Heat dissipation shell of voltage-stabilized power supply
By using a thermal conduction plate in a voltage-controlled power supply to absorb and conduct heat to the heat dissipation chamber, and combining the refrigeration plate and the fan group to alternate between hot and cold, the problem of poor heat dissipation effect in the existing technology is solved, and more effective heat dissipation and stability are achieved .
Patent Information
- Application Number
- CN202420762101.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-12
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-04-12
AI Technical Summary
The heat dissipation effect of existing voltage-regulating power supplies during operation is not ideal, and the heat dissipation fan or heat dissipation plate cannot effectively release heat, resulting in the problem of low local temperature or insufficient heat dissipation.
A heat dissipation shell of a voltage-stable power supply is designed, using a thermal conduction plate to absorb heat and conduct it to the heat dissipation chamber, combined with the refrigeration plate to dissipate heat alternately, and accelerate the hot and cold cycle through the fan group to increase the support rod and improve stability, avoid the refrigeration plate. Contact with power supply.
It achieves better heat dissipation effect, avoids the problem of low local temperature of the power supply, and improves heat dissipation effect and internal stability.
Smart Images

Figure CN222283784U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of voltage-stabilized power supplies, in particular to a heat dissipation shell of a voltage-stabilized power supply. Background Art
[0002] A stabilized power supply is an electronic device that can provide stable AC or DC power to the load, including two categories: AC stabilized power supply and DC stabilized power supply. A stabilized power supply generates a lot of heat during operation. The existing ones are either cooled by a cooling fan or a heat sink. However, the stabilized power supply will continue to release heat during continuous operation. When the internal heat meets the cold air brought by the heat sink or the cooling fan, the heat release is not enough to achieve the ideal effect. Therefore, it is necessary to improve the existing device to meet actual needs. Utility Model Content
[0003] 1. Technical issues to be resolved
[0004] In view of the deficiencies in the prior art, the utility model provides a heat dissipation housing for a voltage-stabilized power supply, which has the advantages of first absorbing the heat generated by the power supply through a heat conduction plate, then conducting it to the inside of a heat dissipation bin, and finally alternating between hot and cold heat inside the heat dissipation bin through a refrigeration plate, thereby achieving a good overall heat dissipation effect and avoiding the problem of excessively low local temperature of the power supply caused by contact between the refrigeration plate and the power supply. At the same time, the fan group blows the inside of the heat dissipation bin to accelerate the hot and cold cycle, thereby solving the above-mentioned technical problems.
[0005] (II) Technical solution
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat dissipation shell of a voltage-stabilized power supply, comprising a shell, a power supply is fixedly installed inside the shell, and a controller is embedded in the front, a fan group is fixedly installed on the back of the shell, a heat conduction plate is fixedly installed on the side of the power supply, and a first support rod is fixedly installed on the side away from the heat conduction plate, a heat dissipation bin is opened on the outside of the first support rod, a second support rod is fixedly installed inside the heat dissipation bin, and a refrigeration plate is fixedly installed inside.
[0007] Preferably, a plurality of sets of heat conducting plates are fixedly mounted on the side of the power supply.
[0008] Through the above technical solution, the heat generated by the power supply is first absorbed by the heat conducting plate, and then transferred to the inside of the heat dissipation chamber through the heat conducting plate, thereby absorbing the heat of the power supply.
[0009] Preferably, a plurality of groups of first support rods are fixedly installed on a side of the power source away from the heat conducting plate, and a plurality of groups of second support rods are fixedly installed inside the heat dissipation bin.
[0010] Through the above technical solution, the outer shell of multiple sets of first support rods and second support rods are raised together with the bottom of the power supply to achieve better heat dissipation effect. At the same time, multiple sets of first support rods and second support rods support the power supply and the heat dissipation compartment to increase internal stability.
[0011] Preferably, a group of refrigeration plates are fixedly installed inside the heat dissipation bin.
[0012] Through the above technical solution, when the heat generated by the power supply is absorbed by the heat conducting plate and transferred to the inside of the heat dissipation bin, the inside of the heat dissipation bin is cooled by the cooling plate, thereby achieving a thorough heat dissipation effect, and the power supply and the cooling plate are isolated by the heat dissipation bin and the first support rod, thereby avoiding the problem of excessively low local temperature of the power supply caused by the contact between the cooling plate and the power supply.
[0013] Preferably, the fan assembly includes a plurality of mounting plates fixedly mounted on the back side of the housing, fans are mounted on sides of the mounting plates, and filter covers are mounted on outer peripheral surfaces of the fans.
[0014] Through the above technical solution, the fan is started to blow the inside of the heat dissipation bin, thereby promoting the circulation between the heat and cold air inside the heat dissipation bin and achieving a better heat dissipation effect.
[0015] Compared with the prior art, the utility model provides a heat dissipation housing for a voltage-stabilized power supply, which has the following beneficial effects:
[0016] 1. The utility model firstly absorbs the heat generated by the power supply through the heat conduction plate, and then transfers it to the inside of the heat dissipation bin through the heat conduction plate, thereby absorbing the heat of the power supply, and pads the outer shell of the power supply and the bottom of the power supply through multiple groups of first support rods and second support rods to achieve better heat dissipation effect. At the same time, multiple groups of first support rods and second support rods support the power supply and the heat dissipation bin, thereby increasing the internal stability. When the heat generated by the power supply is absorbed by the heat conduction plate and transferred to the inside of the heat dissipation bin, the inside of the heat dissipation bin is cooled by the cooling plate, thereby achieving the effect of thorough heat dissipation, and the power supply and the cooling plate are isolated by the heat dissipation bin and the first support rod, thereby avoiding the problem of excessively low local temperature of the power supply caused by contact between the cooling plate and the power supply.
[0017] 2. The utility model starts the fan to blow the inside of the heat dissipation bin, thereby promoting the circulation between the heat and cold air inside the heat dissipation bin and achieving a better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the heat dissipation shell of the utility model;
[0019] Figure 2 This is an isometric side view schematic diagram of the heat dissipation housing of the utility model structure;
[0020] Figure 3 This is a schematic diagram of the internal structure of the heat dissipation shell of the utility model;
[0021] Figure 4 This is a schematic diagram of a partial disassembly of the heat dissipation shell of the utility model structure.
[0022] Among them: 1. Shell; 2. Power supply; 3. Controller; 4. Fan assembly; 41. Mounting plate; 42. Fan; 43. Filter cover; 5. Heat conduction plate; 6. First support rod; 7. Heat dissipation compartment; 8. Second support rod; 9. Refrigeration plate. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] See also Figure 1-4 A heat dissipation shell of a voltage-stabilized power supply comprises a shell 1, a power supply 2 is fixedly installed inside the shell 1, and a controller 3 is embeddedly installed on the front, a fan 42 group 4 is fixedly installed on the back of the shell 1, a heat conduction plate 5 is fixedly installed on the side of the power supply 2, and a first fixed support rod 6 is installed on the side away from the heat conduction plate 5, a heat dissipation bin 7 is opened on the outside of the first support rod 6, a second support rod 8 is fixedly installed inside the heat dissipation bin 7, and a refrigeration plate 9 is fixedly installed inside.
[0025] Specifically, multiple sets of heat conducting plates 5 are fixedly installed on the side of the power supply 2. The advantage is that the heat generated by the power supply 2 is first absorbed by the heat conducting plates 5, and then transferred to the inside of the heat dissipation chamber 7 through the heat conducting plates 5, thereby absorbing the heat of the power supply 2.
[0026] Specifically, a plurality of first support rods 6 are fixedly installed on the side of the power supply 2 away from the heat conducting plate 5, and a plurality of second support rods 8 are fixedly installed inside the heat dissipation chamber 7. The advantage is that the shell of the plurality of first support rods 6 and the second support rods 8 are raised with the bottom of the power supply 2, so that the heat dissipation effect is better, and at the same time, the plurality of first support rods 6 and the second support rods 8 support the power supply 2 and the heat dissipation chamber 7, thereby increasing the internal stability.
[0027] Specifically, a group of cooling plates 9 are fixedly installed inside the heat dissipation chamber 7. The advantage is that when the heat generated by the power source 2 is absorbed by the heat conducting plate 5 and transferred to the inside of the heat dissipation chamber 7, the inside of the heat dissipation chamber 7 is cooled by the cooling plates 9, thereby achieving a thorough heat dissipation effect, and the power source 2 and the cooling plates 9 are isolated by the heat dissipation chamber 7 and the first support rod 6, thereby avoiding the problem of excessively low local temperature of the power source 2 caused by the contact between the cooling plates 9 and the power source 2.
[0028] Specifically, the fan 42 group 4 includes a plurality of mounting plates 41 fixedly mounted on the back of the housing 1, the fans 42 are mounted on the side of the mounting plates 41, and the filter cover 43 is mounted on the outer peripheral surface of the fans 42. The advantage is that when the fans 42 are started, the fans 42 blow the inside of the heat dissipation chamber 7, thereby promoting the circulation between the heat and cold air inside the heat dissipation chamber 7, and achieving a better heat dissipation effect.
[0029] When in use, the heat generated by the power supply 2 is first absorbed by the heat conducting plate 5, and then transferred to the inside of the heat dissipation bin 7 through the heat conducting plate 5, thereby absorbing the heat of the power supply 2, and the outer shell and the bottom of the power supply 2 are padded by multiple groups of first support rods 6 and second support rods 8 to achieve better heat dissipation effect. At the same time, multiple groups of first support rods 6 and second support rods 8 support the power supply 2 and the heat dissipation bin 7, thereby increasing the internal stability. When the heat generated by the power supply 2 is absorbed by the heat conducting plate 5 and transferred to the inside of the heat dissipation bin 7, the inside of the heat dissipation bin 7 is cooled by the refrigeration plate 9, thereby achieving the effect of thorough heat dissipation, and the power supply 2 and the refrigeration plate 9 are isolated by the heat dissipation bin 7 and the first support rod 6 to avoid the problem of excessively low local temperature of the power supply 2 caused by contact between the refrigeration plate 9 and the power supply 2, and the fan 42 is started to blow the inside of the heat dissipation bin 7, thereby promoting the circulation between the heat and cold air in the heat dissipation bin 7, thereby achieving better heat dissipation effect.
[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation housing for a voltage-stabilized power supply, comprising a housing (1), characterized in that: A power supply (2) is fixedly installed inside the shell (1), and a controller (3) is embedded in the front, a fan group (4) is fixedly installed on the back of the shell (1), a heat conduction plate (5) is fixedly installed on the side of the power supply (2), and a first support rod (6) is fixedly installed on the side away from the heat conduction plate (5), a heat dissipation bin (7) is provided on the outside of the first support rod (6), a second support rod (8) is fixedly installed inside the heat dissipation bin (7), and a refrigeration plate (9) is fixedly installed inside.
2. The heat dissipation housing of a voltage-stabilized power supply according to claim 1, characterized in that: A plurality of groups of heat conducting plates (5) are fixedly mounted on the side of the power source (2).
3. The heat dissipation housing of a voltage-stabilized power supply according to claim 1, characterized in that: A plurality of first support rods (6) are fixedly mounted on a side of the power source (2) away from the heat conducting plate (5), and a plurality of second support rods (8) are fixedly mounted inside the heat dissipation bin (7).
4. The heat dissipation housing of a voltage-stabilized power supply according to claim 1, characterized in that: A group of refrigeration plates (9) are fixedly installed inside the heat dissipation bin (7).
5. The heat dissipation housing of a voltage-stabilized power supply according to claim 1, characterized in that: The fan group (4) comprises a plurality of mounting plates (41) fixedly mounted on the back of the housing (1), a fan (42) being mounted on the side of the mounting plate (41), and a filter cover (43) being mounted on the outer peripheral surface of the fan (42).
