Electronic equipment and heat dissipation structure thereof

Abstract

The utility model relates to an electronic device and a heat dissipation structure thereof, the heat dissipation structure comprises a substrate and an electric device connected to a first side of the substrate through a conductive adhesive, the heat dissipation structure further comprises a metal piece and a heat conduction piece, and the metal piece is arranged on a second side, opposite to the first side, of the substrate; the heat conduction piece comprises a first connecting part and a second connecting part, and the first connecting part is located between the substrate and the metal piece and used for connecting the substrate and the metal piece; the second connecting part is connected to the electric device so that heat of the electric device can be transmitted to the metal piece through the heat conduction piece. According to the heat dissipation structure, the bonding force of the substrate and the metal piece is increased, the problem that the conductive adhesive floats up due to heat accumulation of the binding area of the electronic equipment (such as a flat product), and then functional failure is caused can be solved, the product risk is reduced, and the reliability is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of heat dissipation technology, and in particular, to an electronic device and a heat dissipation structure thereof. Background Art

[0002] Currently, in the field of LCD flat panel terminal display, especially in the design of COG (IC on Glass) and FOG (FPC on Glass) products; as the specifications of LCD flat panel products become higher and higher, the load becomes larger and larger, and the current passing through the binding area of ​​electrical components (such as IC and FPC) becomes larger, the current will cause the binding area to generate more heat, causing the ACF (anisotropic conductive adhesive) connecting the IC and FPC to expand and float due to the heat, and the metal conductive particles to have poor contact, causing the IC and FPC to be no longer conductive to the panel, resulting in functional abnormalities.

[0003] In order to solve the above technical problems, in the related art, a graphite sheet is attached behind the backlight to dissipate heat, but the heat dissipation effect is not good. Utility Model Content

[0004] The purpose of the present disclosure is to provide an electronic device and a heat dissipation structure thereof, which can not only increase the bonding strength between the substrate and the metal parts, but also avoid the problem of heat accumulation in the binding area of ​​the electronic device (such as a tablet product) causing the conductive adhesive to float, thereby causing functional failure, thereby reducing product risks and improving reliability.

[0005] In order to achieve the above-mentioned object, the present disclosure provides, in a first aspect, a heat dissipation structure of an electronic device, the heat dissipation structure comprising a substrate and an electrical device connected to a first side of the substrate through a conductive adhesive, the heat dissipation structure further comprising:

[0006] a metal member disposed on a second side of the substrate opposite to the first side; and

[0007] The heat conducting member comprises a first connecting portion and a second connecting portion, wherein the first connecting portion is located between the substrate and the metal member and is used to connect the substrate and the metal member; the second connecting portion is connected to the electrical device so that the heat of the electrical device can be transferred to the metal member through the heat conducting member.

[0008] Optionally, the second connecting portion is attached to a side of the electrical component away from the substrate.

[0009] Optionally, the heat conducting member further includes a third connecting portion connecting the first connecting portion and the second connecting portion, and the third connecting portion is attached to an edge of the substrate.

[0010] Optionally, there are multiple electrical components, and the second connecting part is connected to the multiple electrical components respectively.

[0011] Optionally, the electrical device includes an integrated circuit board and a flexible circuit board;

[0012] The second connecting portion is respectively connected to the side surfaces of the integrated circuit board and the flexible circuit board away from the substrate.

[0013] Optionally, the flexible circuit board is bent from a side of the metal member away from the substrate, and then bypasses the metal member and the lateral edge of the substrate to be connected to the first side of the substrate;

[0014] A via hole is formed on the flexible circuit board, one end of the third connection part is connected to the first connection part, and the other end passes through the via hole and is connected to the second connection part.

[0015] Optionally, a fitting area between the first connection portion and the metal component is larger than a fitting area between the second connection portion and the electrical component.

[0016] Optionally, the heat conducting member is configured as a heat conducting silicone sheet.

[0017] According to a second aspect of the present disclosure, an electronic device is further provided, wherein the electronic device comprises the heat dissipation structure according to the first aspect of the present disclosure.

[0018] Optionally, the electronic device is a tablet or a mobile phone.

[0019] Through the above technical solution, that is, the heat dissipation structure of the present invention, the electrical device is connected to the first side of the substrate through the thermally conductive adhesive, the metal part is connected to the second side of the substrate through the first connecting portion of the thermally conductive part, and the second connecting portion of the thermally conductive part is connected to the electrical device on the first side of the substrate. Through the above arrangement, the metal part can be connected to the second side of the substrate through the first connecting portion of the thermally conductive part, and the second connecting portion of the thermally conductive part can transfer the heat of the electrical device to the first connecting portion and the metal part by connecting to the electrical device to achieve heat dissipation. The heat dissipation structure of the present invention not only increases the bonding force between the substrate and the metal part, but also can conduct the heat generated between the electrical device and the substrate through the thermally conductive part and the metal part, thereby improving the heat dissipation effect, avoiding the problem of heat accumulation in the binding area of ​​the electronic device (such as a tablet product) causing the conductive adhesive to float, thereby causing functional failure, reducing product risks, and improving reliability.

[0020] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0022] Figure 1It is a schematic diagram of the connection between electrical components and glass substrates in the current LCD flat-panel terminal display field.

[0023] Figure 2 It is a schematic diagram of the connection between the electrical device and the glass substrate when the conductive adhesive expands and floats due to heat.

[0024] Figure 3 This is a schematic diagram of the structure in which a substrate and a metal part are bonded together by light-shielding adhesive in the related technology.

[0025] Figure 4 Schematic diagram of a heat dissipation structure of an electronic device provided in some embodiments of the present disclosure.

[0026] Figure 5 is based on Figure 4 X-direction schematic diagram in .

[0027] Description of Reference Numerals

[0028] 100-substrate; 200-electrical component; 210-integrated circuit board; 220-flexible circuit board; 221-via; 300-conductive adhesive; 400-metal part; 500-light shielding adhesive; 600-heat conducting part; 610-first connecting part; 620-second connecting part; 630-third connecting part; DETAILED DESCRIPTION

[0029] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0030] In this disclosure, unless otherwise stated, directional words such as "upper, lower, left, right" generally refer to the upper, lower, left, and right of the corresponding drawings; "inside and outside" refer to the inside and outside of the outline of the component or structure itself. "First, second" and the like are used to distinguish one element from another and do not have order or importance. In addition, in the description with reference to the drawings, the same mark in different drawings represents the same element.

[0031] like Figure 1 The figure shows a schematic diagram of the connection between an electrical device 200 and a glass substrate in the current LCD flat panel terminal display field, wherein the electrical device 200 is connected to the upper surface of the substrate 100 (glass substrate) through a conductive adhesive 300, and the electrical connection is achieved through the metal conductive particles in the conductive adhesive 300. Figure 2 The figure shows a schematic diagram of the connection between the electrical device 200 and the glass substrate when the conductive adhesive 300 expands and floats due to heat, wherein the conductive adhesive 300 (such as ACF, anisotropic conductive adhesive 300) connecting the electrical device 200 (such as IC and FPC) expands and floats due to heat, and the metal conductive particles have poor contact, so that the IC and FPC are not conductive to the panel. Figure 3It is a schematic diagram of the structure in which the substrate 100 and the metal part 400 are bonded by the light shielding glue 500 in the related art, wherein the integrated circuit board 210 and the flexible circuit board 220 are bonded to the side of the substrate 100 away from the metal part 400 by the conductive glue 300. Schematic diagram of the electronic device (such as a flat-panel electric glue) affixing a graphite sheet on the back of the metal part 400 for heat dissipation; wherein the electrical device 200 is affixed to the first side of the substrate 100 by the conductive glue 300, and the second side of the substrate 100 is affixed to the metal part 400 (such as an iron frame) by the light shielding glue 500. A graphite sheet can be affixed to the metal part 400 for heat dissipation, but the heat dissipation effect is not good, which can easily lead to the failure of the electronic device function and poor product reliability.

[0032] Based on this, the embodiments of the present disclosure provide an electronic device and a heat dissipation structure thereof, which not only increases the bonding force between the substrate 100 and the metal part 400, but also avoids the problem of heat accumulation in the binding area of ​​the electronic device (such as a tablet product) causing the conductive adhesive 300 to float, thereby causing functional failure, thereby reducing product risks and improving reliability.

[0033] In order to achieve the above purpose, Figure 4 and Figure 5 As shown, an embodiment of the present disclosure provides a heat dissipation structure of an electronic device, the heat dissipation structure includes a substrate 100 and an electrical device 200 connected to a first side of the substrate 100 through a conductive adhesive 300, and the heat dissipation structure also includes a metal member 400 and a heat conductive member 600. The metal member 400 is disposed on a second side of the substrate 100 opposite to the first side; the heat conductive member 600 includes a first connecting portion 610 and a second connecting portion 620, the first connecting portion 610 is located between the substrate 100 and the metal member 400 and is used to connect the substrate 100 and the metal member 400; the second connecting portion 620 is connected to the electrical device 200, so that the heat of the electrical device 200 can be transferred to the metal member 400 through the heat conductive member 600. Wherein, the substrate 100 includes a first side and a second side opposite to each other, as shown in FIG. Figure 4 As shown in , the left side of the substrate 100 is the first side of the substrate 100 , and the right side of the substrate 100 is the second side of the substrate 100 .

[0034] Through the above technical solution, i.e., the heat dissipation structure of the present disclosure, the electrical device 200 is connected to the first side of the substrate 100 through the heat conductive adhesive, the metal member 400 is connected to the second side of the substrate 100 through the first connection portion 610 of the heat conductive member 600, and the second connection portion 620 of the heat conductive member 600 is connected to the electrical device 200 on the first side of the substrate 100. Through the above arrangement, the metal member 400 can be connected to the second side of the substrate 100 through the first connection portion 610 of the heat conductive member 600, and the second connection portion 620 of the heat conductive member 600 can transfer the heat of the electrical device 200 to the first connection portion 610 and the metal member 400 to achieve heat dissipation by connecting to the electrical device 200. The heat dissipation structure of the present disclosure not only increases the bonding force between the substrate 100 and the metal member 400, but also can conduct the heat generated between the electrical device 200 and the substrate 100 through the heat conductive member 600 and the metal member 400, thereby improving the heat dissipation effect.

[0035] It is understandable that the electrical device 200 is connected to the substrate 100 through the conductive adhesive 300, and the bonding area of ​​the electrical device 200 and the substrate 100 generates heat, which causes the conductive adhesive 300 to expand and float, resulting in poor contact of the metal conductive particles in the conductive adhesive 300, thereby affecting the connection between the electrical device 200 and the substrate 100. The heat-conducting member 600 of the present disclosure can transfer the heat of the electrical device 200 to the metal member 400 to achieve heat dissipation, avoid expansion of the conductive adhesive 300, avoid poor contact between the electrical device 200 and the substrate 100, and ensure the normal use of the electronic device using the heat dissipation structure.

[0036] It should be noted that the substrate 100 disclosed in the present invention may be a glass substrate 100; the metal part 400 disclosed in the present invention may be an iron frame for supporting and fixing the second side of the glass substrate 100, wherein a partial area of ​​the glass substrate 100 is bonded to the iron frame through the first connecting portion 610 of the heat conducting member 600, and other partial areas of the glass substrate 100 may be bonded to the iron frame through a light-shielding adhesive 500.

[0037] In some embodiments, the second connection portion 620 is attached to the side of the electrical device 200 away from the substrate 100. The second connection portion 620 is attached to the side of the electrical device 200 away from the substrate 100, so that the contact area between the heat conductor 600 and the electrical device 200 can be larger, thereby improving the ability to absorb heat from the electrical device 200.

[0038] like Figure 4 As shown, in some other embodiments, the heat conducting member 600 further includes a third connecting portion 630 connecting the first connecting portion 610 and the second connecting portion 620, and the third connecting portion 630 is attached to the edge of the substrate 100. The two ends of the third connecting portion 630 extend from the edge of the substrate 100 and are connected to the first connecting portion 610 and the second connecting portion 620 respectively.

[0039] In some embodiments, there may be multiple electrical devices 200, and the second connecting part 620 is respectively connected to the multiple electrical devices 200 to transfer the heat of the multiple electrical devices 200 to the metal part 400 through the second connecting part 620, the third connecting part 630, and the first connecting part 610, thereby achieving heat dissipation through the metal part 400.

[0040] In some embodiments, the electrical device 200 may be two, for example, the electrical device 200 includes an integrated circuit board 210 and a flexible circuit board 220; the second connection portion 620 is respectively connected to the side of the integrated circuit board 210 and the flexible circuit board 220 away from the substrate 100. The integrated circuit board 210 and the flexible circuit board 220 are respectively connected to the first side of the substrate 100 through the conductive adhesive 300 to achieve electrical connection and signal connection. In order to achieve heat dissipation of the integrated circuit board 210 and the flexible circuit board 220, the second connection portion 620 of the conductive member is respectively attached to the outer side wall of the integrated circuit board 210 and the flexible circuit board to absorb the heat generated at the connection between the two and the substrate 100, thereby improving the reliability of the connection and the stability of use.

[0041] like Figure 4 and Figure 5 As shown, in some embodiments, the flexible circuit board 220 is bent from one side of the metal member 400 away from the substrate 100, and then bypassed by the lateral edges of the metal member 400 and the substrate 100 to be connected to the first side of the substrate 100; a via 221 is formed on the flexible circuit board 220, one end of the third connection portion 630 is connected to the first connection portion 610, and the other end of the third connection portion 630 passes through the via 221 and is connected to the second connection portion 620.

[0042] Among them, the flexible circuit board 220 bypasses the lower edge of the metal part 400 and the substrate 100 from the side of the metal part 400 away from the second side of the substrate 100 and is connected to the substrate 100 on the first side of the substrate 100. In order to pass the heat conductive member 600 connected between the second side of the substrate 100 and the metal part 400 through the flexible circuit board 220 and then connect to the side of the flexible circuit board 220 and the integrated circuit board 210 away from the substrate 100, a through hole 221 for the third connecting portion 630 to pass through is formed on the flexible circuit board 220, so that the heat conductive member 600 bypasses the lower edge of the substrate 100 and extends to the first side and the second side of the substrate 100.

[0043] In order to better transfer the heat of the electrical device 200 to the metal part 400 and achieve heat dissipation through the metal part 400, in some embodiments, the bonding area between the first connection part 610 and the metal part 400 is larger than the bonding area between the second connection part 620 and the electrical device 200. The bonding area between the metal part 400 and the first connection part 610 is greater than or equal to the bonding area between the electrical device 200 and the second connection part 620, so that the heat of the electrical device 200 can be better transferred out.

[0044] In some embodiments, the heat conductive member 600 may be configured as a heat conductive silicone sheet.

[0045] An embodiment of the present disclosure further provides an electronic device, which includes the above-mentioned heat dissipation structure. Therefore, the electronic device also has all the advantages of the heat dissipation structure, which will not be described in detail here.

[0046] In some other embodiments, the electronic device may be a tablet or a mobile phone.

[0047] In the heat dissipation structure of the electronic device and the electronic device disclosed in the present invention, the metal part 400 can be connected to the second side of the substrate 100 through the first connection part 610 of the heat conductive part 600, and the second connection part 620 of the heat conductive part 600 can transfer the heat of the electrical device 200 to the first connection part 610 and the metal part 400 to achieve heat dissipation by connecting to the electrical device 200. The heat dissipation structure disclosed in the present invention not only increases the bonding force between the substrate 100 and the metal part 400, but also can conduct the heat generated between the electrical device 200 and the substrate 100 through the heat conductive part 600 and the metal part 400, thereby improving the heat dissipation effect. The problem of heat accumulation in the binding area of ​​the electronic device (such as a tablet product) causing the conductive adhesive 300 to float, thereby causing functional failure, is avoided, product risks are reduced, and reliability is improved.

[0048] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0049] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0050] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A heat dissipation structure of an electronic device, comprising a substrate and an electrical device connected to a first side of the substrate via a conductive adhesive, characterized in that: The heat dissipation structure also includes: a metal member disposed on a second side of the substrate opposite to the first side; and The heat conducting member comprises a first connecting portion and a second connecting portion, wherein the first connecting portion is located between the substrate and the metal member and is used to connect the substrate and the metal member; the second connecting portion is connected to the electrical device so that the heat of the electrical device can be transferred to the metal member through the heat conducting member.

2. The heat dissipation structure of an electronic device according to claim 1, characterized in that: The second connecting portion is attached to a side surface of the electrical component away from the substrate.

3. The heat dissipation structure of an electronic device according to claim 1, characterized in that: The heat conducting member further includes a third connecting portion connecting the first connecting portion and the second connecting portion, and the third connecting portion is attached to an edge of the substrate.

4. The heat dissipation structure of an electronic device according to claim 1, characterized in that: There are a plurality of the electrical components, and the second connecting portion is connected to the plurality of the electrical components respectively.

5. The heat dissipation structure of the electronic device according to claim 3, characterized in that: The electrical device includes an integrated circuit board and a flexible circuit board; The second connecting portion is respectively connected to the side surfaces of the integrated circuit board and the flexible circuit board away from the substrate.

6. The heat dissipation structure of the electronic device according to claim 5, characterized in that: The flexible circuit board is bent from a side of the metal member away from the substrate, and then bypasses the metal member and the lateral edge of the substrate to be connected to the first side of the substrate; A via hole is formed on the flexible circuit board, one end of the third connection part is connected to the first connection part, and the other end passes through the via hole and is connected to the second connection part.

7. The heat dissipation structure of an electronic device according to claim 1, characterized in that: The bonding area between the first connection portion and the metal component is larger than the bonding area between the second connection portion and the electrical component.

8. The heat dissipation structure of an electronic device according to any one of claims 1 to 7, characterized in that: The heat conducting member is configured as a heat conducting silicone sheet.

9. An electronic device, characterized in that: The electronic device comprises the heat dissipation structure as described in any one of claims 1-8.

10. The electronic device according to claim 9, characterized in that: The electronic device is a tablet computer or a mobile phone.

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