Circuit board, temperature measuring equipment and vehicle

Abstract

The utility model provides a circuit board, a temperature measuring device and a vehicle, the circuit board comprises a circuit board body, a heating device, a temperature measuring circuit and a temperature detection line, and the heating device, the temperature measuring circuit and the temperature detection line are all arranged on the circuit board body. Wherein the temperature detection line is arranged between the heating device and the temperature measurement circuit, and the input end of the temperature measurement circuit is electrically connected with the output end of the temperature detection line. In practical application, the temperature detection line is in close contact with the heating point of the heating device, so that the temperature detection line can detect the temperature of the heating device in real time and output the temperature to the temperature measurement circuit to generate a corresponding temperature signal. According to the utility model, the thermocouple is replaced by the temperature detection line for temperature measurement, and the detection point of the temperature detection line is in contact with the bottom of the chip to be measured, so that the temperature detection line is in close contact with the heating point of the chip to be measured, and the accuracy and timeliness of chip temperature measurement are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature detection, in particular to a circuit board, a temperature measuring device and a vehicle. Background Art

[0002] As the power consumption of chips continues to increase, the power supply current continues to increase, and the temperature of chips becomes higher and higher during operation. The current method for testing chip temperature generally adopts a solution that places a thermistor or thermocouple near or on the surface of the chip. For example, when the thermistor is placed near the chip, the temperature of the chip is detected by the heat dissipated by the circuit board; when the thermocouple is placed on the surface of the chip, the temperature of the chip is detected by the heat dissipated by the package on the surface of the chip. Both of the above temperature measurement methods have certain delays and heat insulation. Therefore, the existing chip temperature measurement method can only detect the temperature dissipated by the chip to the outside, and cannot accurately and timely detect the heat dissipated from the inside of the chip body, resulting in poor detection accuracy. Utility Model Content

[0003] The main purpose of the utility model is to provide a circuit board, a temperature measuring device and a vehicle, aiming at improving the accuracy and timeliness of detecting the temperature of a chip.

[0004] The utility model proposes a circuit board, which comprises: a circuit board body; a heating device, which is arranged on the circuit board body; a temperature measuring circuit, which is arranged on the circuit board body; a temperature detecting line, which is arranged on the circuit board body and between the heating device and the temperature measuring circuit; the input end of the temperature measuring circuit is electrically connected to the output end of the temperature detecting line; the temperature detecting line is used to detect the temperature of the heating device and output it to the temperature measuring circuit to generate a corresponding temperature signal.

[0005] Optionally, the temperature detection line is formed on the circuit board body.

[0006] Optionally, the temperature detection line is formed on the circuit board body in the form of a circuit board conductor to reduce the production cost of the temperature detection line.

[0007] Optionally, the temperature detection line is formed on the circuit board body by copper-nickel electroplating to improve the processability of the temperature detection line; or, the temperature detection line is formed on the circuit board body by chemical copper-nickel deposition to improve the corrosion resistance of the temperature detection line.

[0008] Optionally, the temperature detection line includes a wire and a fixing member, and the wire is fixed to the circuit board body through the fixing member.

[0009] Optionally, the temperature detection line includes at least one detection point, and the detection point is arranged at the bottom of the heating device to contact the heating point of the heating device.

[0010] Optionally, the temperature detection line includes: a first wire and a second wire; the first end of the first wire and the first end of the second wire are connected to the detection point of the temperature detection line, and the second end of the first wire and the second end of the second wire are connected to the input end of the temperature measurement circuit.

[0011] Optionally, the first conductive wire is a copper conductive wire, and the second conductive wire is a copper-nickel conductive wire.

[0012] Optionally, the temperature measurement circuit includes: an amplifier circuit, the input end of the amplifier circuit is connected to the output end of the temperature detection line; the amplifier circuit is used to amplify the voltage corresponding to the temperature of the heating device; a control circuit, the input end of the control circuit is connected to the output end of the amplifier circuit; the control circuit is used to detect the temperature value of the heating device according to the voltage output by the amplifier circuit.

[0013] Optionally, the amplification circuit includes: a first resistor, a second resistor, a third resistor, a fourth resistor and a differential operational amplifier; the first end of the first resistor is connected to the output end of the temperature detection line, and the second end of the first resistor is connected to the first input end of the differential operational amplifier; the first end of the second resistor is connected to the output end of the temperature detection line, and the second end of the second resistor is connected to the second input end of the differential operational amplifier; the first end of the third resistor is connected to the second end of the first resistor, and the second end of the third resistor is connected to the output end of the differential operational amplifier; the first end of the fourth resistor is connected to the second end of the second resistor, and the second end of the fourth resistor is used to connect to the ground terminal.

[0014] The utility model also provides a temperature measuring device, which includes the circuit board as described above.

[0015] The utility model also provides a vehicle, which comprises the temperature measuring device as described above.

[0016] It is understandable that when a heating device is provided on a circuit board, the temperature of the heating device needs to be detected in real time. At present, a thermocouple is usually used to detect the temperature of the heating device, such as a chip, and the thermocouple is usually placed on the surface of the chip, that is, when the chip is fixed on the circuit board body, the thermocouple is fixed on the chip. Since the surface of the chip has a layer of packaging body, it is used to prevent oxidation and contamination of the chip surface and provide good mechanical strength and electrical performance for the chip. Therefore, the detection point of the thermocouple can only be set on the packaging body of the chip. When detecting the temperature of the chip, the thermocouple can only detect through the heat emitted by the packaging body on the surface of the chip, which has a certain delay and inaccuracy. The utility model proposes a circuit board and a temperature measuring device, the circuit board includes a circuit board body, a heating device, a temperature measurement circuit and a temperature detection line. The heating device, the temperature measurement circuit and the temperature detection line are all arranged on the circuit board body. Among them, the temperature detection line is arranged between the heating device and the temperature measurement circuit, and the input end of the temperature measurement circuit is electrically connected to the output end of the temperature detection line. In practical applications, since the temperature detection line can be in close contact with the heating point of the heating device, the temperature detection line can detect the temperature of the heating device in real time and output it to the temperature measurement circuit to generate a corresponding temperature signal. The utility model replaces the thermocouple with the temperature detection line for temperature measurement, and makes the detection point of the temperature detection line contact with the bottom of the chip to be measured, so that the temperature detection line is in close contact with the heating point of the chip to be measured, thereby improving the accuracy and timeliness of the temperature measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 This is a circuit flow chart of a circuit board of the utility model;

[0019] Figure 2 The utility model is a circuit flow chart of a temperature measuring device.

[0020] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0023] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if the meaning of "and / or" appearing in the full text is to include three parallel schemes, taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0024] The current method for testing chip temperature generally adopts a solution of placing a thermistor or thermocouple near or on the surface of the chip. For example, when the thermistor is placed near the chip, the temperature of the chip is detected by the heat dissipated by the circuit board; when the thermocouple is placed on the surface of the chip, the temperature of the chip is detected by the heat dissipated by the package on the surface of the chip. Both of the above temperature measurement methods have certain delays and heat insulation. Therefore, the existing chip temperature measurement method can only detect the temperature dissipated by the chip to the surface, and cannot accurately and timely detect the heat dissipated from the inside of the chip body, resulting in poor detection accuracy.

[0025] In order to improve the accuracy and timeliness of chip temperature detection, the utility model proposes a circuit board, referring to Figure 1 , the circuit board comprises:

[0026] Circuit board body;

[0027] Heating device 10;

[0028] Temperature measurement circuit 30;

[0029] A temperature detection line 20 is provided on the circuit board body and between the heating device 10 and the temperature measurement circuit 30;

[0030] The input end of the temperature measurement circuit 30 is electrically connected to the output end of the temperature detection line 20; the temperature detection line 20 is used to detect the temperature of the heating device 10 and output it to the temperature measurement circuit 30 to generate a corresponding temperature signal.

[0031] It is understandable that when a heating device 10 is provided on a circuit board, the temperature of the heating device 10 needs to be detected in real time. At present, a thermocouple is usually used to detect the temperature of the heating device 10, such as a chip, and the thermocouple is usually placed on the surface of the chip, that is, when the chip is fixed on the circuit board body, the thermocouple is fixed on the chip. Since the surface of the chip has a layer of packaging body, which is used to prevent oxidation and contamination of the chip surface and provide good mechanical strength and electrical performance for the chip, the detection point of the thermocouple can only be set on the chip packaging body. When detecting the temperature of the chip, the thermocouple can only detect through the heat emitted by the packaging body on the surface of the chip, which has a certain delay and inaccuracy.

[0032] In order to solve the above problems, the utility model replaces the thermocouple with a temperature detection line 20 for temperature measurement. The temperature detection line 20 is directly set on the circuit board body, and the detection point of the temperature detection line 20 can contact the bottom of the chip to be measured, so that the temperature detection line 20 does not need to pass through the package and the circuit board to conduct radiation when detecting the chip temperature, thereby improving the accuracy and timeliness of detecting the chip temperature.

[0033] In this embodiment, the heating device 10 can be implemented for the chip to be tested, and the temperature detection line 20 can be implemented by a metal wire. Among them, the metal wire has a detection point, and the detection point is set at the bottom of the chip to be tested, so as to contact the heating point of the chip to be tested at close range, so as to achieve the effect of timely detecting the temperature of the chip to be tested. In addition, the metal wire is fixedly arranged on the circuit board body to form a thermocouple on the circuit board. In practical applications, the detection point of the metal wire is used to detect the temperature of the chip to be tested, and the metal wire outputs the voltage corresponding to the temperature of the detection point to the temperature measurement circuit 30 through the output end. The temperature measurement circuit 30 includes a control circuit 320 for processing the input voltage, and a thermocouple indexing table database is stored in the control circuit 320. The control circuit 320 in the temperature measurement circuit 30 is connected to the voltage of the detection point, and the thermocouple indexing table database is called to confirm the temperature value of the detection point according to the mapping relationship between the voltage and the temperature value reflected by the thermocouple indexing table. For example, when the metal wire is implemented by a copper wire and a copper-nickel wire, the temperature measurement circuit 30 calls the copper-copper-nickel thermocouple indexing table to confirm the temperature value of the detection point.

[0034] The utility model proposes a circuit board and a temperature measuring device, wherein the circuit board includes a circuit board body, a heating device 10, a temperature measuring circuit 30 and a temperature detection line 20. The heating device 10, the temperature measuring circuit 30 and the temperature detection line 20 are all arranged on the circuit board body. Among them, the temperature detection line 20 is arranged between the heating device 10 and the temperature measuring circuit 30, and the input end of the temperature measuring circuit 30 is electrically connected to the output end of the temperature detection line 20. In practical applications, since the temperature detection line 20 can be in close contact with the heating point of the heating device 10, the temperature detection line 20 can detect the temperature of the heating device 10 in real time, and output it to the temperature measurement circuit 30 to generate a corresponding temperature signal. The utility model replaces the thermocouple with the temperature detection line 20 for temperature measurement, and the detection point of the temperature detection line 20 is in contact with the bottom of the chip to be measured, so that the temperature detection line 20 is in close contact with the heating point of the chip to be measured, thereby improving the accuracy and timeliness of measuring temperature.

[0035] In one embodiment, the temperature detection line 20 is formed on the circuit board body.

[0036] It is understandable that in this embodiment, the temperature detection line 20 is implemented in the form of a circuit board conductor. For example, a portion of the copper foil of the circuit board body is removed by etching the circuit board to obtain a copper conductor; or copper-nickel is plated on the circuit board body by electroplating copper-nickel or chemically depositing copper-nickel to obtain a copper-nickel conductor. In addition, a protective insulating layer, such as green oil, may be laid on the circuit board. The green oil is coated on the surface of the circuit board body as a protective layer to protect the circuit formed on the circuit board body. In this embodiment, the green oil coated on the surface of the copper conductor and the copper-nickel conductor is removed to expose the copper conductor and the copper-nickel conductor to enhance the thermal conductivity of the copper conductor and the copper-nickel conductor.

[0037] In one embodiment, the temperature detection line 20 is formed on the circuit board body in the form of a circuit board conductor, so as to reduce the production cost of the temperature detection line 20 .

[0038] It is understandable that in the present embodiment, the temperature detection line 20 is implemented in the form of a circuit board conductor. Specifically, copper foil and other substances are dissolved by a highly corrosive chemical etching solution (usually ferric chloride or hydrogen peroxide), and part of the copper foil of the circuit board body is etched. Usually, the parts that need to be retained on the circuit board body are coated with a covering agent to avoid being corroded by the chemical etching solution, while the area where the copper foil is corroded cannot be protected, and finally a copper conductor is formed. The circuit board body is formed in the form of a circuit board conductor, which can achieve high precision and large-scale production, low cost, and easy operation.

[0039] In one embodiment, the temperature detection line 20 is formed on the circuit board body by electroplating copper-nickel to improve the processability of the temperature detection line 20;

[0040] Alternatively, the temperature detection line 20 is formed on the circuit board body by chemical copper-nickel deposition to improve the corrosion resistance of the temperature detection line 20 .

[0041] It is understandable that in the present embodiment, the temperature detection line 20 is implemented by electroplating copper-nickel. Specifically, before electroplating nickel, the circuit board body needs to be surface treated to ensure that the circuit board surface is clean, smooth, free of impurities and oxides. A basic passivation layer is applied to the surface of the circuit board by soaking, spraying or brushing, and then a rough coating, an intermediate layer and a precision coating are processed to finally form a copper-nickel conductor on the circuit board body. Since the hardness and elastic modulus of electroplated copper-nickel are low and the surface finish is also high, the electroplating copper-nickel method is simple to process and the requirements for processing tools are relatively low, so that the temperature detection line 20 formed on the circuit board body has high processability.

[0042] In another embodiment, the temperature detection line 20 is implemented by chemical copper-nickel deposition. Specifically, before chemical nickel is applied, the circuit board body to be electroplated is surface treated to ensure that the circuit board surface is clean, smooth, and free of dust and rust. A thin film is applied to the treated circuit board surface, and then the circuit board body coated with the film is immersed in a chemical nickel electrolyte for electroplating, so that the nickel ions in the liquid are reduced to metallic nickel, and finally a copper-nickel conductor is formed on the circuit board body. Since the chemical nickel film has uniform thickness, dense structure, and strong adhesion, it can remain uncorroded in a variety of strong acid and strong alkali media, so that the temperature detection line 20 formed on the circuit board body has high corrosion resistance.

[0043] In one embodiment, the temperature detection line 20 includes a conductive wire and a fixing member for fixing the conductive wire.

[0044] It is understandable that, for example, the temperature detection line 20 can be set on the circuit board body by SMT welding. Specifically, when the wire is a copper wire and the fixing part is solder, there are multiple copper wire fixing points on the copper wire. In practical applications, a small amount of solder is clamped and placed on multiple copper wire fixing points, and the solder is heated by an electric soldering iron to melt the solder. When the solder melts, multiple copper wire fixing points are connected to the circuit board body through solder to achieve the effect of fixed connection between the copper wire and the circuit board body. Similarly, when the wire is a copper-nickel wire and the fixing part is solder, there are multiple copper wire fixing points on the copper-nickel wire, and the solder is placed on multiple copper-nickel wire fixing points, and the solder is heated so that multiple copper-nickel wire fixing points are connected to the circuit board body through solder to achieve the effect of fixed connection between the copper-nickel wire and the circuit board body.

[0045] In one embodiment, the temperature detection line 20 includes at least one detection point, and the detection point is disposed at the bottom of the heating device 10 to contact the heating point of the heating device 10 .

[0046] It is understandable that when the detection point is placed near the chip to be tested, only the heat emitted by the circuit board can be measured; when the detection point is placed on the surface of the chip to be tested, only the heat emitted by the package on the surface of the chip to be tested can be measured. The above placement method has a certain delay and inaccuracy in measuring temperature. In this embodiment, the detection point is set at the bottom of the chip to be tested, so as to be in close contact with the hot spot of the chip to be tested, and is used to detect the temperature of the chip to be tested in real time, thereby improving the accuracy and timeliness of measuring temperature.

[0047] In one embodiment, the temperature detection line 20 includes:

[0048] a first conductive wire and a second conductive wire;

[0049] The first end of the first wire and the first end of the second wire are connected to the detection point of the temperature detection line 20 , and the second end of the first wire and the second end of the second wire are connected to the input end of the temperature measurement circuit 30 .

[0050] It can be understood that, in the present embodiment, the temperature detection line 20 is implemented by two metal wires, namely, a first wire and a second wire, and the materials of the first wire and the second wire are different from each other. Among them, the first end of the first wire and the first end of the second wire are electrically connected, and the connection point of the first end of the first wire and the first end of the second wire forms a detection point, and the detection point is set at the bottom of the chip to be tested to detect the temperature of the chip to be tested in real time. The second end of the first wire is electrically connected to the second end of the second wire, and the connection point of the second end of the first wire and the second end of the second wire is connected to the input end of the temperature measurement circuit 30 to transmit the temperature of the detection point to the temperature measurement circuit 30 in the form of voltage.

[0051] In one embodiment, referring to Figure 2 , the first wire is a copper wire, and the second wire is a copper-nickel wire.

[0052] It is understandable that the copper wire and the copper-nickel wire can be implemented in the form of circuit board wires, for example, by removing part of the copper foil of the circuit board body through the production method of circuit board etching to obtain the copper wire, and by electroplating copper-nickel or chemical copper-nickel deposition to obtain the copper-nickel wire. In addition, the copper wire and the copper-nickel wire can also be implemented in the form of non-circuit board wires, wherein the copper wire has a plurality of copper wire fixing points for placing solder, and the copper wire is fixedly connected to the circuit board body by heating the solder on the fixing points; the copper-nickel conductor has a plurality of copper-nickel wire fixing points for placing solder, and the copper-nickel conductor is fixedly connected to the circuit board body by heating the solder on the fixing points.

[0053] In this embodiment, the first end of the copper wire is electrically connected to the first end of the copper-nickel wire, and the connection point of the first end of the copper wire and the first end of the copper-nickel wire forms a detection point, which is set at the bottom of the chip to be tested to detect the temperature of the chip to be tested in real time. The second end of the copper wire is electrically connected to the second end of the copper-nickel wire, and the connection point of the second end of the copper wire and the second end of the copper-nickel wire is connected to the input end of the temperature measurement circuit 30 to transmit the temperature of the detection point to the temperature measurement circuit 30 in the form of voltage.

[0054] In one embodiment, referring to Figure 2 , the temperature measurement circuit 30 comprises:

[0055] an amplifier circuit 310, wherein the input end of the amplifier circuit 310 is connected to the output end of the temperature detection line 20; the amplifier circuit 310 is used to amplify the voltage corresponding to the temperature of the heating device 10;

[0056] The control circuit 320 has an input end connected to the output end of the amplifier circuit 310 ; the control circuit 320 is used to detect the temperature value of the heating device 10 according to the voltage output by the amplifier circuit 310 .

[0057] It can be understood that, in this embodiment, the copper wire is connected to the first input end of the amplifier, the copper-nickel wire is connected to the second input end of the amplifier, and the copper wire and the copper-nickel-copper wire input the temperature detected at the detection point into the amplifier in the form of an electrical signal, so that the amplifier amplifies the voltage as an electrical signal at a fixed ratio and then outputs it to the control circuit 320. The control circuit 320 obtains the voltage of the detection point according to the output signal after amplification, determines the thermoelectromotive force of the detection point according to the voltage of the detection point, and finally determines the temperature value of the detection point by calling the copper-copper-nickel thermocouple graduation table.

[0058] In one embodiment, referring to Figure 2 , the amplifier circuit 310 includes:

[0059] A first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4 and a differential operational amplifier U1;

[0060] The first end of the first resistor R1 is connected to the output end of the temperature detection line 20, and the second end of the first resistor R1 is connected to the first input end of the differential operational amplifier U1;

[0061] A first end of the second resistor R2 is connected to the output end of the temperature detection line 20, and a second end of the second resistor R2 is connected to the second input end of the differential operational amplifier U1;

[0062] The first end of the third resistor R3 is connected to the second end of the first resistor R1, and the second end of the third resistor R3 is connected to the output end of the differential operational amplifier U1;

[0063] The first end of the fourth resistor R4 is connected to the second end of the second resistor R2, and the second end of the fourth resistor R4 is used to connect to the ground.

[0064] It can be understood that when the resistance values ​​of the first resistor R1 and the second resistor R2 are equal, and the resistance values ​​of the third resistor R3 and the fourth resistor R4 are equal, the transfer function of the differential operational amplifier U1 can be simplified to the following expression: Vout=R3 / R1(V2-V1). In this embodiment, the control circuit 320 is implemented by MCU. Specifically, when the resistors R1=R2 and R3=R4, the above transfer function of the differential operational amplifier U1 adjusts the resistance ratio of R3 and R1 to obtain the amplified voltage, and the collected voltage is directly transmitted to the MCU for processing. For example, taking V1=0V, R3 / R1=500, and testing Vout=2.139V as an example, the MCU determines the thermoelectromotive force V2=4.277mV based on the received Vout=2.139V. The MCU calls the internally stored copper-copper-nickel thermocouple graduation table, as shown in Table 1:

[0065] Table 1

[0066]

[0067] The MCU determines that the temperature value of the detection point is 100°C based on the mapping relationship between the 4.277mV thermoelectric potential and temperature in the copper-copper-nickel thermocouple graduation table.

[0068] The utility model also provides a temperature measuring device, comprising the circuit board as described above.

[0069] It can be understood that in this embodiment, the temperature measuring device includes a circuit board, on which a temperature detection line 20 is provided. The detection point of the temperature detection line 20 is set at the bottom of the chip to be measured, which is used to detect the temperature of the chip to be measured in real time, thereby improving the accuracy and timeliness of measuring the chip temperature.

[0070] The utility model also provides a vehicle, comprising the temperature measuring device as described above.

[0071] It is understandable that in the prior art, the method of detecting the temperature of the vehicle chip is to place a thermistor or thermocouple near or on the surface of the chip to test the temperature of the chip, which cannot accurately and timely detect the heat emitted from the inside of the chip body, resulting in poor detection accuracy. In this embodiment, the thermocouple is replaced with a temperature measuring device, and the detection point of the temperature detection line 20 in the test equipment is in contact with the bottom of the vehicle chip, so that the temperature detection line 20 is in close contact with the heating point of the vehicle chip, so that the temperature detection line 20 can detect the temperature of the vehicle chip in real time, thereby improving the accuracy and timeliness of measuring the temperature of the vehicle chip.

[0072] The above embodiments are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A circuit board, characterized in that: The circuit board comprises: Circuit board body; A heating device is arranged on the circuit board body; A temperature measurement circuit is arranged on the circuit board body; A temperature detection line is arranged on the circuit board body and between the heating device and the temperature measurement circuit; The input end of the temperature measurement circuit is electrically connected to the output end of the temperature detection line; the temperature detection line is used to detect the temperature of the heating device and output it to the temperature measurement circuit to generate a corresponding temperature signal.

2. The circuit board according to claim 1, characterized in that The temperature detection line is formed on the circuit board body.

3. The circuit board according to claim 2, characterized in that: The temperature detection line is formed on the circuit board body in the form of a circuit board conductor, so as to reduce the production cost of the temperature detection line.

4. The circuit board according to claim 2, characterized in that: The temperature detection line is formed on the circuit board body by electroplating copper and nickel to improve the processability of the temperature detection line; Alternatively, the temperature detection line is formed on the circuit board body by chemical copper-nickel deposition to improve the corrosion resistance of the temperature detection line.

5. The circuit board according to claim 1, wherein: The temperature detection line includes a wire and a fixing piece, and the wire is fixed to the circuit board body through the fixing piece.

6. The circuit board according to claim 1, wherein: The temperature detection line includes at least one detection point, and the detection point is arranged at the bottom of the heating device to contact the heating point of the heating device.

7. The circuit board according to claim 6, characterized in that: The temperature detection line comprises: a first conductive wire and a second conductive wire; The first end of the first wire and the first end of the second wire are connected to the detection point of the temperature detection line, and the second end of the first wire and the second end of the second wire are connected to the input end of the temperature measurement circuit.

8. The circuit board according to claim 7, characterized in that: The first conductive wire is a copper conductive wire, and the second conductive wire is a copper-nickel conductive wire.

9. The circuit board according to claim 1, characterized in that: The temperature measurement circuit comprises: an amplifier circuit, the input end of which is connected to the output end of the temperature detection line; the amplifier circuit is used to amplify the voltage corresponding to the temperature of the heating device; A control circuit, wherein the input end of the control circuit is connected to the output end of the amplifier circuit; the control circuit is used to detect the temperature value of the heating device according to the voltage output by the amplifier circuit.

10. The circuit board according to claim 9, characterized in that: The amplifying circuit comprises: A first resistor, a second resistor, a third resistor, a fourth resistor and a differential operational amplifier; The first end of the first resistor is connected to the output end of the temperature detection line, and the second end of the first resistor is connected to the first input end of the differential operational amplifier; A first end of the second resistor is connected to the output end of the temperature detection line, and a second end of the second resistor is connected to the second input end of the differential operational amplifier; The first end of the third resistor is connected to the second end of the first resistor, and the second end of the third resistor is connected to the output end of the differential operational amplifier; The first end of the fourth resistor is connected to the second end of the second resistor, and the second end of the fourth resistor is used to connect to the ground.

11. A temperature measuring device, characterized in that: The temperature measuring device comprises the circuit board according to any one of claims 1 to 10.

12. A vehicle, characterized in that: The vehicle includes the temperature measuring device according to claim 11.

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