Multistage cleaning device for circuit board

By designing a multi-stage cleaning device, combining the first and second fluid cleaning mechanisms, the mixed spraying technology of air flow and water flow is used to solve the problems of water drop effect and pool effect in the traditional water washing process, and efficient and uniform cleaning of the circuit board is achieved. Ensures thorough cleaning and production efficiency of the fine parts of the circuit board.

CN222321861UActive Publication Date: 2025-01-07SUZHOU XUAN MINGSHI SEMICON EQUIP TECH CO LTD
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Patent Information

Application Number
CN202421077864.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-17
Publication Date
2025-01-07
Estimated Expiration
2034-05-17

AI Technical Summary

Technical Problem

The traditional single-stage water washing process has a drop effect and a pool effect when cleaning the circuit board, making it difficult to thoroughly clean small particles of impurities, especially the fine parts on the circuit board, resulting in poor cleaning effect, which may lead to impurities residues and conductivity in subsequent processes. Line short circuit.

Method used

Design a multi-stage cleaning device, including a fixture and a first-stage, second-stage, third-stage and fourth-stage cleaning mechanism arranged in sequence along the direction of the fixture conveying. The first- and second-stage cleaning mechanisms are combined to mix with the water flow through the air flow. After the refined water flow is sprayed, it realizes multi-stage cleaning to ensure vertical movement and uniform coverage of the cleaning liquid.

Benefits of technology

It effectively avoids the residual cleaning liquid and the water tank effect, improves the cleaning effect, especially the thorough cleaning of the fine parts of the circuit board, ensuring the cleanliness and efficient production of the circuit board.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model provides a multi-stage cleaning device for a circuit board, which comprises a clamp, and a first-stage cleaning mechanism, a second-stage cleaning mechanism, a third-stage cleaning mechanism and a fourth-stage cleaning mechanism which are sequentially arranged along the conveying direction of the clamp, the clamp vertically moves among the first-stage cleaning mechanism, the second-stage cleaning mechanism, the third-stage cleaning mechanism and the fourth-stage cleaning mechanism through the conveying mechanism. The first-stage cleaning mechanism and the fourth-stage cleaning mechanism are fluid water washing mechanisms, the second-stage cleaning mechanism and the third-stage cleaning mechanism are two-fluid cleaning mechanisms, and after airflow and water flow are mixed, the water flow is refined, so that the water flow is sprayed out in a mist shape to clean a circuit board. According to the circuit board cleaning device, the circuit board is cleaned by adopting the multi-stage cleaning mechanism, the cleaning is uniform and stable, the cleaning of the circuit board is clean and thorough, the cleaning effect is good, and the manufacturing and production of the circuit board with high precision, high requirement and wide universality are realized.
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Description

Technical Field

[0001] The utility model relates to the technical field of circuit board manufacturing, in particular to a multi-stage cleaning device for circuit boards. Background Art

[0002] The production of circuit boards usually adopts the process of substrate dry film → exposure → development → etching → film stripping. Among them, water washing process is required after development, etching and film stripping. The circuit board (PCB) water washing process is a key step in the manufacturing process of printed circuit boards. It helps to remove any contaminants or residues left in the manufacturing process. The water washing process ensures that the final product meets the required quality standards and is free of any impurities.

[0003] The traditional water washing process uses a single-stage, one-fluid nozzle to spray cleaning liquid onto the surface of the circuit board for cleaning. The sprayed cleaning liquid easily forms water droplets, causing a water droplet effect, and cannot clean small particle impurities, especially for the fine lines and small line spacing on the circuit board. The cleaning effect is poor and it is difficult to clean thoroughly. In addition, some circuit boards are cleaned horizontally. The cleaning liquid at the bottom of the circuit board flows too fast, and the cleaning liquid at the top is not easy to flow away, which easily leads to a pool effect, poor cleaning effect, and incomplete cleaning. The residual liquid on the circuit board may flow to the surface of the printed circuit board in the subsequent process, and further etch the surface of the printed circuit board, and may even cause a short circuit in the conductive line. Utility Model Content

[0004] The utility model aims to provide a multi-stage cleaning device for a circuit board to overcome the deficiencies in the prior art.

[0005] In order to solve the above technical problems, the technical solution of the utility model is: a multi-stage cleaning device for circuit boards, including a clamp and a primary cleaning mechanism, a secondary cleaning mechanism, a tertiary cleaning mechanism, and a fourth-level cleaning mechanism arranged in sequence along the conveying direction of the clamp, the clamp clamps the circuit board and moves vertically between the primary cleaning mechanism, the secondary cleaning mechanism, the tertiary cleaning mechanism, and the fourth-level cleaning mechanism through a conveying mechanism; the primary cleaning mechanism and the fourth-level cleaning mechanism are a single-fluid water washing mechanism, and the secondary cleaning mechanism and the tertiary cleaning mechanism are two-fluid cleaning mechanisms, which use air flow and water flow to mix and refine the water flow so that it is sprayed in a mist to clean the circuit board.

[0006] Furthermore, in the above-mentioned multi-stage cleaning device for the circuit board, the first-stage cleaning mechanism and the fourth-stage cleaning mechanism have the same structure, including two groups of relatively arranged nozzle assemblies, the two groups of nozzle assemblies are symmetrically arranged with the fixture as the center, the nozzle assembly includes a nozzle fixing seat and a nozzle, the bottom of the nozzle fixing seat is provided with a liquid inlet, the top of the nozzle fixing seat is provided with a plurality of nozzles evenly arranged along the conveying direction of the fixture, and the nozzle is provided with a plurality of evenly arranged nozzles.

[0007] Furthermore, in the above-mentioned multi-stage cleaning device for circuit boards, the nozzle assembly also includes a support plate, a quick-release joint is provided at the bottom of the nozzle, and is connected to a flow channel provided inside a nozzle fixing seat through the quick-release joint, a plug is provided at the top of the nozzle, a through hole corresponding to the nozzle is provided on the support plate, and the plug located at the top of the nozzle is inserted in the through hole and extends above the support plate.

[0008] Furthermore, in the above-mentioned multi-stage cleaning device for circuit boards, the nozzles on adjacent spray pipes are arranged in a staggered manner.

[0009] Furthermore, in the above-mentioned multi-stage cleaning device for circuit boards, the spraying distance from the nozzle 1 to the circuit board is 90-110 mm.

[0010] Furthermore, in the multi-stage cleaning device for the circuit board mentioned above, the secondary cleaning mechanism and the tertiary cleaning mechanism have the same structure, including two groups of relatively arranged nozzle assemblies 2, the two groups of nozzle assemblies 2 are symmetrically arranged with the fixture as the center, the nozzle assembly 2 includes a nozzle fixing seat 2, a nozzle fixing seat 3, a nozzle 2, and a nozzle 3, the nozzle fixing seat 2 and the nozzle fixing seat 3 are arranged in parallel, and the nozzle fixing seat 2 is arranged on the outside of the nozzle fixing seat 3, the nozzle fixing seat 2 is provided with an air inlet at the bottom, and a plurality of nozzles 2 are evenly arranged along the conveying direction of the fixture are arranged above the nozzle fixing seat 2, and the nozzle 2 is an air flow channel pipe; the nozzle fixing seat 3 is provided with a liquid inlet 2 at the bottom, and a plurality of nozzles 3 are evenly arranged along the conveying direction of the fixture are arranged above the nozzle fixing seat 3, and a plurality of evenly arranged nozzles 2 are arranged on the nozzle 3; the nozzle 2 and the nozzle 3 are arranged one-to-one, and a plurality of air intake pipes corresponding to the nozzle 2 are arranged on the nozzle 2, and the air intake pipes are connected to the corresponding nozzle 2.

[0011] Furthermore, in the above-mentioned multi-stage cleaning device for circuit boards, the second nozzle assembly also includes a second support plate, a quick-release joint is provided at the bottom of the second nozzle, and is connected to a flow channel arranged inside the second nozzle fixing seat through the quick-release joint, a plug is provided at the top of the second nozzle, a through hole second is provided on the second support plate corresponding to the second nozzle, the plug located at the top of the second nozzle is inserted in the through hole second and extends above the second support plate; a quick-release joint is also provided at the bottom of the third nozzle, and is connected to a flow channel arranged inside the third nozzle fixing seat through the quick-release joint, a plug is provided at the top of the third nozzle, a through hole three is provided on the second support plate corresponding to the third nozzle, the plug located at the top of the third nozzle is inserted in the through hole three and extends above the second support plate.

[0012] Furthermore, in the above-mentioned multi-stage cleaning device for the circuit board, the air inlet pipe includes an air guide pipe and adapter 1 and adapter 2 arranged at both ends of the air guide pipe, the air guide pipe is a hose, adapter 1 is connected to nozzle 2, and adapter 2 is connected to nozzle 2; the nozzle 2 is connected to nozzle 3 through an extension pipe, the airflow in nozzle 2 enters nozzle 2 through the air inlet pipe, and is mixed with the water flow entering nozzle 2 through the extension pipe at the front end of the nozzle of nozzle 2, and is sprayed out from the nozzle in a mist form.

[0013] Furthermore, in the above-mentioned multi-stage cleaning device for circuit boards, the nozzles 2 on the adjacent nozzles 3 are staggered.

[0014] Furthermore, in the above-mentioned multi-stage cleaning device for circuit boards, the spraying distance from the second nozzle to the circuit board is 55-75 mm. It can completely cover the board surface.

[0015] The utility model also provides a cleaning method of a multi-stage cleaning device for a circuit board, comprising the following steps:

[0016] S1. Before spraying, DI water is pumped from the liquid storage tank through a magnetic pump and a filter to the water inlet pipelines of the first-level cleaning mechanism, the second-level cleaning mechanism, the third-level cleaning mechanism, and the fourth-level cleaning mechanism, and the water washing pressure is 0.2Mpa~0.22Mpa; the gas enters the air inlet pipelines of the second-level cleaning mechanism and the third-level cleaning mechanism after being compressed, and the pressure is 0.22Mpa~0.25Mpa;

[0017] S2. The fixture is first transported to the primary cleaning mechanism through the conveying mechanism. Two nozzle assemblies of the primary cleaning mechanism spray and clean both sides of the circuit board on the fixture. The particle size of the sprayed water washing particles is no larger than 50um. When the fixture passes through the primary cleaning mechanism completely through the conveying mechanism, one cleaning is completed;

[0018] S3, the fixture is transported to the secondary cleaning mechanism and the tertiary cleaning mechanism in turn through the conveying mechanism. The two nozzle assemblies of the secondary cleaning mechanism and the tertiary cleaning mechanism spray and clean the fine parts on both sides of the circuit board on the fixture in turn. During cleaning, the diameter of the aerosol particles after spraying is no larger than 10um. When the fixture completely passes through the secondary cleaning mechanism and the tertiary cleaning mechanism, the secondary and tertiary cleaning are completed;

[0019] S4. Finally, the fixture is transported to the four-stage cleaning mechanism through the conveying structure. The two nozzle assemblies of the four-stage cleaning mechanism clean both sides of the circuit board on the fixture again. The particle size of the sprayed water washing particles is no larger than 50um. When the fixture completely passes through the four-stage cleaning mechanism, the fourth cleaning is completed.

[0020] Compared with the prior art, the beneficial effects of the utility model are as follows: during cleaning, the circuit board passes through the clamp in a vertical state between the multi-stage cleaning mechanisms, which can avoid the residual cleaning liquid and the pool effect, and the cleaning effect is good; in addition, two two-fluid cleaning mechanisms with water and gas mixture are used, and the cleaning particle size is small, which can thoroughly clean the fine parts of the circuit board. At the same time, the clamp can pass through the four-stage cleaning mechanisms at a uniform speed and continuously, ensuring the cleaning uniformity and stability, and also ensuring the conveying rhythm of the clamp, and improving the cleaning efficiency. The utility model also realizes multi-stage cleaning of the circuit board through the one-fluid water washing of the first-stage cleaning mechanism, the two-fluid washing of the second-stage cleaning mechanism and the third-stage cleaning mechanism, and the one-fluid water washing of the fourth-stage cleaning mechanism, with good cleaning effect, ensuring that the circuit board is cleaned thoroughly. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a schematic diagram of the structure of the multi-stage cleaning device for circuit boards of the utility model;

[0023] Figure 2 It is a side view of the first-stage cleaning mechanism, the fourth-stage cleaning mechanism and the fixture of the multi-stage cleaning device for circuit boards of the utility model;

[0024] Figure 3 It is a side view of the secondary cleaning mechanism, the tertiary cleaning mechanism and the fixture of the multi-stage cleaning device for circuit boards of the utility model;

[0025] Figure 4 The schematic diagram of the first-stage cleaning mechanism of the multi-stage cleaning device for circuit boards of the utility model is shown in FIG. Figure 1 ;

[0026] Figure 5 The schematic diagram of the first-stage cleaning mechanism of the multi-stage cleaning device for circuit boards of the utility model is shown in FIG. Figure 2 ;

[0027] Figure 6 It is a structural schematic diagram of a nozzle assembly 1 of a multi-stage cleaning device for circuit boards of the utility model;

[0028] Figure 7 The schematic diagram of the secondary cleaning mechanism structure of the multi-stage cleaning device for circuit boards of the utility model is shown in FIG. Figure 1 ;

[0029] Figure 8 The schematic diagram of the secondary cleaning mechanism structure of the multi-stage cleaning device for circuit boards of the utility model is shown in FIG. Figure 2 ;

[0030] Fig. 9 It is a structural schematic diagram of the nozzle assembly 2 of the multi-stage cleaning device for circuit boards of the utility model;

[0031] Fig.10 It is a schematic diagram of the connection between the nozzle 2 and the nozzle 3 of the multi-stage cleaning device for circuit boards of the utility model;

[0032] In the figure: 10, fixture; 20, primary cleaning mechanism; 30, secondary cleaning mechanism; 50, quaternary cleaning mechanism;

[0033] 1. A nozzle assembly; 11. A nozzle fixing seat; 111. A liquid inlet; 12. A nozzle; 13. A nozzle; 14. A support plate; 15. A quick-release connector; 16. A plug;

[0034] 2. Nozzle assembly 2; 21. Nozzle fixing seat 2; 211. Air inlet; 22. Nozzle fixing seat 3; 221. Liquid inlet 2; 23. Nozzle 2; 24. Nozzle 3; 25. Nozzle 2; 26. Air inlet pipe; 261. Air guide pipe; 262. Adapter 1; 263. Adapter 2; 27. Support plate 2; 28. Extension pipe. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] Example 1

[0037] like Figure 1-10As shown, a multi-stage cleaning device for circuit boards includes a clamp 10 and a primary cleaning mechanism 20, a secondary cleaning mechanism 30, a tertiary cleaning mechanism 40, and a quaternary cleaning mechanism 50 arranged in sequence along the conveying direction of the clamp 10. The clamp 10 clamps the circuit board and moves vertically between the primary cleaning mechanism 20, the secondary cleaning mechanism 30, the tertiary cleaning mechanism 40, and the quaternary cleaning mechanism 50 through a conveying mechanism (not shown in the figure); the primary cleaning mechanism 20 and the quaternary cleaning mechanism 50 are single-fluid water washing mechanisms, and the secondary cleaning mechanism 30 and the tertiary cleaning mechanism 40 are two-fluid cleaning mechanisms, which use air flow and water flow to mix and refine the water flow so that it is sprayed in a mist to clean the circuit board. During cleaning, the circuit board passes through the clamp 10 in a vertical state between the multi-stage cleaning mechanisms, which can avoid cleaning liquid residue and pool effect, and the cleaning effect is good; in addition, two two-fluid cleaning mechanisms with water and gas mixture are used, and the cleaning particle size is small, which can thoroughly clean the fine parts of the circuit board. At the same time, the clamp 10 can pass through the four-stage cleaning mechanisms at a uniform speed and continuously, ensuring the cleaning uniformity and stability, and also ensuring the conveying rhythm of the clamp, and improving the cleaning efficiency. The utility model realizes multi-stage cleaning of the circuit board through the one-fluid water washing of the first-stage cleaning mechanism 20, the two-fluid washing of the second-stage cleaning mechanism 30 and the third-stage cleaning mechanism 40, and the one-fluid water washing of the fourth-stage cleaning mechanism 50, with good cleaning effect and thorough cleaning.

[0038] In the above structure, if Figure 1 , 2 As shown in Figures 4 and 5, the first-stage cleaning mechanism 20 and the fourth-stage cleaning mechanism 50 have the same structure, including two groups of nozzle assemblies 1 arranged opposite to each other, and the two groups of nozzle assemblies 1 are symmetrically arranged with the fixture 10 as the center. The nozzle assembly 1 includes a nozzle fixing seat 11 and a nozzle 12. The bottom of the nozzle fixing seat 11 is provided with a liquid inlet 111. The nozzle fixing seat 11 is provided with a plurality of nozzles 12 evenly arranged along the conveying direction of the fixture 10 above the nozzle fixing seat 11, and the nozzle 12 is provided with a plurality of nozzles 13 evenly arranged. Figure 2 , 6 As shown, the arrangement of nozzle 13 is to ensure that its spray range can completely cover the circuit board.

[0039] Among them, Figure 1 , 3As shown in Figures 7 and 8, the secondary cleaning mechanism 30 and the tertiary cleaning mechanism 40 have the same structure, including two groups of nozzle assemblies 2 arranged opposite to each other, the two groups of nozzle assemblies 2 are symmetrically arranged with the fixture as the center, the nozzle assembly 2 includes a nozzle fixing seat 21, a nozzle fixing seat 3 22, a nozzle 23, and a nozzle 3 24, the nozzle fixing seat 21 and the nozzle fixing seat 3 22 are arranged in parallel, and the nozzle fixing seat 21 is arranged on the outside of the nozzle fixing seat 3 22, the bottom of the nozzle fixing seat 21 is provided with an air inlet 211, and the top of the nozzle fixing seat 21 is provided with a A plurality of nozzles 23 are evenly arranged along the conveying direction of the fixture, and the nozzles 23 are air flow channel pipes; a liquid inlet 221 is provided at the bottom of the nozzle fixing seat 3 22, and a plurality of nozzles 3 24 are evenly arranged along the conveying direction of the fixture 10 are provided above the nozzle fixing seat 3 22, and the nozzle 3 is a water flow channel pipe, on which a plurality of evenly arranged nozzles 25 are provided; the nozzles 23 and the nozzles 3 24 are arranged one by one, and the nozzles 23 are provided with a plurality of air intake pipes 26 corresponding to the nozzles 25, and the air intake pipes 26 are connected to the corresponding nozzles 25. Figure 3 , 9 As shown, the arrangement of the nozzle 25 should ensure that its spraying range can completely cover the circuit board.

[0040] Example 2

[0041] Based on the structure of Example 1, Figure 4-6 As shown, the nozzle assembly 1 also includes a support plate 14, a quick-release joint 15 is provided at the bottom of the nozzle 12, and is communicated with the flow channel provided inside the nozzle fixing seat 11 through the quick-release joint 15, and a plug 16 is provided at the top of the nozzle 12, which can quickly realize the installation of the nozzle 12, and a through hole 1 is provided on the support plate 14 corresponding to the nozzle 12, and the plug 16 located at the top of the nozzle 12 is inserted into the through hole 1 and extends above the support plate 14. During installation, the nozzle assembly 1 is installed on the cleaning equipment through the nozzle fixing seat 11 and the support plate 14, and the support plate 14 plays the role of supporting the nozzle 12, with a simple structure and easy installation.

[0042] In the above structure, if Figure 2 , 6 As shown, the nozzles 13 on the adjacent nozzles 12 are arranged in a staggered manner, and the spraying distance from the nozzles 13 to the circuit board is 90-110 mm. Through this arrangement, it is ensured that the spraying range of the nozzles 13 can completely cover the circuit board, and according to the process requirements, the spraying distance and the spraying pressure of the cleaning liquid are adjusted to control the spraying particle size to achieve the best cleaning effect.

[0043] In addition, if Figure 7-10As shown, the nozzle assembly 2 also includes a support plate 27. A quick-release joint 15 is provided at the bottom of the nozzle 23, and is communicated with the flow channel arranged inside the nozzle fixing seat 21 through the quick-release joint 15. A plug 16 is provided at the top of the nozzle 23, which can quickly realize the installation of the nozzle 23. A through hole 2 is provided on the support plate 27 corresponding to the nozzle 23. The plug 16 located at the top of the nozzle 23 is inserted in the through hole 2 and extends to the top of the support plate 27; a quick-release joint 15 is also provided at the bottom of the nozzle 3 24, and is communicated with the flow channel arranged inside the nozzle fixing seat 3 22 through the quick-release joint 15. A plug 16 is provided at the top of the nozzle 3 24, which can quickly realize the installation of the nozzle 3 24. A through hole 3 is provided on the support plate 27 corresponding to the nozzle 3 24. The plug 16 located at the top of the nozzle 3 24 is inserted in the through hole 3 and extends to the top of the support plate 27. During installation, the nozzle assembly 2 is installed on the cleaning equipment through the nozzle fixing seat 21, the nozzle fixing seat 3 22, and the support plate 27. The support plate 27 supports the nozzle 23 and the nozzle 3 24. The structure is simple and the installation is easy.

[0044] In the above structure, if Fig.10 As shown, the air intake pipe 26 includes an air guide pipe 261 and an adapter 1 262 and an adapter 2 263 provided at both ends of the air guide pipe 261. The air guide pipe 261 is a hose, and the adapter 1 262 and the adapter 2 263 are right-angle adapters. The adapter 1 262 is connected to the nozzle 2 23, and the adapter 2 263 is connected to the nozzle 2 25. The nozzle 2 25 is connected to the nozzle 3 24 through the extension pipe 28. The air flow in the nozzle 2 23 enters the nozzle 2 25 through the air intake pipe 26, and is mixed with the water flow entering the nozzle 2 25 through the extension pipe 28 at the front end of the nozzle of the nozzle 2 25 and then sprayed out from the nozzle in a mist form. In this embodiment, the axis of the air intake pipe 26 and the axis of the nozzle 2 25 are on the same horizontal plane, the air intake pipe 26 and the nozzle 2 25 are arranged one by one, and the air intake pipe 26 has a simple structure and is easy to install.

[0045] like Figure 3 , 9 As shown, the nozzles 25 on the adjacent nozzles 3 24 are arranged in a staggered manner, and the spray distance from the nozzle 2 25 to the circuit board is smaller than the spray distance from the nozzle 1 13 to the circuit board, and the spray distance from the nozzle 25 to the circuit board is 55-75mm. Through this arrangement, it is ensured that the spray range of the nozzle 2 25 can completely cover the circuit board, and according to the process requirements, the spray distance and the spray pressure of the gas and liquid are adjusted and controlled, and the spray particle size is controlled to achieve the best cleaning effect.

[0046] The utility model also provides a cleaning method of a multi-stage cleaning device for a circuit board, comprising the following steps:

[0047] S1. Before spraying, DI water (deionized water) is pumped from the liquid storage tank to the water inlet pipelines of the first-level cleaning mechanism 20, the second-level cleaning mechanism 30, the third-level cleaning mechanism 40, and the fourth-level cleaning mechanism 50 through a magnetic pump and a filter, and the water washing pressure is 0.2Mpa to 0.22Mpa; the gas enters the air inlet pipelines of the second-level cleaning mechanism 30 and the third-level cleaning mechanism 40 after being compressed, and the pressure is 0.22Mpa to 0.25Mpa;

[0048] S2, the fixture 10 is first transported to the primary cleaning mechanism 20 by the conveying mechanism, and the two nozzle assemblies 1 of the primary cleaning mechanism 20 spray and clean the two sides of the circuit board on the fixture 10, and the particle size of the sprayed water washing particles is no larger than 50um. When the fixture completely passes through the primary cleaning mechanism 20 by the conveying mechanism, one cleaning is completed;

[0049] S3, the fixture 10 is sequentially transported to the secondary cleaning mechanism 30 and the tertiary cleaning mechanism 40 through the conveying mechanism. The two nozzle assemblies 2 of the secondary cleaning mechanism 30 and the tertiary cleaning mechanism 40 sequentially spray and clean the two sides of the circuit board on the fixture, which is mainly used to clean the fine parts of the circuit board. During cleaning, the diameter of the aerosol particles after spraying is no more than 10um. When the fixture 10 completely passes through the secondary cleaning mechanism 30 and the tertiary cleaning mechanism 40, the second and third cleanings are completed; by setting up two two-fluid cleaning mechanisms, not only can the fine parts of the circuit board be cleaned thoroughly, but also the conveying rhythm of the fixture is guaranteed, thereby improving the cleaning efficiency;

[0050] S4. Finally, the fixture 10 is transported to the four-stage cleaning mechanism 50 through the conveying structure. The two nozzle assemblies 1 of the four-stage cleaning mechanism 50 clean both sides of the circuit board on the fixture 10 again. The diameter of the sprayed water particles is no more than 50um. When the fixture 10 completely passes through the four-stage cleaning mechanism 50, the fourth cleaning is completed.

[0051] During cleaning, the fixture 10 passes continuously at a uniform speed between the four-stage cleaning mechanisms without stopping cleaning, thereby ensuring the cleaning uniformity and stability and improving the cleaning efficiency; and the circuit board is cleaned thoroughly through multi-stage cleaning, ensuring the high-precision, high-requirement and wide-applicability manufacturing and production of the circuit board.

[0052] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0053] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A multi-stage cleaning device for a circuit board, characterized in that: It includes a clamp and a primary cleaning mechanism, a secondary cleaning mechanism, a tertiary cleaning mechanism and a quaternary cleaning mechanism arranged in sequence along the conveying direction of the clamp. The clamp clamps the circuit board and moves vertically between the primary cleaning mechanism, the secondary cleaning mechanism, the tertiary cleaning mechanism and the quaternary cleaning mechanism through a conveying mechanism; the primary cleaning mechanism and the quaternary cleaning mechanism are single-fluid water washing mechanisms, and the secondary cleaning mechanism and the tertiary cleaning mechanism are two-fluid cleaning mechanisms, which use air flow and water flow to mix and refine the water flow so that it is sprayed in a mist to clean the circuit board.

2. The multi-stage cleaning device for circuit boards according to claim 1, characterized in that: The first-level cleaning mechanism and the fourth-level cleaning mechanism have the same structure, including two groups of relatively arranged nozzle assemblies, the two groups of nozzle assemblies are symmetrically arranged with the fixture as the center, the nozzle assembly includes a nozzle fixing seat and a nozzle, the bottom of the nozzle fixing seat is provided with a liquid inlet, the top of the nozzle fixing seat is provided with a plurality of nozzles evenly arranged along the conveying direction of the fixture, and the nozzle is provided with a plurality of evenly arranged nozzles.

3. The multi-stage cleaning device for circuit boards according to claim 2, characterized in that: The nozzle assembly also includes a support plate. A quick-release joint is provided at the bottom of the nozzle, and is connected to a flow channel arranged inside a nozzle fixing seat through the quick-release joint. A plug is provided at the top of the nozzle. A through hole corresponding to the nozzle is provided on the support plate. The plug located at the top of the nozzle is inserted into the through hole and extends above the support plate.

4. The multi-stage cleaning device for circuit boards according to claim 2, characterized in that: The nozzles on adjacent nozzles are arranged in a staggered manner.

5. The multi-stage cleaning device for circuit boards according to claim 2, characterized in that: The spraying distance from the nozzle to the circuit board is 90-110 mm.

6. The multi-stage cleaning device for circuit boards according to claim 1, characterized in that: The secondary cleaning mechanism and the tertiary cleaning mechanism have the same structure, including two groups of relatively arranged nozzle assemblies 2, the two groups of nozzle assemblies 2 are symmetrically arranged with the fixture as the center, the nozzle assembly 2 includes a nozzle fixing seat 2, a nozzle fixing seat 3, a nozzle 2, and a nozzle 3, the nozzle fixing seat 2 and the nozzle fixing seat 3 are arranged in parallel, and the nozzle fixing seat 2 is arranged on the outside of the nozzle fixing seat 3, the nozzle fixing seat 2 is provided with an air inlet at the bottom, and a plurality of nozzles 2 evenly arranged along the conveying direction of the fixture are arranged above the nozzle fixing seat 2, and the nozzle 2 is an air flow channel pipe; the nozzle fixing seat 3 is provided with a liquid inlet 2 at the bottom, and a plurality of nozzles 3 evenly arranged along the conveying direction of the fixture are arranged above the nozzle fixing seat 3, and a plurality of evenly arranged nozzles 2 are arranged on the nozzle 3; the nozzle 2 and the nozzle 3 are arranged one-to-one, and a plurality of air intake pipes corresponding to the nozzle 2 are arranged on the nozzle 2, and the air intake pipes are connected with the corresponding nozzle 2.

7. The multi-stage cleaning device for circuit boards according to claim 6, characterized in that: The second nozzle assembly also includes a second support plate, a quick-release joint is provided at the bottom of the second nozzle, and is communicated with the flow channel provided inside the second nozzle fixing seat through the quick-release joint, a plug is provided at the top of the second nozzle, a through hole second is provided on the second support plate corresponding to the second nozzle, the plug located at the top of the second nozzle is inserted in the through hole second and extends above the second support plate; the third nozzle is also provided with a quick-release joint at the bottom, and is communicated with the flow channel provided inside the third nozzle fixing seat through the quick-release joint, a plug is provided at the top of the third nozzle, a through hole third is provided on the second support plate corresponding to the third nozzle, the plug located at the top of the third nozzle is inserted in the through hole third and extends above the second support plate.

8. The multi-stage cleaning device for circuit boards according to claim 6, characterized in that: The air intake pipe includes an air guide pipe and an adapter 1 and an adapter 2 arranged at both ends of the air guide pipe. The air guide pipe is a hose. The adapter 1 is connected to the nozzle 2, and the adapter 2 is connected to the nozzle 2. The nozzle 2 is connected to the nozzle 3 through an extension pipe. The airflow in the nozzle 2 enters the nozzle 2 through the air intake pipe, and is mixed with the water flow entering the nozzle 2 through the extension pipe at the front end of the nozzle of the nozzle 2, and then is sprayed out from the nozzle in a mist form.

9. The multi-stage cleaning device for circuit boards according to claim 6, characterized in that: The nozzles 2 on the adjacent nozzles 3 are arranged in a staggered manner.

10. The multi-stage cleaning device for circuit boards according to claim 6 or 9, characterized in that: The spraying distance from the second nozzle to the circuit board is 55-75 mm.