Slicing device for wafer production
By designing a wafer slicing device including torsion blocks, screws, guide plates and push plates, the problem of inconsistent diameter wafers in slicing is solved, and stable limit and flat slices of wafers of different widths are achieved. Improved the quality of finished products.
Patent Information
- Application Number
- CN202420758924.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-12
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-04-12
AI Technical Summary
During the wafer slicing process, wafers with inconsistent diameters are prone to tilt, resulting in uneven ports of cut wafer segments, affecting the quality of the finished product.
A slicer device for wafer production is designed. Through a combined structure of torsion block, screw, guide plate and push plate, limit clamping of wafers of different widths is achieved to ensure the stability of the slicer process. The device includes a base plate, a positioning shell, a support frame, a knife cutting frame, a movable plate and a driving member. The screw is rotated by a torsion block, which drives the guide plate and push plate to move, adjusts the movable plate to clamp the wafer, and drives the transmission through a motor Wheel assisted delivery and slicing.
It effectively solves the problem of fixed limits of wafers of different widths, improves the stability and finished product quality during slicing, and ensures the flatness of wafer segment ports.
Smart Images
Figure CN222290638U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of wafers, in particular to a slicing device for wafer production. Background Art
[0002] Wafers refer to circular slices cut from semiconductor materials (such as silicon) during the manufacturing process. Wafers usually have a circular shape, similar to a large coin or CD. Their diameter can vary according to specific application requirements, and common diameters are 4 inches (about 10 cm), 6 inches, 8 inches, 12 inches, etc. In the preparation process of wafers, single crystal silicon rods are first obtained through single crystal growth technology, and then the silicon rods are cut into thin slices to form circular wafers. These wafers play a key role in semiconductor processes, supporting the manufacture and integration of various electronic devices as substrates. It should be noted that although wafers are usually circular, other shapes of wafers, such as square or rectangular wafers, can also be used in some special applications. This depends on the specific chip design and manufacturing requirements. However, circular wafers are still the most common and widely used shape.
[0003] When the wafer is processed and formed, it needs to be sliced. However, during the slicing process, the diameters of the wafer strips are inconsistent. When the diameter is small, if the two ends of the cutting part are not fixed well, it is easy to tilt, and the ends of the cut wafer segments are uneven, thus affecting the quality of the finished product.
[0004] Therefore, it is necessary to provide a new wafer production slicing device to solve the above technical problems. Utility Model Content
[0005] In order to solve the above technical problems, the utility model provides a slicing device for wafer production which can conveniently limit the position of wafers with different widths so as to ensure more stable slicing.
[0006] The utility model provides a wafer production slicing device, comprising a base plate, and also comprising: a positioning shell arranged on one side of the top of the base plate, a partition plate is fixedly connected to the rear side of the inner cavity of the positioning shell, first notches are opened on both sides of the front side of the partition, and the inner cavity of the first notch is movably connected to a guide wheel through a rotating shaft; a support frame arranged on the right side of the top of the base plate, a positioning plate is fixedly connected between the tops of the two support frames, an electric push rod is fixedly connected to the bottom of the positioning plate, a cutting knife frame is fixedly connected to the bottom of the inner cavity of the cutting knife frame, and a slicing knife is movably connected to the bottom; a movable plate is arranged on the front side of the inner cavity of the positioning shell, a driving member is fixedly connected to the top of the movable plate, and an adjusting member is fixedly connected to the front side of the positioning shell.
[0007] As a wafer production slicing device provided by the utility model, preferably, the front side and the rear side of the positioning shell are fixedly connected with reinforcement plates, and the bottom of the reinforcement plate is fixedly connected to the bottom plate.
[0008] As a wafer production slicing device provided by the utility model, preferably, the front and rear sides of the top of the cutter frame are fixedly connected to limit rods, and the top of the limit rods passes through the outside of the positioning plate and is fixedly connected to a retaining ring.
[0009] As a slicing device for wafer production provided by the utility model, preferably, the adjusting part includes a guide plate, both sides of the guide plate are fixedly connected with push plates, the opposite sides of the two push plates are fixedly connected to the movable plate, the front side of the guide plate is fixedly connected with a threaded sleeve, the inner cavity of the threaded sleeve is threadedly connected with a screw, the rear side of the screw is fixedly connected to the positioning shell through an axle seat, and the front side of the screw is fixedly connected with a torsion block.
[0010] As a wafer production slicing device provided by the utility model, preferably, both sides of the front side of the guide plate are fixedly connected with sliding sleeves, the inner cavity of the sliding sleeve is provided with a sliding rod, and the rear side of the sliding rod is fixedly connected to the positioning shell.
[0011] As a wafer production slicing device provided by the utility model, preferably, the driving member includes a fixed plate, the fixed plate is fixed to the top of the movable plate, the top of the positioning shell is provided with a limiting hole used to cooperate with the fixed plate, one side of the top of the fixed plate is fixedly connected to a motor, the output end of the motor is fixedly connected to a first transmission rod, the bottom of the first transmission rod passes through the inner cavity of the movable plate and is fixedly connected to the first conveying wheel, the surface of the first transmission rod is sleeved with a first transmission wheel, the surface of the first transmission wheel is sleeved with a transmission belt, one side of the inner cavity of the transmission belt is transmission-connected to the second transmission wheel, the interior of the second transmission wheel is fixedly connected to the second transmission rod, the bottom of the second transmission rod passes through the inner cavity of the movable plate and is fixedly connected to the second conveying wheel.
[0012] As a wafer production slicing device provided by the utility model, preferably, a reinforcement ring is fixedly connected to the bottom of the motor surface, and the bottom of the reinforcement ring is fixedly connected to the fixing plate.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] The wafer production slicing device rotates the screw by twisting the twist block. When the screw rotates, the threaded sleeve drives the guide plate to move. At this time, the movement of the guide plate drives the push plate to move, so that the movable plate can be adjusted, which is convenient for limiting and clamping the wafer strip, improving the stability during slicing, and solving the problem that the existing slicing device is inconvenient for limiting and fixing wafers of different widths. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 A schematic structural diagram of a preferred embodiment of a wafer production slicing device provided by the utility model;
[0016] Figure 2 A schematic diagram of the top view structure of the positioning shell provided by the utility model;
[0017] Figure 3 A schematic diagram of the structure of the cutting blade holder provided by the utility model;
[0018] Figure 4 A schematic diagram of the structure of the adjusting member provided by the utility model;
[0019] Figure 5 This is a schematic diagram of the structure of the driving member provided by the utility model.
[0020] Numbers in the figure: 1, bottom plate; 2, positioning shell; 3, partition; 4, first notch; 5, guide wheel; 6, support frame; 7, positioning plate; 8, electric push rod; 9, cutter frame; 10, slicer; 11, movable plate; 12, driving member; 1201, fixed plate; 1202, limit hole; 1203, motor; 1204, first transmission rod; 1205, first conveying wheel; 1206, first transmission wheel ; 1207, transmission belt; 1208, second transmission wheel; 1209, second transmission rod; 1210, second conveying wheel; 1211, reinforcement ring; 13, adjustment member; 1301, guide plate; 1302, push plate; 1303, threaded sleeve; 1304, screw rod; 1305, torsion block; 1306, sliding sleeve; 1307, sliding rod; 14, reinforcement plate; 15, limit rod; 16, retaining ring. DETAILED DESCRIPTION
[0021] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.
[0022] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in Figure 1 A schematic structural diagram of a preferred embodiment of a wafer production slicing device provided by the utility model; Figure 2 A schematic diagram of the top view structure of the positioning shell provided by the utility model; Figure 3 A schematic diagram of the structure of the cutting blade holder provided by the utility model; Figure 4 A schematic diagram of the structure of the adjusting member provided by the utility model; Figure 5A schematic diagram of the drive structure provided by the utility model. A wafer production slicing device comprises: a bottom plate 1, and also comprises: a positioning shell 2 arranged on one side of the top of the bottom plate 1, a partition 3 is fixedly connected to the rear side of the inner cavity of the positioning shell 2, and first notches 4 are provided on both sides of the front side of the partition 3, and the inner cavity of the first notch 4 is movably connected to a guide wheel 5 through a rotating shaft; a support frame 6 arranged on the right side of the top of the bottom plate 1, a positioning plate 7 is fixedly connected between the tops of the two support frames 6, an electric push rod 8 is fixedly connected to the bottom of the positioning plate 7, a cutter frame 9 is fixedly connected to the bottom of the inner cavity of the cutter frame 9, and a slicing knife 10 is movably connected to the bottom of the inner cavity of the cutter frame 9; a movable plate 11 is arranged on the front side of the inner cavity of the positioning shell 2, a driving member 12 is fixedly connected to the top of the movable plate 11, and an adjusting member 13 is fixedly connected to the front side of the positioning shell 2.
[0023] refer to Figure 3 and Figure 4 As shown, the front and rear sides of the positioning shell 2 are fixedly connected to a reinforcement plate 14, the bottom of the reinforcement plate 14 is fixedly connected to the base plate 1, the front and rear sides of the top of the cutting frame 9 are fixedly connected to a limiting rod 15, the top of the limiting rod 15 passes through the outside of the positioning plate 7 and is fixedly connected to a retaining ring 16.
[0024] It should be noted that the fixed connection between the reinforcing plate 14 and the bottom plate 1 plays a role in reinforcing the positioning shell 2, and the coordinated use of the limiting rod 15 and the retaining ring 16 can improve the stability of the cutting frame 9 when it is raised or lowered.
[0025] refer to Figure 1 , Figure 2 and Figure 4 As shown, the adjusting member 13 includes a guide plate 1301, both sides of the guide plate 1301 are fixedly connected with push plates 1302, the opposite sides of the two push plates 1302 are fixedly connected to the movable plate 11, the front side of the guide plate 1301 is fixedly connected with a threaded sleeve 1303, the inner cavity of the threaded sleeve 1303 is threadedly connected with a screw 1304, the rear side of the screw 1304 is fixedly connected to the positioning shell 2 through an axle seat, the front side of the screw 1304 is fixedly connected with a torsion block 1305, both sides of the front side of the guide plate 1301 are fixedly connected with a sliding sleeve 1306, the inner cavity of the sliding sleeve 1306 is provided with a sliding rod 1307, and the rear side of the sliding rod 1307 is fixedly connected to the positioning shell 2.
[0026] It should be noted that: when the user needs to adjust the movable plate 11 to clamp wafers of different widths, first the twist block 1305 rotates the screw 1304, and the rotation of the screw 1304 causes the threaded sleeve 1303 to drive the guide plate 1301 to move. At this time, as the guide plate 1301 moves, the sliding sleeve 1306 is driven to move on the surface of the sliding rod 1307, and at the same time drives the push plate 1302 to move, thereby adjusting the movable plate 11.
[0027] refer to Figure 2 , Figure 4 and Figure 5 As shown, the driving member 12 includes a fixed plate 1201, the fixed plate 1201 is fixed to the top of the movable plate 11, a limiting hole 1202 used to cooperate with the fixed plate 1201 is opened on the top of the positioning shell 2, a motor 1203 is fixedly connected to one side of the top of the fixed plate 1201, the output end of the motor 1203 is fixedly connected to a first transmission rod 1204, the bottom of the first transmission rod 1204 passes through the inner cavity of the movable plate 11 and is fixedly connected to a first conveying wheel 1205, and the surface of the first transmission rod 1204 is sleeved with a first A transmission wheel 1206, a transmission belt 1207 is sleeved on the surface of the first transmission wheel 1206, one side of the inner cavity of the transmission belt 1207 is transmission-connected to the second transmission wheel 1208, the interior of the second transmission wheel 1208 is fixedly connected to the second transmission rod 1209, the bottom of the second transmission rod 1209 penetrates into the inner cavity of the movable plate 11 and is fixedly connected to the second conveying wheel 1210, the bottom of the surface of the motor 1203 is fixedly connected to a reinforcement ring 1211, and the bottom of the reinforcement ring 1211 is fixedly connected to the fixed plate 1201.
[0028] It should be noted that: the first transmission rod 1204 is driven to rotate by the driving motor 1203, and when the first transmission rod 1204 rotates, the first conveying wheel 1205 is driven to rotate, and at the same time, when the first transmission rod 1204 rotates, the first transmission wheel 1206 is driven to rotate, and when the first transmission wheel 1206 rotates, the transmission belt 1207 is driven to transmit, and as the transmission belt 1207 rotates, the second transmission wheel 1208 drives the second transmission rod 1209 to rotate, and then as the second transmission rod 1209 rotates, the second conveying wheel 1210 is driven to rotate, thereby assisting in the transportation and slicing of the wafer and improving the slicing efficiency. The fixed connection between the reinforcement ring 1211 and the fixed plate 1201 plays a role in reinforcing the motor 1203.
[0029] The working principle of a wafer production slicing device provided by the utility model is as follows: first, the wafer strip is inserted through one side of the positioning shell 2, and then the torsion block 1305 causes the screw 1304 to rotate. When the screw 1304 rotates, the threaded sleeve 1303 will drive the guide plate 1301 to move. At this time, as the guide plate 1301 moves, the sliding sleeve 1306 is driven to move on the surface of the sliding rod 1307, and the push plate 1302 is driven to move, so that the movable plate 11 is adjusted to clamp the wafer strip. At this time, the guide wheel 5 is used to assist the clamping, and then the motor 1203 can be driven to drive the first transmission rod 1204 to rotate. When the first transmission rod 1204 rotates, it will drive the first conveying wheel 1205 rotates, and when the first transmission rod 1204 rotates, it will drive the first transmission wheel 1206 to rotate, and when the first transmission wheel 1206 rotates, it will drive the transmission belt 1207 to transmit, and as the transmission belt 1207 rotates, the second transmission wheel 1208 will drive the second transmission rod 1209 to rotate, and then as the second transmission rod 1209 rotates, it will drive the second conveying wheel 1210 to rotate, and the first conveying wheel 1205 and the second conveying wheel 1210 will contact the wafer strip, thereby assisting in conveying the wafer, and then driving the electric push rod 8 to drive the cutting rack 9 to descend, and when the cutting rack 9 descends, it will drive the slicing knife 10 to descend, so as to slice the wafer.
[0030] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A wafer production slicing device, characterized in that: It comprises a bottom plate (1), and also comprises: A positioning shell (2) is arranged on one side of the top of the bottom plate (1), the rear side of the inner cavity of the positioning shell (2) is fixedly connected to a partition (3), both sides of the front side of the partition (3) are provided with a first notch (4), and the inner cavity of the first notch (4) is movably connected to a guide wheel (5) via a rotating shaft; A support frame (6) is arranged on the right side of the top of the bottom plate (1), a positioning plate (7) is fixedly connected between the tops of the two support frames (6), an electric push rod (8) is fixedly connected to the bottom of the positioning plate (7), a cutting frame (9) is fixedly connected to the bottom of the electric push rod (8), and a slicing knife (10) is movably connected to the bottom of the inner cavity of the cutting frame (9); A movable plate (11) is arranged on the front side of the inner cavity of the positioning shell (2), a driving member (12) is fixedly connected to the top of the movable plate (11), and an adjusting member (13) is fixedly connected to the front side of the positioning shell (2).
2. The wafer production slicing device according to claim 1, characterized in that: The front and rear sides of the positioning shell (2) are both fixedly connected to a reinforcement plate (14), and the bottom of the reinforcement plate (14) is fixedly connected to the base plate (1).
3. The wafer production slicing device according to claim 1, characterized in that: The front and rear sides of the top of the cutting blade holder (9) are both fixedly connected to a limiting rod (15), and the top of the limiting rod (15) passes through the outside of the positioning plate (7) and is fixedly connected to a retaining ring (16).
4. The wafer production slicing device according to claim 1, characterized in that: The adjusting member (13) comprises a guide plate (1301), both sides of the guide plate (1301) are fixedly connected to push plates (1302), the opposite sides of the two push plates (1302) are fixedly connected to the movable plate (11), the front side of the guide plate (1301) is fixedly connected to a threaded sleeve (1303), the inner cavity of the threaded sleeve (1303) is threadedly connected to a screw rod (1304), the rear side of the screw rod (1304) is fixedly connected to the positioning shell (2) through an axle seat, and the front side of the screw rod (1304) is fixedly connected to a torsion block (1305).
5. The wafer production slicing device according to claim 4, characterized in that: Both sides of the front side of the guide plate (1301) are fixedly connected with a sliding sleeve (1306), the inner cavity of the sliding sleeve (1306) is provided with a sliding rod (1307), and the rear side of the sliding rod (1307) is fixedly connected to the positioning shell (2).
6. The wafer production slicing device according to claim 1, characterized in that: The driving member (12) comprises a fixed plate (1201), wherein the fixed plate (1201) is fixed to the top of the movable plate (11), and a limiting hole (1202) used in conjunction with the fixed plate (1201) is provided on the top of the positioning shell (2), a motor (1203) is fixedly connected to one side of the top of the fixed plate (1201), and an output end of the motor (1203) is fixedly connected to a first transmission rod (1204), and the bottom of the first transmission rod (1204) passes through the inner cavity of the movable plate (11) and is fixedly connected to a first transmission rod (1204). A conveying wheel (1205), the surface of the first transmission rod (1204) is sleeved with a first transmission wheel (1206), the surface of the first transmission wheel (1206) is sleeved with a transmission belt (1207), one side of the inner cavity of the transmission belt (1207) is transmission-connected to a second transmission wheel (1208), the interior of the second transmission wheel (1208) is fixedly connected to a second transmission rod (1209), and the bottom of the second transmission rod (1209) passes through the inner cavity of the movable plate (11) and is fixedly connected to a second conveying wheel (1210).
7. The wafer production slicing device according to claim 6, characterized in that: A reinforcement ring (1211) is fixedly connected to the bottom of the surface of the motor (1203), and the bottom of the reinforcement ring (1211) is fixedly connected to the fixing plate (1201).