Transceiver test fixture applicable to various different structures

Abstract

The utility model relates to a testing tool of an optical communication module, in particular to a transceiver testing clamp jig applicable to various different structures, which comprises a detachable guide jig and a testing module, and the testing module comprises a module socket used for being matched with an optical module packaging product. The central position of the module socket is provided with a PCB used for being matched with an optical module packaging product. A jack is formed in the side, away from the guide jig, of the middle of the module socket and used for being matched with an interface of an optical module packaging product in an inserted mode, and after the interface of the optical module packaging product is inserted into the jack, the interface of the optical module packaging product is tightly attached to the PCB. The device is simple in structure, is convenient to install, effectively protects the socket, and is compatible with different structure tests of two OSFP modules. According to the utility model, safe protection can be provided for the socket on the test board in the optical communication field, so that the module is inserted into the socket and touches the stop block firstly, and redundant force cannot act on the socket.

Description

Technical Field

[0001] The utility model relates to a testing tool for an optical communication module, in particular to a testing clamping tool for transceivers which can be applied to various structures. Background Art

[0002] OSFP (Octal Small Form-factor Pluggable) is a new high-speed data transmission standard 400G optical module packaging transceiver. It has 8 high-speed electrical channels and an integrated heat sink, which can greatly improve the heat dissipation performance, higher transmission speed, lower power consumption and smaller size, and is suitable for the telecommunications market, data center networks and high-performance computing applications.

[0003] OSFP module products need to pass certification and compliance testing before leaving the factory to ensure that they meet the specified requirements, such as reliability testing, including but not limited to life testing, reliability index testing, etc.

[0004] During the test, a fixture is needed to connect to the OSFP module product. As the number of tests increases, frequent plugging and unplugging can easily cause damage to the test fixture, because the force of each plugging and unplugging is not consistent. Especially during the insertion process, insufficient force will cause the OSFP module product to be unable to be fully connected to the test fixture, while excessive force will cause the module socket in the test fixture to be overloaded and damaged. Utility Model Content

[0005] The purpose of the utility model is to provide a transceiver test fixture applicable to a variety of different structures to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A transceiver test fixture applicable to a variety of different structures, including a detachable guide fixture and a test module, wherein the test module includes a module socket for matching with an optical module packaging product;

[0008] A PCB board adapted to the optical module packaging product is installed at the central position of the module socket, and the PCB board is connected to the guide fixture at three gap points where the PCB board contacts the guide fixture through hot melt adhesive that is cooled and solidified;

[0009] A socket is provided in the middle of the module socket on one side away from the guide fixture, and the socket is used to be plugged into and matched with the interface of the optical module packaging product. When the interface of the optical module packaging product is inserted into the socket, the interface of the optical module packaging product is tightly attached to the PCB board.

[0010] The transceiver test fixture as described above can be applied to a variety of different structures: the test module also includes a test board, the module socket is installed on the test board, and one side of the test board is close to the bottom surface of the guide fixture.

[0011] The transceiver test clamp jig as described above can be applied to a variety of different structures: a jig cavity is opened inside the guide jig, the jig cavity passes through the bottom surface of the guide jig, and the jig cavity is opened on one side perpendicular to the bottom surface of the guide jig with an opening for the module socket to pass into the jig cavity.

[0012] The transceiver test fixture as described above can be applied to a variety of different structures: the fixture cavity is formed with a stop surface on one side relative to the opening, and when the interface of the optical module packaging product is fully inserted into the socket, the interface of the optical module packaging product fits against the stop surface.

[0013] The transceiver test fixture as described above is applicable to a variety of different structures: a socket back stop is formed on one side of the module socket adjacent to the stop surface, and the socket back stop is in contact with the stop surface.

[0014] The transceiver test fixture as described above is applicable to a variety of different structures: cavity stops are formed on both sides of the fixture cavity, and socket stops corresponding to the cavity stops are formed on both sides of the module socket.

[0015] Compared with the prior art, the beneficial effects of the utility model are as follows: the guide fixture is provided to provide effective protection for the module socket on the test module; during the process of plugging the interface of the optical module packaging product into the module socket, after the interface of the optical module packaging product has been fully inserted into the socket, the guide fixture blocks the interface; thereby preventing excess force applied to the optical module packaging product during the plugging process from acting on the module socket, causing damage and loosening of the module socket.

[0016] In addition, the module socket in the utility model is universal and can be used for OSFP modules of various sizes and shapes. It is easy to operate and highly efficient, and reduces the operation time and cage changing time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The figure is a schematic diagram of the structure of a transceiver test fixture applicable to a variety of different structures when plugged into one of the optical module packaging products.

[0018] Figure 2 for Figure 1 Schematic diagram of the structure from another perspective.

[0019] Figure 3 For Figure 1 Schematic diagram of the structure after removing the guide fixture.

[0020] Figure 4 For Figure 3 A structural diagram of the optical module packaging product when it is replaced with another optical module packaging product.

[0021] Figure 5 Schematic diagram of the structure of the transceiver test fixture in this application.

[0022] Figure 6 For Figure 5 Schematic diagram of the guide fixture and test module after being separated based on the .

[0023] Figure 7 for Figure 6 Schematic diagram of the structure from another perspective.

[0024] Figure 8 A schematic diagram of the test module.

[0025] In the figure: 1-guide fixture; 101-fixture cavity; 102-cavity stop; 2-test module; 201-test board; 202-module socket; 2021-socket stop. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0027] The utility model relates to a transceiver test fixture applicable to a variety of different structures, specifically a fixture for testing OSFP modules in the optical communication field, which has the characteristics of simple structure, convenient installation, effective protection of the socket and compatibility with two different structure tests of OSFP modules. Through the utility model patent, it is possible to provide safe protection for the socket on the test board in the optical communication field, so that the module will first hit the block when inserted into the socket without applying excess force to the socket, thereby improving work efficiency.

[0028] See also Figures 1 to 8 As an embodiment of the utility model, the transceiver test fixture applicable to various structures includes a detachable guide fixture 1 and a test module 2, wherein the test module 2 includes a module socket 202 for matching with an optical module packaging product;

[0029] Specifically, a PCB board adapted to the optical module packaging product is installed at the central position of the module socket 202, and the three gap points where the PCB board contacts the guide fixture 1 are connected by hot melt adhesive after cooling and solidification;

[0030] A socket is provided in the middle of the module socket 202 on one side away from the guide fixture 1, and the socket is used to be plugged into and matched with the interface of the optical module packaging product. When the interface of the optical module packaging product is inserted into the socket, the interface of the optical module packaging product is tightly attached to the PCB board.

[0031] In this embodiment, in the utility model, the guide fixture 1 is provided to provide effective protection for the module socket 202 on the test module 2. During the process of plugging the interface of the optical module packaging product with the module socket 202, after the interface of the optical module packaging product has been fully inserted into the socket, the guide fixture 1 blocks the interface, thereby preventing excess force applied to the optical module packaging product during the plugging process from acting on the module socket 202, thereby causing damage and loosening of the module socket.

[0032] In addition, the module socket 202 in the utility model is universal and can be used for OSFP modules of various sizes and shapes. It is easy to operate and highly efficient, and reduces the operation time and cage changing time.

[0033] As a further solution of the present invention, the test module 2 also includes a test board 201 , the module socket 202 is installed on the test board 201 , and one side of the test board 201 is in close contact with the bottom surface of the guide fixture 1 .

[0034] In this embodiment, since the module socket 202 is installed on the test board 201, the two can form a complete test module 2, and one side of the test board 201 is set to be close to the bottom surface of the guide fixture 1 to ensure that the position of the test module 2 relative to the guide fixture 1 will not deflect.

[0035] As a further solution of the utility model, a jig cavity 101 is opened inside the guide jig 1, and the jig cavity 101 passes through the bottom surface of the guide jig 1, and the jig cavity 101 is opened on one side perpendicular to the bottom surface of the guide jig 1 to allow the module socket 202 to pass through the jig cavity 101.

[0036] In this embodiment, through the above-mentioned structural setting, when the test module 2 is assembled with the guide fixture 1 , the module socket 202 is allowed to enter the fixture cavity 101 , while the test board 201 is placed outside the fixture cavity 101 .

[0037] As a further solution of the utility model, the fixture cavity 101 is formed with a stop surface on one side relative to the opening, and when the interface of the optical module packaging product is fully inserted into the socket, the interface of the optical module packaging product fits against the stop surface.

[0038] In this embodiment, with the help of the set stop surface, after the interface of the optical module packaging product has been fully inserted into the socket, the stop surface in the guide fixture 1 can bear the plugging force from the interface, avoiding the module socket 202 from bearing the force, thereby protecting the module socket 202.

[0039] As a further solution of the utility model, a socket back stop is formed on the side of the module socket 202 adjacent to the stop surface, and the socket back stop is in contact with the stop surface to prevent the test board 201 from being subjected to force and causing the module socket 202 to move relative to the guide fixture 1.

[0040] In this embodiment, if the back stop of the socket is not in contact with the stop surface, there must be a gap between the two; in this case, if the test board 201 and / or the module socket 202 are subjected to a force toward the stop surface, the test board 201 and the module socket 202 may be caused to approach the stop surface, which will cause the above-mentioned gap to decrease, and ultimately result in that when the optical module packaging product is plugged in, although the interface of the optical module packaging product is completely in contact with the stop surface, the interface of the optical module packaging product is not completely inserted into the socket.

[0041] As a further solution of the present invention, cavity stops 102 are formed on both sides of the fixture cavity 101 , and socket stops 2021 corresponding to the cavity stops 102 are formed on both sides of the module socket 202 .

[0042] In this embodiment, the cavity stop 102 is matched with the socket stop 2021, so that after the test module 2 and the guide fixture 1 are assembled, the socket stops 2021 on both sides are close to the cavity stops 102 on both sides, which can effectively prevent the problem of oblique insertion due to left and right shaking during the connection between the optical module packaging product and the module socket 202.

[0043] The above embodiments are exemplary rather than restrictive, so without departing from the spirit or basic features of the present invention, the technical solutions of the present invention that can be implemented in other specific forms are all included in the present invention.

Claims

1. A transceiver test fixture applicable to a variety of different structures, comprising a detachable guide fixture (1) and a test module (2), wherein the test module (2) comprises a module socket (202) for matching with an optical module packaging product, characterized in that: A PCB board adapted to the optical module packaging product is installed at the central position of the module socket (202), and the PCB board is connected to the guide fixture (1) at three gap points where the PCB board contacts the guide fixture (1) through hot melt adhesive that is cooled and solidified; A socket is provided in the middle of the module socket (202) on a side away from the guide fixture (1), and the socket is used to be plugged into and matched with the interface of the optical module packaging product. When the interface of the optical module packaging product is inserted into the socket, the interface of the optical module packaging product is tightly attached to the PCB board.

2. A transceiver test fixture applicable to a variety of different structures according to claim 1, characterized in that: The test module (2) further comprises a test board (201), the module socket (202) being mounted on the test board (201), and one surface of the test board (201) being in close contact with the bottom surface of the guide fixture (1).

3. The transceiver test fixture applicable to a variety of different structures according to claim 1, characterized in that: A jig cavity (101) is provided inside the guide jig (1), the jig cavity (101) passes through the bottom surface of the guide jig (1), and an opening is provided on one side of the jig cavity (101) perpendicular to the bottom surface of the guide jig (1) for allowing the module socket (202) to pass through the jig cavity (101).

4. The transceiver test fixture applicable to a variety of different structures according to claim 3, characterized in that: The fixture cavity (101) is formed with a stop surface on one side relative to the opening, and when the interface of the optical module packaging product is fully inserted into the socket, the interface of the optical module packaging product fits into the stop surface.

5. The transceiver test fixture applicable to a variety of different structures according to claim 4, characterized in that: A socket back stop is formed on one side of the module socket (202) adjacent to the stop surface, and the socket back stop is in contact with the stop surface.

6. The transceiver test fixture applicable to a variety of different structures according to claim 3, characterized in that: Cavity stops (102) are formed on both sides of the fixture cavity (101), and socket stops (2021) corresponding to the cavity stops (102) are formed on both sides of the module socket (202).

Images