Computing device

Abstract

The utility model discloses computing equipment. The computing equipment comprises a shell, a fan, a plurality of fins, a heat transfer plate and a component group, the shell is provided with an air inlet and an air outlet, the air inlet is formed in the side wall of the shell, and the air outlet is formed in the top wall of the shell; the multiple fins are arranged at intervals in the first direction, an air channel is formed between every two adjacent fins, the heat transfer plate is arranged on one side of the multiple fins in the second direction, an air channel is formed between every two adjacent fins and the heat transfer plate, and the air channels communicate between the air inlet and the air outlet; the first direction is perpendicular to the second direction; the component set is arranged on the side, away from the fins, of the heat transfer plate and makes contact with the heat transfer plate for heat conduction. The computing equipment provided by the utility model has the advantages that dust carried in the air is prevented from being in direct contact with the component group, and the component group is protected.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of heat dissipation technology, and in particular to a computing device. Background Art

[0002] Computing devices refer to modern intelligent electronic devices that can perform numerical and logical calculations and have storage and memory functions. Among them, computers are the most common computing devices, which can run according to programs and automatically and quickly process massive amounts of data.

[0003] Wall-mounted computing devices have the advantages of high space utilization and hiding the circuits of electrical equipment. Most of the related wall-mounted computing devices are cooled by air cooling. Specifically, the air outside the computing device can enter the inside of the computing device under the guidance of the fan, and blow to the components inside the computing device, and take the heat of the components away from the inside of the computing device.

[0004] However, the air contains impurities. When the computing device is cooled by air, some of the impurities in the air will remain inside the computing device, affecting the operation of the computing device. Utility Model Content

[0005] The purpose of the embodiments of the present application is to provide a computing device that can solve the problem that when the computing device is cooled by air, some impurities in the air will remain inside the computing device, affecting the operation of the computing device.

[0006] To achieve the above-mentioned purpose, one aspect of an embodiment of the present application provides a computing device, including a housing, a fan, a plurality of fins, a heat transfer plate and a component group; the housing has an air inlet and an air outlet, and the air inlet is arranged on the side wall of the housing, and the air outlet is arranged on the top wall of the housing; the plurality of fins are arranged at intervals along a first direction, and an air duct is formed between two adjacent fins, the heat transfer plate is arranged on one side of the plurality of fins along a second direction, and an air duct is formed between two adjacent fins and the heat transfer plate, and the air duct is connected between the air inlet and the air outlet; the fan guides air to pass through the air inlet, the air duct and the air outlet in sequence; the first direction is perpendicular to the second direction; the component group is arranged on a side of the heat transfer plate away from the plurality of fins, and is in contact with the heat transfer plate for heat conduction.

[0007] The computing device provided in the embodiment of the present application is provided with an air inlet on the side wall of the shell and an air outlet on the top wall of the shell, so that the computing device takes in air from the side and exhausts air from the top, so as to facilitate the flow of air in the computing device; in addition, the air outside the computing device enters the inner cavity of the shell from the air inlet under the guidance of the fan, and flows out of the shell from the air outlet after passing through the air duct formed by two adjacent fins and the heat transfer plate. During the flow of air in the air duct, the heat of the component group arranged on one side of the heat transfer plate can be taken away to achieve the purpose of cooling. Compared with the related art in which air is blown directly to the electrical components, the component group of the computing device provided in the embodiment of the present application and the air transfer heat through the heat transfer plate and multiple fins, so as to avoid direct contact between dust carried in the air and the component group, and protect the component group.

[0008] Optionally, the fan is a centrifugal fan, the air inlet end of the fan faces the air inlet, and the air outlet end of the fan is connected to the air duct.

[0009] Through the above scheme, the characteristic that the air outlet direction of the centrifugal fan is perpendicular to the air outlet direction is utilized to change the flow direction of the air in the casing, which facilitates shortening the air flow path and improving the heat dissipation efficiency.

[0010] Optionally, the component group includes a first heat generating element; the computing device also includes a heat conducting component, the inner cavity of the heat conducting component is filled with a heat transfer medium, at least part of the heat conducting component crosses multiple fins, at least part of the heat conducting component is located on one side of the multiple fins along the second direction, and is in contact with the first heat generating element for heat conduction.

[0011] Through the above scheme, the heat conduction component is used to exchange heat between the first heating element, the fins and the air located in the middle of the air duct, so as to improve the heat dissipation effect of the first heating element.

[0012] Optionally, a portion of the heat-conducting component that contacts and conducts heat with the first heat-generating element has a surface that faces the first heat-generating element and is flat.

[0013] Through the above solution, the contact area between the first heating element and the heat-conducting component is increased by using the plane, thereby improving the heat transfer efficiency between the first heating element and the heat-conducting component.

[0014] Optionally, the heat conductive component includes a first tube body and a second tube body that are connected to each other; a heat transfer medium is filled in the inner cavities of the first tube body and the second tube body; the first tube body crosses multiple fins, and the cross-section of the first tube body is circular; the second tube body contacts the first heat generating element for heat conduction, and a side of the second tube body facing the first heat generating element is flat.

[0015] Through the above solution, the heat of the first heating element is transferred to the second tube body, the heat of the second tube body is transferred to the first tube body, and the heat of the first tube body is transferred to the air flowing in the air duct and the fins.

[0016] Optionally, the heat-conducting component includes a heat-conducting tube and a heat-conducting box body; the heat-conducting box body is a solid body, the heat-conducting box body is in contact with the first heat-generating element for heat conduction, and the side of the heat-conducting box body facing the first heat-generating element is a plane; the heat transfer medium is filled in the inner cavity of the heat-conducting tube, and the heat-conducting tube is passed through multiple fins and the heat-conducting box body.

[0017] Through the above solution, the heat of the first heating element is transferred to the heat-conducting box body, the heat of the heat-conducting box body is transferred to the heat-conducting pipe, and the heat of the heat-conducting pipe is transferred to the air flowing in the air duct and the fins.

[0018] Optionally, there are multiple groups of heat-conducting components, and the multiple groups of heat-conducting components are arranged on multiple fins at intervals along the flow direction of the gas.

[0019] Through the above solution, multiple heat-conducting components can be placed in the length direction of the fin.

[0020] Optionally, a thermally conductive adhesive layer is provided between the thermally conductive component and the first heating element.

[0021] Through the above solution, the heat-conducting component and the first heating element are connected by the heat-conducting adhesive layer to facilitate heat transfer.

[0022] Optionally, the component group further includes a second heating element, and a thermal conductive adhesive layer is provided between the second heating element and the heat transfer plate.

[0023] Through the above solution, the heat transfer plate and the second heating element are connected by the heat conductive adhesive layer to facilitate heat transfer.

[0024] Optionally, the multiple fins have a first end and a second end that are relatively arranged in the air flow direction; the computing device also includes a first air guide cover, which is arranged on the outside of the first ends of the multiple fins, and the first air guide cover is connected to the air outlet end of the fan.

[0025] Through the above solution, all the air flowing out from the air outlet of the fan enters the air duct to avoid air overflow.

[0026] Optionally, the computing device further includes a second air guide cover, which is disposed on the outer side of the second ends of the plurality of fins, and the second air guide cover is connected to the air outlet.

[0027] Through the above solution, all the air flowing out of the air duct can enter the air outlet to avoid air overflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 A cross-sectional view of a computing device provided in an embodiment of the present application;

[0030] Figure 2 for Figure 1 A partial schematic diagram of a computing device is shown;

[0031] Figure 3 for Figure 2 A front view of a plurality of fins of a computing device is shown;

[0032] Figure 4 A cross-sectional view of a first tube body provided in an embodiment of the present application;

[0033] Figure 5 A cross-sectional view of a second tube body provided in an embodiment of the present application;

[0034] Figure 6 A partial cross-sectional view of a heat-conducting component provided in an embodiment of the present application.

[0035] Description of reference numerals:

[0036] 100, housing; 110, air inlet; 120, air outlet;

[0037] 200, fan;

[0038] 300, fin; 310, air duct;

[0039] 410, component group; 411, first heating element; 412, second heating element; 420, circuit board;

[0040] 500, heat conduction component; 510, first tube body; 520, second tube body; 530, heat conduction pipe; 540, heat conduction box body;

[0041] 600, thermal conductive adhesive layer;

[0042] 710, a first air guide cover; 720, a second air guide cover;

[0043] 800, heat transfer medium;

[0044] 900. Heat transfer plate. DETAILED DESCRIPTION

[0045] As described in the background art, the computing device in the related art has a problem that when the computing device is cooled by air, some impurities in the air will remain inside the computing device, affecting the operation of the computing device.

[0046] In response to the above technical problems, an embodiment of the present application provides a computing device, in which the air outside the device enters the inner cavity of the shell from the air inlet under the guidance of the fan, and flows out of the shell from the air outlet after flowing through the air duct formed by two adjacent fins and the heat transfer plate. During the flow of air in the air duct, the heat of the component group arranged on one side of the heat transfer plate can be taken away to achieve the purpose of cooling. Compared with the related art in which air is blown directly to the electrical components, the component group of the computing device provided by the embodiment of the present application and the air transfer heat through the heat transfer plate and multiple fins, thereby preventing dust carried in the air from directly contacting the component group and protecting the component group.

[0047] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0048] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0049] Figure 1 A cross-sectional view of a computing device provided in an embodiment of the present application. Figure 1 The computing device provided in the embodiment of the present application may include a housing 100, a fan 200, a plurality of fins 300, a heat transfer plate 900, and a component group 410. The housing 100 may have a top wall, a bottom wall, and a side wall. The top wall and the bottom wall of the housing 100 are arranged at intervals, and the side wall of the housing 100 may be arranged between the top wall and the bottom wall of the housing 100. The bottom wall, the side wall, and the bottom wall of the housing 100 may enclose an inner cavity of the housing 100.

[0050] The computing device provided in the embodiment of the present application can be wall-mounted. In order to improve the air-cooling and heat dissipation effect of the computing device, the air inlet 110 and the air outlet 120 should be avoided as much as possible from being arranged on the side of the computing device facing the wall. In view of this, in the embodiment of the present application, the air inlet 110 is arranged on the side wall of the housing 100, and the axis of the air inlet 110 is parallel to the wall to be installed. In addition, the air outlet 120 is arranged on the top wall of the housing 100, and the top wall of the housing 100 is arranged away from the ground, so that hot air can flow out upward, so as to dissipate heat from the computing device.

[0051] Figure 2 for Figure 1 A partial schematic diagram of a computing device is shown, Figure 3 for Figure 2 A front view of a plurality of fins 300 of a computing device is shown. Figure 2 and Figure 3, the plurality of fins 300 may be spaced apart along the first direction X, that is, a distance along the first direction X may exist between two adjacent fins 300 .

[0052] refer to Figure 1-Figure 3 The heat transfer plate 900 may be disposed on one side of the plurality of fins 300 along the second direction Y, and an air duct 310 for air flow may be formed between two adjacent fins 300 and the heat transfer plate 900. The second direction Y may be perpendicular to the first direction X. In addition, the air duct 310 may be connected between the air inlet 110 and the air outlet 120 of the housing 100. Figure 1 The solid arrows in the figure indicate the direction of air flow. Figure 1 The fan 200 can guide the air outside the computing device to enter the inner cavity of the housing 100 through the air inlet 110 , and then flow out of the housing 100 from the air outlet 120 after passing through the air duct 310 .

[0053] refer to Figure 1 , the component group 410 can be arranged on a side of the heat transfer plate 900 away from the plurality of fins 300, and the component group 410 can contact the heat transfer plate 900 for heat conduction. When air flows through the air duct 310, the air can take out the heat of the heat transfer element to achieve the purpose of cooling. In addition, since the air and the component group 410 are blocked by the heat transfer plate 900, the air is prevented from blowing directly to the component group 410, thereby protecting the component group 410.

[0054] Optionally, the fan 200 may be an axial flow fan or a centrifugal fan. Among them, since the air inlet 110 is arranged on the side wall of the housing 100, and the air outlet 120 is arranged on the side wall of the housing 100, the axis of the air inlet 110 intersects with the axis of the air outlet 120. In view of this, when the fan 200 is an axial flow fan 200, since the axial fan 200 does not change the flow direction of the air, the extension direction of the first end of the air duct 310 connected to the air inlet 110 and the second end of the air duct 310 connected to the air outlet 120 intersect. Therefore, the fin 300 may include a first section and a second section, the first section may extend along the axis of the air inlet 110, the second section may extend along the axis of the air outlet 120, and the second section intersects with the first section.

[0055] In addition, when the fan 200 is a centrifugal fan, since the direction of the air passing through the centrifugal fan will change, it can be Figure 1 and Figure 2 As shown, the fan 200 is disposed between the air duct 310 and the air inlet 110 , that is, the air inlet end of the fan 200 is connected to the air inlet 110 , and the air outlet end of the fan 200 is connected to the air duct 310 .

[0056] Furthermore, the air outlet end of the fan 200 may be oriented toward the top wall of the housing 100, and the air duct 310 may be disposed along the axis of the air outlet 120 (eg, Figure 1 and Figure 2 The third direction Z) is shown so as to shorten the flow path of the air in the air duct 310 so as to improve the heat exchange speed and effect.

[0057] refer to Figure 2 Furthermore, in order to allow all the air flowing out from the air outlet of the fan 200 to enter the air duct 310 formed by the multiple fins 300, the computing device provided in the embodiment of the present application may also include a first air guide cover 710, one end of which may be connected to the air outlet of the fan 200 by means of covering, embedding, docking, etc., and the other end of the first air guide cover 710 may be covered on the outside of the first end of the multiple fins 300.

[0058] Similarly, in order to allow all the air flowing out of the air duct 310 to flow out through the air outlet 120, refer to Figure 2 Optionally, the computing device provided in the embodiment of the present application may further include a second air guide cover 720, one end of which may be connected to the air outlet 120 by means of covering, embedding, etc., and the other end of the second air guide cover 720 may be covered on the outside of the second ends of the plurality of fins 300.

[0059] refer to Figure 1 , the component group 410 can be arranged on the circuit board 420 and electrically connected through the circuit on the circuit board 420. The circuit board 420 can be fixed to the housing 100 by fasteners or the like. The component group 410 may include a first heating element 411 with a large heat generation, such as a CPU, and may also include a second heating element 412 with a relatively low heat generation, such as a converter.

[0060] It is understandable that the first heating element 411 needs more heat dissipation than the second heating element 412. In order to improve the heat dissipation effect of the first heating element 411, the first heating element 411 can be closer to the air inlet 110 than the second heating element 412, that is, the first heating element 411 and the second heating element 412 are arranged in sequence along the flow direction of the air in the air duct 310, so that the air first exchanges heat with the first heating element 411 and then exchanges heat with the second heating element 412. For example, Figure 1 In the figure, the direction indicated by arrow Z is the flow direction of air in the air duct 310, and the second heating element 412 is located on one side of the first heating element 411 in the direction indicated by arrow Z.

[0061] In addition, refer to Figure 1 and Figure 2In order to improve the heat dissipation effect of the first heat generating element 411, the computing device provided in the embodiment of the present application may further include a heat conducting component 500, and the inner cavity of the heat conducting component 500 is filled with a heat transfer medium 800. At least part of the heat conducting component 500 may cross the plurality of fins 300, and at least part of the heat conducting component 500 may be located on one side of the plurality of fins 300 along the second direction Y, and contact the first heat generating element 411 for heat conduction.

[0062] Specifically, the heat of the first heating element 411 can be transferred to the heat conducting assembly 500, and transferred to the fins 300 and the air flowing in the air duct 310 through the heat transfer medium 800 in the heat conducting assembly 500, so as to improve the heat dissipation effect of the first heating element 411. The heat transfer medium 800 can be selected from one or more of R14, 1150, R508A, R508B, R503, R116, R23, R13, R744, R170, R744A and R41. Since the heat transfer medium 800 in a supercritical state has a temperature and pressure higher than its critical point and has good diffusion performance, the heat transfer medium 800 in a supercritical state can be filled in the inner cavity of the heat conducting assembly 500. For example, R14 is in a supercritical state when the temperature is greater than -45.64°C and the pressure is greater than 3.75MPa, and the good diffusion performance of the working fluid can be used for efficient heat transfer, thereby making the thermal conductivity better and improving the thermal efficiency of the thermal conductive component 500. Optionally, the thermal conductive component 500 can be provided with a pump body that drives the flow of the heat transfer component to improve the heat transfer effect of the thermal conductive component 500.

[0063] In addition, in order to improve the heat transfer effect between the heat-conducting component 500 and the first heat-generating element 411 , optionally, the part of the heat-conducting component 500 that contacts and conducts heat with the first heat-generating element 411 may have a surface that faces the first heat-generating element 411 as a plane.

[0064] To form a plane, the heat conducting component 500 may be arranged in the following ways:

[0065] In one of the configurations of the heat conducting component 500, refer to Figure 1 and Figure 2 The heat-conducting assembly 500 may include a heat-conducting pipe 530 and a heat-conducting box body 540. The heat-conducting box body 540 may be a solid body, and the heat-conducting box body 540 and the first heating element 411 may contact each other for heat conduction, and the side of the heat-conducting box body 540 facing the first heating element 411 is a flat surface. The heat transfer medium 800 may be filled in the inner cavity of the heat-conducting pipe 530, and the heat-conducting pipe 530 may be inserted through the plurality of fins 300 and the heat-conducting box body 540.

[0066] Specifically, part of the heat of the first heating element 411 can be transferred to the heat pipe 530 through the heat conduction box 540, and then transferred to the fins 300 and the air through the heat conduction pipe 530 and the heat transfer medium 800. Another part of the heat of the first heating element 411 can be directly transferred to the air flowing in the air duct 310 through the heat conduction box 540.

[0067] Wherein, the heat-conducting box body 540 can be made of metal materials with high thermal conductivity such as copper, aluminum, copper-aluminum alloy, etc., so as to quickly transfer the heat of the first heating element 411 to the heat-conducting pipe 530. In addition, in order to improve the corrosion resistance, wear resistance and weldability of the heat-conducting box body 540, the surface of the heat-conducting box body 540 can be coated or plated with a nickel layer or other materials with high stability and corrosion resistance. In addition, the heat-conducting pipe 530 can be made of materials with good thermal conductivity such as stainless steel, copper, titanium, aluminum alloy, etc. In addition, the heat-conducting pipe 530 can be a closed ring or an unclosed ring. When the heat transfer medium 800 in the heat-conducting pipe 530 is driven by the pump body, the heat-conducting pipe 530 is a closed ring, so that the inner cavity of the heat-conducting pipe 530 forms a loop for the heat transfer medium 800 to flow.

[0068] In addition, there may be a plurality of heat pipes 530, and the plurality of heat pipes 530 may be arranged at intervals through the plurality of fins 300 along the flow direction of air in the air duct 310. Further, the plurality of heat pipes 530 may be arranged at different positions of the fins 300 in the second direction Y to facilitate heat conduction; or, the plurality of heat pipes 530 may be arranged at intervals along the second direction Y.

[0069] In another configuration of the heat conducting component 500, refer to Figure 4 and Figure 5 The heat conducting assembly 500 may include a first tube body 510 and a second tube body 520 that are connected, and a heat transfer medium 800 is filled in the inner cavities of the first tube body 510 and the second tube body 520. The first tube body 510 may cross a plurality of fins 300, and the cross-section of the first tube body 510 is circular to facilitate heat transfer of the first tube body 510. The second tube body 520 is in contact with the first heating element 411 for heat conduction, and the side of the second tube body 520 facing the first heating element 411 is a plane to facilitate heat transfer between the second tube body 520 and the first heating element 411.

[0070] The first tube body 510 can be connected to the second tube body 520 by sleeve, embedding, docking, etc. In addition, there can be multiple first tube bodies 510, and there can be multiple second tube bodies 520. The multiple first tube bodies 510 and the multiple second tube bodies 520 can be connected one by one. Figure 6 There can be multiple first tube bodies 510 and one second tube body 520 , and the multiple first tube bodies 510 are connected to at least one end of the second tube body 520 .

[0071] In addition, the plurality of first tubes 510 may be arranged at intervals through the plurality of fins 300 along the flow direction of air in the air duct 310. Further, the plurality of first tubes 510 may be arranged at different positions of the fins 300 in the second direction Y to facilitate heat conduction; or, the plurality of first tubes 510 may be arranged at intervals along the second direction Y.

[0072] Among them, the second tube body 520 can be made of a metal material with high thermal conductivity such as copper, aluminum, copper-aluminum alloy, etc., so as to quickly transfer the heat of the first heating element 411 to the first tube body 510. In addition, in order to improve the corrosion resistance, wear resistance and weldability of the second tube body 520, the surface of the second tube body 520 can be coated or plated with a material such as a nickel layer with high stability and corrosion resistance. In addition, the first tube body 510 can be made of a material with good thermal conductivity such as stainless steel, copper, titanium, aluminum alloy, etc. In addition, the first tube body 510 and the second tube body 520 can form a closed closed ring or an unclosed ring. When the heat transfer medium 800 is driven by the pump body, the first tube body 510 and the second tube body 520 can form a closed closed ring, so that the inner cavity of the first tube body 510 and the inner cavity of the second tube body 520 can form a loop for the heat transfer medium 800 to flow.

[0073] For further reference, Figure 2 In order to improve the heat transfer effect between the first heating element 411 and the heat-conducting assembly 500, a heat-conducting adhesive layer 600 may be provided between the first heating element 411 and the heat-conducting assembly 500, so as to achieve fixation and heat conduction between the first heating element 411 and the heat-conducting assembly 500 through the heat-conducting adhesive layer 600. Similarly, in order to improve the heat dissipation effect of the second heating element 412, optionally, a heat-conducting adhesive layer 600 is provided between the second heating element 412 and the heat transfer plate 900, so as to achieve fixation and heat conduction between the second heating element 412 and the heat transfer plate 900 through the heat-conducting adhesive layer 600.

[0074] The thermal conductive adhesive layer 600 can be formed by curing a thermal conductive adhesive which has good thermal conductivity, high pressure resistance, good adhesion, and good adhesion, thermal conductivity, dielectricity, and heat resistance to various materials such as aluminum, copper, stainless steel, and polycarbonate (PC).

[0075] In addition, there may be multiple second heating elements 412. In order to avoid temperature crosstalk among the multiple second heating elements 412, there may be multiple heat transfer plates 900. The multiple heat transfer plates 900 may be arranged at intervals, and the multiple heat transfer plates 900 may be arranged one by one between the multiple second heating elements 412 and the multiple fins 300.

[0076] In addition, the surface of the fin 300 may be planar, and the planar fin 300 may be conducive to the rapid circulation of air, so that heat can be quickly dissipated. Alternatively, the surface of the fin 300 may be concave-convex. For example, the surface of the fin 300 may be wavy to increase the surface area of ​​the fin 300, thereby increasing the contact area with the air, improving the heat exchange efficiency between the fin 300 and the air, and thus improving the heat dissipation performance of the fin 300. In addition, the fin 300 can be made of a metal material with good thermal conductivity such as aluminum and copper. In addition, the surface of the fin 300 may be provided with a nickel plating layer to improve the stability, corrosion resistance, and wear resistance of the fin 300, so that the service life of the fin 300 can be improved. At the same time, the nickel plating layer can ensure the weldability between the heat pipe 530 and the fin 300, or between the first tube body 510 and the fin 300. Welding can reduce the contact thermal resistance between the heat pipe 530 and the fin 300, thereby improving the heat dissipation performance between the heat pipe 530 and the fin 300, or between the first tube body 510 and the fin 300.

[0077] Among them, the terms "upper" and "lower" are used to describe the relative position relationship of each structure in the accompanying drawings, which is only for the convenience of description and is not used to limit the scope of implementation of the present application. Changes or adjustments to their relative relationships should also be regarded as the scope of implementation of the present application without substantially changing the technical content.

[0078] It should be noted that: in this application, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0079] In addition, in this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0080] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A computing device, characterized in that It comprises a housing (100), a fan (200), a plurality of fins (300), a heat transfer plate (900), and a component group (410); The housing (100) has an air inlet (110) and an air outlet (120), wherein the air inlet (110) is arranged on a side wall of the housing (100), and the air outlet (120) is arranged on a top wall of the housing (100); The plurality of fins (300) are arranged at intervals along a first direction, an air duct (310) is formed between two adjacent fins (300), the heat transfer plate (900) is arranged on one side of the plurality of fins (300) along a second direction, and an air duct (310) is formed between two adjacent fins (300) and the heat transfer plate (900), the air duct (310) being connected between the air inlet (110) and the air outlet (120); the fan (200) guides air to pass through the air inlet (110), the air duct (310) and the air outlet (120) in sequence; the first direction is perpendicular to the second direction; The component group (410) is arranged on a side of the heat transfer plate (900) away from the plurality of fins (300), and is in contact with the heat transfer plate (900) for heat conduction.

2. The computing device according to claim 1, wherein: The fan (200) is a centrifugal fan (200), the air inlet end of the fan (200) faces the air inlet (110), and the air outlet end of the fan (200) is in communication with the air duct (310).

3. The computing device according to claim 2, characterized in that The component group (410) comprises a first heat generating element (411); The computing device further comprises a heat-conducting component (500), an inner cavity of which is filled with a heat transfer medium (800), at least a portion of the heat-conducting component (500) crosses the plurality of fins (300), and at least a portion of the heat-conducting component (500) is located on one side of the plurality of fins (300) along the second direction and is in contact with the first heat-generating element (411) for heat conduction.

4. The computing device according to claim 3, characterized in that The portion of the heat-conducting component (500) that contacts and conducts heat with the first heat-generating element (411) has a surface that faces the first heat-generating element (411) and is flat.

5. The computing device according to claim 4, characterized in that The heat-conducting component (500) comprises a first tube body (510) and a second tube body (520) which are connected to each other; a heat transfer medium (800) is filled in the inner cavities of the first tube body (510) and the second tube body (520); The first tube (510) crosses the plurality of fins (300), and a cross-section of the first tube (510) is circular; The second tube (520) is in contact with the first heating element (411) for heat conduction, and a surface of the second tube (520) facing the first heating element (411) is a flat surface.

6. The computing device according to claim 4, characterized in that The heat conduction component (500) comprises a heat conduction pipe (530) and a heat conduction box body (540); The heat-conducting box body (540) is a solid body, the heat-conducting box body (540) contacts the first heating element (411) for heat conduction, and a surface of the heat-conducting box body (540) facing the first heating element (411) is a flat surface; The heat transfer medium (800) is filled in the inner cavity of the heat conducting pipe (530), and the heat conducting pipe (530) is penetrated through the plurality of fins (300) and the heat conducting box body (540).

7. The computing device according to any one of claims 3 to 6, characterized in that: The heat-conducting components (500) are multiple groups, and the multiple groups of heat-conducting components (500) are arranged on the multiple fins (300) at intervals along the flow direction of the gas.

8. The computing device according to any one of claims 3 to 6, characterized in that: A heat-conducting adhesive layer (600) is provided between the heat-conducting component (500) and the first heat-generating element (411).

9. The computing device according to claim 2, wherein: The component group (410) further comprises a second heating element (412), and a heat-conducting adhesive layer (600) is provided between the second heating element (412) and the heat transfer plate (900).

10. The computing device according to claim 2, characterized in that The plurality of fins (300) have a first end and a second end that are arranged opposite to each other in the flow direction of air; The computing device further includes at least one of a first air guide cover (710) and a second air guide cover (720); The first air guide cover (710) is arranged on the outer side of the first end of the plurality of fins (300), and the first air guide cover (710) is connected to the air outlet end of the fan (200); the second air guide cover (720) is arranged on the outer side of the second end of the plurality of fins (300), and the second air guide cover (720) is connected to the air outlet (120).

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