Thick copper core plate and new energy automobile charging pile thick copper plate
By designing vertical flow channel and communication channel on thick copper plates, the overflow path of the semi-cured layer is shortened, and the problem of poor thickness uniformity of thick copper plates is solved, bubble generation is reduced, and the overall quality of thick copper plates is improved.
Patent Information
- Application Number
- CN202323507056.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-20
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2033-12-20
AI Technical Summary
During the pressing process, the thick copper plates have a layer deviation, bent, and bent due to the difference in the shrinkage and stacking asymmetry, and the semi-cured layer has a long overflow path, resulting in poor thickness uniformity and more bubbles.
Design a thick copper core plate, three flow guide grooves perpendicular to the edge line are opened at one end of the thick copper layer, and are connected to the communication grooves. The target area, test area, and identification area are set, and the flow guide groove extends to three edge lines to shorten the semi-curing. Layer overflow path to improve overflow smoothness.
By shortening the overflow path of the semi-cured layer, the overflow smoothness of the semi-cured layer is improved, the bubbles between the adjacent two thick copper core plates are reduced, and the thickness uniformity of the thick copper plates is enhanced.
Smart Images
Figure CN222302086U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of thick copper plates for new energy vehicle charging piles, and in particular to a thick copper core plate and a thick copper plate for new energy vehicle charging piles. Background Art
[0002] Thick copper plates are widely used in new energy vehicle charging piles. They are named thick copper plates because the thickness of each copper layer is ≥2oz. During the pressing process of thick copper plates, layer deviation and plate bending and warping caused by differences in expansion and contraction and asymmetric stacking structures are the difficulties and key points of quality control.
[0003] In the related art, for example, document number CN214381570U discloses a multi-layer thick copper plate, wherein the thick copper plate comprises a plurality of stacked thick copper core plates, and a semi-cured layer is disposed between two adjacent thick copper core plates. A plurality of guide grooves are etched on each thick copper core plate, and each guide groove extends to an edge line. When the thick copper plates are pressed together, the semi-cured layer overflows along the guide groove.
[0004] However, each guide groove is inclined to the corresponding edge of the thick copper core board, which makes the overflow path of the semi-cured layer longer, resulting in poor smoothness of the overflow of the semi-cured layer, causing more bubbles to be generated between two adjacent layers of thick copper core boards, resulting in poor thickness uniformity of the thick copper board. Utility Model Content
[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a thick copper core plate and a thick copper plate for a new energy vehicle charging pile that improve the thickness uniformity of the thick copper plate.
[0006] The purpose of this disclosure is achieved through the following technical solutions:
[0007] A thick copper core board comprises a substrate and a thick copper layer, wherein two thick copper layers are respectively connected to two opposite sides of the substrate;
[0008] One end of the thick copper layer is provided with three guide grooves, namely the first guide groove, the second guide groove and the third guide groove, the three guide grooves extend to the three side lines of the thick copper core board respectively, and each guide groove is perpendicular to the corresponding side line; one end of the thick copper layer is also provided with a connecting groove, and the connecting groove is connected with the three guide grooves respectively;
[0009] A target area, a test area, a first identification area, a second identification area and a third identification area are also provided at one end of the thick copper layer. The target area is located in an area enclosed by the first guide groove, the second guide groove and the connecting groove. The test area is located in an area enclosed by the first guide groove, the second guide groove and the connecting groove. The test area is spaced apart from the target area. The first identification area and the target area are respectively located on both sides of the first guide groove. The second identification area is located between the target area and the test area. The third identification area is located between the target area and the test area, and the third identification area is spaced apart from the second identification area.
[0010] In one embodiment, the target area includes a plurality of annular etching grooves arranged in sequence.
[0011] In one embodiment, the test area is square.
[0012] In one embodiment, the first identification area has a plurality of circular identification copper blocks.
[0013] In one embodiment, the second identification area is semicircular.
[0014] In one embodiment, the third identification area is semicircular.
[0015] In one embodiment, the third identification area is connected to the connecting groove.
[0016] In one embodiment, the second guide groove is perpendicular to the third guide groove.
[0017] In one of the embodiments, each of the guide grooves is rectangular, and the two thick copper layers are symmetrically arranged relative to the substrate.
[0018] A thick copper plate for a new energy vehicle charging pile, comprising the thick copper core plate described in any of the above embodiments, wherein the number of the thick copper core plates is multiple, and the thick copper plate for the new energy vehicle charging pile further comprises multiple semi-cured layers, and two adjacent thick copper core plates are connected by one of the semi-cured layers.
[0019] Compared with the prior art, the present invention has at least the following advantages:
[0020] The thick copper layer is provided with three guide grooves, namely the first guide groove, the second guide groove and the third guide groove. The three guide grooves extend to the three edges of the thick copper core board respectively, and each guide groove is perpendicular to the corresponding edge. When the multi-layer thick copper core board is pressed, the semi-cured layer overflows along the guide groove. Since each guide groove is perpendicular to the corresponding edge, the overflow path of the semi-cured layer is shortened, and the smoothness of the semi-cured layer overflow is improved, so that the gas between the two adjacent layers of thick copper core boards can be discharged in time, and the generation of bubbles between the two adjacent layers of thick copper core boards is suppressed, and the bubbles between the two adjacent layers of thick copper core boards are reduced, and the thick copper uniformity of the thick copper board is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 This is a schematic diagram of the structure of a thick copper plate for a new energy vehicle charging pile according to an embodiment;
[0023] Figure 2 for Figure 1 A schematic structural diagram of one end of a thick copper core plate of a new energy vehicle charging pile thick copper plate shown;
[0024] Figure 3 for Figure 1 Another structural schematic diagram of one end of the thick copper core plate of the new energy vehicle charging pile thick copper plate is shown. DETAILED DESCRIPTION
[0025] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.
[0026] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.
[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0028] The present invention provides a thick copper core board including a substrate and a thick copper layer, wherein the two thick copper layers are respectively connected to opposite sides of the substrate. Further, one end of the thick copper layer is provided with three guide grooves, namely, a first guide groove, a second guide groove and a third guide groove, and the three guide grooves extend to three side lines of the thick copper core board respectively, and each guide groove is perpendicular to the corresponding side line; one end of the thick copper core board is also provided with a connecting groove, and the connecting groove is respectively connected with the three guide grooves. The thick copper layer is also provided with a target area, a test area, a first identification area, a second identification area and a third identification area, the target area is located in the area enclosed by the first guide groove, the second guide groove and the connecting groove, the test area is located in the area enclosed by the first guide groove, the second guide groove and the connecting groove, the test area and the target area are spaced apart, the first identification area and the target area are respectively located on both sides of the first guide groove, the second identification area is located between the target area and the test area, the third identification area is located between the target area and the test area, and the third identification area is spaced apart from the second identification area.
[0029] The thick copper core board mentioned above has three guide grooves in the thick copper layer, namely the first guide groove, the second guide groove and the third guide groove. The three guide grooves extend to the three edges of the thick copper core board respectively, and each guide groove is perpendicular to the corresponding edge. When the multi-layer thick copper core board is pressed together, the semi-cured layer overflows along the guide groove. Since each guide groove is perpendicular to the corresponding edge, the overflow path of the semi-cured layer is shortened, and the smoothness of the semi-cured layer overflow is improved, so that the gas between the two adjacent layers of thick copper core boards can be discharged in time, and the generation of bubbles between the two adjacent layers of thick copper core boards is suppressed, and the bubbles between the two adjacent layers of thick copper core boards are reduced, and the uniformity of the thick copper of the thick copper board is improved.
[0030] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:
[0031] like Figure 1 As shown, the thick copper plate 10 of the new energy vehicle charging pile of one embodiment includes a thick copper core plate 100, the number of the thick copper core plates 100 is multiple, and the new energy vehicle charging pile thick copper plate 10 also includes multiple semi-cured layers 200, and two adjacent thick copper core plates 100 are connected by the semi-cured layers 200. Further, each semi-cured layer 200 includes a plurality of semi-cured sheets 210 stacked.
[0032] like Figure 1As shown, in one embodiment, the thick copper core board 100 includes a substrate 110 and a thick copper layer 120 , and the two thick copper layers 120 are respectively connected to two opposite sides of the substrate 110 .
[0033] like Figure 2 and Figure 3 As shown, further, three guide grooves 121 are opened at one end of the thick copper layer 120, namely the first guide groove 1211, the second guide groove 1212 and the third guide groove 1213, the three guide grooves 121 respectively extend to the three side lines 101 of the thick copper core board 100, and each guide groove 121 is perpendicular to the corresponding side line 101; a connecting groove 122 is also opened at one end of the thick copper layer 120, and the connecting groove 122 is respectively connected with the three guide grooves 121. One end of the thick copper layer 120 is also provided with a target area 123, a test area 124, a first identification area 125, a second identification area 126 and a third identification area 127. The target area 123 is located in the area enclosed by the first guide groove 1211, the second guide groove 1212 and the connecting groove 122. The test area 124 is located in the area enclosed by the first guide groove 1211, the second guide groove 1212 and the connecting groove 122. The test area 124 is spaced apart from the target area 123. The first identification area 125 and the target area 123 are located on both sides of the first guide groove 1211, respectively. The second identification area 126 is located between the target area 123 and the test area 124. The third identification area 127 is located between the target area 123 and the test area 124, and the third identification area 127 is spaced apart from the second identification area 126. It should be emphasized that this paragraph is a special description for each thick copper layer 120.
[0034] like Figure 2 and Figure 3 As shown, in this embodiment, the thickness of the thick copper layer 120 is ≥ 2oz, that is, the thickness of each thick copper layer 120 is ≥ 2oz. The target area 123, the test area 124, the first identification area 125, the second identification area 126 and the third identification area 127 are all areas etched from each thick copper layer 120. The target area 123 is used for alignment when drilling pin holes to improve the accuracy of drilling pin holes. The test area 124 is an area for operators to perform tests, and the first identification area 125, the second identification area 126 and the third identification area 127 are identification areas for positioning.
[0035] The thick copper core board 100 and the thick copper layer 120 are provided with three guide grooves 121, namely the first guide groove 1211, the second guide groove 1212 and the third guide groove 1213. The three guide grooves 121 extend to the three side lines 101 of the thick copper core board 100 respectively, and each guide groove 121 is perpendicular to the corresponding side line 101. When the multi-layer thick copper core board 100 is pressed, the semi-cured layer 200 overflows along the guide groove 121. Since each guide groove 121 is perpendicular to the corresponding side line 101, the overflow path of the semi-cured layer 200 is shortened, and the smoothness of the overflow of the semi-cured layer 200 is improved, so that the gas between the two adjacent layers of thick copper core boards 100 can be discharged in time, the generation of bubbles between the two adjacent layers of thick copper core boards 100 is suppressed, the bubbles between the two adjacent layers of thick copper core boards 100 are reduced, and the thick copper uniformity of the thick copper board is improved.
[0036] like Figure 2 and Figure 3 As shown, in one embodiment, the target area 123 includes a plurality of annular etching grooves 1231 that are sequentially set. In this embodiment, when the drill bit deviates from the center position of the target area 123, since the target area 123 includes a plurality of annular etching grooves 1231 that are sequentially set, the operator can easily observe that the drill bit deviates from the center position, so that the operator can adjust the position of the drill bit in time, thereby improving the accuracy of drilling the pin hole.
[0037] like Figure 2 and Figure 3 As shown, in one embodiment, the test area 124 is square. In this embodiment, the test area 124 is an etched window.
[0038] like Figure 2 and Figure 3 As shown, in one embodiment, a plurality of circular identification copper blocks 120a are provided in the first identification area 125. In this embodiment, an external identification camera can be positioned by the plurality of circular identification copper blocks 120a.
[0039] like Figure 2 and Figure 3 As shown, in one embodiment, the second identification area 126 is semicircular. In this embodiment, the external identification camera can be positioned through the second identification area 126.
[0040] like Figure 2 and Figure 3 As shown, in one embodiment, the third identification area 127 is semicircular. In this embodiment, the external identification camera can be positioned through the third identification area 127.
[0041] like Figure 2 and Figure 3 As shown, in one embodiment, the third identification area 127 is connected to the connecting groove 122 .
[0042] like Figure 2 and Figure 3 As shown, in one embodiment, the second guide groove 1212 is perpendicular to the third guide groove 1213 .
[0043] like Figure 2 and Figure 3 As shown, in one embodiment, each guide groove 121 is rectangular, and the two thick copper layers 120 are symmetrically arranged relative to the substrate 110.
[0044] Compared with the prior art, the present invention has at least the following advantages:
[0045] The thick copper layer 120 is provided with three guide grooves 121, namely the first guide groove 1211, the second guide groove 1212 and the third guide groove 1213. The three guide grooves 121 extend to the three side lines 101 of the thick copper core board 100 respectively, and each guide groove 121 is perpendicular to the corresponding side line 101. When the multi-layer thick copper core board 100 is pressed, the semi-cured layer 200 overflows along the guide groove 121. Since each guide groove 121 is perpendicular to the corresponding side line 101, the overflow path of the semi-cured layer 200 is shortened, and the smoothness of the overflow of the semi-cured layer 200 is improved, so that the gas between the two adjacent layers of thick copper core boards 100 can be discharged in time, the generation of bubbles between the two adjacent layers of thick copper core boards 100 is suppressed, the bubbles between the two adjacent layers of thick copper core boards 100 are reduced, and the thick copper uniformity of the thick copper board is improved.
[0046] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.
Claims
1. A thick copper core board, comprising a substrate and a thick copper layer, wherein two thick copper layers are respectively connected to opposite sides of the substrate, characterized in that: One end of the thick copper layer is provided with three guide grooves, namely the first guide groove, the second guide groove and the third guide groove, the three guide grooves extend to the three side lines of the thick copper core board respectively, and each guide groove is perpendicular to the corresponding side line; one end of the thick copper layer is also provided with a connecting groove, and the connecting groove is connected with the three guide grooves respectively; A target area, a test area, a first identification area, a second identification area and a third identification area are also provided at one end of the thick copper layer. The target area is located in an area enclosed by the first guide groove, the second guide groove and the connecting groove. The test area is located in an area enclosed by the first guide groove, the second guide groove and the connecting groove. The test area is spaced apart from the target area. The first identification area and the target area are respectively located on both sides of the first guide groove. The second identification area is located between the target area and the test area. The third identification area is located between the target area and the test area, and the third identification area is spaced apart from the second identification area.
2. The thick copper core board according to claim 1, characterized in that: The target area includes a plurality of annular etching grooves which are arranged in sequence.
3. The thick copper core board according to claim 1, characterized in that: The test area is square.
4. The thick copper core board according to claim 1, characterized in that: The first identification area has a plurality of circular identification copper blocks.
5. The thick copper core board according to claim 1, characterized in that: The second identification area is semicircular.
6. The thick copper core board according to claim 1, characterized in that: The third identification area is semicircular.
7. The thick copper core board according to claim 6, characterized in that: The third identification area is communicated with the communication groove.
8. The thick copper core board according to claim 1, characterized in that: The second guide groove is perpendicular to the third guide groove.
9. The thick copper core board according to claim 1, characterized in that: Each of the guide grooves is rectangular, and the two thick copper layers are symmetrically arranged relative to the substrate.
10. A thick copper plate for a new energy vehicle charging pile, characterized in that: It comprises the thick copper core board described in any one of claims 1 to 9, wherein the number of the thick copper core boards is multiple, and the thick copper board of the new energy vehicle charging pile further comprises multiple semi-cured layers, and two adjacent thick copper core boards are connected by one of the semi-cured layers.