Independent heat dissipation type dehumidifier

Abstract

The utility model relates to the technical field of dehumidification equipment, and discloses an independent heat dissipation type dehumidifier which comprises a shell and a control assembly, a condensation cavity and a heat dissipation cavity are formed in the shell, and the condensation cavity and the heat dissipation cavity are separated through a partition plate; a semiconductor condensation assembly is arranged in the condensation cavity, and the heating surface of the semiconductor condensation assembly is in contact connection with the partition plate; at least two fans are arranged in the heat dissipation cavity and include the first fan and the second fan, the first fan and the second fan are opposite in rotating direction or the same in rotating direction, the control assembly is arranged on the upper portion in the heat dissipation cavity, the second fan is arranged on the lower portion in the heat dissipation cavity, and the first fan is located between the control assembly and the second fan. According to the scheme, the condensation cavity and the heat dissipation cavity are not communicated, the heat dissipation cavity adopts the large-capacity ventilation design of the multiple fans, effective heat dissipation of the hot end of the semiconductor chilling plate is achieved, normal work of the semiconductor chilling plate is ensured, and the condensation effect of the cold end of the semiconductor chilling plate cannot be affected by large air volume.

Description

Technical Field

[0001] The utility model relates to the technical field of dehumidification equipment, in particular to an independent heat dissipation type dehumidifier. Background Art

[0002] A semiconductor dehumidifier is a device that uses semiconductor refrigeration chips to condense water vapor in the air into liquid, thereby achieving a dehumidification effect.

[0003] Chinese patent CN202321548553.1 discloses a dehumidification device, including a housing and a water tank, the water tank and the housing are detachably connected, characterized in that the housing has a cavity, an air inlet and an air outlet; a fan, a semiconductor component and a purification device are arranged in the cavity; it also includes a controller and a power supply, the controller is respectively connected to the fan, the semiconductor component and the purification device by signal, the power supply is respectively electrically connected to the controller, the fan, the semiconductor component and the purification device; the air suction end of the fan is connected to the air inlet, the air outlet end is connected to the semiconductor component, and the right side of the semiconductor component is connected to the air outlet; the purification device is arranged between the semiconductor component and the air outlet; the semiconductor component is arranged at an angle to the horizontal line. In this scheme, the air duct through which the fan blows the air passes through the heat sinks at the cold end and the hot end of the semiconductor component. This design is not conducive to the heat dissipation of the hot end of the semiconductor component, and at the same time affects the cooling effect of the cold end, and it is impossible to adjust the wind speed according to the external temperature and humidity, and then adjust the condensation end temperature. In a high temperature and low humidity environment, the condensation end temperature is not low enough and dehumidification is impossible.

[0004] The utility model overcomes the shortcomings of the prior art and provides an independent heat dissipation dehumidifier, which separates the heat dissipation of the cold and hot ends of the semiconductor and reduces the influence of the heat dissipation between the cold and hot ends. Utility Model Content

[0005] The main purpose of the utility model is to provide an independent heat dissipation dehumidifier, including a shell and a control component, wherein a condensation chamber and a heat dissipation chamber are arranged inside the shell, and the condensation chamber and the heat dissipation chamber are separated by a partition;

[0006] A semiconductor condensation component is provided in the condensation chamber, the semiconductor condensation component is electrically connected to the control component, and the heating surface of the semiconductor condensation component is in contact with and connected to the partition;

[0007] At least two fans are arranged in the heat dissipation cavity, which are a first fan and a second fan. The first fan and the second fan rotate in opposite or same directions. The first fan and the second fan are electrically connected to the control component respectively. The control component is arranged at the upper part of the heat dissipation cavity, and the second fan is arranged at the lower part of the heat dissipation cavity. The first fan is located between the control component and the second fan.

[0008] Optionally, a plurality of first grilles are provided on one side of the partition located in the heat dissipation cavity, the first grilles are directed vertically downward, and the first grilles and the partition are an integrated structure.

[0009] Optionally, the top and bottom of the heat dissipation cavity are respectively provided with a first ventilation area connected to the outside of the shell, and the two sides of the heat dissipation cavity are respectively provided with a second ventilation area connected to the outside of the shell;

[0010] The shell surface is provided with a third ventilation area and a fourth ventilation area connected to the heat dissipation cavity. The third ventilation area is arranged opposite to the first fan and covers the range of the first fan being projected onto the shell surface. The fourth ventilation area is arranged opposite to the second fan and covers the range of the second fan being projected onto the shell surface.

[0011] Optionally, a first air duct is formed with the first ventilation area as a starting point and one or more of the second ventilation area, the third ventilation area, and the fourth ventilation area as an end point;

[0012] A second air duct is formed with the second ventilation area as a starting point and one or more of the first ventilation area, the third ventilation area, and the fourth ventilation area as an end point;

[0013] A third air duct is formed with the third ventilation area as a starting point and one or more of the first ventilation area, the second ventilation area and the fourth ventilation area as an end point;

[0014] A fourth air duct is formed with the fourth ventilation area as a starting point and one or more of the first ventilation area, the second ventilation area and the third ventilation area as an end point.

[0015] Optionally, the first fan draws air into the heat dissipation cavity, and the second fan blows air out of the heat dissipation cavity.

[0016] Optionally, the semiconductor condensation component includes a condenser and a semiconductor refrigeration sheet, the heating surface of the semiconductor refrigeration sheet is in contact with and connected to the partition, the cooling surface of the semiconductor refrigeration sheet is in contact with and connected to the condenser, the semiconductor refrigeration sheet is surrounded by a heat insulation layer, and the semiconductor refrigeration sheet is electrically connected to the control component;

[0017] The condenser is provided with a plurality of second grids, and the second grids are oriented vertically downward.

[0018] Optionally, a water collecting box is provided below the condenser, the water collecting box is located inside the condensing chamber, an interface is provided at the bottom of the water collecting box to communicate with the water collecting box, and the interface extends out of the shell;

[0019] The lower part of the second grid is pointed, and condensed water from the second grid is collected and dripped into the water collecting box.

[0020] Optionally, a third fan is provided above the condensation chamber, the third fan is located above the semiconductor condensation component, the third fan is electrically connected to the control component, and the wind speed of the third fan is adjusted by the control component;

[0021] A fifth ventilation area is provided on the top of the condensing chamber, and a sixth ventilation area connected to the interior of the condensing chamber is provided on the surface of the shell. The sixth ventilation area is arranged opposite to the condenser and covers the lower area of ​​the condenser.

[0022] Optionally, a fifth air duct is formed with the fifth ventilation zone as the starting point or end point and the sixth ventilation zone as the end point or starting point, passing through the third fan and the semiconductor condensation component.

[0023] Optionally, the control component includes a display screen, buttons and a circuit board, and the circuit board is arranged above the heat dissipation cavity and is electrically connected to the display screen, buttons, a first fan, a second fan, and a semiconductor condensation component; a hole is opened on the surface of the shell, and the display screen and buttons are located on the circuit board, and the display screen and buttons are exposed from the shell through the opening.

[0024] Compared with the prior art, the utility model has the following beneficial effects:

[0025] The dehumidifier provided by the utility model has an internal space of the shell divided into two parts: a condensation chamber and a heat dissipation chamber. The condensation chamber is used to install a semiconductor condensation component, and the heat dissipation chamber is used to install a fan for heat dissipation. The condensation chamber and the heat dissipation chamber are not connected. The heat dissipation chamber adopts a large-capacity ventilation design of multiple fans to achieve effective heat dissipation of the hot end of the semiconductor refrigeration sheet, ensure the normal operation of the semiconductor refrigeration sheet, and the large air volume will not affect the condensation effect of the cold end of the semiconductor refrigeration sheet. The fan speed of the condensation chamber can be adjusted according to the external temperature and humidity, thereby adjusting the temperature of the condensation end. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0027] Figure 1 This is a schematic diagram of an embodiment of the independent heat dissipation dehumidifier of the utility model. Figure 1 ;

[0028] Figure 2 This is a schematic diagram of an embodiment of the independent heat dissipation dehumidifier of the utility model. Figure 2 ;

[0029] Figure 3 This is a schematic diagram of an embodiment of the independent heat dissipation dehumidifier of the utility model. Figure 3 ;

[0030] Figure 4 This is a cross-sectional view of an embodiment of the independent heat dissipation dehumidifier of the utility model;

[0031] Figure 5 The air duct of the independent heat dissipation dehumidifier embodiment of the utility model is shown in FIG. Figure 1 ;

[0032] Figure 6 The air duct of the independent heat dissipation dehumidifier embodiment of the utility model is shown in FIG. Figure 2 ;

[0033] Figure 7 It is an exploded schematic diagram of an embodiment of the independent heat dissipation dehumidifier of the utility model.

[0034] Reference numerals:

[0035] 1-shell; 11-condensation chamber; 111-third fan; 112-fifth ventilation zone; 113-sixth ventilation zone; 12-heat dissipation chamber; 121-first ventilation zone; 122-second ventilation zone; 123-third ventilation zone; 124-fourth ventilation zone; 13-partition; 14-first air duct; 15-second air duct; 16-third air duct; 17-fourth air duct; 18-fifth air duct; 131-first grille; 2-control component; 21-display screen; 22-button; 23-circuit board; 3-semiconductor condensation component; 31-condenser; 311-second grille; 32-semiconductor refrigeration sheet; 33-insulation layer; 34-water collecting box; 341-interface; 4-first fan; 5-second fan. DETAILED DESCRIPTION

[0036] In order to facilitate the understanding of the utility model, the utility model is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element, or there can be one or more centered elements between them. When an element is described as "connected" to another element, it can be directly connected to another element, or there can be one or more centered elements between them. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are only for illustrative purposes. In the description of the utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" means two or more. The term "include" and any variation thereof means non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may be present or added.

[0037] In addition, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a connection between two components. All technical and scientific terms used in this specification have the same meaning as those generally understood by technicians in the technical field of the present utility model. The terms used in the specification of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.

[0038] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0039] The current dehumidification method is to achieve the dehumidification effect by cooling down to condense the water vapor in the air. Semiconductor refrigeration chips, also called thermoelectric refrigeration chips, are a type of heat pump with a simple structure. They can be used in some scenarios where space is limited and there is no refrigerant pollution. They have the advantage of high reliability requirements. In some scenarios with high environmental humidity and high dehumidification requirements (such as electrical boxes in large energy storage devices), the dehumidification effect can be enhanced by increasing the power of semiconductor refrigeration chips. Due to the working characteristics of semiconductor refrigeration chips, as the power increases, the heat generation of the hot end will inevitably increase. If the heat cannot be effectively dissipated at the hot end, it will affect the cooling of the cold end, and then affect the dehumidification effect. How to achieve heat dissipation of high-power semiconductor dehumidifiers without affecting the condensation effect of the cold end is the problem to be solved by the utility model.

[0040] like Figure 1-7 The figure shows a schematic diagram of an embodiment of an independent heat dissipation dehumidifier provided by the utility model.

[0041] Please refer to Figure 1-7 This embodiment can achieve effective heat dissipation of high-power dehumidification, and includes a housing 1 and a control component 2. A condensation chamber 11 and a heat dissipation chamber 12 are provided inside the housing 1, and the condensation chamber 11 and the heat dissipation chamber 12 are separated by a partition 13. Both the housing 1 and the partition 13 are made of aluminum alloy material with good thermal conductivity.

[0042] A semiconductor condensation component 3 is provided in the condensation chamber 11 . The semiconductor condensation component 3 is electrically connected to the control component 2 . The heating surface of the semiconductor condensation component 3 is in contact with and connected to the partition 13 .

[0043] At least two fans are provided in the heat dissipation cavity 12, namely a first fan 4 and a second fan 5. The first fan 4 and the second fan 5 rotate in opposite or same directions. The first fan 4 and the second fan 5 are electrically connected to the control component 2 respectively. The control component 2 is provided at the upper part of the heat dissipation cavity 12, and the second fan 5 is provided at the lower part of the heat dissipation cavity 12. The first fan 4 is located between the control component 2 and the second fan 5.

[0044] The first fan 4 and the second fan 5 rotate in opposite directions to realize the circulation of air inside and outside the heat dissipation cavity, and maintain the air volume in the heat dissipation cavity 12 to realize effective heat dissipation.

[0045] In one embodiment, a plurality of first grilles 131 are provided on one side of the partition 13 located at the heat dissipation cavity 12. The first grilles 131 are oriented vertically downward, and the first grilles 131 and the partition 13 are an integrated structure. The heat exchange area is increased by the first grilles 131, and the first grilles 131 are oriented vertically downward to reduce the movement resistance of the up and down winds.

[0046] In one embodiment, the top and bottom of the heat dissipation cavity 12 are respectively provided with a first ventilation area 121 connected to the outside of the shell 1, and the two sides of the heat dissipation cavity 12 are respectively provided with a second ventilation area 122 connected to the outside of the shell 1. The surface of the shell 1 is provided with a third ventilation area 123 and a fourth ventilation area 124 connected to the heat dissipation cavity 12, the third ventilation area 123 is arranged opposite to the first fan 4, and covers the range of the positive projection of the first fan 4 on the surface of the shell 1, and the fourth ventilation area 124 is arranged opposite to the second fan 5, and covers the range of the positive projection of the second fan 5 on the surface of the shell 1.

[0047] Specifically, the first ventilation area 121 is composed of a plurality of parallel long strip through holes, the second ventilation area 122 is composed of a plurality of parallel long strip through holes, and the third ventilation area 123 and the fourth ventilation area 124 are both composed of a plurality of square through holes, and the plurality of square through holes are evenly distributed.

[0048] Multiple ventilation areas are used to achieve sufficient air circulation inside and outside the heat dissipation cavity 12.

[0049] In one embodiment, the first ventilation area 121 is used as a starting point, and one or more of the second ventilation area 122, the third ventilation area 123, and the fourth ventilation area 124 are used as an end point to form the first air duct 14. The second ventilation area 122 is used as a starting point, and one or more of the first ventilation area 121, the third ventilation area 123, and the fourth ventilation area 124 are used as an end point to form the second air duct 15. The third ventilation area 123 is used as a starting point, and one or more of the first ventilation area 121, the second ventilation area 122, and the fourth ventilation area 124 are used as an end point to form the third air duct 16. The fourth ventilation area 124 is used as a starting point, and one or more of the first ventilation area 121, the second ventilation area 122, and the third ventilation area 123 are used as an end point to form the fourth air duct 17.

[0050] The starting point and the end point of the air duct may vary according to the positive and negative rotation directions of the first fan 4 and the second fan 5. The different positions of the ventilation zones determine the flow area of ​​the air duct. The setting of the ventilation zones may cover the control component 2 in the heat dissipation cavity 12 and the first grille 131 of the entire partition 13. This embodiment takes the first fan 4 sucking air into the heat dissipation cavity 12 and the second fan 5 blowing air out of the heat dissipation cavity 12 as an example to show a situation where the air duct flows. Figure 5-6 shown.

[0051] In one embodiment, the semiconductor condensation component 3 includes a condenser 31 and a semiconductor cooling sheet 32, the heating surface of the semiconductor cooling sheet 32 ​​is in contact with the partition 13, the cooling surface of the semiconductor cooling sheet 32 ​​is in contact with the condenser 31, the semiconductor cooling sheet 32 ​​is surrounded by a heat insulation layer 33, and the semiconductor cooling sheet 32 ​​is electrically connected to the control component 2. The condenser 31 is provided with a plurality of second grids 311, and the second grids 311 are oriented vertically downward.

[0052] The second grid 311 increases the heat exchange area and is designed as an integrated unit with the condenser 31, and is made of aluminum alloy material with good thermal conductivity. The second grid 311 is oriented vertically downward, and the condensed water on its surface moves downward under the action of gravity and collects and drips.

[0053] In one embodiment, a water collecting box 34 is provided below the condenser 31, the water collecting box 34 is located inside the condensation chamber 11, and an interface 341 is provided at the bottom of the water collecting box 34 to communicate with the water collecting box 34, and the interface 341 extends out of the housing 1. The lower part of the second grille 311 is pointed, which facilitates the condensed water of the second grille 311 to collect and drip into the water collecting box 34. The water collecting box 34 collects the condensed water and transfers the condensed water through the external pipeline of the interface 341.

[0054] In one embodiment, a third fan 111 is provided above the condensation chamber 11, the third fan 111 is located above the semiconductor condensation component 3, and the third fan 111 is electrically connected to the control component 2. A fifth ventilation area 112 is provided on the top of the condensation chamber 11, and a sixth ventilation area 113 connected to the inside of the condensation chamber 11 is provided on the surface of the shell 1. The sixth ventilation area 113 is arranged opposite to the condenser 31 and covers the lower area of ​​the condenser 31. The third fan 111 is an adjustable speed fan, and the control component 2 obtains the temperature and humidity of the external environment through the temperature and humidity sensor, and then adjusts the speed of the third fan 111. By adjusting the wind speed of the third fan 111, the temperature of the condensation end is adjusted, and the technical problem that the temperature of the condensation end is not low enough and dehumidification cannot be solved in a high temperature and low humidity environment.

[0055] Furthermore, the fifth ventilation area 112 is used as the starting point or end point, the sixth ventilation area 113 is used as the end point or starting point, and the third fan 111 and the semiconductor condensation assembly 3 are passed through to form a fifth air duct 18. According to the positive and negative rotation directions of the third fan 111, the flow direction of the fifth air duct 18 will change. The third fan 111 is used to accelerate the flow of air in the condensation chamber 11, and the fifth air duct 18 passes through the condenser 31 to ensure the effect of condensation and dehumidification.

[0056] In one embodiment, the control assembly 2 includes a display screen 21, a button 22 and a circuit board 23. The circuit board 23 is disposed above the heat dissipation cavity 12 and is electrically connected to the display screen 21, the button 22, the first fan 4, the second fan 5, the third fan 111, and the semiconductor cooling sheet 32 ​​in the semiconductor condensation assembly 3. A hole is opened on the surface of the housing 1, and the display screen 21 and the button 22 are located on the circuit board 23. The display screen 21 and the button 22 are exposed from the housing 1 through the hole.

[0057] To sum up, in the dehumidifier embodiment provided by the utility model, the internal space of the shell is divided into two parts: a condensation chamber and a heat dissipation chamber. The condensation chamber is used to install the semiconductor condensation component, and the heat dissipation chamber is used to install the heat dissipation fan. The condensation chamber and the heat dissipation chamber are not connected. The heat dissipation chamber adopts a large-capacity ventilation design with multiple fans to achieve effective heat dissipation of the hot end of the semiconductor refrigeration plate, ensure the normal operation of the semiconductor refrigeration plate, and the large air volume will not affect the condensation effect of the cold end of the semiconductor refrigeration plate.

[0058] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may also be combined, the steps may be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An independent heat dissipation dehumidifier, characterized in that: It comprises a shell and a control assembly, wherein a condensation chamber and a heat dissipation chamber are arranged inside the shell, and the condensation chamber and the heat dissipation chamber are separated by a partition; A semiconductor condensation component is provided in the condensation chamber, the semiconductor condensation component is electrically connected to the control component, and the heating surface of the semiconductor condensation component is in contact with and connected to the partition; At least two fans are arranged in the heat dissipation cavity, which are a first fan and a second fan. The first fan and the second fan are electrically connected to the control component respectively. The first fan and the second fan rotate in opposite or same directions. The control component is arranged at the upper part of the heat dissipation cavity, and the second fan is arranged at the lower part of the heat dissipation cavity. The first fan is located between the control component and the second fan.

2. The independent heat dissipation dehumidifier according to claim 1, characterized in that: A plurality of first grilles are provided on one side of the partition located in the heat dissipation cavity. The first grilles are directed vertically downward, and the first grilles and the partition are an integrated structure.

3. The independent heat dissipation dehumidifier according to claim 1 or 2, characterized in that: The top and bottom of the heat dissipation cavity are respectively provided with a first ventilation area connected to the outside of the shell, and the two sides of the heat dissipation cavity are respectively provided with a second ventilation area connected to the outside of the shell; The shell surface is provided with a third ventilation area and a fourth ventilation area connected to the heat dissipation cavity. The third ventilation area is arranged opposite to the first fan and covers the range of the first fan being projected onto the shell surface. The fourth ventilation area is arranged opposite to the second fan and covers the range of the second fan being projected onto the shell surface.

4. The independent heat dissipation dehumidifier according to claim 3, characterized in that: A first air duct is formed with the first ventilation area as a starting point and one or more of the second ventilation area, the third ventilation area, and the fourth ventilation area as an end point; A second air duct is formed with the second ventilation area as a starting point and one or more of the first ventilation area, the third ventilation area, and the fourth ventilation area as an end point; A third air duct is formed with the third ventilation area as a starting point and one or more of the first ventilation area, the second ventilation area and the fourth ventilation area as an end point; A fourth air duct is formed with the fourth ventilation area as a starting point and one or more of the first ventilation area, the second ventilation area and the third ventilation area as an end point.

5. The independent heat dissipation dehumidifier according to claim 3, characterized in that: The first fan sucks air into the heat dissipation cavity, and the second fan blows air out of the heat dissipation cavity.

6. The independent heat dissipation dehumidifier according to claim 1, characterized in that: The semiconductor condensation component includes a condenser and a semiconductor cooling sheet, the heating surface of the semiconductor cooling sheet is in contact with and connected to the partition, the cooling surface of the semiconductor cooling sheet is in contact with and connected to the condenser, the semiconductor cooling sheet is surrounded by a heat insulation layer, and the semiconductor cooling sheet is electrically connected to the control component; The condenser is provided with a plurality of second grids, and the second grids are oriented vertically downward.

7. The independent heat dissipation dehumidifier according to claim 6, characterized in that: A water collecting box is provided below the condenser, the water collecting box is located inside the condensing chamber, an interface is provided at the bottom of the water collecting box to communicate with the water collecting box, and the interface extends out of the shell; The lower part of the second grid is pointed, and condensed water from the second grid is collected and dripped into the water collecting box.

8. The independent heat dissipation dehumidifier according to claim 6, characterized in that: A third fan is provided above the condensation chamber, the third fan is located above the semiconductor condensation component, the third fan is electrically connected to the control component, and the wind speed of the third fan is adjusted by the control component; A fifth ventilation area is provided on the top of the condensing chamber, and a sixth ventilation area connected to the interior of the condensing chamber is provided on the surface of the shell. The sixth ventilation area is arranged opposite to the condenser and covers the lower area of ​​the condenser.

9. The independent heat dissipation dehumidifier according to claim 8, characterized in that: With the fifth ventilation zone as the starting point or the end point, and the sixth ventilation zone as the end point or the starting point, a fifth air duct is formed through the third fan and the semiconductor condensation component.

10. The independent heat dissipation dehumidifier according to claim 1, characterized in that: The control component includes a display screen, buttons and a circuit board. The circuit board is arranged above the heat dissipation cavity and is electrically connected to the display screen, buttons, a first fan, a second fan and a semiconductor condensation component. A hole is opened on the surface of the shell, and the display screen and buttons are located on the circuit board. The display screen and buttons are exposed from the shell through the opening.

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