Vacuum power-off automatic switching device during wafer grinding

Abstract

The utility model discloses a vacuum power-off automatic switching device during wafer grinding, relates to the technical field of wafer grinding, and aims to solve the problems that existing equipment is high in cost and large in occupied space. A suction cup is used for adsorbing a wafer, a first vacuum channel is communicated with the suction cup, and the first vacuum channel is used for forming negative pressure in a power-on state to adsorb the wafer; when the equipment is normally powered on, the first vacuum channel forms a vacuum passage to adsorb the wafer; the second vacuum channel and the first vacuum channel are arranged in parallel, the second vacuum channel is communicated with a vacuum pump of the first vacuum channel, the second vacuum channel is used for forming negative pressure in a power-off state to adsorb a wafer, and the first vacuum channel and the second vacuum channel are automatically switched through the valve body assembly. The first vacuum channel is disconnected through automatic switching of the valve body assembly, so that the second vacuum channel forms a vacuum passage, and the wafer is continuously adsorbed, so that the suction cup can stably adsorb the wafer in the power-on and power-off states.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer grinding, and more specifically to a vacuum power-off automatic switching device during wafer grinding. Background Art

[0002] During the wafer grinding process, the wafer needs to be vacuumed in real time and the vacuum value needs to be detected. This is mainly because the wafer will be subjected to the radial force of the spindle grinding during the wafer grinding process, and the wafer will be continuously cut. At this time, if an emergency power outage occurs, the vacuum pump will stop running. Most of our current solutions use UPS (Uninterruptible Power System) to complete the power supply of the vacuum pump to ensure the maintenance of the vacuum.

[0003] The UPS power supply provides power uninterruptedly to ensure that the vacuum pump is powered on and the vacuum is not lost when the equipment is powered off, preventing the wafer from being lost or broken during processing, and the wafer from micro-moving when the vacuum is insufficient, which will also affect the wafer grinding quality. The existing technical solutions rely more on the UPS power supply, but the UPS power supply is expensive and takes up a lot of space.

[0004] Therefore, how to solve the problem that the existing equipment is high in cost and occupies a large space is an urgent problem to be solved by those skilled in the art. Utility Model Content

[0005] In view of this, the purpose of the utility model is to provide an automatic switching device for vacuum power-off during wafer grinding. Through its own automatic switching, it can ensure that the wafer can be vacuum adsorbed and will not fall when the power is on or off. Compared with the existing UPS power supply method to provide power, it can reduce the cost of the equipment and the space occupied.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A vacuum power-off automatic switching device for wafer grinding, comprising:

[0008] Suction cup, which is used to absorb the wafer;

[0009] A first vacuum channel is connected to the suction cup, and the first vacuum channel is used to form a negative pressure to absorb the wafer in a powered state;

[0010] The second vacuum channel is arranged in parallel with the first vacuum channel and is connected to the vacuum pump of the first vacuum channel. The second vacuum channel is used to form negative pressure to adsorb wafers in a power-off state. The first vacuum channel and the second vacuum channel are automatically switched through a valve body assembly connected to the controller so that the suction cup can stably adsorb the wafers in both the power-on and power-off states.

[0011] Preferably, the valve body assembly comprises:

[0012] A first solenoid valve is provided in the first vacuum channel, the first solenoid valve is used to control the connection and disconnection of the first vacuum channel, and the first solenoid valve is connected to the controller;

[0013] The vacuum solenoid valve is arranged in the second vacuum channel. The vacuum solenoid valve is used to control the connection and disconnection of the second vacuum channel. The vacuum solenoid valve is connected to the controller.

[0014] Preferably, one end of the vacuum pump is connected to the suction cup through a vacuum pipe, the other end of the vacuum pump is connected to a power supply, a first solenoid valve is arranged in the vacuum pipe, the second vacuum channel includes a vacuum generator, the vacuum generator is arranged in the vacuum pipe, the vacuum generator is arranged between the vacuum pump and the first solenoid valve, the vacuum solenoid valve is connected in parallel to the vacuum pipe, one end of the vacuum solenoid valve is connected to the vacuum generator, and the other end of the vacuum solenoid valve is connected to the vacuum pipe between the air control solenoid valve and the suction cup.

[0015] Preferably, a pressure gauge is provided on the vacuum pipe, and the pressure gauge is arranged close to the suction cup.

[0016] Preferably, the vacuum pipeline is connected to a gas source, and the gas source provides positive pressure gas to the vacuum pipeline.

[0017] Preferably, the vacuum pipeline is also provided with an air control solenoid valve, an air source triplet and an air supply solenoid valve, the input end of the air source triplet is connected to the output end of the air source, the output end of the air source triplet is connected to the input end of the air supply solenoid valve, the output end of the air supply solenoid valve is connected to the input end of the air control solenoid valve, the output end of the air control solenoid valve is connected to the pressure gauge, and the air source and the air source triplet are both connected to the controller.

[0018] Preferably, the gas source triplex includes a filter, a pressure regulating valve and a micro mist processor, the filter is used to remove dust from the gas output by the gas source, the pressure regulating valve is used to adjust the pressure of the gas output by the gas source, and the micro mist processor is used to remove oil from the gas output by the gas source.

[0019] Preferably, the pressure gauge has a spring diaphragm inside, and the spring diaphragm is used to sense pressure and convert the sensed pressure into analog current and output it to the controller.

[0020] Preferably, the air supply solenoid valve, the first solenoid valve and the vacuum solenoid valve are all normally open solenoid valves, the air control solenoid valve is a normally closed solenoid valve, and the air control solenoid valve, the air supply solenoid valve, the first solenoid valve and the vacuum solenoid valve are all connected to the controller.

[0021] Preferably, the suction cup is provided with a vacuum connector for connecting to a vacuum pipe.

[0022] The utility model provides an automatic switching device for vacuum power-off during wafer grinding, which includes a suction cup, a first vacuum channel, a second vacuum channel and a valve body assembly. Specifically, the suction cup is used to absorb the wafer, the first vacuum channel is connected to the suction cup, the first vacuum channel is used to form a negative pressure in a power-on state to absorb the wafer, and when the device is powered on normally, the first vacuum channel forms a vacuum path to absorb the wafer so as to facilitate the next action; the second vacuum channel is arranged in parallel with the first vacuum channel and is connected to a vacuum pump of the first vacuum channel, the second vacuum channel is used to form a negative pressure in a power-off state to absorb the wafer, the first vacuum channel and the second vacuum channel are automatically switched through the valve body assembly, and when the device is powered off, the first vacuum channel is disconnected through the automatic switching of the valve body assembly, so that the second vacuum channel forms a vacuum path to continue to absorb the wafer, and the automatic switching of the first vacuum channel and the second vacuum channel is realized by the valve body assembly connected to the controller to ensure that the wafer can be stably absorbed when the device is powered on or off, and will not fall.

[0023] Compared with the design of the above-mentioned background technology, the automatic switching device for vacuum power failure during wafer grinding set up in the above manner can ensure uninterrupted adsorption of the wafer when the equipment is powered off without using a UPS power supply, thereby reducing the cost of the equipment and the occupied space. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0025] Figure 1 The utility model is a schematic structural diagram of the vacuum power-off automatic switching device during wafer grinding.

[0026] Reference numerals:

[0027] 1- Suction cup;

[0028] 2-first vacuum channel, 21-vacuum pump;

[0029] 3-second vacuum channel, 31-vacuum generator;

[0030] 4-valve body assembly, 41-first solenoid valve, 42-vacuum solenoid valve;

[0031] 5- Pressure gauge;

[0032] 6- Gas source;

[0033] 7-gas control solenoid valve;

[0034] 8-Air source triplex;

[0035] 9-Air supply solenoid valve. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0037] The core of the utility model is to provide an automatic switching device for vacuum power-off during wafer grinding. Through its own automatic switching, it can ensure that the wafer can be vacuum adsorbed and will not fall when the power is on or off. Compared with the existing UPS power supply method to provide power, it can reduce the cost of equipment and the occupied space.

[0038] Please refer to Figure 1 A vacuum power-off automatic switching device for wafer grinding includes a suction cup 1, a first vacuum channel 2, a second vacuum channel 3 and a valve body assembly 4.

[0039] Specifically, the suction cup 1 is used to adsorb the wafer, and the first vacuum channel 2 is connected to the suction cup 1. The first vacuum channel 2 is used to form a negative pressure in the power-on state to adsorb the wafer. When the equipment is powered on normally, the first vacuum channel 2 forms a vacuum path to adsorb the wafer for the next action; the second vacuum channel 3 is arranged in parallel with the first vacuum channel 2 and is connected to the vacuum pump 21 of the first vacuum channel 2. The second vacuum channel 3 is used to form a negative pressure in the power-off state to adsorb the wafer. The first vacuum channel 2 and the second vacuum channel 3 are automatically switched by the valve body assembly 4. When the equipment is powered off, the first vacuum channel 2 is disconnected by the automatic switching of the valve body assembly 4, so that the second vacuum channel 3 forms a vacuum path to continue to adsorb the wafer. The automatic switching of the first vacuum channel 2 and the second vacuum channel 3 is realized by the valve body assembly 4 connected to the controller to ensure that the wafer can be stably adsorbed when the equipment is powered on and powered off, and will not fall.

[0040] The automatic switching device for vacuum power failure during wafer grinding set up in the above manner, in the event of a power failure, controls the valve body assembly 4 through the controller to switch the first vacuum channel 2 to the second vacuum channel 3, so as to produce an adsorption effect on the wafer through the second vacuum channel 3. No UPS power supply is required to provide electricity, which can reduce the space occupied by the device, and the uninterrupted supply of vacuum can be completed at a simple cost, which can effectively reduce costs.

[0041] In the above embodiment, the valve body assembly 4 includes a first solenoid valve 41 and a vacuum solenoid valve 42, and the first solenoid valve 41 and the vacuum solenoid valve 42 are both connected to the controller, and the opening and closing of the first solenoid valve 41 and the vacuum solenoid valve 42 are controlled by the controller. The first solenoid valve 41 is arranged in the first vacuum channel 2, and the first solenoid valve 41 is used to control the connection and disconnection of the first vacuum channel 2. The vacuum solenoid valve 42 is arranged in the second vacuum channel 3, and the vacuum solenoid valve 42 is used to control the connection and disconnection of the second vacuum channel 3.

[0042] It should be noted that when the device is powered on, the controller controls the first solenoid valve 41 to close (i.e., the passage state) and controls the vacuum solenoid valve 42 to open (i.e., the open circuit state). At this time, the vacuum pump 21 is turned on to complete the vacuum pumping action, thereby forming a first vacuum channel 2 with negative pressure between the vacuum pump 21, the first solenoid valve 41 and the suction cup 1, thereby achieving the adsorption of the wafer.

[0043] When the device is powered off, the controller controls the first solenoid valve 41 to remain closed (i.e., the passage state) and controls the vacuum solenoid valve 42 to be closed (i.e., the passage state). At this time, the vacuum generator 31 is used to respond to the compressed air input from the compressed air source 6 to generate a vacuum state, thereby forming a second vacuum channel 3 between the vacuum generator 31, the vacuum solenoid valve 42 and the suction cup 1, thereby achieving uninterrupted adsorption of the wafer.

[0044] In the above situation, one end of the vacuum pump 21 is connected to the suction cup 1 through a vacuum pipe, and the other end of the vacuum pump 21 is connected to the power supply. The first solenoid valve 41 is arranged in the vacuum pipe, and the connection and disconnection of the first vacuum channel 2 are controlled by the first solenoid valve 41. The second vacuum channel 3 includes a vacuum generator 31, and the vacuum generator 31 is arranged in the vacuum pipe. The vacuum generator 31 is arranged between the vacuum pump 21 and the first solenoid valve 41. The vacuum solenoid valve 42 is connected in parallel to the vacuum pipe, one end of the vacuum solenoid valve 42 is connected to the vacuum generator 31, and the other end of the vacuum solenoid valve 42 is connected to the vacuum pipe between the air control solenoid valve 7 and the suction cup 1.

[0045] It can be understood that the vacuum generator 31 refers to a vacuum component that uses a positive pressure gas source 6 to generate negative pressure when the air supply solenoid valve 9 and the first solenoid valve 41 are closed (i.e., in the passage state). It uses a nozzle to spray compressed air at high speed to form a jet at the nozzle outlet, generating a suction flow. Under the suction effect, the air around the nozzle outlet is continuously sucked away, so that the pressure in the adsorption chamber drops below the atmospheric pressure, forming a certain vacuum degree. At the same time, it is also a device that generates a vacuum break. Through its own structure, it provides a vacuum state and a vacuum break state for the adsorption of wafers, avoiding the occurrence of wafer fragments and wafer drops caused by unstable factory vacuum. Among them, the vacuum generator 31 mainly generates a vacuum adsorption effect through a high-speed and high-pressure airflow, and the vacuum is lost when the airflow is closed.

[0046] That is to say, the gas circuit is always in a state of passage. When the device is powered on, the gas supply solenoid valve 9 is opened (i.e., the circuit-breaking state), the gas control solenoid valve 7 is closed (i.e., the passage state), and the first solenoid valve 41 is controlled to be closed (i.e., the passage state). At this time, the vacuum pump 21 is opened to complete the vacuum pumping action, thereby forming a first vacuum channel 2 with negative pressure between the vacuum pump 21, the first solenoid valve 41, the gas control solenoid valve 7 and the suction cup 1, thereby realizing the adsorption of the wafer. When the device is powered off, the gas supply solenoid valve 9, the first solenoid valve 41 and the vacuum solenoid valve 42 are all closed (i.e., the passage state), and the gas control solenoid valve 7 is closed (i.e., the circuit-breaking state). At this time, the vacuum generator 31 is used to respond to the compressed air input from the compressed air source 6 to generate a vacuum state, thereby forming a second vacuum channel 3 between the vacuum generator 31, the vacuum solenoid valve 42 and the suction cup 1, and the suction cup 1 is used to adsorb the wafer when the vacuum generator 31 generates a vacuum state.

[0047] It should be noted that the vacuum pipe can be a pneumatic pipe or a pipe made of other materials that can transmit airflow in a stable and sealed manner. Among them, the pneumatic pipe is generally produced with PU raw materials, and has the characteristics of stable quality, high pressure resistance, weather resistance, wear resistance, tortuosity resistance, smooth and flexible pipe body, bright color, high elasticity, resistance to bending and small bending radius.

[0048] Furthermore, a pressure gauge 5 is provided on the vacuum pipe, and the pressure gauge 5 is arranged close to the suction cup 1.

[0049] It should be noted that the pressure gauge 5 is provided to sense the pressure of the airflow in the vacuum pipe.

[0050] In the above embodiment, the vacuum pipeline is connected to the gas source 6, and the gas source 6 provides positive pressure gas to the vacuum pipeline.

[0051] It is understandable that the vacuum pipe is connected to the gas source 6 to provide gas for the entire gas circuit to ensure that the suction cup 1 can adsorb normally.

[0052] On the basis of the above embodiment, an air control solenoid valve 7, an air source triplet 8 and an air supply solenoid valve 9 are also provided on the vacuum pipeline. The input end of the air source triplet 8 is connected to the output end of the air source 6, the output end of the air source triplet 8 is connected to the input end of the air control solenoid valve 7, the output end of the air control solenoid valve 7 is connected to the input end of the air supply solenoid valve 9, the output end of the air supply solenoid valve 9 is connected to the pressure gauge 5, and the air source 6 and the air source triplet 8 are both connected to the controller.

[0053] It should be noted that in order to further improve the purity of the compressed air source 6 and realize the vacuum pressure adjustment of the compressed air, an air source triplet 8 can also be set, which is fixedly connected between the compressed air source 6 and the vacuum generator 31, and the pressure of the compressed air input by the compressed air source 6 is adjusted so that it can adapt to the rated pressure of the vacuum generator 31. By adjusting the size of the vacuum, the greater the compressed air input pressure, the greater the vacuum generated by the subsequent vacuum generator 31.

[0054] In the above embodiment, the gas source triplex 8 includes a filter, a pressure regulating valve and a micro-mist processor. The filter is used to remove dust from the gas output by the gas source 6, the pressure regulating valve is used to adjust the pressure of the gas output by the gas source 6, and the micro-mist processor is used to remove oil from the gas output by the gas source 6.

[0055] It can be understood that the high-pressure air supplied to the factory is pressure-regulated, dust-removed and oil-removed through a pressure regulating valve, a filter and a mist processor.

[0056] Among them, the filter is used to clean the gas source 6, which can filter out moisture in the compressed air to prevent moisture from entering the device with the gas. The pressure regulating valve stabilizes the pressure of the gas source 6 to keep the gas source 6 in a constant state, which can reduce the damage to hardware such as valves or actuators caused by sudden changes in the gas pressure of the gas source 6.

[0057] As a preferred embodiment, the pressure gauge 5 has a spring diaphragm inside, and the spring diaphragm is used to sense pressure and convert the sensed pressure into analog current and output it to the controller.

[0058] In the above situation, the air supply solenoid valve 9, the first solenoid valve 41 and the vacuum solenoid valve 42 are all normally open solenoid valves, the air control solenoid valve 7 is a normally closed solenoid valve, and the air control solenoid valve 7, the air supply solenoid valve 9, the first solenoid valve 41 and the vacuum solenoid valve 42 are all connected to the controller.

[0059] It can be understood that the normally open solenoid valve is in a flow state when the power is off, and is in a disconnected state when the power is on; the normally closed solenoid valve is in a disconnected state when the power is off, and is in a flow state when the power is on.

[0060] In the above embodiment, the suction cup 1 is provided with a vacuum joint for connecting a vacuum pipe.

[0061] It should be noted that the connection between the vacuum pipe and the suction cup 1 is achieved by setting a vacuum joint, so that a sealed connection can be formed between the vacuum pipe and the suction cup 1, and no air leakage will occur. In actual life, other connection methods can also be used, and there is no limitation to this, as long as the above-mentioned technical effects can be achieved.

[0062] In summary, the utility model provides a vacuum power-off automatic switching device for wafer grinding. This solution mainly uses the vacuum generator 31 as a backup vacuum source. When the equipment is powered off, the wafer may be in the process of transportation or grinding. If the vacuum is lost at this time, the wafer will fall and break. In order to ensure that the wafer does not lose the vacuum when the power is off, the device needs to have an automatic power-off switching function. When the normal equipment is powered on, the air supply solenoid valve 9 is in an open circuit state, the first solenoid valve 41 is controlled to be closed (i.e., the passage state), and the air control solenoid valve 7 is closed (i.e., the passage state). At this time, the vacuum pump 21 is turned on to complete the vacuuming action, and the vacuum generator 31 on the vacuum pipeline will not affect the vacuuming; when the equipment suddenly loses power, the air control solenoid valve 7 is in an open circuit state, the air supply solenoid valve 9 is closed (i.e., the passage state), and the vacuum breaking air is avoided. At this time, the first solenoid valve 41 is closed (i.e., the passage state). Due to the high-speed circulation of air, vacuuming is generated under the action of the vacuum generator 31, and the vacuum solenoid valve 42 is also in a closed state (i.e., the passage state), which can produce an adsorption effect on the wafer. This gas path does not require the UPS power supply to provide power uninterruptedly, thereby reducing the cost of the device.

[0063] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0064] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0065] The above is a detailed introduction to the vacuum power-off automatic switching device for wafer grinding provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A vacuum power-off automatic switching device for wafer grinding, characterized in that: include: A suction cup (1), the suction cup (1) being used for sucking a wafer; A first vacuum channel (2) is connected to the suction cup (1), and the first vacuum channel (2) is used to form a negative pressure in a powered state to absorb the wafer; The second vacuum channel (3) is arranged in parallel with the first vacuum channel (2) and is connected to the vacuum pump (21) of the first vacuum channel (2). The second vacuum channel (3) is used to form a negative pressure in a power-off state to adsorb the wafer. The first vacuum channel (2) and the second vacuum channel (3) are automatically switched through a valve body assembly (4) connected to a controller, so that the suction cup (1) can stably adsorb the wafer in both the power-on and power-off states.

2. The automatic switching device for vacuum power failure during wafer grinding according to claim 1, characterized in that: The valve body assembly (4) comprises: a first solenoid valve (41), arranged in the first vacuum channel (2), the first solenoid valve (41) being used to control the connection and disconnection of the first vacuum channel (2), the first solenoid valve (41) being connected to a controller; A vacuum solenoid valve (42) is provided in the second vacuum channel (3), and the vacuum solenoid valve (42) is used to control the connection and disconnection of the second vacuum channel (3). The vacuum solenoid valve (42) is connected to the controller.

3. The automatic switching device for vacuum power off during wafer grinding according to claim 2, characterized in that: One end of the vacuum pump (21) is connected to the suction cup (1) through a vacuum pipe, and the other end of the vacuum pump (21) is connected to a power source. The first solenoid valve (41) is arranged on the vacuum pipe. The second vacuum channel (3) comprises a vacuum generator (31). The vacuum generator (31) is arranged on the vacuum pipe. The vacuum generator (31) is arranged between the vacuum pump (21) and the first solenoid valve (41). The vacuum solenoid valve (42) is connected to the vacuum pipe in parallel. One end of the vacuum solenoid valve (42) is connected to the vacuum generator (31), and the other end of the vacuum solenoid valve (42) is connected to the vacuum pipe between the air control solenoid valve (7) and the suction cup (1).

4. The automatic switching device for vacuum power off during wafer grinding according to claim 3, characterized in that: A pressure gauge (5) is provided on the vacuum pipeline, and the pressure gauge (5) is arranged close to the suction cup (1).

5. The automatic switching device for vacuum power off during wafer grinding according to claim 4, characterized in that: The vacuum pipeline is connected to a gas source (6), and the gas source (6) provides positive pressure gas to the vacuum pipeline.

6. The automatic switching device for vacuum power off during wafer grinding according to claim 5, characterized in that: The vacuum pipeline is also provided with the air control solenoid valve (7), the air source triplet (8) and the air supply solenoid valve (9); the input end of the air source triplet (8) is connected to the output end of the air source (6); the output end of the air source triplet (8) is connected to the input end of the air supply solenoid valve (9); the output end of the air supply solenoid valve (9) is connected to the input end of the air control solenoid valve (7); the output end of the air control solenoid valve (7) is connected to the pressure gauge (5); the air source (6) and the air source triplet (8) are both connected to the controller.

7. The automatic switching device for vacuum power failure during wafer grinding according to claim 6, characterized in that: The gas source triplex (8) comprises a filter, a pressure regulating valve and a micro mist processor, wherein the filter is used to remove dust from the gas output by the gas source (6), the pressure regulating valve is used to adjust the pressure of the gas output by the gas source (6), and the micro mist processor is used to remove oil from the gas output by the gas source (6).

8. The automatic switching device for vacuum power failure during wafer grinding according to claim 7, characterized in that: The pressure gauge (5) has a spring diaphragm inside, and the spring diaphragm is used to sense pressure and convert the sensed pressure into analog current and output it to the controller.

9. The automatic switching device for vacuum power off during wafer grinding according to claim 8, characterized in that: The air supply solenoid valve (9), the first solenoid valve (41) and the vacuum solenoid valve (42) are all normally open solenoid valves, the air control solenoid valve (7) is a normally closed solenoid valve, and the air control solenoid valve (7), the air supply solenoid valve (9), the first solenoid valve (41) and the vacuum solenoid valve (42) are all connected to the controller.

10. The automatic switching device for vacuum power off during wafer grinding according to any one of claims 3 to 9, characterized in that: The suction cup (1) is provided with a vacuum joint for connecting to the vacuum pipeline.

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