PCB bonding pad convenient for tin melting
By designing concave inclined surfaces, barrier rings, crossflowers, heat dissipation holes and partition strips on the pads, the problem of poor convenience during the welding process is solved, and a more efficient and stable welding effect is achieved, which is suitable for unfamiliar with welding. Used by technical operators.
Patent Information
- Application Number
- CN202420746800.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-11
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-04-11
AI Technical Summary
The existing pad design is poorly convenient during the welding process, resulting in problems such as overflow of tin liquid, insolid welding and dummy welding, making it difficult to meet the needs of operators who are not familiar with welding technology.
The pad structure including welding holes, barrier rings, crossholes, heat dissipation holes and partition strips of the concave inclined surfaces was designed, and the structure of the pad was optimized for tin PCB welding, and the tin liquid filling was guided through the inclined surfaces and the barrier ring was prevented. Overflow, even distribution of cross-planktons, heat dissipation holes accelerate heat dissipation and partition strips avoid heat conduction interference.
It improves welding efficiency and quality, reduces tin liquid waste and welding defects, enhances the reliability and stability of welding, simplifies the operation process, and reduces the difficulty of operation.
Smart Images
Figure CN222283563U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of soldering pad technology, and in particular to a PCB soldering pad that is convenient for tin melting. Background Art
[0002] In the PCB manufacturing process, the design of the pad is directly related to the welding quality and welding efficiency. Generally speaking, operators who are not familiar with welding technology are prone to overflow and diffuse the molten tin liquid to accumulate outside the solder hole during welding operations, resulting in loose welding, cold solder joints or PCB peeling.
[0003] The existing pad design mainly focuses on electrical connection and support functions, and does not consider the optimization of the pad structure that is convenient for tin melting PCB. Although some pads are designed to take the convenience of welding into consideration, the effect is not ideal and cannot meet the needs of operators who are not familiar with welding technology to perform welding work. Therefore, developing a PCB pad that is convenient for tin melting to improve the convenience of operation during welding work has important practical value for improving welding quality and efficiency. Utility Model Content
[0004] In view of the shortcomings of the prior art, a PCB pad that is convenient for tin melting is proposed. The purpose of this application is to optimize the structure of the PCB pad to solve the problem that some PCB pads in the prior art are not convenient during the actual welding and tin melting operation.
[0005] The above-mentioned purpose of this application is achieved through the following technical solutions:
[0006] A PCB soldering pad convenient for tin melting comprises a substrate, a soldering pad area is provided on the substrate, a plurality of soldering holes are provided on the soldering pad area, a concave inclined surface is provided in each of the plurality of soldering holes, and an inclination angle between the inclined surface and the substrate ranges from 15° to 20°.
[0007] By adopting the above technical solution, the concave bevel design helps the welding operator to accurately position the tin bar and the pin during welding. The bevel guides the flow of tin liquid during welding, so that the tin liquid can fill the welding hole more quickly, thereby shortening the welding time and improving production efficiency. The tin liquid is more evenly distributed in the welding hole, reducing the formation of bubbles and slag inclusions, thereby improving the welding quality. At the same time, the inclination angle of the bevel is not large, thereby reducing the waste of tin liquid after melting.
[0008] Furthermore, a raised barrier ring is provided on the outer diameter edge of the welding hole and is fixedly connected to the welding pad area, and the raised height of the barrier ring is in the range of 1mm-5mm.
[0009] By adopting the above technical solution, the barrier ring can effectively prevent excess tin liquid from overflowing from the solder hole during the tin melting process. During the soldering process, the tin liquid will melt due to heat and flow into the solder hole, and the presence of the barrier ring forms a physical barrier to prevent the tin liquid from continuing to overflow after reaching the appropriate filling amount. The overflow of tin liquid may cause soldering defects such as short circuits and cold solder joints. The presence of the barrier ring helps to reduce the occurrence of these potential defects and improve the reliability and stability of soldering.
[0010] Furthermore, the welding holes are distributed at intervals, and the welding holes are distributed around the edge of the pad area, and the spacing between the welding holes ranges from 4 mm to 9 mm.
[0011] By adopting the above technical solution, the solder holes are distributed at intervals and designed around the edge of the pad area, which is conducive to optimizing the heat conduction effect of the pad. During the welding process, the pad needs to withstand a certain amount of heat. This distribution method helps to reduce heat concentration and reduce the risk of damage to the pad due to overheating. The larger spacing avoids accidental connection of tin liquid between adjacent solder holes, thereby improving the safety and reliability of welding.
[0012] Furthermore, a cross groove is provided on the inclined surface of the welding hole.
[0013] By adopting the above technical solution, the cross groove on the inclined surface of the solder hole can guide the flow of molten tin, so that the molten tin is more evenly distributed in the solder hole. Due to the guiding effect of the cross groove on the molten tin, the welding operator can more easily control the flow and distribution of the molten tin. This helps to simplify the welding operation process, reduce the difficulty of operation, and improve production efficiency.
[0014] Furthermore, heat dissipation holes are provided around the welding holes, and the diameter of the heat dissipation holes ranges from 0.2 mm to 1 mm.
[0015] By adopting the above technical solution, the heat dissipation area on the surface of the pad area can be increased by setting the heat dissipation holes, which can accelerate the heat dissipation and thus reduce the occurrence of welding defects. The diameter of the heat dissipation holes ranges from 0.2 mm to 1 mm. Too small heat dissipation holes may lead to poor heat dissipation effect, while too large heat dissipation holes may affect the overall structure and strength of the pad area. Within this size range, the heat dissipation holes can ensure good heat dissipation effect without having a negative impact on other properties of the pad area, thereby improving the overall durability of the pad.
[0016] Furthermore, a separation bar is provided between the plurality of solder holes and the heat dissipation holes, and the separation bar is fixedly connected to the solder pad area.
[0017] By adopting the above technical solution, the provision of the separation strip can effectively avoid heat conduction interference between the welding hole and the heat dissipation hole.
[0018] Furthermore, a placement area for placing electronic components is provided at a middle position of the end surface of the substrate away from the pad area.
[0019] By adopting the above technical solution, the placement area is set in the middle of the end surface of the substrate away from the pad area, making the layout of the entire substrate more reasonable, reducing the complexity of line connection, and improving the integration of the entire circuit board.
[0020] Furthermore, the pad area is made of a material with high thermal conductivity.
[0021] By adopting the above technical solution, since the high thermal conductivity material has excellent thermal conductivity, the heat generated during the welding process can be distributed more evenly, thereby reducing the occurrence of welding defects.
[0022] In summary, the present application includes at least one of the following beneficial technical effects:
[0023] 1. The concave bevel design helps to accurately position the tin bar and pins, guide the tin liquid to quickly fill the solder hole, and improve the welding efficiency. The bevel increases the contact area between the tin liquid and the pad, enhances the firmness and stability of the welding connection, and reduces the waste of tin liquid, improving the welding quality;
[0024] 2. The barrier ring effectively prevents the tin liquid from overflowing during the welding process, ensures the accurate amount of tin liquid in the welding hole, improves the welding accuracy and consistency, avoids poor welding caused by excessive tin liquid, reduces the risk of welding defects, and improves the reliability and stability of welding;
[0025] 3. The cross groove on the inclined surface of the welding hole guides the tin liquid to be evenly distributed, reducing welding defects. It simplifies the welding operation, reduces the difficulty of operation, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 It is a schematic diagram of the overall structure in the embodiment;
[0027] Figure 2 is a side view of a substrate in an embodiment;
[0028] Figure 3 is along Figure 2 Section view along line AA.
[0029] Figure numerals: 1, substrate; 2, pad area; 3, solder hole; 4, barrier ring; 5, cross groove; 6, heat dissipation hole; 7, separator strip. DETAILED DESCRIPTION
[0030] The present application is further described in detail below in conjunction with the accompanying drawings.
[0031] Example, see Figure 1 , Figure 2 as well as Figure 3 A PCB pad for tin melting includes a substrate 1, a pad area 2 is provided on the substrate 1, a plurality of solder holes 3 are provided on the pad area 2, a concave inclined surface is provided in each of the plurality of solder holes 3, the inclination angle of the inclined surface is 15°, a raised barrier ring 4 is provided on the outer diameter edge of the solder hole 3 and is fixedly connected to the solder pad area 2, the raised height of the barrier ring 4 is 5 mm, the solder holes 3 are distributed at intervals, the solder holes 3 are distributed around the edge of the solder pad area 2, the spacing of the solder holes 3 is 9 mm, a cross groove 5 is provided on the inclined surface of the solder hole 3, a heat dissipation hole 6 is provided around the solder hole 3, the diameter of the heat dissipation hole 6 is 0.5 mm, a partition bar 7 is provided between the plurality of solder holes 3 and the heat dissipation hole 6, the partition bar 7 is fixedly connected to the solder pad area 2, and a placement area for placing electronic components is provided in the middle of the end surface of the substrate 1 away from the solder pad area 2.
[0032] In this embodiment, the concave bevel design helps the welding operator to accurately position the tin bar and the pin during welding. The bevel guides the flow of tin liquid during welding, so that the tin liquid can fill the welding hole 3 more quickly, thereby shortening the welding time and improving production efficiency. The existence of the bevel can increase the contact area between the tin liquid and the pad area 2, which helps to form a more solid and stable welding connection. The guiding effect of the bevel can make the tin liquid more evenly distributed in the welding hole 3, and the barrier ring 4 can effectively prevent the excess tin liquid from overflowing from the welding hole 3 during the tin melting process. During the welding process, the tin liquid will melt due to heat and flow into the welding hole 3, and the existence of the barrier ring 4 forms a physical barrier to prevent the tin liquid from continuing to overflow after reaching the appropriate filling amount, which helps to ensure that the amount of tin liquid in the welding hole 3 meets the precise requirements and avoids poor welding caused by too much or too little tin liquid. This helps to improve the accuracy and consistency of welding and meet the precise connection requirements of electronic components. The cross groove 5 on the inclined surface of the welding hole 3 can guide the flow of tin liquid and make the tin liquid more evenly distributed in the welding hole 3, which helps to reduce defects such as bubbles and slag inclusions during the welding process and improve the welding quality. The heat dissipation holes 6 and partition strips 7 around the welding hole can avoid heat concentration in the pad area 2 and improve the overall stability of the pad.
[0033] Specific implementation process:
[0034] First, place the substrate 1 flat on a horizontal PCB, insert the pin and the tin bar into the solder hole 3 of the pad area 2 in the substrate 1, and use a welding gun to heat the tin bar to melt. During the welding process, since the solder hole 3 is provided with an inwardly concave inclined surface, the molten tin liquid can flow into the position where the pin is inserted into the solder hole 3 along the guidance of the inclined surface, and the tin liquid can be evenly distributed in the solder hole 3, guiding the tin liquid to quickly fill the required welding position, thereby improving the welding efficiency. When the tin liquid accumulates in the solder hole 3 and overflows, the barrier ring 4 confines the outflowing tin liquid within a certain range to prevent the tin liquid from continuing to flow to other positions in the pad area 2. The solder holes 3 are distributed around the pad area 2. When performing welding operations, operators can directly use the surrounding solder holes 3 for welding operations, which reduces the time cost required for positioning the solder holes 3, improves the convenience of use, and reduces the difficulty of operation. A cross groove 5 is also provided on the inclined surface of the solder hole 3, which increases the contact area between the molten tin and the inclined surface of the solder hole 3, and also guides the flow of the molten tin, so that the molten tin is more evenly distributed in the solder hole 3, simplifying the soldering operation process and reducing the difficulty of operation. Since a large amount of heat is generated during the soldering process, which affects the normal operation and service life of the soldering pad, the design of providing the heat dissipation hole 6 around the solder hole 3 can increase the surface heat dissipation area of the soldering pad area 2, accelerate the heat dissipation, and keep the temperature of the soldering pad area 2 within a suitable range. A partition bar 7 is provided between the solder hole 3 and the heat dissipation hole 6, and the partition bar 7 divides and separates the heat area, effectively avoiding the interference of heat conduction between the solder hole 3 and the heat dissipation hole 6.
[0035] The embodiments of this specific implementation method are all preferred embodiments of the present application and are not intended to limit the scope of protection of the application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.
Claims
1. A PCB soldering pad that is convenient for melting tin, characterized in that: The invention comprises a substrate (1), wherein a pad area (2) is provided on the substrate (1), a plurality of welding holes (3) are provided on the pad area (2), and a concave inclined surface is provided in each of the plurality of welding holes (3), wherein the inclination angle between the inclined surface and the substrate (1) is in a range of 15° to 20°.
2. A PCB soldering pad for easy tin melting according to claim 1, characterized in that: A raised barrier ring (4) is provided on the outer diameter edge of the welding hole (3); the barrier ring (4) is fixedly connected to the welding pad area (2); and the raised height of the barrier ring (4) is in the range of 1 mm to 5 mm.
3. A PCB soldering pad for easy tin melting according to claim 1, characterized in that: The welding holes (3) are distributed at intervals, and the welding holes (3) are distributed around the edge of the pad area (2). The spacing between the welding holes (3) ranges from 4 mm to 9 mm.
4. A PCB soldering pad for easy tin melting according to claim 1, characterized in that: A cross groove (5) is provided on the inclined surface of the welding hole (3).
5. The PCB soldering pad for easy tin melting according to claim 1, characterized in that: A heat dissipation hole (6) is provided around the welding hole (3), and the diameter of the heat dissipation hole (6) ranges from 0.2 mm to 1 mm.
6. A PCB soldering pad for easy tin melting according to claim 5, characterized in that: A separation bar (7) is provided between the plurality of solder holes (3) and the heat dissipation holes (6), and the separation bar (7) is fixedly connected to the solder pad area (2).
7. The PCB soldering pad for easy tin melting according to claim 1, characterized in that: A placement area for placing electronic components is provided at the middle position of the end surface of the substrate (1) away from the pad area (2).
8. The PCB soldering pad for easy tin melting according to claim 1, characterized in that: The substrate (1) is made of a material with high thermal conductivity.