Automatic material changing mechanism of semiconductor device packaging machine
By installing an inner tube, outer tube, push spring, vertical tube, and pressure spring on the semiconductor device packaging machine, and using the suction force of the air supply structure to control the movement of the suction cup, the problem of uneven automatic material changing in the semiconductor device packaging machine is solved, and the uniformity of the quantity of material picked up each time is achieved.
Patent Information
- Application Number
- CN202421148622.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-24
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-05-24
AI Technical Summary
Existing semiconductor device packaging machines cannot guarantee that the quantity of materials picked up each time is the same during automatic material changing, resulting in uneven packaging of semiconductor devices.
An automatic material changing mechanism for a semiconductor device packaging machine is adopted. By installing an inner tube, an outer tube, a push spring, a vertical tube, and a pressure spring, the suction force provided by the air supply structure is used to adsorb the semiconductor devices by the suction cups. After all the suction cups are firmly attached, the suction cups are detached from the holding box by pulling the vertical tube and the inner tube, ensuring that the number of semiconductor devices falling into the hopper each time is the same.
This ensures the uniformity of the number of semiconductor devices falling into the hopper each time, thus guaranteeing the uniformity of the packaging.
Smart Images
Figure CN222311025U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor device packaging, in particular to an automatic material changing mechanism for a semiconductor device packaging machine. Background Art
[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators, which use the special electrical properties of semiconductor materials to perform specific functions.
[0003] Packaging machines are a type of machine that packages products to protect and beautify them.
[0004] After semiconductor devices are processed, they need to be packaged by a packaging machine for easy transportation. The semiconductor devices are placed in a material holding structure, and then the semiconductor devices inside are packaged. However, when the existing semiconductor device packaging machine automatically changes materials for semiconductor device packaging, it cannot ensure that the quantity of materials taken each time is the same, resulting in uneven semiconductor devices after packaging. To this end, we provide an automatic material changing mechanism for semiconductor device packaging machines to solve the above problems. Utility Model Content
[0005] 1) Technical issues solved
[0006] The purpose of the utility model is to make up for the deficiencies of the prior art and to provide an automatic material changing mechanism for a semiconductor device packaging machine.
[0007] 2) Technical solution
[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an automatic material changing mechanism of a semiconductor device packaging machine, comprising a support table, a containing box and a hopper, an electric reciprocating telescopic rod is installed on the bottom surface of the containing box, the lower end of the electric reciprocating telescopic rod is fixedly connected to the support table, one end of the support table away from the containing box is fixedly sleeved on the outer surface of the hopper, a reciprocating structure is arranged above the containing box, both ends of the reciprocating structure are connected to the support table, a pressure sensing starter is installed on the side of the upper end of the support table away from the hopper, the pressure sensing starter is connected to the reciprocating structure, a hollow frame is arranged inside the containing box, a push rod is arranged below the pressure sensing starter, the push rod is fixedly connected to the hollow frame, an outer tube is fixedly installed on the bottom surface of the hollow frame, The lower end of the outer tube is slidably inserted with the inner tube, and the lower end of the inner tube is fixedly connected with a suction cup connected with the interior thereof, the upper end of the inner tube is elastically connected to the inner wall of the hollow frame by a push spring, a cross plate is arranged above the hollow frame, the cross plate is connected to the reciprocating structure, a double tube plate is fixedly inserted on the upper surface of the cross plate, an air supply structure connected with the interior thereof is installed on the upper surface of the double tube plate, the bottom surface of the double tube plate is two tubular structures, vertical pipes are slidably inserted inside the two tubular structures of the double tube plate, the lower end of the vertical pipes is fixedly inserted on the upper surface of the hollow frame, the upper surface of the vertical pipes is elastically connected to the inner wall of the double tube plate by a pressure spring, an inclined plate is arranged between the containing box and the hopper, the inclined plate is fixedly connected to the hopper, and the other end of the hopper is in sliding contact with the side of the containing box.
[0009] Furthermore, the reciprocating structure includes an electric motor and a reciprocating screw, the two ends of the reciprocating screw are respectively rotatably connected to the two ends of the support platform, the motor is fixedly connected to the support platform, one end of the reciprocating screw is fixedly connected to the output end of the motor, the pressure sensing starter is installed together with the motor, and the cross plate is threadedly sleeved on the outer surface of the reciprocating screw.
[0010] Furthermore, the air supply structure includes an air pump and a tension telescopic rod, the two ends of the tension telescopic rod are respectively fixedly connected to the air pump and the double tube plate, the front and back sides of the air pump are fixedly connected with vertical rods, the upper surface of the end of the support platform away from the pressure sensing starter is fixedly connected with a top frame, the end of the top frame close to the vertical rod is a triangular end, the bottom surface of the triangular end of the top frame is located below the bottom surface of the vertical rod, and the upper surface of the triangular end of the top frame is located above the bottom surface of the vertical rod.
[0011] Furthermore, a parallel rod is arranged behind the reciprocating screw rod, both ends of the parallel rod are fixedly connected to the support platform, and the cross plate is slidably sleeved on the outer surface of the parallel rod.
[0012] Furthermore, a plurality of outer tubes are provided, and the plurality of outer tubes are equidistantly distributed on the bottom surface of the hollow frame.
[0013] Furthermore, the two risers are coaxially arranged with the two tubular structures of the double tube plate, and the two risers are symmetrically distributed about the axis of the cross plate.
[0014] Furthermore, the upper end of the containing box is located above one side of the hopper, and the upper end of the hopper is located below the suction cup.
[0015] 3) Beneficial effects:
[0016] Compared with the prior art, the automatic material changing mechanism of the semiconductor device packaging machine has the following beneficial effects:
[0017] 1. The utility model installs an inner tube, an outer tube, a push spring, a vertical tube and a pressure spring. When the hollow frame is located in the containing box, the air supply structure provides suction to the outer tube, the vertical tube and the suction cup through the double tube plate, the vertical tube and the hollow frame. When the suction cup contacts the semiconductor device, the semiconductor device is adsorbed. When all the suction cups tightly adsorb the semiconductor, the suction force exerted on the hollow frame no longer causes leakage. The suction force provided by the air supply structure to the double tube plate pulls the vertical tube and the inner tube to move upward, driving the suction cup and the semiconductor device adsorbed thereon to detach from the containing box. Only after all the suction cups adsorb the semiconductor device, the hollow frame and the suction cup can detach from the containing box, thereby ensuring that the number of semiconductor devices dropped into the hopper is the same each time.
[0018] 2. The utility model installs a tension telescopic rod, an air pump, a vertical rod and a top frame. When the hollow frame moves to the top of the hopper, the triangular end of the top frame contacts the vertical rod. When the vertical rod moves to the right, it moves on the triangular end surface of the top frame, driving the air pump to stretch the tension telescopic rod, so that the air pump is separated from the double tube sheet and stops providing suction to the double tube sheet. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;
[0020] Figure 2 This is a schematic diagram of the front view structure of the utility model;
[0021] Figure 3 This is a schematic diagram of the internal structure of the storage box of the utility model;
[0022] Figure 4 This is a schematic diagram of the connection between the riser and the double tube sheet of the utility model;
[0023] Figure 5 This is a schematic diagram of the connection between the inner tube and the outer tube of the utility model.
[0024] In the figure: 1. support table; 2. containing box; 3. hopper; 4. electric reciprocating telescopic rod; 5. reciprocating structure; 51. motor; 52. reciprocating screw rod; 521. parallel rod; 6. air supply structure; 61. air pump; 62. vertical rod; 63. top frame; 64. tension telescopic rod; 7. pressure sensing starter; 8. top rod; 9. outer tube; 10. push spring; 11. suction cup; 12. hollow frame; 13. inner tube; 14. cross plate; 15. double tube plate; 16. vertical tube; 17. inclined plate; 18. pressure spring. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0026] like Figure 1-5 As shown, the utility model provides a technical solution: an automatic material changing mechanism for a semiconductor device packaging machine, comprising a support table 1, a containing box 2 and a hopper 3, an electric reciprocating telescopic rod 4 is installed on the bottom surface of the containing box 2, the lower end of the electric reciprocating telescopic rod 4 is fixedly connected to the support table 1, one end of the support table 1 away from the containing box 2 is fixedly sleeved on the outer surface of the hopper 3, a reciprocating structure 5 is arranged above the containing box 2, both ends of the reciprocating structure 5 are connected to the support table 1, a pressure sensing starter 7 is installed on the side of the upper end of the support table 1 away from the hopper 3, the pressure sensing starter 7 is connected to the reciprocating structure 5, a hollow frame 12 is arranged inside the containing box 2, a push rod 8 is arranged below the pressure sensing starter 7, and the push rod 8 is fixedly connected to the hollow frame 12.
[0027] An outer tube 9 is fixedly installed on the bottom surface of the hollow frame 12, and an inner tube 13 is slidably inserted at the lower end of the outer tube 9. A suction cup 11 connected to the inside of the inner tube 13 is fixedly connected at the lower end of the inner tube 13. A plurality of outer tubes 9 are provided, and the plurality of outer tubes 9 are equidistantly distributed on the bottom surface of the hollow frame 12. The upper end of the inner tube 13 is elastically connected to the inner wall of the hollow frame 12 by a push spring 10. The push spring 10 has a tendency to push the inner tube 13 to move downward. The electric reciprocating telescopic rod 4 drives the containing box 2 to reciprocate up and down, so that the semiconductor devices placed inside can be evenly distributed, so that all the suction cups 11 can contact the semiconductor devices. A cross plate 14 is provided above the hollow frame 12, and the cross plate 14 is connected to the reciprocating structure 5. The reciprocating structure 5 includes a motor 51 and a reciprocating screw rod 52. The two ends of the reciprocating screw rod 52 are respectively It is rotatably connected to both ends of the support platform 1, the motor 51 is fixedly connected to the support platform 1, one end of the reciprocating screw 52 is fixedly connected to the output end of the motor 51, and the pressure sensing starter 7 is installed together with the motor 51. After the top rod 8 moves upward to apply pressure to the pressure sensing starter 7, the pressure sensing starter 7 can drive the motor 51 to rotate a certain number of circles, and the cross plate 14 is threadedly sleeved on the outer surface of the reciprocating screw 52, so that the cross plate 14 can perform a reciprocating movement by meshing with the reciprocating screw 52. Parallel rods 521 are arranged at the rear of the reciprocating screw 52, and both ends of the parallel rods 521 are fixedly connected to the support platform 1, and the cross plate 14 is slidably sleeved on the outer surface of the parallel rods 521. The parallel rods 521 improve the stability of the meshing of the cross plate 14 and the reciprocating screw 52.
[0028] The upper surface of the cross plate 14 is fixedly plugged with a double tube plate 15, and the upper surface of the double tube plate 15 is installed with an air supply structure 6 connected to the inside thereof. The bottom surface of the double tube plate 15 is two tubular structures. The air supply structure 6 includes an air pump 61 and a tension telescopic rod 64. The two ends of the tension telescopic rod 64 are respectively fixedly connected to the air pump 61 and the double tube plate 15. The tension telescopic rod 64 has a tendency to drive the air pump 61 to contact and communicate with the upper end of the double tube plate 15. The front and back sides of the air pump 61 are fixedly connected with a vertical rod 62. The support platform The upper surface of the end away from the pressure sensing starter 7 is fixedly connected with a top frame 63. The end of the top frame 63 close to the vertical rod 62 is a triangular end. The bottom surface of the triangular end of the top frame 63 is located below the bottom surface of the vertical rod 62, and the upper surface of the triangular end of the top frame 63 is located above the bottom surface of the vertical rod 62. After the suction cup 11 is completely moved to the top of the hopper 3, the vertical rod 62 moves to the right and contacts the top frame 63, pushing the air pump 61 upward to separate from the double tube sheet 15, so that the air pump 61 stops providing air force to the inside of the double tube sheet 15, and the suction cup 11 is completely moved to the top of the hopper 3. The semiconductor devices adsorbed by the plate 11 can fall into the hopper 3. The two tubular structures of the double tube plate 15 are slidably plugged with a riser 16. The lower ends of the risers 16 are fixedly plugged into the upper surface of the hollow frame 12. The two risers 16 are coaxially arranged with the two tubular structures of the double tube plate 15, respectively. The two risers 16 are symmetrically distributed with the axis of the cross plate 14. The upper surface of the riser 16 is elastically connected to the inner wall of the double tube plate 15 through a pressure spring 18. The upper end of the containing box 2 is located above one side of the hopper 3. The hopper The upper end of 3 is located below the suction cup 11, and an inclined plate 17 is provided between the containing box 2 and the hopper 3, and the inclined plate 17 is fixedly connected to the hopper 3. The other end of the hopper 3 is in sliding contact with the side of the containing box 2, and the electric reciprocating telescopic rod 4 pushes the upper end of the containing box 2 upward to move to a point lower than the lower end of the highest end of the inclined plate 17. When the hollow frame 12 moves toward the containing box 2, the suction cup 11 and the containing box 2 can slide on the inclined plate 17 to compress the push spring 10 and the pressure spring 18 and enter the inside of the containing box 2.
[0029] Working principle: When the vertical rod 62 is not in contact with the top frame 63, the tension telescopic rod 64 pulls the air pump 61 to contact the upper end of the double tube sheet 15, so that the air pump 61 provides suction to the inside of the double tube sheet 15, and provides suction to the suction cup 11 through the vertical pipe 16, the hollow frame 12, the outer tube 9 and the inner tube 13. When the hollow frame 12 is located in the storage box 2, the push spring 10 pushes the inner tube 13 to contact the semiconductor devices inside the storage box 2, so that the suction cups 11 adsorb the semiconductor devices. When all the suction cups 11 are tightly attached to the semiconductors, the suction force on the hollow frame 12 no longer causes leakage. When the air pump 61 continues to provide suction to the double tube sheet 15, the vertical pipe 16 and the inner tube 13 are pulled upward, driving the suction cup 11 and the semiconductor devices adsorbed thereon to separate from the storage box 2. When the hollow frame 12 continues to move upward, the top rod 8 is used to push the pressure sensor 11 to move upward. When the starter 7 applies pressure, the motor 51 is controlled to drive the reciprocating screw 52 to rotate a certain number of times. The cross plate 14 engages with the rotating reciprocating screw 52 to first drive the hollow frame 12 to move above the hopper 3. When the hollow frame 12 moves above the hopper 3, the triangular end of the top frame 63 contacts the vertical rod 62. When the vertical rod 62 moves to the right, it moves on the triangular end surface of the top frame 63, driving the air pump 61 to stretch the tension telescopic rod 64, so that the air pump 61 is separated from the double-tube plate 15, and stops providing suction to the double-tube plate 15, so that the semiconductor device adsorbed by the suction cup 11 falls into the hopper 3. Then, when the reciprocating screw 52 continues to rotate, it drives the cross plate 14 to move toward the receiving box 2, and the suction cup 11 and the hollow frame 12 can be moved into the receiving box 2 by sliding on the inclined plate 17, and the motor 51 stops rotating.
Claims
1. An automatic material changing mechanism for a semiconductor device packaging machine, comprising a support table (1), a containing box (2) and a hopper (3), characterized in that: An electric reciprocating telescopic rod (4) is installed on the bottom surface of the containing box (2), the lower end of the electric reciprocating telescopic rod (4) is fixedly connected to the support platform (1), the end of the support platform (1) away from the containing box (2) is fixedly sleeved on the outer surface of the hopper (3), a reciprocating structure (5) is arranged above the containing box (2), the two ends of the reciprocating structure (5) are connected to the support platform (1), and a pressure sensing starter is installed on the side of the upper end of the support platform (1) away from the hopper (3). The pressure sensing starter (7) is connected to the reciprocating structure (5), a hollow frame (12) is arranged inside the containing box (2), a push rod (8) is arranged below the pressure sensing starter (7), the push rod (8) is fixedly connected to the hollow frame (12), an outer tube (9) is fixedly installed on the bottom surface of the hollow frame (12), an inner tube (13) is slidably inserted at the lower end of the outer tube (9), and a suction cup (13) is fixedly connected to the lower end of the inner tube (13) and communicated with the interior thereof. 11), the upper end of the inner tube (13) is elastically connected to the inner wall of the hollow frame (12) through a push spring (10), a cross plate (14) is arranged above the hollow frame (12), the cross plate (14) is connected to the reciprocating structure (5), a double tube plate (15) is fixedly plugged on the upper surface of the cross plate (14), an air supply structure (6) connected to the inside of the double tube plate (15) is installed on the upper surface of the double tube plate (15), the bottom surface of the double tube plate (15) is two tubular structures, and the double tube plate ( A vertical pipe (16) is slidably inserted into the two tubular structures of the hollow frame (15), the lower end of the vertical pipe (16) is fixedly inserted into the upper surface of the hollow frame (12), the upper surface of the vertical pipe (16) is elastically connected to the inner wall of the double tube plate (15) through a pressure spring (18), an inclined plate (17) is provided between the containing box (2) and the hopper (3), the inclined plate (17) is fixedly connected to the hopper (3), and the other end of the hopper (3) is in sliding contact with the side of the containing box (2).
2. The automatic material changing mechanism of a semiconductor device packaging machine according to claim 1, characterized in that: The reciprocating structure (5) comprises a motor (51) and a reciprocating screw (52), the two ends of the reciprocating screw (52) are rotatably connected to the two ends of the support platform (1) respectively, the motor (51) is fixedly connected to the support platform (1), one end of the reciprocating screw (52) is fixedly connected to the output end of the motor (51), the pressure sensing starter (7) is installed together with the motor (51), and the cross plate (14) is threadedly sleeved on the outer surface of the reciprocating screw (52).
3. The automatic material changing mechanism of a semiconductor device packaging machine according to claim 1, characterized in that: The air supply structure (6) comprises an air pump (61) and a tension telescopic rod (64), the two ends of the tension telescopic rod (64) are respectively fixedly connected to the air pump (61) and the double tube plate (15), the front and back sides of the air pump (61) are fixedly connected to the vertical rod (62), the upper surface of one end of the support platform (1) away from the pressure sensing starter (7) is fixedly connected to a top frame (63), the end of the top frame (63) close to the vertical rod (62) is a triangular end, the bottom surface of the triangular end of the top frame (63) is located below the bottom surface of the vertical rod (62), and the upper surface of the triangular end of the top frame (63) is located above the bottom surface of the vertical rod (62).
4. The automatic material changing mechanism of a semiconductor device packaging machine according to claim 2, characterized in that: A parallel rod (521) is arranged behind the reciprocating screw rod (52), both ends of the parallel rod (521) are fixedly connected to the support platform (1), and the cross plate (14) is slidably sleeved on the outer surface of the parallel rod (521).
5. The automatic material changing mechanism of a semiconductor device packaging machine according to claim 1, characterized in that: A plurality of outer tubes (9) are provided, and the plurality of outer tubes (9) are distributed at equal distances on the bottom surface of the hollow frame (12).
6. The automatic material changing mechanism of a semiconductor device packaging machine according to claim 1, characterized in that: The two risers (16) are respectively coaxially arranged with the two tubular structures of the double tube plate (15), and the two risers (16) are symmetrically distributed about the axis of the cross plate (14).
7. The automatic material changing mechanism of a semiconductor device packaging machine according to claim 1, characterized in that: The upper end of the containing box (2) is located above one side of the hopper (3), and the upper end of the hopper (3) is located below the suction cup (11).