Semiconductor laser module cooling device

Abstract

The utility model provides a semiconductor laser module cooling device. The semiconductor laser module cooling device comprises a water-cooling heat dissipation unit and an air-cooling heat dissipation unit. The water-cooling heat dissipation unit comprises a radiator, a heat dissipation plate, a sealing plate and a water-cooling machine, and the air-cooling heat dissipation unit comprises an air-cooling heat dissipation assembly; the radiator and the heat dissipation plate are installed in a sealed mode, the sealing plate is installed on the heat dissipation plate, the water cooling machine supplies circulating cooling water to the radiator, and the air cooling heat dissipation assemblies are installed at the two ends of the radiator. In the water-cooling heat dissipation unit, cooling water enters a sealing plate through a heat dissipation plate circulation opening and then flows into another cold water tank of the heat dissipation device through the sealing plate, so that the contact area between the cooling water and the heat dissipation plate is increased, and the water-cooling heat dissipation efficiency is improved; air-cooling heat dissipation and water-cooling heat dissipation are integrated in the same heat dissipation device, and after heat dissipation is conducted through the water-cooling device, redundant heat is further dissipated through air-cooling heat dissipation.

Description

Technical Field

[0001] The utility model relates to the technical field of laser heat dissipation, in particular to a semiconductor laser module cooling device. Background Art

[0002] Semiconductor lasers are a type of laser that uses semiconductor materials as working materials. Based on the unique electrical and optical properties of semiconductor crystal materials, semiconductor lasers have the advantages of wide wavelength range, high electro-optical conversion efficiency, low power consumption, long working life, and easy integration. With the introduction of the concept of quantum wells, the preparation process of semiconductor materials has reached a new stage, and the types of semiconductor lasers are becoming more and more abundant, with diverse functions and wider application fields.

[0003] In the operation of semiconductor laser devices, although the electro-optical conversion efficiency is very high, since electrical energy cannot be completely converted into light energy, part of the energy will be output in the form of heat energy, causing the operating temperature of the laser module to increase. In addition, factors such as the operating threshold current, output wavelength, output power, and stability are sensitive to temperature changes. When the temperature is too high, the laser output power will drop, the beam quality will decrease, and the wavelength range will fluctuate. Therefore, stabilizing the temperature of the laser module is very important to improve the output beam quality.

[0004] In view of the impact of temperature fluctuations on the light output of laser modules, solving the heat dissipation problem in the development process of semiconductor lasers is particularly critical. Traditional heat dissipation modes include air cooling, water cooling, etc. The traditional single cooling method not only has low heat dissipation efficiency, but also unstable heat dissipation effect under special environments. Utility Model Content

[0005] Taking into account the problems of existing laser module heat dissipation modes, in order to further improve the heat dissipation efficiency and expand the application scope of semiconductor laser modules, the utility model provides a novel semiconductor laser module cooling device integrating air cooling and water cooling.

[0006] The utility model provides a semiconductor laser module cooling device, including a water-cooling heat dissipation unit and an air-cooling heat dissipation unit; the water-cooling heat dissipation unit includes a radiator, a heat dissipation plate, a sealing plate and a water cooler, and the air-cooling heat dissipation unit includes an air-cooling heat dissipation component;

[0007] The radiator is sealed and installed with the heat dissipation plate, the sealing plate is installed on the heat dissipation plate, the water cooler supplies circulating cooling water to the radiator, and the air-cooled heat dissipation components are installed at both ends of the radiator.

[0008] Preferably, the water cooler supplies circulating cooling water to the radiator through two quick-connect plugs.

[0009] Preferably, the air-cooling heat dissipation component includes a fan fixing frame and a plurality of fans, the fan fixing frame is installed at two ends of the radiator, and the fans are installed at the ventilation openings of the fan fixing frame.

[0010] Preferably, a plurality of cold water troughs are provided on the top of the radiator, the heat sink is installed on the top of the radiator and forms a closed water channel with the cold water trough, and the water channels are not interconnected; a plurality of fins are provided at the lower end of the radiator, and the fan fixing frame is installed at both ends of the fins.

[0011] Preferably, the plurality of cold water tanks are evenly arranged longitudinally, and the plurality of fins are evenly arranged longitudinally.

[0012] Preferably, a sealing ring groove is also provided on the top of the radiator for accommodating a sealing ring.

[0013] Preferably, two rows of flow openings are provided on the heat sink, and the two rows of flow openings are directly opposite to the two ends of the cold water tank, and the two ends of one row of the flow openings serve as a water inlet and a water outlet respectively, and a quick-connect plug is installed on the water inlet and the water outlet respectively.

[0014] Preferably, a water passage groove is provided on the sealing plate, and the water passage groove is used to connect two adjacent flow ports.

[0015] Preferably, the rotation directions of the plurality of fans are consistent.

[0016] Preferably, each row of the flow openings has a plurality of evenly distributed flow openings.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] In the water-cooled heat dissipation unit, cooling water enters the sealing plate through the heat dissipation plate flow port, and then flows into another cold water tank of the radiator through the sealing plate, thereby increasing the contact between the cooling water and the heat dissipation plate and improving the water-cooled heat dissipation efficiency; air-cooled heat dissipation and water-cooled heat dissipation are integrated into the same radiator. After the water-cooled device dissipates heat, excess heat is further dissipated through air-cooled heat dissipation. Since water-cooled and air-cooled heat dissipation are integrated into one, the issue of heat transfer efficiency between the two heat dissipation systems is avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1This is a schematic structural diagram of a semiconductor laser module cooling device according to an embodiment of the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the radiator according to an embodiment of the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the heat dissipation plate of an embodiment of the utility model;

[0023] Figure 4 It is a structural schematic diagram of a sealing plate according to an embodiment of the utility model.

[0024] Description of reference numerals:

[0025] 1: Radiator; 2: Heat sink; 3: Sealing plate; 4: Fan mounting bracket; 5: Fan; 6: Quick-connect plug; 11: Cold water tank; 12: Fins; 13: Sealing ring groove; 21: Water inlet; 22: Water outlet; 23: Flow port; 31: Water trough; 41: Ventilation port. DETAILED DESCRIPTION

[0026] The technical solution of the utility model will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, "multiple" means two or more, unless otherwise clearly and specifically defined. In addition, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0029] like Figures 1 to 4 As shown, the utility model provides a semiconductor laser module cooling device, including a water-cooled heat dissipation unit and an air-cooled heat dissipation unit; the water-cooled heat dissipation unit includes a radiator 1, a heat dissipation plate 2, a sealing plate 3 and a water cooler, and the air-cooled heat dissipation unit includes an air-cooled heat dissipation component.

[0030] The radiator 1 is sealed and installed with the heat dissipation plate 2, the sealing plate 3 is installed on the heat dissipation plate 2, the water cooler provides circulating cooling water to the radiator 1, and the air cooling heat dissipation components are installed at both ends of the radiator 1. The water cooler supplies circulating cooling water to the radiator 1 through two quick-connect plugs 6.

[0031] The air-cooling heat dissipation assembly comprises a fan fixing frame 4 and a plurality of fans 5. The fan fixing frame 4 is mounted at both ends of the radiator 1, and the fans 5 are mounted at the vents 41 of the fan fixing frame 4. The rotation directions of the plurality of fans 5 are the same.

[0032] A plurality of cold water tanks 11 are arranged on the top of the radiator 1. The heat sink 2 is installed on the top of the radiator 1 and forms a closed water channel with the cold water tank 11. The water channels are not interconnected. A plurality of fins 12 are arranged at the lower end of the radiator 1. The fan fixing frame 4 is installed at both ends of the fins 12. The plurality of cold water tanks 11 are evenly arranged longitudinally, and the plurality of fins 12 are evenly arranged longitudinally. A sealing ring groove 13 is also arranged on the top of the radiator 1 for placing a sealing ring.

[0033] Two rows of flow openings 23 are arranged on the heat sink 2, and the two rows of flow openings 23 are directly opposite to the two ends of the cold water tank 11, and the two ends of one row of flow openings 23 serve as a water inlet 21 and a water outlet 22 respectively, and a quick-connect plug 6 is installed on the water inlet 21 and the water outlet 22 respectively.

[0034] The sealing plate 3 is provided with a water groove 31, which is used to connect two adjacent circulation ports 23. Preferably, each row of circulation ports 23 has a plurality of evenly distributed circulation ports 23, and the number of circulation ports 23 in each row is consistent with the number of cold water tanks 11. Preferably, each row is provided with six circulation ports 23, that is, six cold water tanks 11 are provided.

[0035] The working mode of the water-cooling heat dissipation unit of the utility model is: the water cooler supplies water to the water inlet 21, the cooling water is poured into the first cold water tank, and then enters the sealing plate 3 through the corresponding flow port 23, and the water groove 31 guides the cooling water into another cold water tank. In this way, the cooling water continuously circulates among the radiator 1, the heat dissipation plate 2, and the sealing plate 3. The heat generated by the laser module is first transferred to the heat dissipation plate 2 and then transferred from the heat dissipation plate 2 to the radiator 1. The cooling water continuously takes away the heat of the heat dissipation plate 2 to achieve the heat dissipation effect.

[0036] The working mode of the air-cooled heat dissipation unit of the present invention is: the radiator 1 has a cold water tank 11 and fins 12 at the same time, the heat dissipation plate 2 transfers heat to the radiator 1, the heat flows into the fins 12, the fan 5 is controlled to rotate so that more air passes through the fins 12, and the heat on the fins 12 is transferred to the air to achieve further heat dissipation.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A semiconductor laser module cooling device, characterized in that: It comprises a water-cooling heat dissipation unit and an air-cooling heat dissipation unit; the water-cooling heat dissipation unit comprises a radiator (1), a heat dissipation plate (2), a sealing plate (3) and a water cooler, and the air-cooling heat dissipation unit comprises an air-cooling heat dissipation component; The radiator (1) is sealed and installed with the heat dissipation plate (2), the sealing plate (3) is installed on the heat dissipation plate (2), the water cooler supplies circulating cooling water to the radiator (1), and the air-cooled heat dissipation components are installed at both ends of the radiator (1).

2. The semiconductor laser module cooling device according to claim 1, characterized in that: The water cooler supplies circulating cooling water to the radiator (1) via two quick-connect plugs (6).

3. The semiconductor laser module cooling device according to claim 2, characterized in that: The air-cooling heat dissipation component comprises a fan fixing frame (4) and a plurality of fans (5); the fan fixing frame (4) is mounted at two ends of the radiator (1); and the fans (5) are mounted at the ventilation openings (41) of the fan fixing frame (4).

4. The semiconductor laser module cooling device according to claim 3, characterized in that: The top of the radiator (1) is provided with a plurality of cold water tanks (11); the heat dissipation plate (2) is mounted on the top of the radiator (1) and forms a closed water channel with the cold water tank (11); the water channels are not interconnected; the lower end of the radiator (1) is provided with a plurality of fins (12); the fan fixing frame (4) is mounted on both ends of the fins (12).

5. The semiconductor laser module cooling device according to claim 4, characterized in that: The plurality of cold water tanks (11) are evenly arranged longitudinally, and the plurality of fins (12) are evenly arranged longitudinally.

6. The semiconductor laser module cooling device according to claim 4, characterized in that: The top of the radiator (1) is also provided with a sealing ring groove (13) for accommodating a sealing ring.

7. The semiconductor laser module cooling device according to claim 4, characterized in that: Two rows of flow openings (23) are provided on the heat sink (2), and the two rows of flow openings (23) are directly opposite to the two ends of the cold water tank (11), and the two ends of one row of the flow openings (23) serve as a water inlet (21) and a water outlet (22), respectively, and one of the quick-connect plugs (6) is installed on the water inlet (21) and the water outlet (22), respectively.

8. The semiconductor laser module cooling device according to claim 7, characterized in that: The sealing plate (3) is provided with a water passage groove (31), and the water passage groove (31) is used to connect two adjacent flow openings (23).

9. The semiconductor laser module cooling device according to claim 3, characterized in that: The rotation directions of the plurality of fans (5) are consistent.

10. The semiconductor laser module cooling device according to claim 7, characterized in that: Each row of the flow openings (23) has a plurality of evenly distributed flow openings (23).

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