High-precision laminating device for chip production

Abstract

The utility model provides a high-precision laminating device for chip production, and relates to the technical field of chip production equipment, the high-precision laminating device for chip production comprises a processing support plate and a buffer bottom plate, and the buffer bottom plate is arranged above the processing support plate. A supporting stand column and an adjusting and laminating mechanism are connected through a limiting inserting rod, chips of different sizes can be conveniently placed and laminated, the stability during overall operation is improved, during normal laminating, a driving motor operates until the chip needs to be laminated is moved to the position above the chip, laminating treatment is conducted through a vacuum suction cup, and the laminating efficiency is improved. Remote real-time supervision is facilitated through an infrared sensor, distance monitoring during lamination is facilitated through a distance sensor, a vacuum chuck is driven to move downwards through operation of an electric telescopic rod until a chip is laminated, and the situation that the chip is damaged due to the fact that the lamination speed is too high is avoided through the distance sensor.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production equipment, in particular to a high-precision bonding device for chip production. Background Art

[0002] A chip, also known as an integrated circuit, can be understood as the meaning of miniaturizing and micro-miniaturizing an electrical circuit. Chips are generally divided into three categories: digital chips, analog chips, and mixed digital-analog chips. The classification according to purpose is even broader. All high-tech electronic devices cannot do without chips, and modern life cannot do without chips. The function of a chip is to complete calculations and process tasks. If the central processing unit CPU is likened to the heart of the entire computer system, then the chipset on the motherboard is the trunk of the entire body. For the motherboard, the chipset almost determines the function of the motherboard, which in turn affects the performance of the entire computer system.

[0003] In actual work, with the development of global electronic information technology, the use of chips is becoming more and more extensive, so the chip bonding requirements are constantly increasing, and the requirements for bonding accuracy are even greater. The bonding equipment in the existing technology has a relatively single function, and cannot take into account the bonding of chips of different specifications, cannot quickly adjust the lateral position of the equipment as required, and does not integrate the buffer protection function of the equipment. The overall flexibility of use is low and cannot meet normal needs.

[0004] Therefore, the utility model provides a high-precision bonding device for chip production. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings of the prior art and provide a high-precision bonding device for chip production.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solution: a high-precision bonding device for chip production, including a processing support plate, and also including:

[0007] A buffer bottom plate, which is installed above the processing support plate;

[0008] A processing table, which is installed on the top of the buffer bottom plate. Two first bonding racks are fixedly connected to the top of the processing table, one side of which is fixedly connected to a third bonding rack. Both the first bonding rack and the third bonding rack are used for placement and processing of chips during bonding;

[0009] A support column, the support column is installed on the top of the processing support plate and is located on one side of the buffer bottom plate;

[0010] An adjusting and laminating mechanism is installed on one side of the supporting column and is located above the processing table. The adjusting and laminating mechanism includes a mounting horizontal plate. A mounting horizontal plate is installed on one side of the supporting column and is located above the processing table. A vacuum suction cup is installed below the mounting horizontal plate. The vacuum suction cup is used to assist chip laminating.

[0011] The auxiliary laminating component is installed at the bottom of the adjusting laminating mechanism, and is used to cooperate with the vacuum suction cup to assist the chip laminating.

[0012] The technical effect of adopting the above further scheme is: the supporting column and the adjusting fitting mechanism are connected by the limiting plug rod, and when normal chip fitting is performed, a downward force is applied to the entire processing table, driving the buffer base plate to move downward, and the buffer spring and the damping shock absorber are used to perform buffering protection during the movement of the buffer base plate, and the movement trajectory of the buffer base plate is limited by the limiting guide rail and the second limiting slider, and cooperated with the subsequent normal resetting, and the first bonding frame, the second bonding frame, the third bonding frame and the bonding placement plate with different specifications are installed on the top of the processing table, so as to facilitate the placement of chips of different sizes. Placement and bonding are carried out to improve the stability of the overall operation. During normal bonding, the reciprocating screw is driven to rotate by the driving motor, the first limit slider is driven to move to one side, and the vacuum suction cup is driven to move to one side until it moves over the chip to be bonded. The bonding process is carried out by the vacuum suction cup. The infrared sensor facilitates remote real-time supervision. The distance sensor facilitates distance monitoring during bonding. The electric telescopic rod is operated to drive the vacuum suction cup to move downward until the chip is bonded. The distance sensor avoids damage to the chip caused by excessive bonding speed.

[0013] As a preferred embodiment, two second bonding frames are fixedly connected to the top of the processing table and located between the first bonding frame and the third bonding frame, and two symmetrically distributed bonding placement plates are fixedly connected to the top of the processing table and located on the side of the third bonding frame away from the second bonding frames. The first bonding frame, the second bonding frame, the third bonding frame and the bonding placement plates are all used for placement processing during chip bonding.

[0014] The technical effect of adopting the above further solution is that the first bonding rack, the second bonding rack, the third bonding rack and the bonding placement plate are all used for chip placement during bonding.

[0015] As a preferred embodiment, the auxiliary bonding component includes a first limit slider and a mounting plate, the internal rotation of the mounting cross plate is connected to a reciprocating screw, the outer side of the reciprocating screw is threadedly connected to the first limit slider, the bottom of the first limit slider is fixedly connected to an electric telescopic rod, the output end of the electric telescopic rod is fixedly connected to the mounting plate, the internal thread of the mounting plate is connected to a mounting screw, one end of the bottom of the mounting screw is connected to the vacuum suction cup, and the electric telescopic rod is used to adjust the bonding height of the vacuum suction cup.

[0016] The technical effect of adopting the above further solution is: the electric telescopic rod is used to adjust the fitting height of the vacuum suction cup.

[0017] As a preferred embodiment, an infrared sensor is fixedly connected to the bottom of the mounting plate and on one side of the vacuum suction cup, and a distance sensor is fixedly connected to the bottom of the mounting plate and on the other side of the vacuum suction cup. The infrared sensor is used for remote monitoring, and the distance sensor is used for distance monitoring during operation.

[0018] The technical effect of adopting the above further solution is: using infrared sensors for remote monitoring and distance sensors for distance monitoring during operation.

[0019] As a preferred embodiment, a limit groove is provided at the bottom of the mounting cross plate for use in the installation of a reciprocating screw rod. A drive motor is fixedly connected to the side of the mounting cross plate away from the supporting column. The output end of the drive motor is fixedly connected to one end of the reciprocating screw rod. The drive motor is used to drive the reciprocating screw rod to rotate to achieve reciprocating adjustment of the fitting mechanism.

[0020] The technical effect of adopting the above further solution is: the reciprocating adjustment of the fitting mechanism is achieved by using a driving motor to drive the reciprocating screw to rotate.

[0021] As a preferred embodiment, equidistantly distributed buffer springs are installed between the processing support plate and the buffer base plate, and damping shock absorbers are installed inside the buffer springs. The top ends of the buffer springs are fixedly connected to the bottom of the buffer base plate, and the bottom ends of the buffer springs are fixedly connected to the top of the processing support plate. The buffer springs and damping shock absorbers are used to perform buffering and protection treatment when the buffer base plate is subjected to extrusion force.

[0022] The technical effect of adopting the above further solution is: the buffer spring and the damping shock absorber are used to provide buffer protection when the buffer base plate is subjected to compression force.

[0023] As a preferred embodiment, a limiting guide rail is provided inside the supporting column, and a second limiting slider is slidably connected inside the limiting guide rail, and one side of the second limiting slider is fixedly connected to the buffer bottom plate. The limiting guide rail and the second limiting slider are used to limit the motion trajectory when the buffer bottom plate is subjected to compression force.

[0024] The technical effect of adopting the above further solution is: the limiting guide rail and the second limiting slider are used to limit the movement trajectory of the buffer bottom plate when it is subjected to compression force.

[0025] As a preferred embodiment, a control panel extending to the inner wall of the adjusting fitting mechanism is installed on one side of the support column, and a control panel is fixedly connected to one side of the support column and located below the limiting plug rod. The drive motor, electric telescopic rod, vacuum suction cup, infrared sensor and distance sensor are all electrically connected to the control panel, and the control panel is used to control the operation of the drive motor, electric telescopic rod, vacuum suction cup, infrared sensor and distance sensor.

[0026] The technical effect of adopting the above further solution is: the control panel is used to control the operation of the drive motor, the electric telescopic rod, the vacuum suction cup, the infrared sensor and the distance sensor.

[0027] Compared with the prior art, the advantages and positive effects of the utility model are: a processing support plate, a buffer bottom plate, a processing table, an adjustment bonding mechanism and an auxiliary bonding component are provided. When in use, the control panel is opened, and the support column and the adjustment bonding mechanism are connected by a limit rod. When normal chip bonding is performed, a downward force is applied to the processing table as a whole, driving the buffer bottom plate to move downward, and a buffer spring and a damping shock absorber are used to perform buffering protection treatment when the buffer bottom plate moves. The movement trajectory of the buffer bottom plate is limited by a limit guide rail and a second limit slider, and in conjunction with subsequent normal reset, a first bonding frame and a second limit slider with different specifications are installed on the top of the processing table. The second bonding rack, the third bonding rack and the bonding placement plate facilitate the placement and bonding of chips of different sizes, and improve the stability of the overall operation. During normal bonding, the driving motor is operated to drive the reciprocating screw to rotate, drive the first limit slider to move to one side, drive the vacuum suction cup to move to one side, until it moves above the chip to be bonded, and the bonding process is performed by the vacuum suction cup. The infrared sensor facilitates remote real-time supervision, and the distance sensor facilitates distance monitoring during bonding. The electric telescopic rod is operated to drive the vacuum suction cup to move downward until the chip is bonded. The distance sensor avoids damage to the chip caused by excessive bonding speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a front view of the overall structure of a high-precision bonding device for chip production provided by the utility model;

[0029] Figure 2 This is a side view of the overall structure of a high-precision bonding device for chip production provided by the utility model;

[0030] Figure 3 This is an enlarged view of the bonding mechanism structure of a high-precision bonding device for chip production provided by the utility model;

[0031] Figure 4 A top view of the structure of a section bonding mechanism of a high-precision bonding device for chip production provided by the utility model;

[0032] Figure 5 This is an enlarged view of the auxiliary bonding component structure of a high-precision bonding device for chip production provided by the utility model.

[0033] Legend:

[0034] 1. Processing support plate;

[0035] 2. Buffer bottom plate;

[0036] 3. Processing table;

[0037] 4. Support columns;

[0038] 5. Adjust the fitting mechanism; 51. Drive motor; 52. Install the horizontal plate; 53. Limiting groove; 54. Reciprocating screw rod;

[0039] 6. Auxiliary laminating component; 61. First limit slider; 62. Electric telescopic rod; 63. Mounting plate; 64. Vacuum suction cup; 65. Mounting screw; 66. Infrared sensor; 67. Distance sensor;

[0040] 7. Control panel;

[0041] 8. Limiting rod;

[0042] 9. Limit guide rail;

[0043] 10. Second limit slider;

[0044] 11. Buffer spring;

[0045] 12. Damping shock absorber;

[0046] 13. The first laminating frame;

[0047] 14. The second laminating frame;

[0048] 15. The third laminating frame;

[0049] 16. Place the board in place. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0051] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, this embodiment provides a technical solution: a high-precision bonding device for chip production, including a processing support plate 1, and also including:

[0052] A buffer bottom plate 2, the buffer bottom plate 2 is installed above the processing support plate 1;

[0053] The processing table 3 is installed on the top of the buffer bottom plate 2. Two first bonding racks 13 are fixedly connected to the top of the processing table 3. A third bonding rack 15 is fixedly connected to one side of one of the first bonding racks 13. Both the first bonding rack 13 and the third bonding rack 15 are used for placement and processing during chip bonding;

[0054] A support column 4, the support column 4 is installed on the top of the processing support plate 1 and is located on one side of the buffer bottom plate 2;

[0055] The laminating mechanism 5 is adjusted and installed on one side of the support column 4 and located above the processing table 3. The laminating mechanism 5 includes a mounting horizontal plate 52. The mounting horizontal plate 52 is installed on one side of the support column 4 and located above the processing table 3. A vacuum suction cup 64 is installed below the mounting horizontal plate 52. The vacuum suction cup 64 is used to assist chip laminating;

[0056] The auxiliary laminating component 6 is installed at the bottom of the adjusting laminating mechanism 5 , and is used to cooperate with the vacuum suction cup 64 to assist the chip laminating.

[0057] The above scheme also provides a processing support plate 1, a buffer base plate 2, a processing table 3, an adjustment bonding mechanism 5 and an auxiliary bonding component 6. When in use, open the control panel 7, connect the support column 4 and the adjustment bonding mechanism 5 through the limit rod 8, and when normal chip bonding is performed, a downward force is applied to the processing table 3 as a whole, driving the buffer base plate 2 to move downward, and the buffer spring 11 and the damping shock absorber 12 are used to buffer and protect the buffer base plate 2 during movement, and the movement trajectory of the buffer base plate 2 is limited by the limit guide rail 9 and the second limit slider 10, and cooperate with the subsequent normal reset, by installing a first bonding frame 13, a second bonding frame 14, and a third bonding frame 15 of different specifications on the top of the processing table 3. The bonding frame 15 and the bonding placement plate 16 facilitate the placement and bonding of chips of different sizes, and improve the stability of the overall operation. During normal bonding, the driving motor 51 is operated to drive the reciprocating screw 54 to rotate, drive the first limit slider 61 to move to one side, and drive the vacuum suction cup 64 to move to one side until it moves above the chip to be bonded, and the bonding process is performed by the vacuum suction cup 64. The infrared sensor 66 facilitates remote real-time supervision, and the distance sensor 67 facilitates distance monitoring during bonding. The electric telescopic rod 62 is operated to drive the vacuum suction cup 64 to move downward until the chip is bonded, and the distance sensor 67 is used to avoid damage to the chip caused by excessive bonding speed.

[0058] Further, such as Figure 1 and Figure 2 As shown: two second laminating frames 14 are fixedly connected to the top of the processing table 3 and located between the first laminating frame 13 and the third laminating frame 15, and two symmetrically distributed laminating placement plates 16 are fixedly connected to the top of the processing table 3 and located on the side of the third laminating frame 15 away from the second laminating frame 14.

[0059] In the above solution, the first bonding rack 13, the second bonding rack 14, the third bonding rack 15 and the bonding placement plate 16 are all used for placement processing during chip bonding.

[0060] Further, such as Figure 1 , Figure 2 and Figure 5 As shown: the auxiliary fitting component 6 includes a first limit slider 61 and a mounting plate 63, the internal rotation of the mounting cross plate 52 is connected to the reciprocating screw 54, the outer side of the reciprocating screw 54 is threadedly connected to the first limit slider 61, the bottom of the first limit slider 61 is fixedly connected to the electric telescopic rod 62, the output end of the electric telescopic rod 62 is fixedly connected to the mounting plate 63, the internal thread of the mounting plate 63 is connected to the mounting screw 65, the bottom of the mounting plate 63 and located on one side of the vacuum suction cup 64 is fixedly connected to an infrared sensor 66, and the bottom of the mounting plate 63 and located on the other side of the vacuum suction cup 64 is fixedly connected to a distance sensor 67.

[0061] In the above scheme, one end of the bottom of the mounting screw 65 is connected to the vacuum suction cup 64, the electric telescopic rod 62 is used to adjust the fitting height of the vacuum suction cup 64, the infrared sensor 66 is used for remote monitoring, and the distance sensor 67 is used for distance monitoring during operation.

[0062] Further, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown: a limiting groove 53 for cooperating with the reciprocating screw rod 54 is opened at the bottom of the mounting cross plate 52, a driving motor 51 is fixedly connected to the side of the mounting cross plate 52 away from the supporting column 4, an output end of the driving motor 51 is fixedly connected to one end of the reciprocating screw rod 54, a control panel 7 extending to the inner wall of the adjusting fitting mechanism 5 is installed on one side of the supporting column 4, a control panel 7 is fixedly connected to one side of the supporting column 4 and located below the limiting plug rod 8, the driving motor 51, the electric telescopic rod 62, the vacuum suction cup 64, the infrared sensor 66 and the distance sensor 67 are all electrically connected to the control panel 7.

[0063] In the above scheme, there is also a drive motor 51 for driving the reciprocating screw 54 to rotate to achieve reciprocating adjustment of the fitting mechanism 5, and the control panel 7 is used to control the operation of the drive motor 51, the electric telescopic rod 62, the vacuum suction cup 64, the infrared sensor 66 and the distance sensor 67, thereby realizing the normal operation of the whole.

[0064] Further, such as Figure 1 and Figure 2 As shown: equidistantly distributed buffer springs 11 are installed between the processing support plate 1 and the buffer base plate 2, damping shock absorbers 12 are installed inside the buffer springs 11, the top ends of the buffer springs 11 are fixedly connected to the bottom of the buffer base plate 2, the bottom ends of the buffer springs 11 are fixedly connected to the top of the processing support plate 1, a limiting guide rail 9 is opened inside the support column 4, a second limiting slider 10 is slidably connected inside the limiting guide rail 9, and one side of the second limiting slider 10 is fixedly connected to the buffer base plate 2.

[0065] The above scheme also includes a buffer spring 11 and a damping shock absorber 12 for buffering and protecting the buffer base plate 2 when it is subjected to compression force, and a limiting guide rail 9 and a second limiting slider 10 for limiting the motion trajectory of the buffer base plate 2 when it is subjected to compression force.

[0066] Working principle:

[0067] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown:

[0068] When in use: When in use, open the control panel 7, connect the support column 4 and the adjustment bonding mechanism 5 through the limit rod 8, and when performing normal chip bonding, a downward force will be applied to the processing table 3 as a whole, driving the buffer base plate 2 to move downward, and the buffer spring 11 and the damping shock absorber 12 are used to perform buffer protection treatment when the buffer base plate 2 moves, and the movement trajectory of the buffer base plate 2 is limited by the limit guide rail 9 and the second limit slider 10, and the subsequent normal reset is coordinated, and the first bonding frame 13, the second bonding frame 14, the third bonding frame 15 and the bonding placement plate 16 of different specifications are installed on the top of the processing table 3, which is convenient for different sizes. inch chips are placed and bonded, which improves the stability of the overall operation. During normal bonding, the driving motor 51 is operated to drive the reciprocating screw 54 to rotate, drive the first limit slider 61 to move to one side, and drive the vacuum suction cup 64 to move to one side until it moves over the chip to be bonded. The bonding process is performed by the vacuum suction cup 64, and the infrared sensor 66 is used to facilitate remote real-time supervision. The distance sensor 67 is used to facilitate distance monitoring during bonding. The electric telescopic rod 62 is operated to drive the vacuum suction cup 64 to move downward until the chip is bonded. The distance sensor 67 is used to avoid damage to the chip caused by excessive bonding speed.

[0069] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A high-precision bonding device for chip production, comprising a processing support plate (1), characterized in that: Also includes: A buffer bottom plate (2), the buffer bottom plate (2) being installed above the processing support plate (1); A processing table (3), the processing table (3) being mounted on the top of the buffer bottom plate (2), the top of the processing table (3) being fixedly connected to two first bonding frames (13), one side of one of the first bonding frames (13) being fixedly connected to a third bonding frame (15), the first bonding frame (13) and the third bonding frame (15) being used for placement and processing during chip bonding; A supporting column (4), the supporting column (4) being mounted on the top of the processing supporting plate (1) and located on one side of the buffer bottom plate (2); An adjusting laminating mechanism (5), the adjusting laminating mechanism (5) being mounted on one side of the supporting column (4) and located above the processing table (3), the adjusting laminating mechanism (5) comprising a mounting cross plate (52), a mounting cross plate (52) being mounted on one side of the supporting column (4) and located above the processing table (3), a vacuum suction cup (64) being mounted below the mounting cross plate (52), the vacuum suction cup (64) being used to assist chip laminating; An auxiliary laminating component (6) is installed at the bottom of the laminating adjustment mechanism (5), and the auxiliary laminating component (6) is used to cooperate with the vacuum suction cup (64) to assist the chip laminating.

2. The high-precision bonding device for chip production according to claim 1, characterized in that: Two second bonding frames (14) are fixedly connected to the top of the processing table (3) and located between the first bonding frame (13) and the third bonding frame (15); two symmetrically distributed bonding placement plates (16) are fixedly connected to the top of the processing table (3) and located on a side of the third bonding frame (15) away from the second bonding frame (14); the first bonding frame (13), the second bonding frame (14), the third bonding frame (15) and the bonding placement plates (16) are all used for placement processing during chip bonding.

3. The high-precision bonding device for chip production according to claim 1, characterized in that: The auxiliary laminating component (6) comprises a first limit slider (61) and a mounting plate (63); the interior of the mounting cross plate (52) is rotatably connected to a reciprocating screw rod (54); the outer side of the reciprocating screw rod (54) is threadedly connected to the first limit slider (61); the bottom of the first limit slider (61) is fixedly connected to an electric telescopic rod (62); the output end of the electric telescopic rod (62) is fixedly connected to the mounting plate (63); the interior of the mounting plate (63) is threadedly connected to a mounting screw rod (65); one bottom end of the mounting screw rod (65) is connected to a vacuum suction cup (64); and the electric telescopic rod (62) is used to adjust the laminating height of the vacuum suction cup (64).

4. The high-precision bonding device for chip production according to claim 3, characterized in that: An infrared sensor (66) is fixedly connected to the bottom of the mounting plate (63) and located on one side of the vacuum suction cup (64), and a distance sensor (67) is fixedly connected to the bottom of the mounting plate (63) and located on the other side of the vacuum suction cup (64). The infrared sensor (66) is used for remote monitoring, and the distance sensor (67) is used for distance monitoring during operation.

5. The high-precision bonding device for chip production according to claim 4, characterized in that: A limiting groove (53) for mounting a reciprocating screw rod (54) is provided at the bottom of the mounting cross plate (52). A driving motor (51) is fixedly connected to a side of the mounting cross plate (52) away from the supporting column (4). An output end of the driving motor (51) is fixedly connected to one end of the reciprocating screw rod (54). The driving motor (51) is used to drive the reciprocating screw rod (54) to rotate so as to achieve reciprocating adjustment of the fitting mechanism (5).

6. The high-precision bonding device for chip production according to claim 1, characterized in that: Buffer springs (11) are installed between the processing support plate (1) and the buffer bottom plate (2) at equal intervals, and damping shock absorbers (12) are installed inside the buffer springs (11). The top ends of the buffer springs (11) are fixedly connected to the bottom of the buffer bottom plate (2), and the bottom ends of the buffer springs (11) are fixedly connected to the top of the processing support plate (1). The buffer springs (11) and the damping shock absorbers (12) are used to perform buffering protection when the buffer bottom plate (2) is subjected to compression force.

7. The high-precision bonding device for chip production according to claim 1, characterized in that: A limiting guide rail (9) is provided inside the supporting column (4), a second limiting slider (10) is slidably connected inside the limiting guide rail (9), one side of the second limiting slider (10) is fixedly connected to the buffer bottom plate (2), and the limiting guide rail (9) and the second limiting slider (10) are used to limit the movement trajectory of the buffer bottom plate (2) when it is subjected to compression force.

8. The high-precision bonding device for chip production according to claim 5, characterized in that: A control panel (7) extending to the inner wall of the adjusting fitting mechanism (5) is installed on one side of the support column (4); the control panel (7) is fixedly connected to one side of the support column (4) and located below the limit plug rod (8); the drive motor (51), the electric telescopic rod (62), the vacuum suction cup (64), the infrared sensor (66) and the distance sensor (67) are all electrically connected to the control panel (7); the control panel (7) is used to control the operation of the drive motor (51), the electric telescopic rod (62), the vacuum suction cup (64), the infrared sensor (66) and the distance sensor (67).

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