processor is connected to the interface via the interface control circuit.

[0011] Optionally, the interface includes a display interface, an audio interface, an amplifier interface, a COM interface, a USB interface, an RJ45 network port, a Mini-PCIE interface, a SIM card slot, a fan interface, a GPIO interface and a TF card slot;

[0012] The interface control circuit comprises an Ethernet Gigabit PHY chip, a CODEC chip, a power amplifier chip, a PCIE HUB chip and a USB HUB chip.

[0013] Optionally, the display interface includes:

[0014] An HDMI interface, electrically connected to the main processor;

[0015] A MIPI-DSI interface is electrically connected to the main processor.

[0016] Optionally, the audio interface is electrically connected to the CODEC chip, and the power amplifier interface is electrically connected to the CODEC chip through the power amplifier chip.

[0017] Optionally, the COM interface includes:

[0018] RS485 interface, connected to the USB HUB chip through a converter;

[0019] RS232 interface, connected to the USB HUB chip through a converter;

[0020] and a plurality of TTL interfaces, at least one of the TTL interfaces is electrically connected to the USB HUB chip through a converter, and at least one of the TTL interfaces is electrically connected to the main processor.

[0021] Optionally, the USB interface includes:

[0022] USB 3.0 interface, at least one of the USB 3.0 interfaces is electrically connected to the main processor, and / or at least one of the USB 3.0 interfaces is electrically connected to the PCIE HUB chip;

[0023] USB 2.0 Type-A interface, electrically connected to the PCIE HUB chip;

[0024] USB 2.0 pin interface, at least one of the USB 2.0 pin interfaces is electrically connected to the main processor, and / or at least one of the USB 2.0 interfaces is electrically connected to the PCIE HUB chip, and / or at least one of the USB 2.0 pin interfaces is electrically connected to the USB HUB chip.

[0025] Optionally, the RJ45 network port is electrically connected to the Ethernet Gigabit PHY chip; the SIM card slot is electrically connected to the Mini-PCIE interface, and the Mini-PCIE interface is electrically connected to the PCIE HUB chip; the fan interface is electrically connected to the main processor; the GPIO interface is electrically connected to the main processor; and the TF card slot is electrically connected to the main processor.

[0026] Optionally, the mainboard further includes:

[0027] A wireless communication module, the wireless communication module is electrically connected to the main processor, and the wireless communication module includes a WIFI module and a Bluetooth module;

[0028] Memory particles, electrically connected to the main processor;

[0029] The EMMC particles are electrically connected to the main processor.

[0030] Optionally, the main processor includes an ARM processor, and the ARM processor includes an NPU.

[0031] The utility model also provides an intelligent cleaning robot, which includes the mainboard mentioned above.

[0032] The beneficial effects of the utility model are:

[0033] The intelligent robot motherboard includes a rich number of interfaces to meet the needs of connecting to a large number of different peripheral devices; multiple interfaces are horizontally arranged, and include a WAFER interface with a clip to reduce the probability of the intelligent robot becoming loose due to bumps and jitters during operation, thereby affecting normal operation; at the same time, a main processor based on the ARM platform and integrated with NPU is adopted to improve the motherboard computing power to meet the use of the intelligent cleaning robot in complex environments; the utility model improves the efficiency, stability, intelligence and safety of the intelligent cleaning robot during use by increasing the types and number of interfaces, anti-shake and shock-proof design of the interfaces and increasing the computing power of the motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a circuit diagram of an embodiment of the mainboard of the utility model;

[0035] Figure 2 It is a structural schematic diagram of an embodiment of the mainboard interface of the utility model.

[0036] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] The descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0039] The utility model proposes a mainboard applied to an intelligent cleaning robot, aiming to solve the problems of poor shock resistance, non-anti-shake interface, insufficient computing power and insufficient interface resources of the intelligent cleaning robot.

[0040] Reference Figure 1 In one embodiment, the mainboard includes:

[0041] Circuit boards;

[0042] A main processor is arranged on the circuit board;

[0043] Multiple interfaces for connecting external devices; multiple interfaces are horizontally arranged, including WAFER interfaces with buckles;

[0044] a plurality of interface control circuits, wherein the interface control circuits are electrically connected to the main processor and the interface control circuits are electrically connected to at least one interface;

[0045] The main processor is electrically connected to the interface and / or the main processor is connected to the interface via the interface control circuit.

[0046] Specifically, the intelligent cleaning robots of the future will be faced with a larger cleaning range and a more complex environment, while existing cleaning robots generally have defects such as poor shock resistance, non-anti-shake interfaces, insufficient computing power, and insufficient interface resources, making it difficult to meet user demands for efficiency, stability, intelligence, and safety.

[0047] Therefore, in this embodiment, multiple interfaces and various interfaces are provided for accessing external devices to expand the functions of the intelligent cleaning robot.

[0048] In this embodiment, multiple interfaces are arranged horizontally, and include WAFER interfaces with snap-ons. The WAFER interface is a high-precision component that can realize the connection of electronic components on a printed circuit board, and has the characteristics of small size, high-density wiring and reliable connection. The USB pin interface, GPIO interface and COM interface can use the horizontally arranged WAFER interface with a snap-on component, and other interfaces such as the display interface, audio interface, network port, Mini-PCIE interface, fan interface, etc. can use the horizontally arranged ordinary interface. Placing the interface horizontally can enhance the friction resistance between the interface and the connector of the external connecting cable when the cleaning robot is bumped up and down, and reduce the probability of the interface loosening due to bumps and jitters during the operation of the cleaning robot. At the same time, the interface is provided with a snap-on component to further prevent the interface from loosening or even the connection cable from falling off during the operation of the cleaning robot.

[0049] Specifically, in one embodiment, referring to Figure 2 , Figure 2 The schematic diagrams of the structures of three interfaces are shown, namely, a USB2.0 pin interface 1000, an RS485 interface 1100 and a GPIO interface 1800, all of which are horizontal interfaces. The USB2.0 pin interface 1000 is a WAFER interface, including a housing 1001, a buckle assembly 1002 and a jack 1003; the RS485 interface 1100 is a WAFER interface, including a housing 1101, a buckle assembly 1102 and a jack 1103; and the GPIO interface 1800 includes a housing 1801, a buckle assembly 1802 and a jack 1803.

[0050] The snap assembly is used to fix the external connection line by pressing when it is inserted into the interface. The shape and structure of the snap assembly are not specifically limited. The structural diagrams of the above three interfaces are only examples of the horizontally placed WAFER interface with a snap assembly used in this embodiment.

[0051] The motherboard proposed in this embodiment for use in the intelligent cleaning robot has the characteristics of rich interface resources and interface anti-shake / anti-shock design, which supports the intelligent cleaning robot to connect to a variety of internal / external devices for expanded functions, and the anti-shake / anti-shock design enables the intelligent cleaning robot to face more complex application scenarios.

[0052] Based on the above embodiments, refer to Figure 1 and Figure 2 , the mainboard proposed in this application is further explained below.

[0053] In one embodiment, the interface includes a display interface, an audio interface 500, an amplifier interface 600, a COM interface, a USB interface, an RJ45 network port 300, a Mini-PCIE interface 800, a SIM card slot 2000, a fan interface 1900, a GPIO interface 1800 and a TF card slot 1500;

[0054] The interface control circuit includes an Ethernet Gigabit PHY chip 12 , a CODEC chip 13 , a power amplifier chip 14 , a PCIE HUB chip 15 and a USB HUB chip 16 .

[0055] Specifically, the display interface is used to connect the display component; the audio interface is used to input and output audio signals; the power amplifier interface is used to connect the audio source and the power amplifier to amplify the audio signal and output it to the speaker; the COM interface is used to communicate with other devices; the USB interface is used to access external devices; the RJ45 network port is connected to the external data cable for access to Ethernet; the Mini PCI-E interface is an interface based on the PCIE bus and can be used to expand access to the 4G module; the SIM card slot is used to access the SIM card for mobile communications; the fan interface is used to access the fan assembly; the GPIO interface is used to connect external electronic components; and the TF card slot is used to access the mobile storage TF card.

[0056] Specifically, the Ethernet Gigabit PHY chip is the Ethernet physical layer transceiver basic chip, which is used to achieve the 1000Mbps transmission speed standard; the CODEC chip is used to process audio input and output signals; the power amplifier chip is used to amplify the received audio signal for output to the speaker; the PCIE HUB chip is used for the PCIE bus to uniformly connect multiple external device interfaces; the USB HUB chip is used for multiple USB interfaces to uniformly access the main processor through a USB hub.

[0057] Optionally, in one embodiment, the display interface includes an HDMI interface 100 and a MIPI-DSI interface 200, and the display interface is electrically connected to the main processor.

[0058] Specifically, the HDMI interface is used to connect external high-definition multimedia devices, and the MIPI-DSI interface can be used to access the display components of the intelligent cleaning robot.

[0059] Optionally, the audio interface 500 is electrically connected to the CODEC chip 13 , and the power amplifier interface 600 is electrically connected to the CODEC chip 13 via the power amplifier chip 14 .

[0060] Specifically, the CODEC chip is used for processing audio signals, including converting audio digital signals into analog signals and converting audio analog signals into digital signals. Using the CODEC chip to electrically connect the audio interface and the power amplifier interface can save main processor resources.

[0061] Optionally, in one embodiment, the COM interface includes:

[0062] RS485 interface 1100, connected to the USB HUB chip 16 via a converter;

[0063] RS232 interface 1200, connected to the USB HUB chip 16 via a converter;

[0064] and a plurality of TTL interfaces 1300, at least one of which is electrically connected to the USB HUB chip via a converter, and at least one of which is electrically connected to the main processor

[0065] Specifically, the RS485 interface is used to access external devices through RS485 bus communication; the RS232 interface is used to access external devices through RS232 bus communication; the TTL interface is an interface based on TTL parallel data transmission, which can be used to connect small-size, low-resolution display components; multiple communication interfaces are suitable for accessing a variety of different external devices, enriching the usage scenarios of the intelligent cleaning robot.

[0066] Optionally, in one embodiment, the USB interface includes:

[0067] USB 3.0 interface 700, at least one of the USB 3.0 interface is electrically connected to the main processor 11, and / or at least one of the USB 3.0 interface 700 is electrically connected to the PCIE HUB chip 15;

[0068] USB 2.0 Type-A interface 900, electrically connected to the PCIE HUB chip 15;

[0069] USB 2.0 pin interface 1000, at least one of the USB 2.0 pin interface 1000 is electrically connected to the main processor 11, and / or at least one of the USB 2.0 pin interface is electrically connected to the PCIE HUB chip 15, and / or at least one of the USB 2.0 pin interface is electrically connected to the USB HUB chip 16.

[0070] Specifically, USB2.0 and USB3.0 are used to meet the access requirements of external devices with different transmission bandwidth and different versions, and different Type types of USB interfaces are also used to meet the access requirements of different external devices; optionally, the USB interface may also include other types of USB interfaces such as Type-B, Type-C, etc., and the version of the USB interface is not limited. This embodiment only indicates that the motherboard proposed in this application supports multiple USB interfaces to access external devices.

[0071] Optionally, in one embodiment, the RJ45 network port 300 is electrically connected to the Ethernet Gigabit PHY chip 12; the SIM card slot 2000 is electrically connected to the Mini-PCIE interface 800, and the Mini-PCIE interface 800 is electrically connected to the PCIE HUB chip 15; the fan interface 1900 is electrically connected to the main processor 11; the GPIO interface 1800 is electrically connected to the main processor 11; and the TF card slot 1500 is electrically connected to the main processor 11.

[0072] Specifically, the main processor is connected to an external communication cable through an Ethernet Gigabit PHY chip and an RJ45 network port to enable the cleaning robot to achieve Ethernet communication; the cleaning robot can also achieve mobile network communication by accessing a SIM card; the fan interface includes an internal fan interface and an external fan interface, and the internal fan and the external fan are respectively used for internal and external heat dissipation of the cleaning robot; the cleaning robot can also access a TF memory card, which can expand the data storage space of the cleaning robot and can also be used for fast data transmission and data backup.

[0073] Optionally, the mainboard further includes:

[0074] A wireless communication module 400, which is electrically connected to the main processor and includes a WIFI module and a Bluetooth module;

[0075] Memory chip 1700, electrically connected to the main processor;

[0076] The EMMC particle 1600 is electrically connected to the main processor.

[0077] Specifically, the wireless communication module is used for wireless communication between the cleaning robot and other devices. The wireless communication module includes a WIFI module and a Bluetooth module, and may also include a WIFI Bluetooth two-in-one module; the memory particle 1700 is used to provide RAM memory for the main processor; the EMMC particle 1600 includes a flash memory and a flash memory controller. The EMMC particle is suitable for data and application storage of mobile devices. It is fast and upgradeable, and can simplify product design and save motherboard space.

[0078] Optionally, in one embodiment, the main processor 11 includes an ARM processor, and the ARM processor includes an NPU.

[0079] Specifically, the ARM processor has the characteristics of low power consumption, high performance and high computing power. The neural network processor NPU is a chip used for deep learning calculations with a computing power of up to 3TOPS. It increases the computing power of the motherboard while maintaining a small size and low power consumption to meet the use of the intelligent cleaning robot in connecting to a variety of external devices and in various complex environments.

[0080] In summary, the utility model proposes a motherboard for an intelligent cleaning robot, including rich interface resources for display, audio amplifier, network connection, external device communication, fan control, storage, peripheral electronic component connection, etc., to meet the use of a large number of peripheral devices; multiple interfaces are horizontally arranged, and include a WAFER interface with a buckle, so as to reduce the probability of loosening of the interface due to bumps and jitters during the operation of the intelligent cleaning robot, and ensure the normal and safe operation of the equipment; the motherboard also adopts a main processor based on the ARM platform and integrated with an NPU to enhance the motherboard computing power and meet the needs of the intelligent cleaning robot to access external devices and use in complex environments.

[0081] The utility model further provides an intelligent cleaning robot, which includes the mainboard described above. The beneficial effects of the intelligent cleaning robot have been described in detail in the above embodiments and will not be repeated here.

[0082] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structures or equivalent process changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly or indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A motherboard, applied to an intelligent cleaning robot, characterized in that: The main board comprises: Circuit boards; A main processor is arranged on the circuit board; Multiple interfaces for connecting external devices; multiple interfaces are horizontally arranged and include WAFER interfaces with buckles; a plurality of interface control circuits, wherein the interface control circuits are electrically connected to the main processor and the interface control circuits are electrically connected to at least one interface; The main processor is electrically connected to the interface and / or the main processor is electrically connected to the interface via the interface control circuit.

2. The mainboard according to claim 1, wherein: The interfaces include display interface, audio interface, amplifier interface, COM interface, USB interface, RJ45 network port, Mini-PCIE interface, SIM card slot, fan interface, GPIO interface and TF card slot; The interface control circuit comprises an Ethernet Gigabit PHY chip, a CODEC chip, a power amplifier chip, a PCIE HUB chip and a USB HUB chip.

3. The mainboard according to claim 2, characterized in that: The display interface comprises: An HDMI interface, electrically connected to the main processor; A MIPI-DSI interface is electrically connected to the main processor.

4. The mainboard according to claim 2, characterized in that: The audio interface is electrically connected to the CODEC chip, and the power amplifier interface is electrically connected to the CODEC chip through the power amplifier chip.

5. The mainboard according to claim 2, characterized in that: The COM interface includes: RS485 interface, connected to the USB HUB chip through a converter; RS232 interface, connected to the USB HUB chip through a converter; and a plurality of TTL interfaces, at least one of the TTL interfaces is electrically connected to the USB HUB chip through a converter, and at least one of the TTL interfaces is electrically connected to the main processor.

6. The mainboard according to claim 2, characterized in that: The USB interface comprises: USB 3.0 interface, at least one of the USB 3.0 interfaces is electrically connected to the main processor, and / or at least one of the USB 3.0 interfaces is electrically connected to the PCIE HUB chip; USB 2.0 Type-A interface, electrically connected to the PCIE HUB chip; USB 2.0 pin interface, at least one of the USB 2.0 pin interfaces is electrically connected to the main processor, and / or at least one of the USB 2.0 interfaces is electrically connected to the PCIE HUB chip, and / or at least one of the USB 2.0 pin interfaces is electrically connected to the USB HUB chip.

7. The mainboard according to claim 2, characterized in that: The RJ45 network port is electrically connected to the Ethernet Gigabit PHY chip; the SIM card slot is electrically connected to the Mini-PCIE interface, and the Mini-PCIE interface is electrically connected to the PCIE HUB chip; the fan interface is electrically connected to the main processor; the GPIO interface is electrically connected to the main processor; and the TF card slot is electrically connected to the main processor.

8. The mainboard according to claim 1, wherein: The mainboard also includes: A wireless communication module, the wireless communication module is electrically connected to the main processor, and the wireless communication module includes a WIFI module and a Bluetooth module; Memory particles, electrically connected to the main processor; The EMMC particles are electrically connected to the main processor.

9. The mainboard according to any one of claims 1 to 8, characterized in that: The main processor includes an ARM processor, and the ARM processor includes an NPU.

10. An intelligent cleaning robot, characterized in that: The intelligent cleaning robot comprises the mainboard as described in any one of claims 1-9.

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