Air-cooled heat dissipation brake
By designing an air-cooled heat dissipation structure in the brakes of the stamping equipment, using the heat dissipation notch and the thermal conduction fan for air-cooling heat dissipation, and combining with the semiconductor refrigeration plate to reduce the temperature, the performance degradation and safety risks of the brake due to insufficient heat dissipation are solved, and the performance degradation and safety risks of the brake are improved. The stability and safety of the equipment are achieved.
Patent Information
- Application Number
- CN202420182963.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-25
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-01-25
AI Technical Summary
During frequent use of brakes in stamping equipment, the brake performance is degraded due to the lack of effective heat dissipation structure, which may lead to quality deviations of the machining parts and safety risks of operators.
An air-cooled heat dissipation brake is designed, including a heat dissipation outer shell, a heat conduction mechanism and a refrigeration mechanism. The air-cooled heat dissipation is achieved through five sets of heat dissipation notches and a heat conduction fan, and a semiconductor refrigeration plate is used to reduce the temperature of the heat dissipation chamber and enhance the heat dissipation effect.
Effectively reduce the temperature of the brake, improve its stability and safety, and ensure the quality of the processed parts and the safety of the operator.
Smart Images

Figure CN222315749U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of brakes for stamping equipment, and particularly relates to an air-cooled heat dissipation brake. Background Art
[0002] Stamping equipment is the so-called press, scientific name: stamping machine, oil press, hydraulic press. Stamping equipment is composed of several mechanical parts, among which the brake is an important component to control the braking of the stamping equipment. The performance of the brake determines the stability and safety of the stamping equipment. During the use of the stamping equipment, it is necessary to frequently use the brake to perform braking operations, so that the workpiece to be processed can be stamped according to the processing requirements, and it can be braked in time in an emergency to prevent accidents. The brake of the stamping equipment will generate a lot of heat during frequent use. Common stamping equipment brakes do not have additional corresponding heat dissipation structures, which results in the heat generated by the brake cannot be effectively dissipated. The brake will be in a high-temperature environment for a long time, and the brake will be in a relatively harsh environment for operation, which makes it difficult to guarantee its braking performance. After long-term use, it may not be able to perform precise operations according to the operator's established operations, resulting in deviations in the quality of the processed parts.
[0003] Secondly, stamping equipment is a kind of equipment with a high risk factor, and the safety awareness of operators varies. Operators may have their hands under the stamping parts when working. As the braking performance of the stamping equipment brake decreases, the brake may fail or the braking time may be too long, causing the stamping parts to cause damage to the operator's hands.
[0004] In summary, there will be some problems if the stamping equipment brake is not equipped with a corresponding heat dissipation structure, so it is hoped to propose a new structure to solve the above technical problems. Utility Model Content
[0005] In view of the deficiencies in the prior art, the utility model aims to provide an air-cooled heat-dissipating brake to solve the problems raised in the above-mentioned background technology.
[0006] The utility model is realized through the following technical scheme: a brake with air-cooled heat dissipation, comprising: a heat dissipation outer shell, a heat dissipation cavity, a heat conduction mechanism and a refrigeration mechanism, an inner shell body is arranged inside the heat dissipation outer shell, an outer shell body is arranged outside the heat dissipation outer shell, a heat dissipation cavity is formed between the inner shell body and the outer shell body, five groups of heat dissipation through slots are vertically penetrated through the outer side of the outer shell body, a heat conduction mechanism is arranged inside the heat dissipation through slots, a refrigeration mechanism groove is opened on the right side of the outer shell body, a refrigeration mechanism is arranged inside the refrigeration mechanism groove, and a brake body is arranged inside the heat dissipation outer shell.
[0007] As a preferred embodiment, the five groups of heat dissipation slots are equally distributed on a circle, and mounting grooves are provided on the outer sides of the five groups of heat dissipation slots.
[0008] As a preferred embodiment, a mounting frame is provided on the outside of the heat-conducting mechanism, and the mounting frame and the mounting groove are movably engaged with each other and connected by screws. A heat-conducting fan is provided on the inside of the heat-conducting mechanism. The five groups of heat-conducting mechanisms are divided into two groups and the upper and lower heat-conducting mechanisms are one group. The heat-conducting mechanism is embedded in the mounting groove through its mounting frame and fixed with screws. Starting the heat-conducting fan in the heat-conducting mechanism can cool the brake body by air.
[0009] As a preferred embodiment, the outer side surface of the inner shell body is provided with five groups of heat dissipation openings which are equally distributed in a circle, each group of the heat dissipation openings is composed of a plurality of rectangular through grooves, the position of each group of the heat dissipation openings corresponds one-to-one with each group of heat dissipation through grooves, and the wind generated by the heat-conducting fan can cool the brake body through the heat dissipation openings.
[0010] As a preferred embodiment, the refrigeration mechanism is provided with three groups of refrigeration fin brackets at one end close to the heat dissipation slot, and several groups of semiconductor refrigeration fins are provided on the lower side of the refrigeration fin bracket. The temperature in the heat dissipation cavity can be reduced by the semiconductor refrigeration fins, thereby improving the air-cooling heat dissipation effect of the brake body.
[0011] As a preferred embodiment, ring frames are provided at both ends of the left and right sides of the refrigeration mechanism, and the ring frames are movably engaged with the refrigeration mechanism grooves. Connecting protrusions are provided at both ends of the right side of the refrigeration mechanism, and a group of connecting tension spring parts are provided on the front side surface of the front connecting protrusion and the rear side surface of the rear connecting protrusion.
[0012] As a preferred embodiment, a group of connecting ring seats are provided on the right side surface of the shell body and the front and rear ends of the refrigeration mechanism groove. The connecting tension spring member is used in conjunction with the connecting ring seat. The refrigeration mechanism groove, refrigeration mechanism and connecting ring seat are each provided with two groups and are located at the upper and lower ends of the shell body. When the ambient temperature is high, the ring frame of the refrigeration mechanism slides along the refrigeration mechanism groove, so that the refrigeration plate bracket in the refrigeration mechanism is located in the heat dissipation groove. The refrigeration mechanism can be fixed by using the connecting tension spring member in conjunction with the connecting ring seat.
[0013] After adopting the above technical scheme, the beneficial effects of the utility model are as follows: by adding a heat dissipation outer shell and a heat conduction mechanism, three of the five groups of heat conduction mechanisms are started, so that the heat conduction fans in the heat conduction mechanisms are operated, and after the wind is generated, it is blown to the brake body inside the heat dissipation outer shell through the heat dissipation port opened on the outer side of the inner shell body, thereby being able to perform air cooling operation on the brake body;
[0014] By adding a heat dissipation shell and a refrigeration mechanism, when the environment is stable and relatively high, the ring frames at the left and right ends of the refrigeration mechanism are slid along the refrigeration mechanism grooves, so that the refrigeration plate bracket in the refrigeration mechanism is located in the heat dissipation groove. When the semiconductor refrigeration plate is working, the heat dissipation cavity is in a low temperature state, and the heat conduction mechanisms corresponding to the two groups of refrigeration mechanisms conduct the heat generated by the semiconductor refrigeration plate, thereby enhancing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0016] Figure 1 The utility model is a schematic diagram of the overall structure of an air-cooled heat dissipation brake.
[0017] Figure 2 The utility model is a schematic structural diagram of a heat dissipation outer shell in an air-cooled heat dissipation brake.
[0018] Figure 3 for Figure 2 Enlarged view of point A in the middle.
[0019] Figure 4 The utility model is a schematic structural diagram of a heat conduction mechanism in an air-cooled heat dissipation brake.
[0020] Figure 5 The utility model is a schematic diagram of the structure of a refrigeration mechanism in an air-cooled heat dissipation brake.
[0021] Figure 6 The utility model is a partial structural schematic diagram of a refrigeration mechanism in an air-cooled heat dissipation brake.
[0022] In the figure, 100-heat dissipation outer shell, 101-inner shell body, 102-heat dissipation port, 103-outer shell body, 104-heat dissipation slot, 105-installation slot, 106-refrigeration mechanism slot, 107-connecting ring seat, 108-heat dissipation cavity;
[0023] 200-heat conduction mechanism, 201-installation frame, 202-heat conduction fan;
[0024] 300-refrigeration mechanism, 301-refrigeration plate bracket, 302-semiconductor refrigeration plate, 303-connecting tension spring member;
[0025] 400-Brake body. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] See also Figures 1 to 6 The utility model provides a technical solution: an air-cooled heat dissipation brake, comprising: a heat dissipation outer shell 100, a heat dissipation cavity 108, a heat conduction mechanism 200 and a refrigeration mechanism 300, and an inner shell body 101 is provided inside the heat dissipation outer shell 100;
[0028] An outer shell body 103 is disposed outside the heat dissipation outer shell 100, a heat dissipation cavity 108 is formed between the inner shell body 101 and the outer shell body 103, and five groups of heat dissipation slots 104 are vertically penetrated through the outer side surface of the outer shell body 103;
[0029] A heat conducting mechanism 200 is disposed inside the heat dissipation slot 104 , a cooling mechanism slot 106 is opened on the right side of the shell body 103 , a cooling mechanism 300 is disposed inside the cooling mechanism slot 106 , and a brake body 400 is disposed inside the heat dissipation shell body 100 .
[0030] The five groups of heat dissipation slots 104 are equally distributed in a circle, and mounting grooves 105 are formed on the outer sides of the five groups of heat dissipation slots 104 .
[0031] A mounting frame 201 is provided on the outside of the heat-conducting mechanism 200, and the mounting frame 201 and the mounting groove 105 are movably engaged with each other and connected by screws. A heat-conducting fan 202 is provided on the inside of the heat-conducting mechanism 200. The five groups of heat-conducting mechanisms 200 are divided into two groups and the upper and lower heat-conducting mechanisms 200 are one group. The heat-conducting mechanism 200 is embedded in the mounting groove 105 through its mounting frame 201 and fixed with screws. Starting the heat-conducting fan 202 in the heat-conducting mechanism 200 can perform air cooling and heat dissipation on the brake body 400. Three of the five groups of heat-conducting mechanisms 200 perform air cooling and heat dissipation, and the heat-conducting mechanism 200 at the corresponding position of the refrigeration mechanism 300 extracts the heat generated by the semiconductor refrigeration plate 302.
[0032] The outer side of the inner shell body 101 is provided with five groups of heat dissipation openings 102 equally distributed in a circle, each group of heat dissipation openings 102 is composed of a plurality of rectangular through grooves, and the position of each group of heat dissipation openings 102 corresponds one-to-one to each group of heat dissipation through grooves 104. The wind generated by the heat conduction fan 202 can cool the brake body 400 through the heat dissipation openings 102.
[0033] See also Figure 1-Figure 4, as the first embodiment of the utility model: first, the user embeds the five sets of heat-conducting mechanisms 200 into the mounting groove 105 through the mounting frame 201 thereof and fixes them with screws; secondly, the user starts three of the five sets of heat-conducting mechanisms 200 that are not provided with the refrigeration mechanism 300, and the heat-conducting fan 202 in the heat-conducting mechanism 200 can generate wind force, and then the brake body 400 is cooled by air through the heat dissipation port 102 opened on the outer side of the inner shell body 101, thereby being able to meet the heat dissipation requirements of the brake body 400 in daily use.
[0034] The cooling mechanism 300 is provided with three groups of cooling plate brackets 301 at one end close to the heat dissipation slot 104, and a plurality of groups of semiconductor cooling plates 302 are provided on the lower side of the cooling plate brackets 301. The semiconductor cooling plates 302 can reduce the temperature in the heat dissipation cavity 108, thereby improving the air-cooling heat dissipation effect of the brake body 400.
[0035] Ring frames are provided at both ends of the refrigeration mechanism 300, and the ring frames are movably engaged with the refrigeration mechanism groove 106. Connecting protrusions are provided at both ends of the right side of the refrigeration mechanism 300, and a group of connecting tension spring components 303 are provided on the front side surface of the front connecting protrusion and the rear side surface of the rear connecting protrusion.
[0036] A group of connecting ring seats 107 are provided on the right side of the shell body 103 and the front and rear ends of the refrigeration mechanism groove 106. The connecting tension spring member 303 is used in conjunction with the connecting ring seat 107. The refrigeration mechanism groove 106, the refrigeration mechanism 300 and the connecting ring seat 107 are each provided with two groups and are located at the upper and lower ends of the shell body 103. When the ambient temperature is high, the ring frame of the refrigeration mechanism 300 slides along the refrigeration mechanism groove 106, so that the refrigeration plate bracket 301 in the refrigeration mechanism 300 is located in the heat dissipation groove 104, and the refrigeration mechanism 300 can be fixed by using the connecting tension spring member 303 in conjunction with the connecting ring seat 107.
[0037] See also Figure 1-Figure 6As the second embodiment of the utility model: Based on the above-mentioned first embodiment, the refrigeration mechanism 300 is provided with three groups of refrigeration plate brackets 301 at one end near the heat dissipation slot 104, and a plurality of groups of semiconductor refrigeration plates 302 are provided on the lower side of the refrigeration plate bracket 301. Ring frames are provided at both ends of the refrigeration mechanism 300. The front and rear ends of the right side of the refrigeration mechanism 300 are provided with connecting protrusions. The front side surface of the front connecting protrusion and the rear side surface of the rear connecting protrusion are provided with a group of connecting tension springs 303. The right side surface of the shell body 103 and the front and rear ends of the refrigeration mechanism slot 106 are provided with a plurality of semiconductor refrigeration plates 302. Each of the refrigeration mechanisms is provided with a set of connecting ring seats 107. When the ambient temperature is high, the user removes the connecting tension spring member 303 of the refrigeration mechanism from the connecting ring seat 107 at the rear end, and slides the ring frame along the refrigeration mechanism groove 106, so that the refrigeration plate bracket 301 in the refrigeration mechanism 300 is located in the heat dissipation slot 104, and the air in the heat dissipation cavity 108 is cooled by the semiconductor refrigeration plate 302. The heat conduction mechanism 200 corresponding to the refrigeration mechanism 300 can conduct the heat generated by the semiconductor refrigeration plate 302 when it is working, thereby improving the air-cooled heat dissipation effect.
[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. An air-cooled brake, comprising: A heat dissipation outer shell (100), a heat dissipation cavity (108), a heat conduction mechanism (200) and a refrigeration mechanism (300), characterized in that an inner shell body (101) is provided inside the heat dissipation outer shell (100); An outer shell body (103) is provided on the outside of the heat dissipation outer shell (100), a heat dissipation cavity (108) is formed between the inner shell body (101) and the outer shell body (103), and five groups of heat dissipation slots (104) are vertically penetrated through the outer side surface of the outer shell body (103); A heat conduction mechanism (200) is provided inside the heat dissipation slot (104), a refrigeration mechanism slot (106) is provided on the right side of the shell body (103), a refrigeration mechanism (300) is provided inside the refrigeration mechanism slot (106), and a brake body (400) is provided inside the heat dissipation shell body (100).
2. The air-cooled heat dissipation brake according to claim 1, characterized in that: The five groups of heat dissipation slots (104) are equally distributed on a circumference, and mounting slots (105) are provided on the outsides of the five groups of heat dissipation slots (104).
3. The air-cooled heat dissipation brake according to claim 2, characterized in that: A mounting frame (201) is provided on the outside of the heat-conducting mechanism (200), the mounting frame (201) and the mounting groove (105) are movably engaged with each other and connected by screws, a heat-conducting fan (202) is provided on the inside of the heat-conducting mechanism (200), and the five groups of heat-conducting mechanisms (200) are divided into two groups, and the upper and lower heat-conducting mechanisms (200) are one group.
4. The air-cooled heat dissipation brake according to claim 3, characterized in that: The outer side surface of the inner shell body (101) is provided with five groups of heat dissipation openings (102) equally distributed in a circle, each group of the heat dissipation openings (102) is composed of a plurality of rectangular through grooves, and the position of each group of the heat dissipation openings (102) corresponds one-to-one to each group of heat dissipation through grooves (104).
5. The air-cooled heat dissipation brake according to claim 1, characterized in that: The refrigeration mechanism (300) is provided with three groups of refrigeration fin brackets (301) at one end close to the heat dissipation slot (104), and a plurality of groups of semiconductor refrigeration fins (302) are provided on the lower side of the refrigeration fin bracket (301).
6. The air-cooled heat dissipation brake according to claim 5, characterized in that: The left and right ends of the refrigeration mechanism (300) are provided with ring frames, and the ring frames are movably engaged with the refrigeration mechanism groove (106). The right side of the refrigeration mechanism (300) is provided with connecting protrusions at both the front and rear ends, and the front side surface of the front connecting protrusion and the rear side surface of the rear connecting protrusion are provided with a group of connecting tension spring parts (303).
7. The air-cooled heat dissipation brake according to claim 6, characterized in that: A set of connecting ring seats (107) are provided on the right side surface of the shell body (103) and the front and rear ends of the refrigeration mechanism groove (106); the connecting tension spring member (303) is used in conjunction with the connecting ring seat (107); the refrigeration mechanism groove (106), the refrigeration mechanism (300) and the connecting ring seat (107) are provided in two sets and are located at the upper and lower ends of the shell body (103).