Heat dissipation structure and electronic equipment
By using heat conduction technology of the accommodating groove and coating in the heat dissipation structure, the problems of dimensional instability and low heat transfer efficiency during the welding of fanless structure heat dissipation components are solved, and more efficient heat dissipation and lower heat dissipation are achieved manufacturing cost.
Patent Information
- Application Number
- CN202420343508.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-23
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-02-23
AI Technical Summary
The existing fanless heat dissipation components have problems such as welding stress deformation, difficulty in controlling the size, high cost and low heat transfer efficiency during the welding process of the heat pipe module and the structure body.
The heat dissipation structure including a containment groove and a coating layer is adopted. The coating layer conducts heat conduction in a melting and solidified state, and heat exchange efficiency is improved through the thermally conductive component and sealing layer to avoid high-temperature welding. The prefabricated structure is used to simplify manufacturing.
It improves heat conduction efficiency, avoids structural dimensional instability, reduces manufacturing costs, and extends the service life of electronic equipment.
Smart Images
Figure CN222283751U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of heat dissipation device technology, and in particular to a heat dissipation structure and electronic device. Background Technology
[0002] With the development of industrial technology, factories have increasingly higher demands for intelligence. Fanless industrial control computers are being used more and more in detection, sensing, monitoring, automated operation robots, and vehicle lights. While fanless structures can bring stability and low failure rates to computing systems, they also place higher demands on the thermal management of computing units, making the design of the main heat dissipation components that come into contact with heat-generating elements particularly important.
[0003] There are two existing types of fanless heat dissipation components. One type uses high-temperature soldering to connect the heat pipe to the main structure. Specifically, the main structure is nickel-plated, then solder paste is applied, and finally the heat pipe module is placed on top of the solder paste. The entire assembly is then placed in a furnace for high-temperature solder melting and cooling to complete the heat dissipation module. However, high-temperature soldering significantly affects the welding stress and deformation of the heat pipe module and the main structure, making dimensional control difficult. Furthermore, the multiple surface plating processes are complex and costly. The special morphology of the solder paste results in weak affinity with the solder interface, preventing the thermosetting solder from completely filling the interface and affecting heat transfer efficiency. The other type uses mechanical rolling to press the heat pipe into the main structure. Specifically, grooves with the same circumference as the heat pipe are machined into the main structure, and then the heat pipe is slowly pressed into the structure using a rolling press. However, this method lacks interfacial heat conduction, making it impossible to ensure contact between the heat pipe surface and the main structure. It requires specialized rolling equipment, resulting in low efficiency, high cost, and the potential for damage to weak heat pipes due to localized internal stress. Utility Model Content
[0004] This disclosure provides a heat dissipation structure and electronic device to at least solve the above-mentioned technical problems existing in the prior art.
[0005] According to a first aspect of this disclosure, a heat dissipation structure is provided, comprising:
[0006] The body has a receiving groove, and the receiving groove has a coating layer; and
[0007] A heat dissipation component, placed in the receiving groove, includes a first heat-conducting component, a heat-conducting part is provided on the first heat-conducting component, a heat-conducting layer is provided on the surface of the heat-conducting part, and the heat-conducting layer is in contact with the heat-generating element;
[0008] The coating layer includes two states: a molten state and a solidified state.
[0009] In one embodiment, the heat dissipation component further includes a second thermally conductive component, which is located between the coating layer and the first thermally conductive component.
[0010] In one embodiment, the second heat-conducting component includes a heat pipe and a connecting plate, the connecting plate being connected to the coating layer, and the heat pipe being limited and fixed by the connecting plate.
[0011] In one embodiment, the second thermally conductive component further includes a sealing layer disposed between the connecting plate and the coating layer.
[0012] In one embodiment, the second thermally conductive component further includes a sealing layer disposed between the connecting plate and the coating layer.
[0013] In one embodiment, the heat-conducting part is a metal block.
[0014] In one embodiment, the body includes a first surface and a second surface opposite to each other, the receiving groove is located on the first surface, and the second surface has a fin structure.
[0015] In one embodiment, a connecting component is further included, the connecting component comprising two connectors disposed on the first surface and disposed opposite to each other.
[0016] In one possible implementation, the connector and the body are perpendicular.
[0017] According to a second aspect of this disclosure, an electronic device is provided, including a body, the body being provided with a heating element, and further provided with a heat dissipation structure as described in any of the above embodiments, wherein the heat-conducting layer is in contact with the heating element.
[0018] In this disclosure, the heat dissipation structure includes a heat dissipation component. The heat-conducting layer of the first heat-conducting component in the heat dissipation component is in contact with the heating element, enabling the heat from the heating element to be conducted to the body of the heat dissipation structure, which then dissipates the heat into the air. The receiving groove of the body has a coating layer, which includes a molten state and a solidified state. When the coating layer is heated, a solid-liquid phase change occurs, transforming it from a solidified state to a molten state. This allows the heat dissipation component to fit more closely to the receiving groove, resulting in lower thermal resistance and improved heat transfer efficiency. Furthermore, the heat dissipation structure adopts an assembled structure, avoiding dimensional instability caused by high-temperature welding and simplifying manufacturing.
[0019] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description
[0020] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which:
[0021] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.
[0022] Figure 1 A schematic diagram of the overall structure of a heat dissipation structure according to an exemplary embodiment of the present disclosure is shown;
[0023] Figure 2 A schematic diagram of the overall structure of the second heat-conducting component of a heat dissipation structure according to an exemplary embodiment of the present disclosure is shown;
[0024] Figure 3 A schematic diagram of the overall structure of the first heat-conducting component of a heat dissipation structure according to an exemplary embodiment of the present disclosure is shown.
[0025] Figure 4 A schematic diagram of the overall structure of the heat dissipation structure body of an exemplary embodiment of the present disclosure is shown.
[0026] The following are the labels in the diagram: 1. Body; 2. Coating layer; 3. Heat dissipation component; 4. Connecting component; 11. First surface; 12. Second surface; 31. First heat-conducting component; 32. Second heat-conducting component; 110. Receiving groove; 121. Fin structure; 310. Heat-conducting plate; 311. Heat-conducting part; 312. Heat-conducting layer; 321. Heat pipe; 322. Connecting plate. Detailed Implementation
[0027] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0028] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.
[0029] Reference Figure 1 and Figure 2As shown, this disclosure discloses an exemplary embodiment of a heat dissipation structure, including a body 1 and a heat dissipation component 3. The body 1 has a receiving groove 110, and the receiving groove 110 contains a coating layer 2. The heat dissipation component 3 is placed within the receiving groove 110. The heat dissipation component 3 includes a first heat-conducting component 31, on which a heat-conducting part 311 is disposed. A heat-conducting layer 312 is disposed on the surface of the heat-conducting part 311, and the heat-conducting layer 312 is in contact with a heating element (not shown in the figure). The coating layer 2 includes both a molten state and a solidified state.
[0030] In this embodiment, the body 1 is a die-cast structure with micropores, and the coating layer 2 is made of a metal phase change material. Metal phase change materials mainly refer to metallic materials that undergo phase change under conditions such as temperature and pressure. Metal phase change materials generally have high energy storage density and power density, and are therefore widely used in the manufacture of materials for storing and releasing energy. Common metal phase change materials include titanium alloys, nickel-titanium shape memory alloys, or platinum-steel eutectic alloys. Since metal phase change materials are semi-solid at room temperature, they absorb heat and transform into a molten state when the temperature reaches 75°C, thus improving the heat exchange efficiency between the heat dissipation component 3 and the body 1. The thermally conductive layer 312 is preferably made of thermally conductive silicone grease, which has high thermal conductivity, excellent thermal conductivity, a wide operating temperature range, and good stability. It is understood that heat dissipation structures can be applied to fields including but not limited to electronic devices, industrial control computers, medical devices, aerospace, and solar energy storage. The devices in the above fields have heat-generating elements and need to have heat dissipation functions. The heat-generating elements can be, but are not limited to, central processing units, chips, or resistance wires. During heat conduction, the temperature of the heat-generating element is first conducted through the heat-conducting layer 312 to the heat-conducting part 311, and then conducted by the heat-conducting part 311 to the first heat-conducting component 31. Finally, the first heat-conducting component 31 conducts the heat to the body 1 through the coating layer 2, and finally the body 1 dissipates the heat into the air, realizing heat exchange with the air.
[0031] Therefore, in this embodiment, since the heat dissipation structure includes a heat dissipation component 3, and the heat-conducting layer 312 of the first heat-conducting component 31 in the heat dissipation component 3 is in contact with the heating element, the heat from the heating element can be conducted to the body 1 of the heat dissipation structure, and then the body 1 dissipates the heat into the air. The receiving groove 110 of the body 1 has a coating layer 2, which includes a molten state and a solidified state. When the coating layer 2 is heated, a solid-liquid phase change occurs, and it changes from a solidified state to a molten state. As a result, the heat dissipation component 3 fits more closely to the receiving groove 110, the thermal resistance is lower, and the heat conduction efficiency is improved. In addition, the heat dissipation structure adopts an assembled structure, which avoids the structural dimensional instability caused by high-temperature welding and simplifies the processing and manufacturing.
[0032] In one embodiment, the heat dissipation component 3 further includes a second heat-conducting component 32, which is located between the coating layer 2 and the first heat-conducting component 31.
[0033] Specifically, in one embodiment, the second heat-conducting component 32 includes a heat pipe 321 and a connecting plate 322. The connecting plate 322 is connected to the coating layer 2, and the heat pipe 321 is limited and fixed by the connecting plate 322.
[0034] In this embodiment, the connecting plate 322 has an accommodating space, within which the heat pipe 321 is placed, providing support and fixation to prevent it from shifting. The heat pipe 321 is a heat transfer element that fully utilizes the principles of heat conduction and the rapid heat transfer properties of phase change media. It rapidly transfers heat from the heating object to the outside of the heat source, exceeding the thermal conductivity of any known metal. In the embodiments disclosed in this disclosure, the heat pipe 321 is specifically a copper pipe. During heat conduction, the temperature of the heating element is first conducted through the thermally conductive layer 312 to the thermally conductive part 311, then from the thermally conductive part 311 to the first thermally conductive component 31, and then from the first thermally conductive component 31 to the heat pipe 321. The heat pipe 321 rapidly diffuses the heat, finally transferring it to the body 1 through the coating layer 2. Ultimately, the body 1 dissipates the heat into the air, achieving heat exchange with the air.
[0035] In one embodiment, the second heat-conducting component 32 further includes a sealing layer disposed between the connecting plate 322 and the coating layer 2.
[0036] In this embodiment, the sealing layer is specifically a high-temperature resistant adhesive. Common materials for the adhesive include, but are not limited to, acrylic, hot melt adhesive, or rubber. By setting a sealing layer between the connecting plate 322 and the coating layer 2, leakage of the molten coating layer 2 is prevented after the coating layer 2 undergoes a solid-liquid phase change from a solidified state to a molten state when heated.
[0037] Reference Figure 3 As shown, in one possible embodiment, the first heat-conducting component 31 includes a heat-conducting plate 310, a heat-conducting part 311 disposed on the heat-conducting plate 310, and the heat-conducting plate 310 is fixedly connected to the body 1.
[0038] In this embodiment, the heat-conducting plate 310 is fixed to the body 1 by a plurality of fasteners. The fasteners may be, but are not limited to, screws or spring screws, as long as they can fix the heat-conducting plate 310 to the body 1.
[0039] In one embodiment, the heat-conducting part 311 is a metal block.
[0040] In this embodiment, the heat-conducting part 311 is preferably a copper block. Copper blocks, as heat-conducting parts 311, have good thermal conductivity, high heat exchange efficiency, and are easy to process and form.
[0041] Reference Figure 4As shown, in one embodiment, the body 1 includes a first surface 11 and a second surface 12 opposite to each other, a receiving groove 110 is located on the first surface 11, and the second surface 12 has a fin structure 121.
[0042] In this embodiment, since the fin structure 121 has a large heat dissipation area, it dissipates heat quickly and in large quantities. By setting the fin structure 121 on the second surface 12 of the body 1, the heat conduction efficiency can be further improved and the heat dissipation performance of the heat dissipation structure can be enhanced.
[0043] In one embodiment, the heat dissipation structure further includes a connecting component 4, which includes two connectors disposed on the first surface 11 and arranged opposite to each other.
[0044] Specifically, in one embodiment, the connector and the body 1 satisfy the perpendicular condition.
[0045] In this embodiment, the connector facilitates the placement of the heat dissipation structure within the application scenario. It is understood that the connector can also be placed at any location on the main body 1, as long as it meets the requirements for connecting the main body of the device in the application scenario.
[0046] This disclosure also provides an electronic device (not shown in the figure), including a main body, a heating element disposed on the main body, and a heat dissipation structure as described in any of the above embodiments, wherein a heat-conducting layer 312 is in contact with the heating element.
[0047] In this embodiment, the temperature of the heating element is first conducted through the heat-conducting layer 312 to the heat-conducting part 311, then from the heat-conducting part 311 to the first heat-conducting component 31, and finally from the first heat-conducting component 31 to the body 1 through the coating layer 2. The body 1 then dissipates the heat into the air, achieving heat exchange with the air. Since the electronic device includes a heat dissipation structure, which includes a heat dissipation component 3, the heat-conducting layer 312 of the first heat-conducting component 31 is in contact with the heating element, enabling the heat from the heating element to be conducted to the body 1 of the heat dissipation structure, and then dissipated into the air by the body 1. The receiving groove 110 of the body 1 contains a coating layer 2, which includes a molten state and a solidified state. When the coating layer 2 is heated, a solid-liquid phase change occurs, transforming it from a solidified state to a molten state. This allows the heat dissipation component 3 to fit more closely with the receiving groove 110, resulting in lower thermal resistance and improved heat conduction efficiency, thereby enhancing the performance of the electronic device and extending its service life. In addition, the heat dissipation structure adopts an assembled structure, which avoids the structural dimensional instability caused by high-temperature welding and simplifies processing and manufacturing.
[0048] In the description of this disclosure, it should be understood that the orientation or positional relationship indicated by directional terms is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this disclosure and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this disclosure; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.
[0049] For ease of description, spatial relative terms such as "above," "over," "on the upper surface of," and "above" are used herein to describe the spatial positional relationship between one or more components or features shown in the figures and other components or features. It should be understood that spatial relative terms include not only the orientation of the component as depicted in the figures but also different orientations during use or operation. For example, if the components in the figures are inverted as a whole, "above" or "above other components or features" will include cases where the component is "below" or "under" other components or features. Thus, the exemplary term "above" can include both "above" and "below." Furthermore, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this document intends to include all such cases.
[0050] It should be noted that the terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the exemplary implementations according to this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, parts, components, and / or combinations thereof.
[0051] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in sequences other than those illustrated or described herein.
[0052] This disclosure has been described through the above embodiments; however, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit this disclosure to the described embodiments. Furthermore, those skilled in the art will understand that this disclosure is not limited to the above embodiments, and many more variations and modifications can be made based on the teachings of this disclosure, all of which fall within the scope of protection claimed by this disclosure. The scope of protection of this disclosure is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation structure, characterized in that: include: A main body (1), wherein a receiving groove (110) is provided on the main body (1), and a coating layer (2) is provided in the receiving groove (110); as well as A heat dissipation component (3) is disposed in the accommodating groove (110), comprising a first heat-conducting component (31), a heat-conducting portion (311) being provided on the first heat-conducting component (31), a heat-conducting layer (312) being provided on the surface of the heat-conducting portion (311), and the heat-conducting layer (312) being in contact with the heating element; Wherein, the coating layer (2) includes two states: a molten state and a solidified state.
2. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation component (3) further comprises a second heat-conducting component (32), wherein the second heat-conducting component (32) is located between the coating layer (2) and the first heat-conducting component (31).
3. The heat dissipation structure according to claim 2, characterized in that: The second heat-conducting component (32) comprises a heat pipe (321) and a connecting plate (322); the connecting plate (322) is connected to the coating layer (2); and the heat pipe (321) is fixed in position by the connecting plate (322).
4. The heat dissipation structure according to claim 3, characterized in that: The second heat-conducting component (32) further comprises a sealing layer, wherein the sealing layer is arranged between the connecting plate (322) and the coating layer (2).
5. The heat dissipation structure according to claim 1, characterized in that: The first heat-conducting component (31) comprises a heat-conducting plate (310), the heat-conducting portion (311) is arranged on the heat-conducting plate (310), and the heat-conducting plate (310) is fixedly connected to the body (1).
6. The heat dissipation structure according to claim 5, characterized in that: The heat conducting part (311) is a metal block.
7. The heat dissipation structure according to claim 1, characterized in that: The body (1) comprises a first surface (11) and a second surface (12) which are opposite to each other, the receiving groove (110) is located on the first surface (11), and the second surface (12) has a fin structure (121).
8. The heat dissipation structure according to claim 7, characterized in that: It also comprises a connecting component (4), wherein the connecting component (4) comprises two connecting members, wherein the two connecting members are arranged on the first surface (11) and are arranged opposite to each other.
9. The heat dissipation structure according to claim 8, characterized in that: The connecting piece and the main body (1) meet the vertical condition.
10. An electronic device, comprising a main body, wherein the main body is provided with a heating element, characterized in that: A heat dissipation structure as described in any one of claims 1 to 9 is also provided, and the heat-conducting layer (312) is in contact with and connected to the heating element.