Triode and electronic equipment

Abstract

The utility model relates to a triode and electronic equipment, the triode comprises a slide holder, a frame structure, a chip, a lead and a fixing mechanism, the frame structure is arranged on one side of the slide holder along a first direction, the frame structure comprises at least one of a first pole, a second pole and a control end, and the control end is used for controlling the conduction of the first pole and the second pole. The chip is arranged on one side of the slide holder in the thickness direction, and the first direction intersects with the thickness direction. The lead is connected to the chip and the frame structure. The fixing mechanism comprises a fixing piece which is fixed to the frame structure and is spaced from the frame structure in the thickness direction, and the lead part is located between the fixing piece and the frame structure. According to the embodiment of the invention, the lead and the frame structure are fixed through the fixing mechanism, and the condition that the lead is unsoldered due to the fact that the lead is too thin is avoided, so that the risk of lead connection failure is greatly reduced, and the reliability of the triode is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a triode and an electronic device. Background Art

[0002] Transistor devices are widely used in the power electronics industry and are one of the basic components of electronic products. In the process of industrial electronic upgrading, they are increasingly valued and applied. However, as the power change capability of a single transistor device can no longer meet the growing demand, how to improve the reliability of transistors has become a research direction for major manufacturers. Utility Model Content

[0003] The transistor and electronic device provided in the embodiments of the present application can utilize a fixing mechanism to stably fix the leads on the frame structure, thereby reducing the risk of failure due to lead disconnection and improving product reliability.

[0004] In a first aspect, an embodiment of the present application provides a triode, which includes a wafer stage, a frame structure, a chip, a lead, and a fixing mechanism. The frame structure is arranged on one side of the wafer stage along a first direction, and the frame structure includes at least one of a first pole, a second pole, and a control terminal, and the control terminal is used to control the conduction between the first pole and the second pole. The chip is arranged on one side in the thickness direction of the wafer stage, and the first direction intersects with the thickness direction. The lead is connected to the chip and the frame structure. The fixing mechanism includes a fixing member fixed to the frame structure and spaced apart from the frame structure in the thickness direction, and the lead portion is located between the fixing member and the frame structure.

[0005] In some embodiments, the fixing member includes a crimping portion and a connecting portion, the crimping portion is located on the side of the lead away from the frame structure, the connecting portion is located on at least one side of the crimping portion along the second direction and is connected to the crimping portion and the frame structure, and the first direction, the second direction and the thickness direction intersect each other.

[0006] In some embodiments, the frame structure includes a first surface, which is a surface of the frame structure close to the lead. A fixing hole is provided on the frame structure, which is recessed along the thickness direction of the frame structure by the first surface, and the connecting portion is located in the fixing hole and fixed in the fixing hole.

[0007] In some embodiments, a clamping portion is provided at one end of the connecting portion away from the crimping portion, a clamping groove is provided on the hole wall of the fixing hole, and the clamping portion is clamped in the clamping groove.

[0008] In some embodiments, the fixing hole is arranged through the frame structure in the thickness direction, the connecting portion includes a first connecting portion and a second connecting portion connected by bending, and an end of the first connecting portion away from the second connecting portion is connected to the crimping portion;

[0009] The first connecting portion is at least partially located in the fixing hole, and the crimping portion and the second connecting portion are arranged on both sides of the frame structure along the thickness direction.

[0010] In some embodiments, the fixing hole is arranged through the frame structure along the thickness direction, and two fixing holes and two connecting parts are arranged. The connecting parts are arranged in one-to-one correspondence with the fixing holes. The connecting part at least partially passes through the fixing hole and is located on the side of the frame structure away from the crimping part. A through hole is opened on the passing part of the connecting part, and the fastener can pass through the two through holes in sequence to fix the relative position between the two connecting parts.

[0011] In some embodiments, the first connection end of the lead is arranged on the frame structure along the first direction, two fixing holes are provided and are arranged on both sides of the first connection end along the second direction, two connecting parts are provided and are respectively arranged on both sides of the crimping part, and the two connecting parts are respectively fixed in the two fixing holes.

[0012] In some embodiments, the fixing mechanism further includes a limiting portion, which at least partially fills the fixing hole to fix the connecting portion to the fixing hole.

[0013] In some embodiments, the lead includes a first lead and a second lead, one end of the first lead is connected to the first pole of the chip, and the other end is connected to the first pole of the frame structure, one end of the second lead is connected to the second pole of the chip, and the other end is connected to the second pole of the frame structure, the diameter of the first lead is smaller than the diameter of the second lead, and the fixing mechanism is used to fix the first connecting end of the first lead to the frame structure.

[0014] In a second aspect, an embodiment of the present application provides an electronic device, comprising the transistor in any of the aforementioned embodiments.

[0015] According to an embodiment of the present application, a transistor and an electronic device are provided, in which one end of the transistor lead connected to the frame structure is fixed on the frame structure by a fixing mechanism, so that the lead can be stably connected to the frame, avoiding the situation where the lead is desoldered due to the lead being too thin, thereby greatly reducing the risk of lead connection failure, improving the reliability of the transistor, and thus greatly extending the service life of the transistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments of the utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0018] Figure 1 A schematic diagram of the structure of a triode provided in some embodiments of the present application;

[0019] Figure 2 A partial structural schematic diagram of another triode provided in some embodiments of the present application;

[0020] Figure 3 A structural schematic diagram of a fixing mechanism and a frame structure of another triode provided in some embodiments of the present application;

[0021] Figure 4 A structural schematic diagram of a fixing mechanism and a frame structure of another triode provided in some embodiments of the present application;

[0022] Figure 5 for Figure 4 A partial enlarged view of the middle A;

[0023] Figure 6 A structural schematic diagram of a fixing mechanism and a frame structure of another triode provided in some embodiments of the present application;

[0024] Figure 7 for Figure 6 A partial enlarged view of point B in the middle;

[0025] Figure 8 A structural schematic diagram of a fixing mechanism and a frame structure of another triode provided in some embodiments of the present application;

[0026] Fig. 9 A structural schematic diagram of a fixing mechanism and a frame structure of a transistor is also provided for some embodiments of the present application.

[0027] Marking Description:

[0028] 10. Slide stage; 11. Fixing slot;

[0029] 20. frame structure; 21. fixing hole; 211. slot; 22. first pin; 23. second pin; 24. third pin; 25. connecting frame; 26. first block; 27. second block;

[0030] 30. chip; 31. first pole; 32. second pole;

[0031] 40. lead wire; 41. first lead wire; 42. second lead wire;

[0032] 50. fixing mechanism; 51. fixing member; 511. crimping portion; 512. connecting portion; 513. clamping portion; 514. fastener; 52. limiting portion;

[0033] X, first direction; Y, second direction; Z, thickness direction.

[0034] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0035] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0036] Transistor devices are widely used in the power electronics industry and are one of the basic components of electronic products. In the process of industrial electronic upgrading, they are increasingly valued and applied. However, with the advancement of science and technology and the development of informatics, the market has higher and higher requirements for transistor devices. The power change capability of a single transistor device can no longer meet the growing demand. How to improve the reliability of transistors has become a research direction for major manufacturers.

[0037] At present, for triode devices, in order to improve their transmission efficiency and utilization, the gate pad area is usually designed to be as small as possible to increase the source area. Due to the small gate pad and only used for single transmission, the gate lead 40 size also adopts a thinner lead 40. However, when a thinner lead 40 is bonded to the frame structure 20, the bonding joint of the lead 40 is at risk of being lifted and desoldered due to the thinner lead 40 resulting in a smaller solder joint, especially the aluminum wire on the nickel-plated frame structure. Compared with copper, epoxy molding compound (EMC) has weaker adhesion to the nickel surface. Therefore, when the electromagnetic compatibility interface and the frame structure are delaminated, the bonding joint will be peeled off by the frame structure and the device will be in a disconnected state.

[0038] In the actual application process of the bonding aluminum wire and the frame structure, when the bonding aluminum wire and the frame structure are in a high temperature environment, due to the mismatch of the thermal expansion coefficients of the aluminum wire, the plastic packaging material and the frame structure, the connection between the aluminum wire and the frame structure will be subjected to uneven thermal expansion stress, resulting in stress concentration at the solder joints, thereby causing the solder joints to desolder. Therefore, in the extreme application process of the bonding aluminum wire and the frame structure, the lead solder joints and the frame structure are prone to delamination and desoldering, resulting in device failure and affecting the service life of the device.

[0039] First, as Figure 1-Figure 2As shown, an embodiment of the present application provides a triode, which includes a wafer stage 10, a frame structure 20, a chip 30, a lead 40 and a fixing mechanism 50. The frame structure 20 is arranged on one side of the wafer stage 10 along the first direction X, and the frame structure 20 includes at least one of a first pole 31, a second pole 32 and a control terminal, and the control terminal is used to control the conduction between the first pole 31 and the second pole 32. The chip 30 is arranged on one side of the wafer stage 10 in the thickness direction Z, and the first direction X intersects with the thickness direction Z. The lead 40 connects the chip 30 and the frame structure 20. The fixing mechanism 50 includes a fixing member 51 fixed to the frame structure 20 and spaced apart from the frame structure 20 in the thickness direction Z, and a portion of the lead 40 is located between the fixing member 51 and the frame structure 20.

[0040] In the embodiment of the present application, one end of the lead 40 connected to the frame structure 20 is fixed on the frame structure 20 by a fixing mechanism 50, so that the lead 40 can be stably connected to the frame structure 20, avoiding the situation where the lead 40 is lifted due to the lead 40 being too thin, thereby greatly reducing the risk of connection failure of the lead 40, improving the reliability of the transistor, and thus greatly extending the service life of the transistor.

[0041] Transistors are widely used in the power electronics industry and are one of the basic components of electronic products. Transistors can be used in a variety of scenarios. For example, transistors can be used in integrated circuits, flat panel displays, optoelectronic devices, etc. in the electronics field. Of course, transistors can also be used in other required devices or scenarios, and this is not limited in the embodiments of this application.

[0042] The wafer carrier 10 is a carrier of the triode structure, and is used to support and carry electronic components to form a base of an electronic circuit. In the embodiment of the present application, the wafer carrier 10 is used to support and carry a chip 30 .

[0043] The frame structure 20 is the basic component of the transistor mechanism, which is used to realize the electrical connection between the internal circuit lead-out terminal of the chip 30 and the external lead 40, forming a key structural part of the electrical circuit, and serves as a bridge for connecting with external wires. The wire structure is required in most transistors and semiconductors, and is an important part of the electronic information industry.

[0044] In the embodiment of the present application, the frame structure 20 includes a first pin 22, a second pin 222 and a third pin 223. The frame structure 20 also includes a connecting frame 25. The first pin 22, the second pin 222 and the third pin 223 are all fixed on the connecting frame 25. The second pin 222 extends along the first direction X to the wafer stage 10 and is fixedly connected to the wafer stage 10.

[0045] The frame structure 20 is arranged on one side of the wafer stage 10 along the first direction X. Optionally, in some embodiments, the wafer stage 10 and the frame structure 20 are an integrally formed structure. By arranging the wafer stage 10 and the frame structure 20 as an integrally formed structure, on the one hand, there is no need to connect the wafer stage 10 and the frame structure 20 through additional connection processes such as welding or bonding, thereby simplifying the manufacturing process flow. At the same time, compared with connecting the wafer stage 10 and the frame structure 20 through connection processes such as welding or bonding, the wafer stage 10 and the frame structure 20 having an integrated structure have a higher connection firmness, thereby being able to improve the overall structural strength of the transistor. Of course, in other embodiments, the wafer stage 10 and the frame structure 20 may also adopt a split structure, which are prepared separately and then connected and fixed by welding or the like, which will not be repeated here.

[0046] The chip 30 is a core component of the triode structure, and is used to perform functions such as calculation and storage. In the embodiment of the present application, the chip 30 is disposed on the wafer stage 10 .

[0047] In this embodiment, the first pole 31 of the chip 30 is a gate, the second pole 32 is a source, the frame structure 20 includes a first pin 22, a second pin 222 and a third pin 223, the first pin 22 is provided with a first pole 31, the first pole 31 is a gate region, the third pin 223 is provided with a second pole 32, the second pole 32 is a source region, the second pin 222 is fixedly connected to the wafer stage 10, the second pin 222 is provided with a third pole, the third pole is a drain region.

[0048] Drain (Collector): The drain is the output terminal, responsible for receiving the output current and outputting it to other circuits. In a triode, the drain is equivalent to the collector.

[0049] Source (Emitter): The source is the input terminal, responsible for inputting the reference current and controlling the working state of the transistor. In the transistor, the source is equivalent to the emitter.

[0050] Gate (Base): The gate is the control terminal, which controls the current amplification of the transistor or controls the on-off between the source and the drain by controlling the current or voltage. In the transistor, the gate is equivalent to the base.

[0051] Of course, in other embodiments, the chip 30 may be configured as a collector, an emitter and a base. Similarly, corresponding collector regions, emitter regions and base regions are respectively configured on the frame structure 20 connected to the chip 30 .

[0052] In addition, other relevant principles of the transistor are not described here.

[0053] The leads 40 are used to connect the chip 30 and the frame structure 20 to form a complete electronic circuit.

[0054] Optionally, the material of the lead 40 includes aluminum. The price of aluminum wire is cheaper than that of the lead 40 made of other materials. Using aluminum wire as the lead 40 can greatly reduce the production cost of the entire transistor structure. The aluminum wire is light in texture and can greatly reduce the weight of the entire transistor structure, thereby making the weight of the electronic device made of the transistor lighter. In addition, the aluminum wire has good anti-oxidation and corrosion resistance, which can greatly extend the service life of the transistor and enhance the reliability of the transistor structure.

[0055] Optionally, the material of the lead 40 also includes copper. The lead 40 made of copper has higher electrical conductivity, thermal conductivity, better mechanical properties and lower thermal expansion coefficient than the lead 40 made of aluminum. Of course, in other embodiments, the lead 40 can also be made of other materials, which will not be repeated here.

[0056] The fixing mechanism 50 is used to fix one end of the lead 40 connected to the frame structure 20 on the frame structure 20. The fixing mechanism 50 includes a fixing member 51 fixed to the frame structure 20 and spaced apart from the frame structure 20 in the thickness direction Z, and a portion of the lead 40 is located between the fixing member 51 and the frame structure 20.

[0057] In the embodiment of the present application, the fixing member 51 is fixed to the frame structure 20, and the lead 40 is arranged between the fixing member 51 and the frame structure 20, so as to limit the position of the end of the lead 40 connected to the frame structure 20 on the frame structure 20, so that the lead 40 can be stably connected to the frame structure 20, avoiding the situation where the lead 40 is lifted due to the lead 40 being too thin, thereby greatly reducing the risk of connection failure of the lead 40, improving the reliability of the transistor, and thus greatly extending the service life of the transistor.

[0058] The two ends of the fixing member 51 can be fixedly connected by welding, or threaded holes can be opened on the fixing member 51 and the frame structure 20 and fixedly connected by bolts. The specific connection method is not limited here.

[0059] In order to achieve a good match with the aluminum lead 40, the material of the fixing member 51 may also include aluminum. The buffer layer made of aluminum has good anti-oxidation and corrosion resistance, and has a good match with the aluminum lead 40. At the same time, when the lead 40 is replaced with other materials, the material of the fixing member 51 may also be changed together with the material of the lead 40.

[0060] Optionally, the fixing member 51 may also be made of a material different from that of the lead 40, but the hardness of the material should be close to that of the lead 40, so as to avoid damage to the lead 40 when the fixing member 51 fixes the lead 40 due to excessive hardness of the fixing member 51.

[0061] In addition, it should be noted that the fixing mechanism 50 for fixing the lead 40 provided in the embodiment of the present application can be used in the semiconductor field to fix the position of the lead 40, and can also be applied to other technical fields. In other words, as long as the position of the lead 40, bonding wire, connecting wire and other wire harnesses need to be fixed, and there are certain requirements for the reliability of the connection of the lead 40, the fixing mechanism 50 provided in the embodiment of the present application can be used.

[0062] like Figure 3 As shown, the fixing member 51 includes a crimping portion 511 and a connecting portion 512, the crimping portion 511 is located on the side of the lead 40 away from the frame structure 20, the connecting portion 512 is located on at least one side of the crimping portion 511 along the second direction Y, and is connected to the crimping portion 511 and the frame structure 20, and the first direction X, the second direction Y and the thickness direction Z intersect each other.

[0063] The crimping portion 511 is located on the side of the lead 40 away from the frame structure 20. The crimping portion 511 is used to define the position of the lead 40 on the frame structure 20, and a connecting portion 512 is provided on the crimping portion 511 at the same time. One end of the connecting portion 512 is connected to the crimping portion 511, and the other end is connected to the frame structure 20, thereby fixing the position of the crimping portion 511, making the position definition of the lead 40 by the crimping portion 511 more stable and reliable.

[0064] Optionally, there are two connecting parts 512, which are respectively arranged at the two ends of the crimping part 511, so as to fix both ends of the crimping part 511, thereby limiting the position of the crimping part 511 relative to the lead 40, achieving stable fixation of the lead 40, and improving the reliability of fixation. The connecting part 512 and the frame structure 20 can be fixedly connected by welding, or by opening threaded holes in the connecting part 512 and the frame structure 20 and fixing them by bolts. The specific connection method is not limited here.

[0065] In addition, in order to reduce the production cost of the fixing member 51, the connecting portion 512 can also be provided as one, and fixedly connected to one side of the crimping portion 511. The connecting portion 512 and the crimping portion 511 are respectively fixedly connected to the frame structure 20 by welding, or threaded holes are opened in the connecting portion 512, the crimping portion 511 and the frame structure 20 to be fixedly connected by bolts, and the specific connection method is not limited here.

[0066] It should be noted that, in the embodiment of the present application, the first direction X, the second direction Y and the thickness direction Z are three different directions. Optionally, the first direction X, the second direction Y and the thickness direction Z are arranged perpendicular to each other.

[0067] like Figure 4-Figure 9As shown, the frame structure 20 includes a first surface, which is a surface of the frame structure 20 close to the lead 40. A fixing hole 21 is provided on the frame structure 20. The fixing hole 21 is recessed along the thickness direction Z of the frame structure 20 by the first surface, and the connecting portion 512 is located in the fixing hole 21 and fixed in the fixing hole 21.

[0068] By opening a fixing hole 21 on the frame structure 20, the connecting portion 512 can extend into the fixing hole 21 and be fixedly connected to the fixing hole 21, so that the fixation of the fixing member 51 on the frame structure 20 is more stable and the area occupied by the fixing member 51 on the first surface of the frame structure 20 can be reduced.

[0069] Optionally, the fixing hole 21 may be a through hole formed by a depression of the first surface along the thickness direction Z of the frame structure 20 , or may be a countersunk hole formed by a depression of the first surface along the thickness direction Z of the frame structure 20 .

[0070] Among them, making the fixing hole 21 into a countersunk hole can prevent dust or other impurities from entering the interior of the transistor structure through the fixing hole 21 during the use of the transistor, thereby affecting the connection between the chip 30 and the lead 40 and the frame structure 20, affecting the connection effect between the lead 40 and the frame structure 20, and reducing the reliability of the transistor structure.

[0071] In addition, it is relatively easier to make the fixing hole 21 into a through hole than into a countersunk hole. Because the thickness of the frame structure 20 is relatively thin, in the process of making the fixing hole 21, it is more convenient to directly penetrate the frame structure 20 to make a through hole than to make a countersunk hole.

[0072] like Figure 4-Figure 7 As shown, a clamping portion 513 is provided at one end of the connecting portion 512 away from the crimping portion 511 , a clamping groove 211 is provided on the hole wall of the fixing hole 21 , and the clamping portion 513 is clamped in the clamping groove 211 .

[0073] For ease of understanding, in the embodiment of the present application, the fixing holes 21 separate the frame structure 20 into the first block 26 and the second block 27 , and the fixing member 51 fixes the lead 40 on the first block 26 .

[0074] like Figure 4-Figure 5 As shown, optionally, the card slot 211 is arranged on the side wall of the first block 26 along the second direction Y, and the clamping portion 513 is clamped in the card slot 211. In addition, the card slot 211, the connecting portion 512 and the clamping portion 513 can be provided with two, and the two card slots 211 are arranged on the side walls of the first block 26 along the second direction Y on both sides.

[0075] In addition, if Figure 6-Figure 7As shown, the card slot 211 can also be arranged on the side wall of the second block 27 along the second direction Y. Similarly, in this arrangement, two card slots 211 can also be arranged, and the second block 27 is provided with two and is arranged on both sides of the first block 26 along the second direction Y, and the two card slots 211 are arranged on the side walls of the two second blocks 27 along the second direction Y.

[0076] Compared with the traditional welding connection method, the clamping connection method does not require the use of high-temperature welding equipment, and the installation site is safer without open flames, while reducing production costs and installation difficulties. In addition, the clamping connection method is easy and quick to operate, which can save tedious preparation work and waiting time, improve construction efficiency, and save time costs. In addition, the clamping connection method not only has a low operating cost, but can also be disassembled during inspection and maintenance, and can be reused after disassembly, thereby reducing material loss and energy consumption, reducing system operating costs, and is an economical and practical connection method.

[0077] like Figure 8 As shown, the fixing hole 21 is arranged through the frame structure 20 along the thickness direction Z, and the connecting portion 512 includes a first connecting portion and a second connecting portion that are bent and connected, and one end of the first connecting portion away from the second connecting portion is connected to the crimping portion 511; the first connecting portion is at least partially located in the fixing hole 21, and the crimping portion 511 and the second connecting portion are arranged on both sides of the frame structure 20 along the thickness direction Z.

[0078] In the embodiment of the present application, the connecting portion 512 is arranged to be a first connecting portion and a second connecting portion that are bent and connected, and the lead 40 is abutted against the frame structure 20 through the crimping portion 511, the first connecting portion abuts against the hole wall of the fixing hole 21, the second connecting portion abuts against the second surface of the frame structure 20, and the second surface of the frame structure 20 is located on a side of the frame structure 20 away from the lead 40, so that the lead 40 is stably fixed on the frame structure 20, thereby greatly reducing the risk of connection failure of the lead 40, improving the reliability of the transistor, and thus greatly extending the service life of the transistor.

[0079] In addition, the crimping portion 511 and the second connecting portion can be arranged on both sides of the frame structure 20 along the thickness direction Z. However, when the crimping portion 511 is pressed on the lead 40 under the action of gravity to fix the lead 40 on the frame structure 20, the second connecting portion does not abut against the second surface of the frame structure 20, thereby providing a certain floating space for the lead 40. During the use of the transistor, the lead 40 expands due to thermal expansion force, so that the lead 40 will not be deformed due to the expansion and the mutual squeezing of the fixing part 51, thereby greatly reducing the risk of connection failure of the lead 40 and improving the reliability of the transistor.

[0080] like Fig. 9As shown, the fixing hole 21 is arranged through the frame structure 20 along the thickness direction Z, and two fixing holes 21 and connecting parts 512 are each provided, and the connecting parts 512 are arranged one-to-one with the fixing holes 21. The connecting parts 512 at least partially pass through the fixing holes 21 and are located on the side of the frame structure 20 away from the crimping part 511. A through hole is opened on the passing part of the connecting part 512, and the fastener 514 can pass through the two through holes in sequence to fix the relative position between the two connecting parts 512.

[0081] In the embodiment of the present application, the end of the connecting portion 512 away from the crimping portion 511 is extended out of the fixing hole 21, and a through hole is provided on the extended portion, and the fastener 514 is passed through the two through holes, so as to fix the position of the fixing member 51, thereby fixing the position of the lead 40 on the frame structure 20. This embodiment is also the same as the above embodiment, and the fastener 514 does not abut the second surface of the frame structure 20, so as to provide a certain floating space for the lead 40.

[0082] like Figure 1-Figure 2 As shown, the first connection end of the lead 40 is arranged on the frame structure 20 along the first direction X, two fixing holes 21 are provided, and are arranged on both sides of the first connection end along the second direction Y, two connecting parts 512 are provided, and are respectively arranged on both sides of the crimping part 511, and the two connecting parts 512 are respectively fixed in the two fixing holes 21.

[0083] The first connection end of the lead 40 in the embodiment of the present application is arranged on the frame structure 20 along the first direction X, the fixing holes 21 are arranged at intervals along the second direction Y, and the crimping portion 511 is also arranged along the second direction Y, which can avoid interference between the lead 40 and the fixing member 51, affect the arrangement of the lead 40, and reduce the fixing effect of the fixing member 51 on the lead 40.

[0084] like Figure 8-Figure 9 As shown, the fixing mechanism 50 further includes a limiting portion 52 , and the limiting portion 52 is at least partially filled in the fixing hole 21 to fix the connecting portion 512 to the fixing hole 21 .

[0085] By filling the limiting portion 52 into the fixing hole 21, the limiting portion 52 is fully abutted against the connecting portion 512, so that the connecting portion 512 abuts against the hole wall of the fixing hole 21, thereby limiting the position of the fixing member 51, thereby greatly improving the stability of the fixing mechanism 50 and improving the reliability of the transistor.

[0086] In the embodiment of the present application, the limiting portion 52 is made of epoxy molding compound (EMC-Epoxy Molding Compound), which has strong adhesion and can be fully filled in the fixing hole 21 to limit the position of the fixing member 51. In addition, the epoxy molding compound has good heat resistance and electrical insulation, which can greatly improve the stability of the fixing mechanism 50 and improve the reliability of the transistor.

[0087] In addition, the limiting portion 52 can be set in the fixing hole 21 that is set through, and can also be set in the fixing hole 21 that is recessed to form a countersunk hole to limit the position of the fixing member 51, thereby greatly improving the stability of the fixing mechanism 50 and improving the reliability of the transistor.

[0088] like Figure 1-Figure 2 As shown, the lead 40 includes a first lead 41 and a second lead 42. One end of the first lead 41 is connected to the first pole 31 of the chip 30, and the other end is connected to the first pole 31 of the frame structure 20. One end of the second lead 42 is connected to the second pole 32 of the chip 30, and the other end is connected to the second pole 32 of the frame structure 20. The diameter of the first lead 41 is smaller than the diameter of the second lead 42. The fixing mechanism 50 is used to fix the first connection end of the first lead 41 to the frame structure 20.

[0089] In the embodiment of the present application, the first pole 31 and the second pole 32 of the chip 30 are arranged along the second direction Y, and the first lead 41 and the second lead 42 respectively extend away from each other and are respectively connected to the first pole 31 and the second pole 32 of the frame structure 20, thereby avoiding entanglement and interference between the multiple leads 40.

[0090] like Figure 1-Figure 2 As shown, the transistor in the embodiment of the present application further includes a heat dissipation mechanism, which includes a heat sink. A fixing groove 11 is provided on the wafer carrier 10, and the heat sink is arranged in the fixing groove 11.

[0091] It should be noted that, depending on actual needs, the heat dissipation mechanism in the embodiment of the present application may also choose to include a temperature control unit, or the heat dissipation mechanism may also choose not to include a temperature control unit. The heat dissipation mechanism also includes a temperature control unit, which is arranged on the chip 30. The temperature control unit can detect the temperature of the chip 30, and the temperature control unit is electrically connected to the heat sink. When the temperature control unit detects that the chip 30 exceeds the preset temperature, the temperature control unit can control the heat sink to start working and dissipate heat for the chip 30. When the temperature control unit detects that the temperature of the chip 30 drops below the preset temperature, the temperature control unit can control the heat sink to stop working. By controlling the opening and closing of the heat sink by the temperature control unit, precise control of the temperature of the chip 30 can be achieved, and it can be avoided that the heat sink continues to work after the temperature of the chip 30 drops below the preset temperature, resulting in energy waste.

[0092] By providing a fixing groove 11 on the wafer stage 10, the heat sink can be quickly installed and removed, which can greatly improve the installation efficiency of the transistor structure. When the heat sink fails, it can be easily repaired, quickly removed and repaired, which greatly improves the repair efficiency. In the embodiment of the present application, the heat sink is fixed in the fixing groove 11 by a fixing method of a cam and a slot 211. A cam is provided on one of the heat sink and the fixing groove 11, and a slot 211 is provided on the other of the heat sink and the fixing groove 11. The fixing method of the cam and the slot 211 can not only achieve stable fixation of the heat sink in the fixing groove 11, but also achieve rapid installation and removal of the heat sink relative to the fixing groove 11.

[0093] Optionally, the contour shape of the fixing groove 11 may be matched with the outer contour of the heat sink.

[0094] In other embodiments, the heat sink may be connected to the fixing groove 11 by welding or bolting. In this way, the heat sink can be stably fixed in the fixing groove 11, which can reduce the risk of relative movement of the heat sink due to factors such as vibration or impact, and improve the reliability of the relative position between the heat sink and the fixing groove 11.

[0095] The transistor also includes an outer shell, in which a receiving cavity is provided, the wafer carrier 10 and a part of the frame structure 20 are located in the receiving cavity, and the first pin, the second pin and the third pin are partially located outside the receiving cavity.

[0096] The outer shell can protect the transistor, reduce the impact of external vibration and impact on the transistor, and can also reduce the intrusion of impurities such as dust into the transistor, playing a certain dust-proof role.

[0097] A limiting mechanism is also provided in the outer shell. The limiting mechanism is located in the accommodating cavity. The limiting mechanism is fixedly connected to the semiconductor bonding structure. The limiting mechanism can fix the relative position of the wafer stage 10 and part of the frame structure 20 in the accommodating cavity.

[0098] In a second aspect, an embodiment of the present application provides an electronic device, comprising the transistor in any of the aforementioned embodiments.

[0099] It should be noted that the electronic devices provided in the embodiments of the present application include various types, such as flat panel displays, optoelectronic devices, etc. In addition, the electronic devices provided in the embodiments of the present application have the beneficial effects of the triode in any of the aforementioned embodiments. For details, please refer to the aforementioned description of the beneficial effects of the triode, which will not be repeated in the embodiments of the present application.

[0100] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. A triode, characterized in that: include: Slide stage, A frame structure is arranged on one side of the wafer stage along a first direction, the frame structure includes at least one of a first pole, a second pole and a control end, and the control end is used to control conduction between the first pole and the second pole; A chip is arranged on one side of the wafer carrier in a thickness direction, wherein the first direction intersects with the thickness direction; Leads, connected to the chip and the frame structure; The fixing mechanism includes a fixing piece fixed to the frame structure and spaced apart from the frame structure in the thickness direction, and the lead part is located between the fixing piece and the frame structure.

2. The triode according to claim 1, characterized in that: The fixing member includes a crimping portion and a connecting portion, the crimping portion is located on the side of the lead away from the frame structure, the connecting portion is located on at least one side of the crimping portion along the second direction and is connected to the crimping portion and the frame structure, and the first direction, the second direction and the thickness direction intersect each other.

3. The transistor according to claim 2, characterized in that: The frame structure includes a first surface, which is a surface of the frame structure close to the lead. A fixing hole is provided on the frame structure, and the fixing hole is recessed from the first surface along the thickness direction of the frame structure. The connecting portion is located in the fixing hole and fixed in the fixing hole.

4. The triode according to claim 3, characterized in that: A clamping portion is provided at one end of the connecting portion away from the crimping portion, a clamping groove is provided on the hole wall of the fixing hole, and the clamping portion is clamped in the clamping groove.

5. The transistor according to claim 3, characterized in that: The fixing hole is arranged through the frame structure along the thickness direction, the connecting portion comprises a first connecting portion and a second connecting portion which are bent and connected, and one end of the first connecting portion away from the second connecting portion is connected to the crimping portion; The first connecting portion is at least partially located in the fixing hole, and the crimping portion and the second connecting portion are arranged on both sides of the frame structure along the thickness direction.

6. The transistor according to claim 3, characterized in that: The fixing hole is arranged through the frame structure along the thickness direction, and two fixing holes and two connecting parts are each provided. The connecting parts are arranged in a one-to-one correspondence with the fixing holes. The connecting part at least partially passes through the fixing hole and is located on a side of the frame structure away from the crimping part. A through hole is opened on the passing part of the connecting part, and a fastener can pass through the two through holes in sequence to fix the relative position between the two connecting parts.

7. The transistor according to claim 3, characterized in that: The first connection end of the lead is arranged on the frame structure along the first direction, two fixing holes are provided and are arranged on both sides of the first connection end along the second direction, two connecting parts are provided and are respectively arranged on both sides of the crimping part, and the two connecting parts are respectively fixed in the two fixing holes.

8. The transistor according to claim 3, characterized in that: The fixing mechanism further includes a limiting portion, and the limiting portion is at least partially filled in the fixing hole to fix the connecting portion to the fixing hole.

9. The triode according to claim 1, characterized in that: The lead includes a first lead and a second lead, one end of the first lead is connected to the first pole of the chip, and the other end is connected to the first pole of the frame structure, one end of the second lead is connected to the second pole of the chip, and the other end is connected to the second pole of the frame structure, the diameter of the first lead is smaller than the diameter of the second lead, and the fixing mechanism is used to fix the first connection end of the first lead to the frame structure.

10. An electronic device, characterized in that: The invention comprises the triode as described in any one of claims 1 to 9.

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