Silicon wafer production line

Abstract

The utility model discloses a silicon wafer production line, which is characterized in that on a cutting station, cut silicon wafers and crystal supports are put into a material frame together, and the material frame is transferred to a degumming station by a transfer trolley; separating the crystal support from the silicon wafer on the degumming station; a material frame conveying module is arranged on the material frame horizontal conveying station and used for horizontally conveying material frames to the fragmentation overturning station; a wafer separation module and a turnover conveying module are arranged on the wafer separation turnover station, the wafer separation module is used for separating the silicon wafers in the material frame and conveying the silicon wafers subjected to wafer separation upwards one by one in a vertical posture, and the turnover conveying module is used for turning the silicon wafers into a horizontal posture from the vertical posture; a horizontal conveying module is arranged on the silicon wafer horizontal conveying station and is used for conveying silicon wafers to the wafer inserting station in a horizontal posture; the wafer inserting station is used for inserting the silicon wafers; and the cleaning and drying station is used for cleaning and drying the inserted silicon wafers. The production line realizes automation of the whole silicon wafer transfer process, and improves the silicon wafer transfer reliability and efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, in particular to a silicon wafer production line. Background Art

[0002] In the production process of silicon wafers, the silicon rod is first cut into silicon wafers by a wire cutting machine. At this time, the silicon wafers are glued to the crystal tray with a resin plate, and then the crystal tray and the cut silicon wafers are put into the material frame together. The material frame transports the crystal tray and the silicon wafers to the degumming station together, and uses a degumming machine to degummed and separate the crystal tray and the silicon wafers. Then the silicon wafers are transported to the subsequent insertion, cleaning, drying and other stations in sequence.

[0003] In the prior art, the material frame clamps and limits the silicon wafers as a whole. When the silicon wafers in the material frame are loaded in slices before inserting, the material frame releases the clamping of all silicon wafers, and then the silicon wafers placed vertically in the material frame are manually taken out, and then the silicon wafers are manually turned 90° and placed horizontally in the small material tray before the subsequent loading operation. Since all silicon wafers are released from the limit during loading, the silicon wafers that have not been loaded are prone to tilting and squeezing in the material frame, causing the silicon wafers to break or crack, seriously damaging the quality of the silicon wafers. In addition, during the entire silicon wafer circulation process, it is necessary to manually perform operations such as slicing the silicon wafers and transporting the silicon wafers between different workstations, which has low reliability and low efficiency.

[0004] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] In view of the problems pointed out in the background technology, the utility model provides a silicon wafer production line to realize the automation of the whole process of silicon wafer transportation and improve the reliability and efficiency of silicon wafer transportation.

[0006] In order to achieve the above-mentioned utility model purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a silicon wafer production line, comprising:

[0008] A material frame, which is used to hold the cut silicon wafers;

[0009] A cutting station is provided with a slicing device for cutting silicon rods into silicon wafers. The cut silicon wafers are placed together with the wafer holder in a material frame, and the material frame is transported to the degumming station by a transport trolley;

[0010] A degumming station, on which a degumming device is provided for separating the wafer tray from the silicon wafer;

[0011] A material frame horizontal conveying station, on which a material frame conveying module is provided, for conveying the material frame horizontally to the slice flipping station;

[0012] A slicing and flipping station is provided with a slicing module and a flipping and conveying module. The slicing module is used to slice the silicon wafers in the material frame and to convey the sliced ​​silicon wafers one by one upward in a vertical posture. The flipping and conveying module is used to receive the vertical silicon wafers conveyed by the slicing module and flip the silicon wafers from the vertical posture to the horizontal posture.

[0013] A silicon wafer horizontal conveying station is provided with a horizontal conveying module for receiving the horizontal silicon wafer conveyed by the flip conveying module and conveying the silicon wafer in a horizontal posture to the wafer insertion station;

[0014] The wafer inserting station is provided with a flower basket for inserting the silicon wafers transported by the horizontal transport module.

[0015] In some embodiments, the transfer cart automatically runs between the cutting station and the degumming station according to a set route.

[0016] In some embodiments, a containing space for containing silicon wafers is formed in the material frame, and the multiple silicon wafers in the material frame are divided into multiple silicon wafer groups;

[0017] The material frame is provided with a clamping assembly and an unlocking trigger part;

[0018] The clamping assembly comprises a movable plate, the movable plate extends along the length direction of the containing space, the movable plate is provided with a plurality of clamping parts arranged in sequence along the length direction thereof, the plurality of clamping parts correspond to the plurality of silicon wafer groups one by one to clamp the corresponding silicon wafer groups, each of the clamping parts moves in a direction away from the silicon wafer to release the clamping of the corresponding silicon wafer group, and the unlocking trigger part is connected to the movable plate;

[0019] The transfer trolley is provided with an unlocking part. After the material frame is placed on the transfer trolley, the unlocking part triggers the unlocking trigger part to move. Under the action of the unlocking trigger part, the movable plate moves in a direction away from the containing space, and the movable plate drives the multiple clamping parts provided thereon to move synchronously in a direction away from the containing space.

[0020] The material frame is removed from the transfer trolley, the unlocking portion is disengaged from the unlocking trigger portion, and the clamping portion moves toward the direction approaching the silicon wafer under the action of the reset member to clamp the silicon wafer.

[0021] In some embodiments, an unlocking device is provided on the horizontal conveying station of the material frame. When the material frame conveying module drives the material frame to move in the horizontal direction, a relative movement is generated between the material frame and the unlocking device. The plurality of clamping parts contact the unlocking device in sequence with the relative movement between the material frame and the unlocking device. The unlocking device applies an external force to the clamping part to move the clamping part away from the corresponding silicon wafer group.

[0022] In some embodiments, the clamping portion includes a second pin shaft, the second pin shaft passes through the material frame and the movable plate, an unlocking block is provided on the first end of the second pin shaft, a clamping block is provided on the second end of the second pin shaft, a spring is sleeved on the second pin shaft, and the spring is located between the clamping block and the material frame;

[0023] When the movable plate moves in a direction away from the containing space, the movable plate pushes all the unlocking blocks to move synchronously in a direction away from the containing space, so that all the clamping blocks are away from the containing space;

[0024] The clamping block moves toward the direction approaching the silicon wafer under the action of the restoring force of the spring to clamp the corresponding silicon wafer group;

[0025] The unlocking device applies external force to the unlocking block to make the corresponding clamping part move away from the corresponding silicon wafer group.

[0026] In some embodiments, the unlocking block includes a transverse portion and a vertical portion, the transverse portion is used to abut against the movable plate, and the vertical portion is used to act with the unlocking device;

[0027] There is a certain distance between the vertical portion and the movable plate, and the vertical portion is provided with an inclined surface on a side facing the movable plate, and along the discharge direction of the silicon wafer, the distance between the inclined surface and the movable plate first decreases and then increases;

[0028] The unlocking device includes a first roller. When relative movement occurs between the material frame and the unlocking device, the first roller moves to between the inclined surface and the movable plate and contacts the inclined surface. The relative displacement between the first roller and the inclined surface causes the second pin shaft to move in a direction away from the silicon wafer.

[0029] In some embodiments, the material frame includes an upper frame and a lower frame, the upper frame is detachably arranged above the lower frame, a limiting structure for limiting the crystal holder is arranged on the upper frame, and the clamping assembly is arranged on the lower frame;

[0030] The material frame is placed on the debonding station, the lower frame is lifted away from the upper frame to separate the crystal support from the silicon wafer, and the material frame conveying module conveys the lower frame in a horizontal direction.

[0031] In some embodiments, the slicing module includes a water spraying part and a vertical conveying part. The water spraying part is used to spray water on the unlocked silicon wafer group in the material frame to slice the multiple silicon wafers in the silicon wafer group. The vertical conveying part is used to convey the sliced ​​silicon wafers one by one in a vertical posture upward to the flip conveying module.

[0032] In some embodiments, the vertical conveying part includes a first mounting frame, on which is provided an adsorption part and a vertical conveyor belt, the adsorption part is used to adsorb the silicon wafers after slicing onto the vertical conveyor belt, and the vertical conveyor belt drives the silicon wafers to move upward in a vertical posture.

[0033] In some embodiments, the flipping and conveying module includes a flipping auxiliary part and a glue coating rolling wheel. The flipping auxiliary part includes a second mounting frame. The second mounting frame is provided with a blowing part. The blowing part is located above the vertical conveying part. The blowing part is used to blow air to the vertical silicon wafer conveyed upward by the vertical conveying part so that the silicon wafer is dumped onto the glue coating rolling wheel. The glue coating rolling wheel drives the silicon wafer to move to a horizontal posture.

[0034] Compared with the prior art, the advantages and positive effects of the utility model are:

[0035] In the silicon wafer production line disclosed in the present application, the cutting station completes the silicon rod cutting, the degumming station completes the degumming and separation of the crystal tray and the silicon wafer, the material frame horizontal conveying station realizes the horizontal conveying of the material frame, the slicing flipping station completes the slicing and vertical loading and conveying, the silicon wafer horizontal conveying station completes the horizontal conveying of the silicon wafer, the inserting station completes the inserting of the silicon wafer, and the cleaning and drying station completes the cleaning and drying of the silicon wafer. The silicon wafer production line realizes the full process flow automation of the silicon wafer, and improves the reliability and efficiency of the operations such as silicon wafer transmission, slicing, loading, and inserting.

[0036] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0038] Figure 1 A schematic diagram of the structure layout of a silicon wafer production line according to an embodiment;

[0039] Figure 2 is a schematic structural diagram of a rack and a material frame conveying module according to an embodiment;

[0040] Figure 3 is a structural schematic diagram of a material frame conveying module according to an embodiment;

[0041] Figure 4 is a structural schematic diagram of a slicing module according to an embodiment;

[0042] Figure 5 is a schematic structural diagram of a flip auxiliary part according to an embodiment;

[0043] Figure 6 It is a structural schematic diagram of a slicing module and a flip auxiliary part according to an embodiment;

[0044] Figure 7 It is a structural schematic diagram of a slicing module, a flipping conveying module, and a horizontal conveying module according to an embodiment;

[0045] Figure 8 is a schematic structural diagram of a cleaning unit according to an embodiment;

[0046] Fig. 9 is a schematic diagram of the relative positions of the cleaning portion and the rubber-coated rolling wheel according to an embodiment;

[0047] Fig.10 is a structural schematic diagram of a silicon wafer detection module according to an embodiment;

[0048] Fig.11 This is one of the structural schematic diagrams of the material frame and the transfer trolley according to the embodiment;

[0049] Fig.12 This is a second structural schematic diagram of a material frame and a transfer trolley according to an embodiment;

[0050] Fig.13 for Fig.12 Enlarged view of part A in the middle;

[0051] Fig.14 is a schematic structural diagram of a material frame and a silicon wafer unit according to an embodiment;

[0052] Fig.15 is a schematic structural diagram of an upper frame according to an embodiment;

[0053] Fig.16 is a schematic structural diagram of a lower frame according to an embodiment;

[0054] Fig.17 is a schematic structural diagram of a clamping assembly and a lower frame according to an embodiment;

[0055] Fig.18 is a schematic structural diagram of a clamping assembly according to an embodiment;

[0056] Fig.19 for Fig.18 Middle AA section view;

[0057] Fig. 20 for Fig.18 Middle BB section view;

[0058] Fig.21 is a schematic structural diagram of a clamping portion according to an embodiment;

[0059] Fig. 22 for Fig.14 Enlarged view of middle part B;

[0060] Fig.23 is a schematic structural diagram of an unlocking device according to an embodiment;

[0061] Fig.24 is a schematic structural diagram of an anti-dumping assembly according to an embodiment;

[0062] Fig.25 is a schematic structural diagram of a transfer vehicle according to an embodiment;

[0063] Fig.26 is a cross-sectional view of a transfer vehicle according to an embodiment;

[0064] Fig. 27 Schematic diagram of the structure of a silicon wafer unit according to an embodiment. DETAILED DESCRIPTION

[0065] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0066] This embodiment discloses a silicon wafer production line. Figure 1 , including silicon wafer cutting, degumming, slicing, loading, cleaning, drying and other operations.

[0067] The silicon wafer production line includes a cutting station 11, a debonding station 17, a material frame horizontal conveying station 12, a wafer splitting and flipping station 13, a silicon wafer horizontal conveying station 14, a wafer inserting station 15, and a cleaning and drying station 16.

[0068] The cutting station 11 completes the cutting of silicon rods, the degumming station 17 completes the degumming and separation of the crystal tray and the silicon wafer, the material frame horizontal conveying station 12 realizes the horizontal conveying of the material frame, the slicing and flipping station 13 completes the slicing and vertical loading and conveying, the silicon wafer horizontal conveying station 14 completes the horizontal conveying of silicon wafers, the inserting station 16 completes the silicon wafer inserting, and the cleaning and drying station 16 completes the cleaning and drying of the silicon wafers.

[0069] Among them, the material frame horizontal conveying station 12, the slice flipping station 13, the silicon wafer horizontal conveying station 14, and the wafer inserting station 15 are arranged in sequence along the same straight line and integrated into an all-in-one structure to realize the automatic conveyance of silicon wafers.

[0070] The cutting station 11 is provided with a slicing device, such as a wire cutting machine, which is used to cut the silicon rod into silicon wafers. After the silicon rod is cut, the silicon wafer 120 is pasted on the wafer support 110 through a resin plate, which is called a silicon wafer unit 100. Fig. 27 As shown, the plurality of silicon wafers 120 are divided into a plurality of silicon wafer groups 121 . Fig. 27 The dotted line in the figure separates two adjacent silicon wafer groups 121. The wafer tray 110 and the silicon wafers 120 are loaded into a material frame, and the material frame is transported to the debonding station 17 by a transport vehicle.

[0071] The degumming station 17 is provided with a degumming device, which is used to degumming and separate the crystal tray and the silicon wafer. The silicon wafer continues to stay in the material frame, and the material frame transfers the silicon wafer to the next process.

[0072] The material frame horizontal conveying station 12 is provided with a material frame conveying module 20 for conveying the material frame horizontally to the slice flipping station 13, that is, conveying the debonded silicon wafer to the next station.

[0073] The slicing and flipping station 13 is provided with a slicing module 30 and a flipping and conveying module 40. The slicing module 30 is used to slice the silicon wafers in the material frame and to convey the sliced ​​silicon wafers one by one in a vertical posture upward. The flipping and conveying module 40 is used to receive the vertical posture silicon wafers conveyed by the slicing module 30 and flip the silicon wafers from the vertical posture to the horizontal posture.

[0074] The silicon wafer horizontal conveying station 14 is provided with a horizontal conveying module 50 for receiving the horizontal silicon wafer conveyed by the flip conveying module 40 and conveying the silicon wafer to the wafer inserting station 15 in a horizontal posture.

[0075] A flower basket is provided on the wafer inserting station 15 for inserting the silicon wafers conveyed by the horizontal conveying module 50 .

[0076] The cleaning and drying station 16 is provided with cleaning and drying equipment for cleaning and drying the silicon wafers after insertion.

[0077] The silicon wafer production line realizes the full process automation of silicon wafers, improving the reliability and efficiency of operations such as silicon wafer transmission, slicing, loading, and insertion.

[0078] Reference Figures 1 to 7 The material frame horizontal conveying station 12, the slice flipping station 13, the silicon wafer horizontal conveying station 14, and the wafer insertion station 15 are arranged in sequence along the same straight line and integrated into an all-in-one structure, which is called a silicon wafer loading and conveying device 1, including a frame 10, a material frame conveying module 20, a slicer module 30, a flipping conveying module 40, a horizontal conveying module 50, an insertion module 60 and the like.

[0079] The rack 10 constitutes the framework of the entire loading and conveying device and serves as a mounting carrier for other functional modules. The material frame conveying module 20, the slicer module 30, the flip conveying module 40, the horizontal conveying module 50, and the inserting module 60 are arranged in sequence along the length direction of the rack 10. The straight-line arrangement of the functional modules facilitates the transfer of silicon wafers between the modules.

[0080] A water tank with an open top is formed in the rack 10. The rack 10 also serves as a water container. On the one hand, it receives liquid dripping from the silicon wafer, and on the other hand, it provides a water source for functional modules that need water, such as the flipping and conveying module 40.

[0081] The structure of the material frame 200 is as follows: Fig.17 As shown, the multiple silicon wafers in the material frame 200 are divided into a plurality of silicon wafer groups 121 , and one end of the material frame 200 is provided with an outlet 214 for discharging the silicon wafers 120 .

[0082] The structure of the material frame conveying module 20 is as follows Figure 2 and Figure 3 As shown, the material frame conveying module 20 is used to convey the material frame 200 to the slicing module 30. After the silicon rod is cut on the slicing device, as shown in FIG. Fig. 27 The silicon wafer 120 and the crystal tray 110 shown are placed together in the material frame 200, and the material frame 200 is transferred from the cutting station 11 to the degumming station 17 by a transfer device (such as a transfer cart), and the crystal tray is separated from the silicon wafer at the degumming station 17, and the silicon wafer remains in the material frame. The material frame 200 is then transported to the material frame conveying module 20 by auxiliary equipment such as a robot, and the material frame conveying module 20 automatically conveys the material frame 200 to the downstream slicing module 30 to slice the silicon wafers in the material frame 200, so as to facilitate the subsequent silicon wafer loading operation.

[0083] The structure of the slicing module 30 is as follows Figure 4 As shown, the slicing module 30 includes a water spraying portion 31 and a vertical conveying portion 32. The water spraying portion 31 is used to spray water on the silicon wafers 120 in the material frame 200 in units of silicon wafer groups 121 to slice the multiple silicon wafers in the silicon wafer group 121. The vertical conveying portion 32 is used to convey the silicon wafers after slicing one by one in a vertical posture upward.

[0084] The structure of the overturning conveying module 40 is as follows: Figures 5 to 7 As shown, the flipping conveying module 40 is used to receive the vertical silicon wafers conveyed by the vertical conveying unit 32, and flip the silicon wafers from the vertical posture to the horizontal posture.

[0085] Reference Figure 7 The horizontal conveying module 50 is used to receive the horizontal silicon wafers conveyed by the flip conveying module 40 and convey the silicon wafers to the inserting module 60 in a horizontal posture.

[0086] The wafer inserting module 60 is used to insert the silicon wafers conveyed by the horizontal conveying module 50 .

[0087] In the silicon wafer loading and conveying device 1 of the present embodiment, the material frame conveying module 20, the slicing module 30, the flipping conveying module 40, the horizontal conveying module 50, and the inserting module 60 are arranged in a straight line, which is convenient for the automatic transmission of silicon wafers between the modules. The loading and conveying device integrates the above functions into an integrated structure, which is novel and compact, realizes automatic slicing, flipping and inserting of silicon wafers, greatly improves work efficiency, and improves the quality reliability of silicon wafers during operation.

[0088] For the specific structure of the material frame conveying module 20, in some embodiments, refer to Figure 2 and Figure 3 The material frame conveying module 20 includes a conveying track 21, a moving frame 22, and a driving mechanism 23. The conveying track 21 is arranged at the bottom of the water tank and extends along the length direction of the water tank. The driving mechanism 23 is used to drive the moving frame 22 to move along the length direction of the water tank. The moving frame 22 is connected to the material frame 200 to drive the material frame 200 to move synchronously.

[0089] The material frame 200 is located on the conveying track 21, and the driving mechanism 23 is started to drive the moving frame 22 to move along the length direction of the water tank, and the moving frame 22 drives the material frame to move synchronously with it.

[0090] Furthermore, there are two conveying tracks 21, which are arranged opposite to each other. The conveying tracks 21 include a transverse bearing portion 2101 and a vertical limiting portion 2102. The material frame 200 is located on the transverse bearing portion 2101. The material frame 200 moves along the transverse bearing portion 2101. The vertical limiting portion 2102 is located on the side of the material frame 200 to limit the material frame 200 and prevent the material frame 200 from falling off the transverse bearing portion 2101.

[0091] Furthermore, a roller 2103 is provided on the transverse bearing portion 2101 , and the roller 2103 is in rolling contact with the bottom of the material frame 200 , thereby reducing the moving friction of the material frame 200 .

[0092] Furthermore, the distance between the two vertical limiting portions 2102 can be adjusted to accommodate material frames 200 of different widths.

[0093] The adjustment structure between the two vertical limiting parts 2102 can be implemented by using common mechanical structures such as a lead screw and a bolt, and this embodiment does not impose any specific limitation.

[0094] Furthermore, the driving mechanism 23 includes a driving motor 2301 , which drives a transmission shaft 2303 to rotate via a first transmission belt 2302 , and the transmission shaft 2303 drives a second transmission belt 2304 to rotate. The second transmission belt 2304 extends along the length direction of the water tank, and the movable frame 22 is connected to the second transmission belt 2304 .

[0095] The driving motor 2301 is started, and the driving motor 2301 drives the first transmission belt 2302 to rotate, the first transmission belt 2302 drives the transmission shaft 2303 to rotate, the transmission shaft 2303 drives the second transmission belt 2304 to rotate, the second transmission belt 2304 drives the mobile frame 22 to move synchronously, and then the mobile frame 22 drives the material frame 200 to move synchronously.

[0096] Further, there are two second transmission belts 2304, each of which is arranged at the top of the corresponding side of the frame 10. The mobile frame 22 is a U-shaped frame structure, including a mobile horizontal portion 2201 and a mobile vertical portion 2202, and the two ends of the mobile horizontal portion 2201 are respectively provided with a mobile vertical portion 2202, and the top of the mobile vertical portion 2202 is fixedly connected to the second transmission belt 2304 on the corresponding side.

[0097] from Figure 2 It can be seen that the drive motor 2301, the first transmission belt 2302, the transmission shaft 2303, and the second transmission belt 2304 are located outside the frame 10, and will not occupy the internal space of the frame 10, and will not occupy the placement space of the material frame 200. The movable frame 22 is located inside the frame 10, which is convenient for connecting with the material frame 200 to drive the material frame to move synchronously.

[0098] Furthermore, a limiting structure for limiting the material frame 200 is provided on the movable transverse portion 2201. The detachable connection between the limiting structure and the material frame 200 facilitates the connection between the material frame 200 and the limiting structure so that the material frame 200 moves synchronously with the moving frame 22, and also facilitates the separation between the material frame 200 and the limiting structure.

[0099] In a specific embodiment, referring to Figure 3 The limiting structure is a raised column 2203 provided on the movable horizontal portion 2201. Fig.14A matching hole is provided on the outer side of one end of the material frame. The material frame is placed into the frame 10 from top to bottom, and the raised column 2203 is inserted into the matching hole 216 to achieve the connection and matching between the material frame 200 and the movable frame 22.

[0100] For the specific structure of the slicing module 30, refer to Figure 4 The vertical conveying part 32 includes a first mounting frame 3201, on which an adsorption part and a vertical conveyor belt 3202 are provided. The adsorption part is used to adsorb the silicon wafers after slicing onto the vertical conveyor belt 3202, and the vertical conveyor belt 3202 drives the silicon wafers to move upward in a vertical posture.

[0101] The silicon wafers 120 after being sliced ​​in the material frame 200 are adsorbed by the adsorption part and placed on the vertical conveyor belt 3202. The vertical conveyor belt 3202 drives the silicon wafers 120 to move upward. The adsorption part cooperates with the vertical conveyor belt 3202 to transport the silicon wafers in the material frame 200 upward one by one.

[0102] Furthermore, the adsorption portion includes an adsorption area 3203 and an auxiliary conveying area 3204. The auxiliary conveying area 3204 is arranged above and below the adsorption area 3203. The adsorption area 3203 is used to provide adsorption force to the silicon wafer so as to adsorb the silicon wafer onto the vertical conveyor belt 3202. The auxiliary conveying area 3204 is in rolling contact with the silicon wafer to assist the silicon wafer to move upward in a vertical posture.

[0103] The adsorption area 3203 is directly opposite to the silicon wafer, so as to smoothly adsorb the silicon wafer in the material frame 200 onto the vertical conveyor belt 3202, and the auxiliary conveying areas 3204 arranged at intervals above and below are in rolling contact with the upper and lower parts of the silicon wafer, which assists the vertical upward movement of the silicon wafer.

[0104] Furthermore, the adsorption area 3203 is a water absorption plate 3205, on which a plurality of spaced-apart water absorption holes 3206 are provided. The water absorption plate 3205 is connected to a water absorption waterway (not shown). Under the suction force of the water absorption waterway, the liquid on the silicon wafer is sucked into the water absorption waterway through the water absorption holes 3206, and the silicon wafer is adsorbed onto the surface of the vertical conveyor belt 3202.

[0105] Furthermore, the vertical conveyor belt 3202 is arranged opposite to the adsorption area 3203 , so that the silicon wafer can be directly adsorbed onto the surface of the vertical conveyor belt 3202 under the action of the adsorption area 3203 .

[0106] Furthermore, the auxiliary conveying area 3204 includes a plurality of follower rollers 3207 , and the follower rollers 3207 are in rolling contact with the silicon wafers.

[0107] Furthermore, the vertical conveyor belt 3202 is driven by a driving mechanism 23, which includes a motor 3208, a synchronous belt 3209, and a rotating shaft 3210. The synchronous belt 3209 is connected between the power output end of the motor 3208 and the rotating shaft 3210. The rotating shaft 3210 is connected to the vertical conveyor belt 3202 to drive the vertical conveyor belt 3202 to rotate.

[0108] The motor 3208 and the synchronous belt 3209 are located beside the adsorption area 3203 and the auxiliary conveying area 3204 and do not interfere with the upward transportation of the silicon wafers.

[0109] Furthermore, there are multiple, for example two, vertical conveyor belts 3202, which are arranged at intervals along the width direction of the adsorption portion, and the multiple vertical conveyor belts 3202 are driven by the same rotating shaft 3210 to ensure the movement consistency of the multiple vertical conveyor belts 3202. The interval arrangement of the multiple vertical conveyor belts 3202 helps to improve the reliability of the upward transportation of the silicon wafers.

[0110] Furthermore, a water spraying part 31 is provided on the first mounting frame 3201. The water spraying part 31 is located on two opposite sides of the vertical conveying part 32, and water is sprayed from both sides of the silicon wafer at the same time, thereby improving the reliability of silicon wafer separation.

[0111] Furthermore, two water spraying parts 31 spaced apart from each other are provided on each side of the vertical conveying part 32 to spray water on both the upper and lower parts of the silicon wafers, thereby further improving the reliability of silicon wafer separation.

[0112] For the specific structure of the flipping conveying module 40, in some embodiments, refer to Figures 5 to 7 The flipping and conveying module 40 includes a flipping auxiliary part 41 and a rubber-coated rolling wheel 42 .

[0113] The flip auxiliary part 41 is as follows Figure 5 As shown, it includes a second mounting frame 4101, on which a blowing portion 4102 is provided, and combined with Figure 6 The blowing part 4102 is located above the vertical conveying part 32. The blowing part 4102 is used to blow air to the vertical silicon wafers conveyed upward by the vertical conveying part 32, so that the silicon wafers are dumped onto the glue-coating rolling wheel 42, and the glue-coating rolling wheel 42 drives the silicon wafers to move to a horizontal posture.

[0114] The cooperation between the blowing part 4102 and the glue-coating rolling wheel 42 allows the silicon wafers to be transported vertically upwards and then horizontally. The setting of the blowing part 4102 allows the silicon wafers to be tilted onto the glue-coating rolling wheel 42, and then the rotation of the glue-coating rolling wheel 42 drives the tilted silicon wafers to a horizontal position.

[0115] The rubber-coated rolling wheel 42 may be a metal wheel encapsulated in rubber, or may be a metal rolling wheel and a non-metal rolling wheel nested in a circular rubber sleeve.

[0116] Furthermore, a sub-frame 4105 is provided on the second mounting frame 4101, and a pressure wheel 4106 is provided on the sub-frame 4105. The pressure wheel 4106 is located in front of the vertical conveying part 32 and is used to press the silicon wafer against the vertical conveying part 32 to prevent the silicon wafer from tipping over in the opposite direction and ensure that the silicon wafer is tipped over reliably onto the glue-coated rolling wheel 42.

[0117] Furthermore, the sub-frame 4105 is rotatably connected to the mounting frame, and the pressure wheel 4106 is in the form of a floating wheel to prevent the pressure wheel 4106 from crushing the silicon wafer.

[0118] Furthermore, there are multiple pressing wheels 4106, which are arranged at intervals in the horizontal direction to apply uniform force to the silicon wafer.

[0119] Furthermore, the blowing part 4102 includes a blowing plate 4103 , on which a plurality of blowing holes 4104 arranged at intervals are provided, and the blowing plate 4103 is connected to a blowing air path (not shown).

[0120] Furthermore, the flipping and conveying module 40 further includes a cleaning unit 43, which is used to regularly clean the rubber-coated rolling wheel 42. Figure 8 and Fig. 9 Along the horizontal conveying direction of the silicon wafer, the cleaning unit 43 is disposed behind the glue coating rolling wheel 42 and below the horizontal conveying module 50 .

[0121] The cleaning unit 43 includes a cylinder 4303, a cleaning frame 4302, and a sponge block 4301. The cleaning frame 4302 is arranged at the power output end of the cylinder 4303, and the sponge block 4301 is arranged on the cleaning frame 4302. When it is necessary to clean the rubber-coated rolling wheel 42, the cylinder 4303 is started to drive the cleaning frame 4302 to move toward the direction close to the rubber-coated rolling wheel 42 until the sponge block 430 contacts the rubber-coated rolling wheel 42. As the rubber-coated rolling wheel 42 rotates, the sponge block 4301 cleans the rubber-coated rolling wheel 42 in all directions. After cleaning, the sponge block 4301 retreats to stay away from the rubber-coated rolling wheel 42.

[0122] For the specific structure of the horizontal conveying module 50, in some embodiments, refer to Figure 7 The horizontal conveying module 50 includes a horizontal conveyor belt group 51. The driving mechanism 23 of the horizontal conveyor belt group 51 is not shown in the figure. The horizontal silicon wafer conveyed by the rubber-coated rolling wheel 42 moves to the horizontal conveyor belt group 51, and the horizontal conveyor belt group 51 continues to transport the silicon wafer in a horizontal posture to the subsequent insertion station.

[0123] An annular groove 4201 is provided on the rubber-coated rolling wheel 42 along its circumference, and the horizontal conveyor belt set 51 partially extends into the groove 4201 to receive the horizontal silicon wafers conveyed by the rubber-coated rolling wheel 42, thereby achieving smooth transmission of the silicon wafers between the rubber-coated rolling wheel 42 and the horizontal conveyor belt set 51.

[0124] Further, continue to refer to Figure 7 The horizontal conveying module 50 also includes two baffles 52 arranged opposite to each other. The baffles 52 extend along the horizontal conveying direction of the silicon wafers. One end of the baffle 52 is located beside the rubber-coated rolling wheel 42, which plays a left and right limiting role in the horizontal conveying of the silicon wafers.

[0125] In some embodiments, the silicon wafer feeding and conveying device 1 further includes a silicon wafer detection module 70, such as Fig.10 As shown, it includes a lifting frame 71, a turning frame 72, and a lifting drive unit 75. The lifting drive unit 75 drives the lifting frame 71 to move up and down. The turning frame 72 is rotatably connected to the lifting frame 71. A rolling wheel 73 is provided at the bottom of the turning frame 72. A sensor 74, such as a photoelectric sensor, is provided on the lifting frame 71.

[0126] The silicon wafer detection module 70 is arranged in front of the slicing module 30, and the material frame conveying module 20 conveys the material frame 200 horizontally toward the slicing module 30 until the silicon wafer in the material frame 200 touches the rolling wheel 73 on the silicon wafer detection module 70. As the material frame 200 continues to move forward, the flip frame 72 flips. At this time, the sensor 74 detects the flipping action of the flip frame 72. The system knows that the silicon wafer is in place, then the lifting drive unit 75 drives the lifting frame 71 to rise, and the lifting frame 71 drives the flip frame 72 and the rolling wheel 73 to rise synchronously to the top of the silicon wafer so as not to affect the subsequent slicing and loading operations of the silicon wafer. The slicing module 30 is started to spray water and vertically convey the silicon wafer.

[0127] For the specific structure of the material frame 200, in some embodiments, refer to Figures 14 to 17 The frame 210 of the material frame 200 includes an upper frame 211 and a lower frame 212 , and the upper frame 211 and the lower frame 212 are detachably connected. Fig.15 Shown is the upper frame 211, Fig.16 Shown is the lower frame 212, Fig.17 The structure shown is that the clamping assembly 220 and the anti-dumping assembly 240 are arranged on the lower frame 212.

[0128] A containing space 213 for containing the silicon wafers 120 is formed in the lower frame 212 . The top of the containing space 213 is open, and a discharge port 214 communicating with the containing space 213 is provided at one end of the lower frame 212 .

[0129] The upper frame 211 is detachably mounted on the top of the lower frame 212. The upper frame 211 is provided with an opening 2113 that is vertically opposite to and communicates with the containing space 213. The silicon wafer unit 100 is loaded into the containing space 213 below through the opening 2113. The upper frame 211 is provided with a limiting structure for limiting the wafer holder 110 to ensure the stability of the silicon wafer unit 100 in the material frame 200. The lower frame 212 is provided with a clamping assembly 220 for limiting the silicon wafer 120.

[0130] The upper frame 211 is moved away from the lower frame 212 to separate the crystal tray 110 from the silicon wafer 120, and the silicon wafer 120 remains in the lower frame 212. The material frame conveying module 20 conveys the lower frame 212 to the slicing module 30. Specifically, after the material frame 200 reaches the debonding station 17, the upper frame 211 is moved away from the lower frame 212 by the debonding device. Since there is a limit connection relationship between the upper frame 211 and the crystal tray 110, and the silicon wafer 120 below is clamped by the clamping assembly 220, when the upper frame 211 is moved away from the lower frame 212, the upper frame 211 and the crystal tray 110 are separated from the silicon wafer 120 together, so that the crystal tray 110 and the silicon wafer 120 are debonded and separated.

[0131] In this embodiment, the material frame 200 has an upper and lower split structure, and the clamping assembly 220 in the lower frame 212 clamps the silicon wafer 120, and the upper frame 211 limits and fixes the crystal tray 110. By separating the upper frame 211 from the lower frame 212, the crystal tray 110 and the silicon wafer 120 can be separated.

[0132] Further, refer to Fig.14 , Fig.15 as well as Fig. 27 The front and rear ends of the crystal tray 110 unit are respectively provided with extension parts 111, and the upper frame 211 is provided with two spaced protrusions 2115 on the corresponding sides. The extension part 111 is clamped between the two protrusions 2115 to achieve the limiting fixation of the crystal tray 110.

[0133] Further, the upper frame 211 includes two upper frame first brackets 2111 and two upper frame second brackets 2112, the upper frame first brackets 2111 extend along the length direction L of the material frame 200, and the upper frame second brackets 2112 extend along the width direction W of the material frame 200. Two spaced support frames 2114 are provided between the two upper frame first brackets 2111, and there is a certain distance between the support frame 2114 and the upper frame second bracket 2112 on the corresponding side. A protrusion 2115 is provided on the support frame 2114.

[0134] Further, the lower frame 212 includes two relatively arranged lower frame first brackets 2121 and two relatively arranged lower frame second brackets 2122, the lower frame second bracket 2122 includes a lower frame transverse frame 2123, and lower frame vertical frames 2124 are respectively provided at opposite ends of the lower frame transverse frame 2123, the lower frame first bracket 2121 extends along the length direction K of the material frame 200, the lower frame transverse frame 2123 extends along the width direction W of the material frame 200, and the lower frame vertical frame 2124 extends along the height direction of the material frame 200.

[0135] The bottom of the upper frame 211 is detachably connected to the top of the lower frame vertical frame 2124 to achieve a detachable connection between the upper frame 211 and the lower frame 212 .

[0136] Further, refer to Figures 14 to 16 The upper frame 211 is provided with an upper limit block 2116 at the bottom, and the lower frame vertical frame 2124 is provided with a lower limit block 2126 at the top. The upper limit block 2116 and the lower limit block 2126 are adapted through a concave-convex structure to achieve the cooperation between the upper frame 211 and the lower frame 212. For example, the upper limit block 2116 is provided with a concave shape, and the lower limit block 2126 is provided with a convex shape, and the concave shape is adapted to the convex shape.

[0137] In some other embodiments, the upper frame 211 and the lower frame 212 may be detachably connected by means of bolts, pins, etc.

[0138] Further, refer to Fig.15 An upper grabbing portion 2117 is provided on the outer side of the upper frame 211 , and the upper grabbing portion 2117 is used for grabbing by external force to separate the upper frame 211 from the lower frame 212 .

[0139] Reference Fig.16 A lower grabbing portion 2127 is provided on the outer side of the lower frame 212 , and the lower grabbing portion 2127 is used for grabbing by external force to transfer the material frame 200 .

[0140] Furthermore, support rollers 215 are provided at the bottom of the lower frame 212 . The support rollers 215 are arranged at intervals along the width direction W of the material frame 200 . The support rollers 215 are in contact with the bottom of the silicon wafer 120 .

[0141] The gap between two adjacent support rollers 215 facilitates water on the silicon wafer 120 to drip downward.

[0142] In some embodiments, reference Fig.14 , Fig.17 and Fig.18 The clamping assembly 220 is used to clamp the silicon wafer unit 100. On the one hand, the clamping assembly 220 can clamp the entire silicon wafer unit 100 at the same time; on the other hand, the clamping assembly 220 can independently unlock each silicon wafer group 121.

[0143] There are two clamping assemblies 220 located at opposite sides of the containing space 213 to clamp opposite sides of the silicon wafer unit 100 .

[0144] The clamping assembly 220 includes a plurality of clamping parts 222 arranged in sequence along the length direction of the containing space 213 (i.e., the length direction L of the material frame 200), and the plurality of clamping parts 222 correspond to the plurality of silicon wafer groups 121 one by one to clamp the corresponding silicon wafer groups 121. Each clamping part 222 moves in a direction away from the silicon wafer 120 to release the clamping of the corresponding silicon wafer group 121.

[0145] That is to say, each silicon wafer group 121 is clamped by the corresponding clamping part 222. When all the clamping parts 222 clamp the corresponding silicon wafer group 121, the entire silicon wafer unit 100 is clamped. When it is necessary to load the silicon wafer unit 100 in pieces by silicon wafer group 121, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is loaded in pieces, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping parts 222. In this way, the placement stability of the remaining silicon wafer groups 121 that have not been loaded in the material frame 200 can be ensured, and the silicon wafers 120 are prevented from tipping over or squeezing each other, and the silicon wafers 120 are avoided from being damaged, thereby ensuring the quality of the silicon wafers 120.

[0146] The clamping part 222 unlocks the silicon wafer group 121 through the action between the unlocking device 300 and the clamping part 222. Specifically, the unlocking device 300 is arranged on the inner side wall of the frame 10, and the unlocking device 300 is arranged close to the slicing module 30. When the material frame conveying module 20 conveys the lower frame 212 in the horizontal direction toward the unlocking device 300, the multiple clamping parts 222 contact the unlocking device 300 in sequence with the relative movement between the material frame 200 and the unlocking device 300. The unlocking device 300 is used to apply external force to the clamping part 222 to make the clamping part 222 away from the corresponding silicon wafer group 121, that is, to release the clamping of the silicon wafer group 121.

[0147] The material frame 200 in this embodiment clamps the corresponding silicon wafer groups 121 simultaneously through the multiple clamping parts 222 on the clamping assembly 220 to achieve the clamping of all silicon wafers. At the same time, the unlocking of the silicon wafer group 121 by each clamping part 222 is independent of each other. The unlocking device 300 unlocks each clamping part 222 in sequence, that is, the unlocking of each silicon wafer group 121 is independent of each other. In this way, when it is necessary to load the silicon wafer unit 100 in units of silicon wafer groups 121, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is loaded in pieces, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping parts 222. In this way, the placement stability of the remaining silicon wafer groups 121 that have not been loaded in the material frame 200 can be ensured, the silicon wafers 120 can be prevented from tipping over or squeezing each other, the silicon wafers 120 are avoided from being damaged, and the quality of the silicon wafers 120 is ensured.

[0148] In some embodiments, reference Fig. 20 The clamping portion 222 includes a second pin shaft 2221, the second pin shaft 2221 passes through the frame 210, and the second pin shaft 2221 can move along the direction of passing through the frame 210. An unlocking block 2223 is provided on the first end of the second pin shaft 2221, and a clamping block 2222 is provided on the second end of the second pin shaft 2221. A spring 2229 is sleeved on the second pin shaft 2221, and the spring 2229 is located between the clamping block 2222 and the frame 210.

[0149] Under the action of the unlocking device 300 , each unlocking block 2223 moves in a direction away from the silicon wafer unit 100 , driving the corresponding clamping block 2222 away from the corresponding silicon wafer group 121 , so as to unlock the corresponding silicon wafer group 121 .

[0150] The clamping block 2222 moves toward the direction approaching the silicon wafer unit 100 under the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121 .

[0151] In some embodiments, the cooperation structure between the unlocking device 300 and the clamping portion 222 is as follows, Figure 20 to Figure 23 :

[0152] The unlocking block 2223 includes a transverse portion 2225 and a vertical portion 2226 of an integrated structure, wherein the transverse portion 2225 is used to abut against the movable plate 221, and the vertical portion 2226 is used to act with the unlocking device 300. Specifically, one end of the transverse portion 2225 is connected to the second pin shaft 2221, a step portion 2228 is formed between the transverse portion 2225 and the second pin shaft 2221, and the other end of the transverse portion 2225 is connected to the vertical portion 2226.

[0153] There is a certain distance between the vertical portion 2226 and the movable plate 221 . The vertical portion 2226 is provided with an inclined surface 2227 on the side facing the frame 210 . Along the discharge direction of the silicon wafer 120 , the distance between the inclined surface 2227 and the movable plate 221 first decreases and then increases.

[0154] The unlocking device 300 includes a first roller 320. When relative movement occurs between the material frame 200 and the unlocking device 300, the first roller 320 moves to between the inclined surface 2227 and the frame 210 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin shaft 2221 moves in a direction away from the silicon wafer 120.

[0155] Specifically, the unlocking device 300 is arranged on the horizontal conveying station 12 of the material frame, and is specifically fixed on the inner wall of the frame 10. Two clamping assemblies 220 are arranged on the corresponding material frame 200, and two unlocking devices 300 are also arranged. Each unlocking device 300 is used to interact with the clamping assembly 220 on the corresponding side. When it is necessary to slice the silicon wafers 120 in the material frame 200 into units of silicon wafer groups 121, the material frame 200 moves in a horizontal direction under the action of the material frame conveying module 20, and a relative movement occurs between the material frame 200 and the unlocking device 300. Along the movement direction of the material frame 200, each clamping part 222 contacts the unlocking device 300 one by one, and the first roller 320 moves to between the inclined surface 2227 and the frame 210 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin shaft 2221 moves in a direction away from the silicon wafer 120, driving the clamping block 2222 away from the silicon wafer 120, that is, releasing the clamping of the corresponding silicon wafer group 121, thereby facilitating the subsequent devices on the unlocked silicon wafer group 121 to perform slicing operations.

[0156] Furthermore, two inclined surfaces 2227 are provided on the vertical portion 2226, one of which is located above the horizontal portion 2225, and the other is located below the horizontal portion 2225. The unlocking device 300 further includes a first mounting frame 310 of a U-shaped structure, and first rollers 320 are provided on the upper and lower walls of the first mounting frame 310, respectively, and the first rollers 320 are in contact with the inclined surfaces 2227 on the corresponding sides. In this way, the unlocking effect of the unlocking device 300 on the clamping portion 222 is improved, and the unlocking reliability is improved.

[0157] In some embodiments, the clamping assembly 220 further includes a movable plate 221 , which extends along the length direction of the containing space 213 , and a plurality of clamping portions 222 are sequentially arranged along the length direction of the movable plate 221 .

[0158] When the movable plate 221 moves in a direction away from the containing space 213 under the action of external force, the movable plate 221 drives all the clamping parts 222 arranged thereon to move synchronously in a direction away from the containing space 213, thereby increasing the distance between the two relative clamping components 220, making it easier for the silicon wafer to be loaded into the containing space 213 from top to bottom.

[0159] Further, the movable plate 221 is located outside the frame 210. For details, refer to Fig.16 and Fig. 20 The lower frame 212 includes two oppositely arranged transverse frames 2125, the transverse frames 2125 extend along the length direction of the containing space 213, the movable plate 221 is located outside the transverse frames 2125, and the second pin shaft 2221 passes through the transverse frames 2125 and the movable plate 221. When the movable plate 221 moves in a direction away from the containing space 213 under the action of an external force, the movable plate 221 pushes all the unlocking blocks 2223 to move synchronously in a direction away from the containing space 213, so that all the clamping blocks 2222 are away from the containing space 213. Specifically, a step portion 2228 is formed between the unlocking block 2223 and the second pin shaft 2221. When the movable plate 221 moves in a direction away from the containing space 213, the movable plate 221 abuts against the step portion 2228 to push the unlocking block 2223 to move synchronously. The unlocking block 2223 drives the second pin shaft 2221 and the clamping block 2222 to move synchronously in a direction away from the containing space 213, and the spring 2229 is compressed.

[0160] After the external force acting on the movable plate 221 disappears, the clamping block 2222 moves toward the direction approaching the silicon wafer 120 under the action of the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121 .

[0161] Furthermore, a second limiting shaft 223 is provided on the transverse frame 2125 , a second elongated through hole 2224 is provided on the second pin shaft 2221 , and the second limiting shaft 223 penetrates into the second elongated through hole 2224 to prevent the second pin shaft 2221 from rotating.

[0162] In some embodiments, reference Fig.14 and Fig.24 The material frame 200 further includes an anti-dumping assembly 240, which is used to support the silicon wafer 120. The anti-dumping assembly 240 is disposed at one end away from the material outlet 214. When the transfer trolley 400 pushes the material frame 200 to move forward, the silicon wafer 120 has a tendency to dump backward (i.e., in the direction opposite to the movement direction of the material frame 100). The anti-dumping assembly 240 abuts against the silicon wafer 120, thereby preventing the silicon wafer 120 from dumping.

[0163] The anti-dumping assembly 240 includes a second mounting frame 241 and a second roller 242 disposed on the second mounting frame 241. The second mounting frame 241 is disposed on the frame 210, and the second roller 242 is used to abut against the silicon wafer 120. A plurality of second rollers 242 are arranged at intervals in the vertical direction, for example, two, so as to have multiple contacts with the silicon wafer 120 in the vertical direction, thereby improving the reliability of the anti-dumping.

[0164] Furthermore, the second mounting frame 241 includes a fixed frame 2411 and a movable frame 2412. The fixed frame 2411 is fixedly mounted on the frame 210. The movable frame 2412 is rotatably connected to the fixed frame 2411. A torsion spring 2413 is disposed between the movable frame 2412 and the fixed frame 2411. The second roller 242 is disposed on the movable frame 2412. The movable frame 2412 rotates relative to the fixed frame 2411 to adapt to the bumps generated during the transportation of the material frame 200, thereby preventing the second roller 242 from rigidly squeezing the silicon wafer 120.

[0165] In some embodiments, the material frame 200 also includes an unlocking trigger part 230, which includes a first pin shaft 231. The first pin shaft 231 passes through the transverse frame 2125. The first end of the first pin shaft 231 is fixedly connected to the movable plate 221. The second end of the first pin shaft 231 is used to receive external force so that the first pin shaft 231 moves along its passing direction in the transverse frame 2125, so as to drive the movable plate 221 to move synchronously in a direction away from the containing space 213. The movable plate 221 then drives all the clamping parts 222 to move synchronously in a direction away from the containing space 213. In this way, the distance between the two relatively arranged clamping assemblies 220 is increased, which facilitates the silicon wafer unit 100 to be placed into the material frame 200 from top to bottom.

[0166] In some embodiments, the material frame 200 is transferred between the cutting station 11 and the debonding station 17 by a transfer vehicle 400. Fig.11 and Fig.12 First, the material frame 200 is placed on the transfer cart 400 , and then the silicon wafer unit 100 after cutting is placed in the material frame 200 , and the transfer cart 400 transfers the material frame 200 to the debonding station 17 .

[0167] Structural reference of transfer trolley 400 Fig.25 and Fig.26 The transfer trolley 400 has the functions of storage, limiting, and transportation for the material frame 200.

[0168] The transfer cart 400 is provided with an unlocking portion 410, which is used to interact with the unlocking triggering portion 230 on the material frame 200 to provide external force to the unlocking triggering portion 230. Specifically, after the material frame 200 is placed on the transfer cart 400, the unlocking portion 410 contacts the unlocking triggering portion 230, and the unlocking portion 410 triggers the unlocking triggering portion 230 to move, and the movable plate 221 moves in a direction away from the filling space 213 under the action of the unlocking triggering portion 230, and the movable plate 221 drives the multiple clamping portions 222 provided thereon to move synchronously in a direction away from the filling space 213.

[0169] When in use, before placing the silicon wafer unit 100 into the material frame 200, the material frame 200 is first placed on the transfer cart 400. At this time, the unlocking portion 410 is in contact with the unlocking trigger portion 230, and the effect achieved is that the movable plate 221 moves in a direction away from the containing space 213 under the action of the unlocking trigger portion 230, and the movable plate 221 drives the multiple clamping portions 222 arranged thereon to move synchronously in a direction away from the containing space 213, that is, the distance between the two relative clamping components 220 is increased, which makes it easier for the silicon wafer unit 100 to be loaded into the containing space 213 from top to bottom.

[0170] The material frame 200 is provided with a limiting structure for limiting the wafer tray 110 . By limiting the wafer tray 110 by the material frame 200 , the stability of the placement of the silicon wafer unit 100 in the material frame 200 is ensured, and the silicon wafer 120 is prevented from tipping over or shifting.

[0171] After the silicon wafer unit 100 is placed in the material frame 200, the material frame 200 is transferred to the next work station, specifically the degumming station, by the transfer cart 400. After arriving at the degumming station, the material frame 200 is taken off the transfer cart 400 by a manipulator or other equipment. At this time, the unlocking part 410 is separated from the unlocking trigger part 230, and the clamping assembly 220 automatically moves toward the direction close to the silicon wafer unit 100 under the reset force of the reset member to clamp the silicon wafer unit 100. After the silicon wafer unit 100 is clamped, it is convenient for the silicon wafer unit 100 to be degummed at the degumming station. At this time, the silicon wafer 120 is clamped by the clamping assembly 220, which facilitates the smooth separation of the crystal support 110 and the silicon wafer 120.

[0172] After the silicon wafer unit 100 is debonded, it is transferred to the next work station by the material frame 200, and the silicon wafer 120 is sliced ​​into silicon wafer groups 121 as units. The sliced ​​silicon wafer 120 is convenient for subsequent wafer insertion operations. When the silicon wafer 120 is sliced ​​into silicon wafer groups 121 as units, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is sliced ​​and loaded, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping part 222. In this process, the clamping part 222 unlocks the silicon wafer group 121 through the action between the unlocking device 300 and the clamping part 222.

[0173] According to the silicon wafer production process, the use method of the silicon wafer transfer device composed of a material frame and a transfer trolley is as follows:

[0174] When the cut silicon wafer unit 100 is transported, the material frame 200 is first placed on the transport trolley 400, the unlocking portion 410 contacts the unlocking trigger portion 230, and the unlocking portion 410 triggers the unlocking trigger portion 230 to move, and all the clamping portions 222 are driven by the movable plate 221 to move synchronously in a direction away from the containing space 213, so that the silicon wafer unit 100 can be loaded into the containing space 213 from top to bottom. At this time, the clamping assembly 220 does not clamp the silicon wafer 120;

[0175] The material frame 200 is provided with a limiting structure for limiting the wafer support 110, so as to ensure the stability of the placement of the silicon wafer unit 100 in the material frame 200;

[0176] After the transfer trolley 400 transfers the material frame 200 to the next work station, the material frame 200 is removed from the transfer trolley 400, the unlocking portion 410 is disengaged from the unlocking trigger portion 230, and all the clamping portions 222 move toward the direction close to the silicon wafer unit 100 under the action of the reset member to clamp the silicon wafer 120, so as to facilitate the debonding and separation of the wafer support 110 and the silicon wafer 120;

[0177] The material frame 200 transfers the silicon wafer 120 to the next work station, and slices the silicon wafer 120 in the material frame 200 into units of silicon wafer groups 121. At this time, relative movement occurs between the material frame 200 and the unlocking device 300, and multiple clamping parts 222 contact the unlocking device 300 in sequence with the relative movement between the material frame 200 and the unlocking device 300. The unlocking device 300 applies external force to the clamping parts 222 to move the clamping parts 222 away from the corresponding silicon wafer groups 121, thereby releasing the clamping of the silicon wafer groups 121.

[0178] In this embodiment, the clamping mechanism on the material frame 200 is triggered by the matching structure between the transfer trolley 400 and the material frame 200. On the one hand, when the material frame 200 cooperates with the transfer trolley 400, the clamping mechanism is in an unlocked state to facilitate the placement of the silicon wafer 120 into the material frame 200. On the other hand, when the material frame 200 is separated from the transfer trolley 400, the clamping mechanism automatically clamps the silicon wafer 120 as a whole, thereby improving the placement reliability of the silicon wafer 120 during the transportation process and facilitating the subsequent debonding and separation of the crystal tray 110 and the silicon wafer 120. When the silicon wafer 120 is loaded in pieces, the material frame 200 can independently release the clamping of each silicon wafer group 121 through the unlocking device 300, thereby avoiding damage to the silicon wafer 120, reducing manual intervention, and improving work efficiency.

[0179] In some embodiments, a roller (referred to as the third roller 232) is disposed at the second end of the first pin shaft 231. Fig.13 , Fig.25 and Fig.26 The unlocking portion 410 is a column arranged on the transfer trolley 400. The column is provided with a guide contact surface 411 at the upper end on the side facing the third roller 232. When the material frame 200 is placed on the transfer trolley 400 from top to bottom, the third roller 232 moves from top to bottom along the guide contact surface 411 to drive the first pin shaft 231 to move in a direction away from the loading space 213. Since the first pin shaft 231 is fixedly connected to the movable plate 221, the movable plate 221 is driven to move synchronously in a direction away from the loading space 213.

[0180] Further, refer to Fig.26 The guide contact surface 411 includes, from top to bottom, a first contact surface section 4111, a second contact surface section 4112, and a third contact surface section 4113. The second contact surface section 4112 extends in a vertical direction. The first contact surface section 4111 extends obliquely from the top of the second contact surface section 4112 toward a direction away from the third roller 232. The third contact surface section 4113 extends obliquely from the bottom of the second contact surface section 4112 toward a direction close to the third roller 232.

[0181] When the material frame 200 is placed on the transfer cart 400 from top to bottom, the third roller 232 first contacts the first contact surface section 4111, and the inclined first contact surface section 4111 plays a preliminary positioning role in the placement of the material frame 200. As the material frame 200 continues to be lowered, the third roller 232 moves along the inclined first contact surface section 4111, gradually pushing the first pin shaft 231 away from the loading space 213. After the third roller 232 moves to the second contact surface section 4112, the outward movement of the first pin shaft 231 stops. As the material frame 200 continues to be lowered, after the third roller 232 moves to the lower end of the second contact surface section 4112, the third contact surface section 4113 stops the movement of the third roller 232, and the material frame 200 is placed in place.

[0182] Further, each movable plate 221 is equipped with two unlocking trigger parts 230, and the two unlocking trigger parts 230 are arranged at opposite ends of the movable plate 221, that is, each material frame 200 is equipped with four unlocking trigger parts 230, and correspondingly, four unlocking parts 410 are arranged on the transfer trolley 400, such as Fig.25 The four unlocking parts 410 are used, on the one hand, to contact the corresponding unlocking triggering parts 230 , and on the other hand, to guide the placement of the material frame 200 .

[0183] Furthermore, a first limiting shaft 233 is provided on the transverse frame 2125 , a first long through hole 234 is provided on the first pin shaft 231 , and the first limiting shaft 233 passes through the first long through hole 234 to prevent the first pin shaft 231 from rotating.

[0184] In some embodiments, reference Fig.25 and Fig.26 A limiting portion 420 is provided on the body of the transfer trolley 400 . The limiting portion 420 is a limiting protrusion arranged on the side of the material frame 200 . The limiting portion 420 is used to limit the material frame 200 to ensure the stability of the material frame 200 placed on the transfer trolley 400 .

[0185] Furthermore, the transfer cart 400 is provided with a liquid collecting tank 430, which is located below the material frame 200 and is used to collect the liquid dripping from the silicon wafer 120. The lower part of the liquid collecting tank 430 is provided with a drain port 440 and a drain valve 450 for draining the liquid.

[0186] Furthermore, a positioning portion 460 is provided at the moving front end of the transfer cart 400, and the positioning portion 460 is used for positioning the transfer cart 400 when it moves to a designated position.

[0187] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

Claims

1. A silicon wafer production line, characterized in that: include: A material frame, which is used to hold the cut silicon wafers; A cutting station is provided with a slicing device for cutting silicon rods into silicon wafers. The cut silicon wafers are placed together with the wafer holder in a material frame, and the material frame is transported to the degumming station by a transport trolley; A degumming station, on which a degumming device is provided for separating the wafer tray from the silicon wafer; A material frame horizontal conveying station, on which a material frame conveying module is provided, for conveying the material frame horizontally to the slice flipping station; A slicing and flipping station is provided with a slicing module and a flipping and conveying module. The slicing module is used to slice the silicon wafers in the material frame and to convey the sliced ​​silicon wafers one by one upward in a vertical posture. The flipping and conveying module is used to receive the vertical silicon wafers conveyed by the slicing module and flip the silicon wafers from the vertical posture to the horizontal posture. A silicon wafer horizontal conveying station is provided with a horizontal conveying module for receiving the horizontal silicon wafer conveyed by the flip conveying module and conveying the silicon wafer in a horizontal posture to the wafer insertion station; The wafer inserting station is provided with a flower basket for inserting the silicon wafers transported by the horizontal transport module.

2. The silicon wafer production line according to claim 1, characterized in that: The transfer trolley automatically runs between the cutting station and the degumming station according to a set route.

3. The silicon wafer production line according to claim 1, characterized in that: A containing space for containing silicon wafers is formed in the material frame, and the multiple silicon wafers in the material frame are divided into multiple silicon wafer groups; The material frame is provided with a clamping assembly and an unlocking trigger part; The clamping assembly comprises a movable plate, the movable plate extends along the length direction of the containing space, the movable plate is provided with a plurality of clamping parts arranged in sequence along the length direction thereof, the plurality of clamping parts correspond to the plurality of silicon wafer groups one by one to clamp the corresponding silicon wafer groups, each of the clamping parts moves in a direction away from the silicon wafer to release the clamping of the corresponding silicon wafer group, and the unlocking trigger part is connected to the movable plate; The transfer trolley is provided with an unlocking part. After the material frame is placed on the transfer trolley, the unlocking part triggers the unlocking trigger part to move. Under the action of the unlocking trigger part, the movable plate moves in a direction away from the containing space, and the movable plate drives the multiple clamping parts provided thereon to move synchronously in a direction away from the containing space. The material frame is removed from the transfer trolley, the unlocking portion is disengaged from the unlocking trigger portion, and the clamping portion moves toward the direction approaching the silicon wafer under the action of the reset member to clamp the silicon wafer.

4. The silicon wafer production line according to claim 3, characterized in that: An unlocking device is provided on the horizontal conveying station of the material frame. When the material frame conveying module drives the material frame to move in the horizontal direction, a relative movement is generated between the material frame and the unlocking device. The plurality of clamping parts contact the unlocking device in sequence with the relative movement between the material frame and the unlocking device. The unlocking device applies an external force to the clamping part to keep the clamping part away from the corresponding silicon wafer group.

5. The silicon wafer production line according to claim 4, characterized in that: The clamping part comprises a second pin shaft, the second pin shaft passes through the material frame and the movable plate, an unlocking block is arranged on the first end of the second pin shaft, a clamping block is arranged on the second end of the second pin shaft, a spring is sleeved on the second pin shaft, and the spring is located between the clamping block and the material frame; When the movable plate moves in a direction away from the containing space, the movable plate pushes all the unlocking blocks to move synchronously in a direction away from the containing space, so that all the clamping blocks are away from the containing space; The clamping block moves toward the direction approaching the silicon wafer under the action of the restoring force of the spring to clamp the corresponding silicon wafer group; The unlocking device applies external force to the unlocking block to make the corresponding clamping part move away from the corresponding silicon wafer group.

6. The silicon wafer production line according to claim 5, characterized in that: The unlocking block comprises a transverse portion and a vertical portion, wherein the transverse portion is used to abut against the movable plate, and the vertical portion is used to act with the unlocking device; There is a certain distance between the vertical portion and the movable plate, and the vertical portion is provided with an inclined surface on a side facing the movable plate, and along the discharge direction of the silicon wafer, the distance between the inclined surface and the movable plate first decreases and then increases; The unlocking device includes a first roller. When relative movement occurs between the material frame and the unlocking device, the first roller moves to between the inclined surface and the movable plate and contacts the inclined surface. The relative displacement between the first roller and the inclined surface causes the second pin shaft to move in a direction away from the silicon wafer.

7. The silicon wafer production line according to claim 3, characterized in that: The material frame comprises an upper frame and a lower frame, the upper frame is detachably arranged above the lower frame, a limiting structure for limiting the crystal holder is arranged on the upper frame, and the clamping assembly is arranged on the lower frame; The material frame is placed on the debonding station, the lower frame is lifted away from the upper frame to separate the crystal support from the silicon wafer, and the material frame conveying module conveys the lower frame in a horizontal direction.

8. The silicon wafer production line according to any one of claims 1 to 7, characterized in that: The slicing module includes a water spraying part and a vertical conveying part. The water spraying part is used to spray water on the unlocked silicon wafer group in the material frame to slice the multiple silicon wafers in the silicon wafer group. The vertical conveying part is used to convey the sliced ​​silicon wafers one by one in a vertical posture upward to the flip conveying module.

9. The silicon wafer production line according to claim 8, characterized in that: The vertical conveying part includes a first mounting frame, on which a suction part and a vertical conveyor belt are provided. The suction part is used to suction the silicon wafers after slicing onto the vertical conveyor belt, and the vertical conveyor belt drives the silicon wafers to move upward in a vertical posture.

10. The silicon wafer production line according to claim 8, characterized in that: The flipping and conveying module includes a flipping auxiliary part and a glue-coating rolling wheel. The flipping auxiliary part includes a second mounting frame. The second mounting frame is provided with a blowing part. The blowing part is located above the vertical conveying part. The blowing part is used to blow air to the vertical silicon wafers conveyed upward by the vertical conveying part so that the silicon wafers are dumped onto the glue-coating rolling wheel. The glue-coating rolling wheel drives the silicon wafers to move to a horizontal posture.

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