Liquid cooling circulation structure of computer case
By designing a liquid-cooled circulation structure in a computer chassis, the water tank and volute system are used to achieve direct contact and circulating cooling of coolant and components, the problem of insufficient heat removal caused by indirect contact of liquid is solved, and the heat dissipation effect and coolant are significantly improved. efficiency of utilization.
Patent Information
- Application Number
- CN202421026211.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2025-01-03
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In the existing liquid-cooled heat dissipation technology, the liquid comes indirectly with components such as CPU, memory, graphics card chips, etc., resulting in limited heat removal and the liquid is prone to heat up, affecting the heat dissipation effect.
Design a liquid-cooled circulation structure of computer chassis. Through the water tank and volute system, coolant is poured directly into the immersion component in the water tank, and the motor drives the first impeller to rotate, spray the liquid onto the component through the heat dissipation pipe and the nozzle to form Recycle cooling, and recondensation is achieved by evaporation and gaseous reflux to achieve liquid cooling cycle.
It improves the heat dissipation effect, ensures the coolant is in direct contact with the components, enhances the heat absorption and removal capacity, extends the service life of the coolant, and maintains the coolant temperature below 25 degrees Celsius through evaporation and condensation cycles, and continuously effectively dissipates heat.
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Figure CN222300020U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of computer liquid cooling, in particular to a computer case liquid cooling circulation structure. Background Art
[0002] Desktop computers are a common tool in our lives today. When using a computer, especially when the CPU is running at high load, it will generate a lot of heat. If the heat is not dissipated in time, it will easily cause CPU damage or even crash. Common heat dissipation systems include air cooling and liquid cooling.
[0003] Air cooling uses fans to cause high-speed air flow to take away heat from computer components such as the CPU and graphics card. The heat dissipation effect is poor. For industries such as gaming, video editing, scientific computing, 3D modeling, etc. that need to process large amounts of data and perform complex calculations, air cooling can no longer meet the needs. These industries usually use liquid cooling.
[0004] Existing liquid cooling technology mainly utilizes liquid with high specific heat (such as water), which is stored in a liquid cooling box. A simple pressure device is used to make the liquid flow in the laid pipes. The pipes filled with liquid are in contact with the CPU, graphics card and other components. The heat in the CPU, graphics card and other components is introduced into the pipes through heat conduction, and the heat is taken away by the liquid in the pipes. The liquid then flows back to the liquid cooling box, thereby achieving a circulating cooling effect.
[0005] Although liquid cooling is better than air cooling, the liquid in the liquid pipe does not directly contact the CPU, memory, graphics card chip and other components. The liquid is in indirect contact with the heat-generating parts, resulting in limited heat being removed. After working for a long time, the liquid is prone to heat up, thus affecting the heat dissipation effect.
[0006] To this end, a computer case liquid cooling circulation structure is provided. Utility Model Content
[0007] The purpose of the utility model is to provide a liquid cooling circulation structure for a computer case to solve the defect mentioned in the above background technology that the liquid in the liquid pipeline does not directly contact the CPU, memory, graphics card chip and other components, and the liquid is in indirect contact with the heating parts, resulting in limited heat taken away, and after working for a long time, the liquid is easy to heat up, thereby affecting the heat dissipation effect.
[0008] To achieve the above-mentioned purpose, a computer case liquid cooling circulation structure is provided, comprising a water tank, wherein the right side of the water tank is fixedly connected to a frame, the water tank contains fluorinated liquid, the outer side of the water tank near the lower end is fixedly connected to a motor, the water tank is fixedly connected to a volute near the front bottom, a first impeller is arranged inside the volute, the rotating shaft of the first impeller penetrates the volute and the water tank and is fixedly connected to the output shaft of the motor, and the rotating shaft of the first impeller is rotatably connected to the volute and the water tank through a sealed bearing;
[0009] 30 heat sinks are evenly and fixedly connected in the middle position of the front side of the water tank, a liquid outlet pipe is connected to the upper position of the annular outer surface of the volute, a heat sink is plugged into the heat sink, the liquid outlet of the liquid outlet pipe is connected to the liquid inlet at the lower end of the heat sink, the upper liquid outlet of the heat sink is connected to a transfer box, the upper side of the annular outer surface of the transfer box is connected to a guide pipe, the liquid outlet of the guide pipe penetrates into the water tank and is connected to a branch pipe with a U-shaped structure, and the branch pipe is evenly distributed on the nozzle.
[0010] Preferably, a cover plate is provided at the upper end of the water tank, a sealing strip is fixedly connected to the lower end surface of the cover plate corresponding to the upper end surface of the water tank, a groove matching the sealing strip is provided on the upper end surface of the water tank, a screw hole is provided on the upper end surface of the cover plate extending to the bottom of the groove, a screw is threadedly connected to the inner thread of the screw hole, a liquid filling port is provided on the cover plate near the center, a sealing plug is threadedly connected to the inner thread of the liquid filling port.
[0011] Preferably, a partition is fixedly connected inside the water tank between the frame and the volute, and five leakage holes are opened on the upper surface of the partition.
[0012] Preferably, a cover shell with a trumpet-shaped structure is fixedly inserted on the front side of the water tank near the position below the upper branch pipe, a fixing frame is fixedly connected to the inside of the cover shell, a fixed shaft is rotatably inserted at the center position of the fixing frame, a fan blade is fixedly connected to the rear end of the fixed shaft, and the front end of the fixed shaft passes through the inside of the transfer box and is fixedly connected to the second impeller.
[0013] Preferably, the front end of the housing is connected to a reflux pipe, and the liquid outlet of the reflux pipe passes through the heat sink to the inside of the water tank.
[0014] Preferably, four pillars are fixedly connected to the front side of the water tank near the four corners, and a protective plate is fixedly connected to the front end of the pillar by bolts. Through holes are opened on the front side of the protective plate at positions corresponding to the heat sink, and a cooling fan is installed in the through holes.
[0015] Compared with the prior art, the beneficial effects of the utility model are:
[0016] 1. Install the CPU, graphics card, motherboard and other components on the rack, pour the coolant directly into the water tank and immerse the CPU, graphics card, motherboard and other components, so that the CPU, graphics card, motherboard and other heat-generating components can directly contact the coolant, improve the heat dissipation effect, and set a motor to drive the first impeller in the volute to rotate so as to suck the coolant in the water tank into the volute, input the coolant into the branch pipe through the heat dissipation pipe, and spray it onto the CPU, graphics card, motherboard and other heat-generating components through the nozzle on the branch pipe. The coolant sprayed by the nozzle will enter the volute again, and then enter the branch pipe through the heat dissipation pipe, and so on. The cycle is repeated to form a liquid cooling cycle to further improve the heat dissipation effect.
[0017] 2. The coolant will be evaporated into gas after absorbing the heat from the CPU, graphics card, motherboard and other components. The coolant in the heat pipe will drive the second impeller to rotate when entering the transfer box, thereby driving the fan blades to rotate, and then the gaseous coolant floating above the water tank will enter the cover. The gaseous coolant will be cooled after entering the return pipe, thereby forming liquid coolant that will flow back to the water tank again, so that the coolant can be fully utilized. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 The utility model is a three-dimensional schematic diagram of the overall structure Figure 1 ;
[0019] Figure 2 The utility model is a three-dimensional schematic diagram of the overall structure Figure 2 ;
[0020] Figure 3 for Figure 2 Schematic cross-section diagram of
[0021] Figure 4 for Figure 1 Schematic cross-section diagram of
[0022] Figure 5 It is an exploded schematic diagram of the overall structure of the utility model;
[0023] Figure 6 This is a schematic diagram of the sealing strip position;
[0024] Figure 7 for Figure 3 A is an enlarged schematic diagram.
[0025] Description of reference numerals:
[0026] 1. Water tank; 11. Cover plate; 12. Liquid filling port; 13. Sealing strip; 14. Partition plate; 15. Heat sink; 16. Frame; 2. Protective plate; 21. Through hole; 22. Cooling fan; 3. Motor; 31. Volute; 32. First impeller; 33. Liquid outlet pipe; 34. Heat dissipation pipe; 4. Transfer box; 41. Second impeller; 42. Guide pipe; 43. Branch pipe; 5. Cover; 51. Fan blades; 52. Fixed frame; 53. Fixed shaft; 54. Reflux pipe. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0028] See also Figures 1 to 7 , the utility model provides a technical solution:
[0029] A computer case liquid cooling circulation structure includes a water tank 1, a frame 16 is fixedly connected to the right side of the water tank 1, a fluorinated liquid is contained in the water tank 1, a motor 3 is fixedly connected to the outer side of the water tank 1 near the lower end, a volute 31 is fixedly connected to the front bottom of the water tank 1, a first impeller 32 is arranged inside the volute 31, a rotating shaft of the first impeller 32 passes through the volute 31 and the water tank 1 and is fixedly connected to the output shaft of the motor 3, and the rotating shaft of the first impeller 32 is rotatably connected to the volute 31 and the water tank 1 through a sealed bearing;
[0030] Thirty heat sinks 15 are evenly and fixedly connected in the middle of the front side of the water tank 1, a liquid outlet pipe 33 is connected to the upper side of the annular outer surface of the volute 31, a heat dissipation pipe 34 is plugged into the heat sink 15, the liquid outlet of the liquid outlet pipe 33 is connected to the liquid inlet at the lower end of the heat dissipation pipe 34, the upper end of the heat dissipation pipe 34 is connected to the transfer box 4, the upper side of the annular outer surface of the transfer box 4 is connected to the guide pipe 42, the liquid outlet of the guide pipe 42 penetrates into the water tank 1 and is connected to a branch pipe 43 of a U-shaped structure, and the branch pipe 43 is evenly distributed on the nozzle;
[0031] The upper end of the water tank 1 is provided with a cover plate 11, and a sealing strip 13 is fixedly connected to the lower end surface of the cover plate 11 corresponding to the upper end surface of the water tank 1. A groove matching the sealing strip 13 is provided on the upper end surface of the water tank 1. A screw hole penetrating to the bottom of the groove is provided on the upper end surface of the cover plate 11, and a screw is connected to the inner thread of the screw hole. A liquid filling port 12 is provided on the upper surface of the cover plate 11 near the center position;
[0032] A partition plate 14 is fixedly connected between the frame 16 and the volute 31 inside the water tank 1 , and five leakage holes are formed on the upper end surface of the partition plate 14 .
[0033] By adopting the above technical solution, the water tank 1 is installed inside the computer case, and the CPU, motherboard, graphics card and other components are installed on the rack 16, and then the coolant is poured in. The coolant is a fluorinated liquid, which is a colorless, odorless, non-flammable, insulating liquid that can be used for cooling electronic equipment. The coolant is submerged in the CPU, motherboard, graphics card and other components, and then the cover plate 11 is covered, and the screws are screwed into the screw holes on the cover plate 11 to complete the sealing of the water tank 1. The upper end surface of the cover plate 11 is also provided with a data line connector installation port, and the data line connectors of the motherboard, graphics card and other components are installed in the data line connector installation port, and sealed with a sealant, and the computer data cable is connected to the data line connector installation port on the cover plate 11. The computer can be used normally by connecting the data line connector. During the use of the computer, the CPU, motherboard, graphics card and other components will gradually generate heat, and the coolant is in direct contact with the CPU, motherboard, graphics card and other components, so that the heat can be fully absorbed into the coolant, thereby improving the heat dissipation effect. When the computer is running at a high load, the heat generated by the CPU, motherboard, graphics card and other components increases. At this time, the motor 3 can be started to drive the first impeller 32 to rotate, so that the coolant in the water tank 1 is sucked into the volute 31. The coolant entering the volute 31 enters the liquid outlet pipe 33 under the action of centrifugal force, and then enters the heat dissipation pipe 34 coiled inside the heat sink 15. The coolant is then transferred to the heat dissipation pipe 34 through the transfer The cooling liquid sprayed on the CPU, motherboard, graphics card and other components flows into the bottom of the water tank 1 through the leakage hole on the partition 14, and then enters the volute 31 again, and then is transported to the branch pipe 43 and sprayed on the CPU, motherboard, graphics card and other components through the nozzle, so as to form a liquid cooling cycle, improve the fluidity of the cooling liquid, improve the effect of the cooling liquid absorbing heat, and further improve the heat dissipation effect of the CPU, motherboard, graphics card and other components. The setting of the partition 14 can make the cooling liquid sprayed on the CPU, motherboard, graphics card and other components It flows back to the bottom of the water tank 1 through the leak hole at a slower speed, ensuring the fluidity of the coolant while extending the contact time between the coolant and the CPU, motherboard, graphics card and other components, so as to fully absorb the heat emitted by the CPU, motherboard, graphics card and other components and improve the heat dissipation effect. As the coolant continues to absorb heat, the temperature of the coolant itself will increase. When the coolant passes through the heat pipe 34, the heat in the coolant will be conducted to the heat sink 15, thereby reducing the temperature of the coolant, so that the temperature of the coolant when entering the water tank 1 is always maintained below 25 degrees Celsius, so as to continuously absorb the heat generated by the CPU, motherboard, graphics card and other components to ensure the normal operation of the CPU, motherboard, graphics card and other components.
[0034] like Figure 3 , Figure 4 , Figure 5 , Figure 7As shown: a trumpet-shaped cover shell 5 is fixedly inserted at a position below the upper branch pipe 43 near the front side of the interior of the water tank 1, a fixing frame 52 is fixedly connected to the interior of the cover shell 5, a fixed shaft 53 is rotatably inserted at the center of the fixing frame 52, a fan blade 51 is fixedly connected to the rear end of the fixed shaft 53, a front end of the fixed shaft 53 penetrates into the interior of the transfer box 4 and is fixedly connected to the second impeller 41, a front end of the cover shell 5 is connected to a return pipe 54, and a liquid outlet of the return pipe 54 penetrates through the heat sink 15 to the interior of the water tank 1.
[0035] By adopting the above technical solution, since the boiling point of the fluorinated liquid is between 50 and 60 degrees Celsius, and the temperature of the CPU, motherboard, graphics card and other components will exceed 60 degrees Celsius when running under high load, the fluorinated liquid will boil and evaporate into a gaseous state. In this process, a large amount of heat emitted by the CPU, motherboard, graphics card and other components can be taken away. When the coolant in the heat dissipation pipe 34 enters the transfer box 4, it will continuously impact the second impeller 41, thereby driving the second impeller 41 to rotate, and then driving the fan blades 51 to rotate. The rotation of the fan blades 51 generates suction to suck the gaseous coolant into the cover 5, and the gaseous coolant enters the return pipe 54. Since the liquid outlet at the lower end of the return pipe 54 penetrates into the water tank 1, and The position close to the volute 31 allows the suction generated by the first impeller 32 to suck the gaseous coolant into the bottom of the water tank 1, and the return pipe 54 is coiled inside the heat sink 15, so that when the gaseous coolant passes through the heat sink 15, the heat in the gaseous coolant can be conducted to the heat sink 15, thereby condensing the gaseous coolant into liquid coolant, so that the coolant can be reused. The cover plate 11 is sealed and connected to the water tank 1 with a sealing strip 13 to prevent the gaseous coolant from volatilizing, reduce the consumption of the coolant, and save costs. The inner thread of the liquid filling port 12 is connected with a sealing plug. When coolant needs to be added, the sealing plug can be unscrewed and coolant can be added through the liquid filling port 12, which facilitates the addition of coolant.
[0036] like Figure 5 As shown: four pillars are fixedly connected to the front side of the water tank 1 near the four corners, and a protective plate 2 is fixedly connected to the front end of the pillar by bolts. A through hole 21 is opened at the front side of the protective plate 2 corresponding to the heat sink 15, and a heat dissipation fan 22 is installed in the through hole 21.
[0037] By adopting the above technical solution, by installing a cooling fan 22 on the protective plate 2, the heat on the heat sink 15 is extracted out of the chassis through the cooling fan 22, so that the heat sink 15 always maintains a low temperature, thereby being able to continuously absorb the heat of the coolant inside the heat pipe 34 and the heat in the gaseous coolant in the return pipe 54, so as to ensure that the temperature of the coolant is always maintained below 25 degrees Celsius, thereby ensuring the ability to continuously dissipate heat for components such as the CPU, motherboard, and graphics card, and ensuring the normal operation of the computer.
[0038] Working principle: Pour the coolant directly into the water tank 1 until the CPU, motherboard, graphics card and other components on the rack 16 are submerged. When the computer is running at high load, the heat generated by the CPU, motherboard, graphics card and other components increases. At this time, the motor 3 can be started to drive the first impeller 32 to rotate, so that the coolant in the water tank 1 is sucked into the volute 31. The coolant entering the volute 31 enters the liquid outlet pipe 33 under the action of centrifugal force, and then enters the heat dissipation pipe 34 coiled inside the heat sink 15. The coolant then passes through the transfer box 4 and enters the guide pipe 42. Finally, it enters the U-shaped branch pipe 43 through the guide pipe 42, and is sprayed on the CPU, motherboard, graphics card and other components through the nozzle on the branch pipe 43. The coolant sprayed on the CPU, motherboard, graphics card and other components flows into the bottom of the water tank 1 through the leakage hole on the partition 14, and then enters the volute 31 again, and then is transported to the branch pipe 43 and sprayed on the CPU, motherboard, graphics card and other components through the nozzle, so as to form a liquid cooling cycle, improve the fluidity of the coolant, improve the effect of the coolant absorbing heat, and further improve the heat dissipation effect of the CPU, motherboard, graphics card and other components.
[0039] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A computer case liquid cooling circulation structure, comprising a water tank (1), characterized in that: The right side of the water tank (1) is fixedly connected to a frame (16), the water tank (1) contains cooling liquid, the outer side of the water tank (1) is fixedly connected to a motor (3) near the lower end, the water tank (1) is fixedly connected to a volute (31) near the front bottom, the volute (31) is fixedly connected to a first impeller (32), the rotating shaft of the first impeller (32) passes through the volute (31) and the water tank (1) and is fixedly connected to the output shaft of the motor (3), and the rotating shaft of the first impeller (32) is rotatably connected to the volute (31) and the water tank (1) via a sealed bearing; Thirty heat sinks (15) are evenly and fixedly connected at the middle position of the front side of the water tank (1); a liquid outlet pipe (33) is connected to the upper position of the annular outer surface of the volute (31); a heat dissipation pipe (34) is inserted into the heat sink (15); the liquid outlet of the liquid outlet pipe (33) is connected to the liquid inlet at the lower end of the heat dissipation pipe (34); the upper end liquid outlet of the heat dissipation pipe (34) is connected to a transfer box (4); the upper side of the annular outer surface of the transfer box (4) is connected to a guide pipe (42); the liquid outlet of the guide pipe (42) penetrates into the interior of the water tank (1) and is connected to a branch pipe (43) of a U-shaped structure; the branch pipe (43) is evenly distributed on the nozzle.
2. A computer case liquid cooling circulation structure according to claim 1, characterized in that: The upper end of the water tank (1) is provided with a cover plate (11), the lower end surface of the cover plate (11) is fixedly connected with a sealing strip (13) corresponding to the upper end surface of the water tank (1), the upper end surface of the water tank (1) is provided with a groove matching the sealing strip (13), the upper end surface of the cover plate (11) is provided with a screw hole penetrating to the bottom of the groove, the screw hole is threadedly connected with a screw, and a liquid filling port (12) is provided on the upper surface of the cover plate (11) near the center, and the liquid filling port (12) is threadedly connected with a sealing plug.
3. The computer case liquid cooling circulation structure according to claim 1, characterized in that: A partition plate (14) is fixedly connected between the frame (16) and the volute (31) inside the water tank (1), and five leakage holes are formed on the upper end surface of the partition plate (14).
4. The computer case liquid cooling circulation structure according to claim 1, characterized in that: A trumpet-shaped cover shell (5) is fixedly inserted at a position below the upper branch pipe (43) near the front side of the water tank (1), a fixing frame (52) is fixedly connected to the inside of the cover shell (5), a fixing shaft (53) is rotatably inserted at the center of the fixing frame (52), a fan blade (51) is fixedly connected to the rear end of the fixing shaft (53), and a front end of the fixing shaft (53) passes through the inside of the transfer box (4) and is fixedly connected to the second impeller (41).
5. A computer case liquid cooling circulation structure according to claim 4, characterized in that: The front end of the housing (5) is connected to a return pipe (54), and the liquid outlet of the return pipe (54) passes through the heat sink (15) and penetrates into the interior of the water tank (1).
6. The computer case liquid cooling circulation structure according to claim 1, characterized in that: Four pillars are fixedly connected to the front side of the water tank (1) near the four corners, and a protective plate (2) is fixedly connected to the front end of the pillar by bolts. A through hole (21) is opened on the front side of the protective plate (2) at a position corresponding to the heat sink (15), and a heat dissipation fan (22) is installed in the through hole (21).
