Heat dissipation enhancing type airborne universal reinforced case

Abstract

The utility model discloses an enhanced heat dissipation type airborne universal reinforced chassis, which comprises a chassis main body, the front end of the chassis main body is provided with an interface switching front panel, an air duct type guide rail is arranged in the chassis main body, and a plurality of function module shielding boxes are arranged in the chassis main body in parallel in the direction perpendicular to the air duct type guide rail. A fan switching rear panel is arranged at the rear end of the case body, a mother set mounting bottom plate is arranged at the lower end of the functional module shielding box, a cold conduction boss in the functional module shielding box can conduct heat consumption on components outwards in a metal heat conduction mode, and heat on the module box can be transmitted to a case shell through multiple paths. Meanwhile, air is supplied outwards through the heat dissipation air channels between the modules and the draught fan at the rear end of the case, heat is taken away through convection, and the overall heat dissipation performance of the case is improved in a combined heat dissipation mode.

Description

Technical Field

[0001] The utility model relates to the technical field of airborne universal chassis, in particular to an enhanced heat dissipation type airborne universal reinforced chassis. Background Art

[0002] In recent years, the level of my country's aviation industry has been continuously improved, the integration of avionics equipment has become increasingly higher, the number of devices installed on the cabin racks has gradually increased, and the electromagnetic environment faced by electronic equipment has become more complex. These changes have made the structural design of electronic products such as chassis more and more difficult. With the development of modularization, integration, and miniaturization of electronic equipment, the thermal power consumption of electronic equipment will inevitably increase, the space utilization will be more compact, and higher requirements will be placed on module packaging.

[0003] At present, aviation air-cooled chassis have been widely used in various electronic equipment, and the technology is relatively mature. The design focus of the air-cooled chassis must be to improve the heat dissipation efficiency of the equipment chassis, and use structural design methods to achieve a low thermal resistance transmission path for heat conduction and a reasonable design of the air duct, so that the operating temperature of the components is controlled within the allowable range.

[0004] A certain type of traditional air-cooled standard CPCI chassis uses forced convection for heat dissipation. The interior of the chassis includes a number of directly fixed CPCI standard module boards. The module boards are equipped with metal heat sinks. When cold air enters the chassis, it takes away the heat on them, and the fan then discharges the hot air in the chassis. However, the independence of each module in this type of air-cooled chassis is not high, and the protection is poor. It is not suitable for long-term use in high-intensity shock and vibration environments; the fan heat dissipation method is also greatly reduced in efficiency due to the limited size of the metal heat sink mounted on the module; the module boards inside this type of chassis are in the same electromagnetic environment space, with no isolation or shielding measures between them, and the electromagnetic interference between them cannot be effectively suppressed, and may even affect the normal operation of each module. Utility model content

[0005] In order to overcome the deficiencies of the prior art, the utility model solves the problem in the prior art that the heat dissipation of the chassis is not efficient enough and the electronic equipment cannot work stably for a long time in a harsh environment.

[0006] An enhanced heat dissipation airborne general reinforced chassis comprises a chassis body, a front panel for interface connection is arranged at the front end of the chassis body, a duct type guide rail is arranged inside the chassis body, a plurality of function module shielding boxes are arranged inside the chassis body in parallel with a direction perpendicular to the duct type guide rail, a fan connection rear panel is arranged at the rear end of the chassis body, and a motherboard mounting base plate is arranged at the lower end of the function module shielding box.

[0007] Furthermore, the chassis body comprises a rectangular frame structure consisting of a left side plate, a right side plate, a rear box body, a lower cover plate and an upper cover plate, and a front box body is arranged at the front end thereof.

[0008] Furthermore, the upper cover plate and the lower cover plate are in surface contact with the functional module shielding box, and form a heat conduction path.

[0009] Furthermore, the upper cover plate, the left side plate and the right side plate are provided with air inlet holes, and arc-shaped groove heat dissipation teeth are also provided on the outer sides of the left side plate and the right side plate.

[0010] Furthermore, the functional module shielding box is composed of a module box cavity and a cover plate, and a wedge-shaped locking block is also provided on the side of the module box cavity.

[0011] Furthermore, a plurality of bosses are arranged on the surface of the module box cavity.

[0012] Furthermore, the air duct type guide rail is a rectangular flat plate structure, a plurality of tracks are arranged vertically and in parallel on the surface, and a plurality of through holes are arranged between the tracks.

[0013] Beneficial effects of the utility model:

[0014] The cooling boss inside the functional module shielding box can conduct the heat loss on the components to the outside through metal heat conduction. The heat on the module box can be transferred to the chassis shell through multiple paths, improving the heat dissipation effect of the chassis structure. At the same time, through the heat dissipation duct between the modules, the fan at the rear end of the chassis sends air outward to take away the heat through convection. The combined heat dissipation method improves the overall heat dissipation performance of the chassis.

[0015] Each functional module shielding box is an independent metal shielding cavity, which realizes the physical isolation of internal and external interference sources, so that the EMC of the whole machine is well guaranteed.

[0016] The interface transfer front panel and the fan transfer rear panel are both detachable. The independent detachable structure provides convenient maintenance for the equipment, shortens the fault repair time, and the structure has good maintainability.

[0017] The motherboard mounting base is made of high-strength aluminum alloy and has high structural strength, which can withstand the force of plugging and unplugging the module shielding box plug-in. The reasonable arrangement and number of connecting screws of the mounting base on the motherboard printed circuit board and the appropriate number of screw-mounting constraints can significantly improve the structural rigidity of the motherboard printed circuit board unit and effectively reduce the response of the printed circuit board unit under vibration and impact conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the disassembled structure of the enhanced heat dissipation airborne general-purpose reinforced chassis;

[0019] Figure 2 It is a schematic diagram of the structure of a general purpose reinforced chassis for airborne equipment with enhanced heat dissipation;

[0020] Figure 3It is a schematic diagram of the main structure of the chassis of an enhanced heat dissipation airborne general reinforced chassis;

[0021] Figure 4 It is a schematic diagram of the structure of a shielding box for a functional module of an enhanced heat dissipation airborne general reinforced chassis;

[0022] Figure 5 It is a schematic diagram of the module box cavity structure of an enhanced heat dissipation airborne universal reinforced chassis;

[0023] Figure 6 It is a schematic diagram of the duct-type guide structure of an enhanced heat dissipation airborne general reinforced chassis.

[0024] In the figure: 1-interface adapter front panel, 2-duct guide rail, 3-functional module shielding box, 4-chassis body, 5-fan adapter rear panel, 6-motherboard mounting base plate, 7-left side plate, 8-lower cover plate, 9-front box body, 10-upper cover plate, 11-right side plate, 12-rear box body, 13-wedge-shaped locking block, 14-cover plate, 15-module box cavity, 16-boss. DETAILED DESCRIPTION

[0025] The following is an explanation of the implementation of the present invention by specific specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to the implementation. On the contrary, the purpose of introducing the utility model in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present utility model. In order to provide a deep understanding of the present utility model, many specific details will be included in the following description. The present utility model can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present utility model, some specific details will be omitted in the description. It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. It should be noted that in this specification, similar reference numerals and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further defined and explained in the subsequent figures.

[0026] Unless otherwise defined, the technical terms or scientific terms used in the present invention shall have the usual meanings understood by persons with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate quantity restrictions, but indicate the existence of at least one. Words such as "set", "connected", "connected" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two components. For ordinary technicians in this field, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances. The directions or positional relationships indicated by “upper”, “lower”, “left”, “right”, “inner”, “bottom”, etc. are based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the utility model.

[0027] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0028] In this embodiment, as shown in the attached Figure 1-6 As shown, an enhanced heat dissipation airborne universal reinforced chassis includes a chassis body 4, a front end of the chassis body 4 is provided with an interface adapter front panel 1, an interior of the chassis body 1 is also provided with an air duct guide rail 2, a plurality of functional module shielding boxes 3 are arranged in parallel in a direction perpendicular to the air duct guide rail 2 inside the chassis body 1, a rear end of the chassis body 4 is provided with a fan adapter rear panel 5, and a motherboard mounting base plate 6 is arranged at the lower end of the functional module shielding box 3.

[0029] Furthermore, the chassis body 4 includes a rectangular frame structure formed by a left side plate 7, a right side plate 11, a rear box body 12, a lower cover plate 8 and an upper cover plate 10, and a front box body 9 is arranged at the front end thereof.

[0030] Furthermore, the upper cover plate 10 and the lower cover plate 8 are in surface contact with the functional module shielding box 3 and form a heat conduction path.

[0031] Furthermore, the upper cover plate 10, the left side plate 7 and the right side plate 11 are provided with air inlet holes, and arc-shaped groove heat dissipation teeth are also provided on the outer sides of the left side plate 7 and the right side plate 11, which not only effectively reduces the weight of the chassis, but also greatly increases the heat dissipation area of ​​the chassis shell, thereby improving the overall heat exchange capacity of the chassis.

[0032] Furthermore, the functional module shielding box 3 is composed of a module box cavity 15 and a cover plate 14. A wedge-shaped locking block 13 is also provided on the side of the module box cavity 15. The functional module shielding box 3 is designed as a ventilation cavity shielding structure.

[0033] Furthermore, a plurality of bosses 16 are provided on the surface of the module box cavity 15 .

[0034] Furthermore, the air duct type guide rail 2 is a rectangular flat plate structure, a plurality of tracks are arranged vertically and parallelly on the surface, and a plurality of through holes are arranged between the tracks.

[0035] The specific working principle of this application is as follows:

[0036] The function module shielding box 3 is designed as a ventilation cavity shielding structure, which consists of a module box cavity 15 and a cover plate 14. The module box cavity 15 is fixed to the clamping surface of the guide rail groove in the chassis through the wedge-shaped locking blocks 13 on both sides. There are ventilation duct holes on the front and rear end surfaces where the clamping surface is located. Six sets of fans are installed on the fan adapter rear panel 5 at the rear end of the chassis body 4. Air inlet holes are opened at the two side walls and the top cover plate of the chassis body 4. The heat consumption of the components on the module printed circuit board is transferred to the module metal shielding box cooling boss 16 through the thermal pad. The module box has heat dissipation teeth on the cooling surface, which can be regarded as a larger heat sink. Through the heat dissipation duct between the modules, the fan sends air outward and takes away the heat of the printed circuit board components through convection. Each function module shielding box 3 is an independent metal shielding cavity, which realizes the physical isolation of internal and external interference sources, so that the EMC of the whole machine is well guaranteed.

[0037] The interface transfer front panel 1 adopts a detachable structure, which is installed on the outside of the front box body 9 of the chassis body 4 and fixed by screws. The external electrical interface of the equipment is installed on the interface transfer front panel, which is internally connected to the mixed motherboard and externally connected to the carrier platform as a user interface. The detachable structure has good maintainability, greatly improves the testability of the equipment, and quickly locates faults.

[0038] Six sets of fans are installed on the rear panel of the fan adapter, which together with the shielding material form an independent fan unit. The fan unit is fixed to the rear box body of the chassis body 4 structural frame by screws to provide cooling air source for the whole machine. At the same time, the independent and detachable structure facilitates maintenance of the fan and shortens the fault repair time.

[0039] The motherboard mounting base plate is made of high-strength aluminum alloy through integral milling and forming, and has high structural strength, and can withstand the force when the module shielding box is plugged in and out. Reasonable arrangement and number of connecting screws of the mounting base plate on the motherboard printed circuit board, and the appropriate number of screw-mounted constraints can significantly improve the structural rigidity of the motherboard printed circuit board unit, and effectively reduce the response of the printed circuit board unit under vibration and impact conditions. The motherboard mounting base plate 6 is fixed to the main frame of the chassis and the bottom of the duct-type guide rail by screws on all sides; the chassis structure is designed with a mechanical limit surface for module insertion, which can not only ensure that the module box is inserted in place and protect the module board connector, but also the module shielding box and the motherboard mounting base plate form contact at the mechanical limit surface, and transfer part of the heat on the module board to the chassis outer shell frame through metal conduction heat dissipation, thereby improving the overall heat dissipation performance of the chassis;

[0040] The duct-type guide rail 5 provides a mechanical limit clamping surface on one side for the functional module shielding box 3. The heat generated on the module is conducted to the contact surface of the guide clamping surfaces on both sides of the chassis through the cold plate and locking block of the module box cavity. At the same time, each slide groove surface of the duct-type guide rail 2 is designed with a rectangular strip hole. The cold air takes away the heat on the module through the strip hole through the air ducts on both sides of the module, converges at the rear of the chassis, and the hot air is taken out of the chassis by the fan, so that the heat on the module box can be transferred to the chassis shell through multiple paths, thereby improving the heat dissipation effect of the chassis structure.

[0041] Beneficial effects of the utility model:

[0042] The cooling boss inside the functional module shielding box can conduct the heat loss on the components to the outside through metal heat conduction. The heat on the module box can be transferred to the chassis shell through multiple paths, improving the heat dissipation effect of the chassis structure. At the same time, through the heat dissipation duct between the modules, the fan at the rear end of the chassis sends air outward to take away the heat through convection. The combined heat dissipation method improves the overall heat dissipation performance of the chassis.

[0043] Each functional module shielding box is an independent metal shielding cavity, which realizes the physical isolation of internal and external interference sources, so that the EMC of the whole machine is well guaranteed.

[0044] The interface transfer front panel and the fan transfer rear panel are both detachable. The independent detachable structure provides convenient maintenance for the equipment, shortens the fault repair time, and the structure has good maintainability.

[0045] The motherboard mounting base is made of high-strength aluminum alloy and has high structural strength, which can withstand the force of plugging and unplugging the module shielding box plug-in. The reasonable arrangement and number of connecting screws of the mounting base on the motherboard printed circuit board and the appropriate number of screw-mounting constraints can significantly improve the structural rigidity of the motherboard printed circuit board unit and effectively reduce the response of the printed circuit board unit under vibration and impact conditions.

[0046] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. Enhanced heat dissipation type airborne general reinforced chassis, characterized by: The invention comprises a chassis body (4), wherein an interface adapter front panel (1) is arranged at the front end of the chassis body (4), an air duct guide rail (2) is arranged inside the chassis body (4), a plurality of function module shielding boxes (3) are arranged inside the chassis body (4) in a direction perpendicular to the air duct guide rail (2) and in parallel, a fan adapter rear panel (5) is arranged at the rear end of the chassis body (4), and a motherboard mounting base plate (6) is arranged at the lower end of the function module shielding box (3).

2. The enhanced heat dissipation airborne universal reinforced chassis according to claim 1, characterized in that: The chassis body (4) is also comprised of a left side plate (7), a right side plate (11), a rear box body (12), a lower cover plate (8) and an upper cover plate (10) forming a rectangular frame structure, and a front box body (9) is arranged at the front end thereof.

3. The enhanced heat dissipation airborne universal reinforced chassis according to claim 2, characterized in that: The upper cover plate (10) and the lower cover plate (8) are in surface contact with the functional module shielding box (3), and form a heat conduction path.

4. The enhanced heat dissipation airborne universal reinforced chassis according to claim 2, characterized in that: The upper cover plate (10), the left side plate (7) and the right side plate (11) are provided with air inlet holes, and arc-shaped groove heat dissipation teeth are also provided on the outer sides of the left side plate (7) and the right side plate (11).

5. The enhanced heat dissipation airborne universal reinforced chassis according to claim 1, characterized in that: The functional module shielding box (3) is composed of a module box cavity (15) and a cover plate (14), and a wedge-shaped locking block (13) is also provided on the side of the module box cavity (15).

6. The enhanced heat dissipation airborne universal reinforced chassis according to claim 5, characterized in that: The module box cavity (15) also includes a plurality of bosses (16) arranged on the surface thereof.

7. The enhanced heat dissipation airborne universal reinforced chassis according to claim 1, characterized in that: The air duct type guide rail (2) is a rectangular flat plate structure, with a plurality of tracks arranged vertically and in parallel on the surface, and a plurality of through holes arranged between the tracks.

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