Ceramic substrate for packaging COB (Chip On Board) area light source

Abstract

The utility model discloses a ceramic substrate for packaging a COB (Chip On Board) area light source. The ceramic substrate comprises an insulating seat, an anode circuit layer and a cathode circuit layer, the insulating seat is provided with a COB area light source bearing area; the insulating seat comprises a ceramic body and a reinforcing frame. The ceramic body comprises a base layer and a boss integrally extending upwards from the base layer, the COB area light source bearing area is located on the upper surface of the boss, and the positive electrode circuit layer and the negative electrode circuit layer are formed on the surface of the ceramic body in an electroplating mode. The insulating seat in the product is composed of the ceramic body and the reinforcing frame, and the reinforcing frame is made of a carbon fiber composite material and is fixed on the surface of the base layer through thermocuring molding and overlapping, so that the edge of the product can be made to be thinner on the premise of ensuring the overall structural strength of the product, and the product is convenient to install and use; the product can give consideration to installation, use and structural strength at the same time, the structural strength is better, and installation and use are more convenient.

Description

Technical Field

[0001] The utility model relates to the field of ceramic substrate packaging technology, in particular to a ceramic substrate used for COB surface light source packaging. Background Art

[0002] COB surface light source is chip on board packaging, which is one of the bare chip mounting technologies. The semiconductor chip is mounted on the printed circuit board. The electrical connection between the chip and the substrate is achieved by wire stitching and covered with resin to ensure reliability. Although COB is the simplest bare chip mounting technology, its packaging density is far less than that of TAB and flip chip welding technology. Therefore, COB surface light source in the form of COB packaging is also called COB light source, COB plane light source or COB integrated light source, etc.

[0003] In order to achieve better heat dissipation performance, the current COB surface light sources are all packaged with ceramic substrates, and their main structures include an insulating seat, a positive circuit layer, and a negative circuit layer; the insulating seat has a COB surface light source bearing area, and the positive circuit layer and the negative circuit layer are both arranged on the insulating seat, and the positive circuit layer and the negative circuit layer are separated from each other and extend from the COB surface light source bearing area to the outside of the COB surface light source bearing area. However, in the prior art, the insulating seat is made of ceramic material as a whole. Since the ceramic material is relatively brittle, if the insulating seat is relatively thick, the structural strength is sufficient and it will not break, but it is not convenient for installation and use. If the insulating seat is relatively thin, although the edge can be installed and used, the structural strength is insufficient and it is easy to break. Therefore, the current ceramic substrate cannot take into account both installation and use and structural strength at the same time, and it is necessary to improve the current ceramic substrate. Utility Model Content

[0004] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a ceramic substrate for COB surface light source packaging, which can effectively solve the problem that the existing ceramic substrates cannot take into account both installation and structural strength at the same time.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A ceramic substrate for COB surface light source packaging comprises an insulating seat, a positive circuit layer and a negative circuit layer; the insulating seat is provided with a COB surface light source bearing area, the positive circuit layer and the negative circuit layer are both arranged on the insulating seat, the positive circuit layer and the negative circuit layer are separated from each other and both extend from the COB surface light source bearing area to the outside of the COB surface light source bearing area; the insulating seat comprises a ceramic body and a reinforced frame; the ceramic body comprises a base layer and a boss extending upwardly from the base layer as a whole, the COB surface light source bearing area is located on the upper surface of the boss, the positive circuit layer and the negative circuit layer are both formed on the surface of the ceramic body by electroplating; the reinforced frame is a carbon fiber composite material, which is fixed on the surface of the base layer by thermal curing molding and is located on the periphery of the boss, the upper surface of the reinforced frame is lower than the upper surface of the boss, and the reinforced frame is provided with a positive electrode pad and a negative electrode pad, the positive electrode pad and the negative electrode pad are respectively conductively connected to the outer end of the positive circuit layer and the outer end of the negative circuit layer.

[0007] As a preferred solution, the outer contour of the ceramic body and the outer contour of the reinforced frame are both square, and the reinforced frame completely covers the upper surface of the base layer to effectively enhance the overall structural strength of the insulating seat.

[0008] As a preferred solution, the outer contour of the boss is circular, and a dam is provided on the upper surface of the boss. The dam is located at the periphery of the COB surface light source bearing area to facilitate chip packaging.

[0009] As a preferred solution, the dam is made of epoxy resin and is easy to shape.

[0010] As a preferred solution, the positive electrode circuit layer and the negative electrode circuit layer are both copper-plated circuits with good conductivity.

[0011] As a preferred solution, the positive electrode pad and the negative electrode pad are both formed by thickening through electroplating. Both the positive electrode pad and the negative electrode pad are made of copper and exposed on the upper surface of the reinforced frame. They are easy to manufacture and have good conductivity.

[0012] As a preferred solution, a fixing hole is provided at two of the diagonals of the insulating seat, and each fixing hole penetrates the upper and lower surfaces of the base layer and the upper and lower surfaces of the reinforced frame; the positive electrode pad and the negative electrode pad are respectively located at the other two diagonals of the insulating seat so as to be welded and connected with the external circuit.

[0013] As a preferred solution, the lower surface of the base layer is completely covered with a graphene heat dissipation coating to improve the thermal conduction efficiency of the insulating seat and achieve a better heat dissipation effect.

[0014] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0015] The insulating seat in this product is composed of a ceramic body and a reinforced frame. The reinforced frame is a carbon fiber composite material, which is fixed on the surface of the base layer by thermal curing molding and lamination. This allows the edge of the product to be made thinner while ensuring the overall structural strength, so as to facilitate installation and use. This product can take into account both installation and use and structural strength at the same time, with better structural strength and more convenient installation and use.

[0016] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view of a preferred embodiment of the utility model;

[0018] Figure 2 It is a cross-sectional view of a preferred embodiment of the utility model.

[0019] Description of the accompanying drawings:

[0020] 10. Insulation seat 11. Ceramic body

[0021] 111, base layer 112, boss

[0022] 12. Strengthen the border 13. Dam

[0023] 14. Graphene heat dissipation coating 101. COB surface light source bearing area

[0024] 102, fixing hole 20, positive electrode circuit layer

[0025] 30. Negative electrode circuit layer 41. Positive electrode pad

[0026] 42. Negative electrode welding pad. DETAILED DESCRIPTION

[0027] Please refer to Figure 1 to Figure 2 As shown, it shows the specific structure of a preferred embodiment of the utility model, including an insulating seat 10, a positive electrode circuit layer 20 and a negative electrode circuit layer 30.

[0028] The insulating seat 10 has a COB surface light source carrying area 101, and the insulating seat 10 includes a ceramic body 11 and a reinforced frame 12; the ceramic body 11 includes a base layer 111 and a boss 112 extending upward from the base layer 111, and the COB surface light source carrying area 101 is located on the upper surface of the boss 112; the reinforced frame 12 is a carbon fiber composite material, which is fixed on the surface of the base layer 111 by thermal curing molding and is located on the periphery of the boss 112, the upper surface of the reinforced frame 12 is lower than the upper surface of the boss 112, and the reinforced frame 12 has a positive electrode pad 41 and a negative electrode pad 42.

[0029] In this embodiment, the outer contour of the ceramic body 11 and the outer contour of the reinforced frame 12 are both square, and the reinforced frame 12 completely covers the upper surface of the base layer 111 to effectively enhance the overall structural strength of the insulating seat 10. The outer contour of the boss 112 is circular, and a dam 13 is provided on the upper surface of the boss 112. The dam 13 is located at the periphery of the COB surface light source bearing area 101 to facilitate chip packaging. In addition, the dam 13 is made of epoxy resin and is easy to mold. The positive electrode pad 41 and the negative electrode pad 42 are both formed by electroplating thickening. The positive electrode pad 41 and the negative electrode pad 42 are both made of copper and exposed on the upper surface of the reinforced frame 12. In addition, a fixing hole 102 is provided at two diagonal positions of the insulating seat 10, and each fixing hole 102 penetrates the upper and lower surfaces of the base layer 111 and the upper and lower surfaces of the reinforcing frame 12, so as to be firmly installed with the outside; the positive electrode pad 41 and the negative electrode pad 42 are respectively located at the other two diagonal positions of the insulating seat 10, so as to be welded and connected with the external circuit. In addition, the lower surface of the base layer 111 is completely covered with a graphene heat dissipation coating 14 to improve the thermal conductivity efficiency of the insulating seat 10 and achieve a better heat dissipation effect.

[0030] The positive circuit layer 20 and the negative circuit layer 30 are both arranged on the insulating seat 10, and the positive circuit layer 20 and the negative circuit layer 30 are separated from each other and both extend from the COB surface light source bearing area 101 to the outside of the COB surface light source bearing area 101, and the positive electrode pad 41 and the negative electrode pad 42 are respectively connected to the outer end of the positive circuit layer 20 and the outer end of the negative circuit layer 30. In this embodiment, the positive circuit layer 20 and the negative circuit layer 30 are both formed on the surface of the ceramic body 11 by electroplating, which is easy to manufacture, and the positive circuit layer 20 and the negative circuit layer 30 are both copper-plated circuits with good conductivity.

[0031] The production process of this embodiment is described in detail as follows:

[0032] First, the ceramic body 11 is formed and manufactured. Then, the positive electrode circuit layer 20, the negative electrode circuit layer 30, the positive electrode pad 41 and the negative electrode pad 42 are formed on the surface of the ceramic body 11 by electroplating. Then, carbon fiber cloth is laid on the upper surface of the base layer 111, and then heated and cured to form a reinforced frame 12. Then, graphene coating is sprayed on the lower surface of the base layer 111 to form a graphene heat dissipation coating 14, and a dam 13 is bonded and fixed to the upper surface of the boss 112.

[0033] When in use, the chip is packaged in the COB surface light source bearing area 101, and then screws are passed through the fixing holes 102 to fix it to the outside, and the external circuit is welded to the positive electrode pad 41 and the negative electrode pad 42 for conduction.

[0034] The design focus of the utility model is that the insulating seat in the product is composed of a ceramic body and a reinforced frame. The reinforced frame is a carbon fiber composite material, which is fixed on the surface of the base layer by thermal curing molding and stacking. This allows the product to be made thinner at the edge while ensuring the overall structural strength, so as to facilitate installation and use. The product can take into account both installation and use and structural strength at the same time, has better structural strength, and is more convenient to install and use.

[0035] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A ceramic substrate for COB surface light source packaging, comprising an insulating seat, a positive circuit layer and a negative circuit layer; the insulating seat has a COB surface light source bearing area, the positive circuit layer and the negative circuit layer are both arranged on the insulating seat, the positive circuit layer and the negative circuit layer are separated from each other and both extend from the COB surface light source bearing area to the outside of the COB surface light source bearing area; characterized in that: The insulating seat includes a ceramic body and a reinforced frame; the ceramic body includes a base layer and a boss extending upward from the base layer, the COB surface light source bearing area is located on the upper surface of the boss, and the positive circuit layer and the negative circuit layer are both formed on the surface of the ceramic body by electroplating; the reinforced frame is a carbon fiber composite material, which is fixed on the surface of the base layer by thermal curing molding and is located on the periphery of the boss, the upper surface of the reinforced frame is lower than the upper surface of the boss, and the reinforced frame is provided with a positive electrode pad and a negative electrode pad, and the positive electrode pad and the negative electrode pad are respectively conductively connected to the outer end of the positive circuit layer and the outer end of the negative circuit layer.

2. The ceramic substrate for COB surface light source packaging according to claim 1, characterized in that: The outer contour of the ceramic body and the outer contour of the reinforced frame are both square, and the reinforced frame completely covers the upper surface of the base layer.

3. The ceramic substrate for COB surface light source packaging according to claim 1, characterized in that: The outer contour of the boss is circular, and a dam is provided on the upper surface of the boss. The dam is located at the periphery of the COB surface light source bearing area.

4. The ceramic substrate for COB surface light source packaging according to claim 3, characterized in that: The dam is made of epoxy resin.

5. The ceramic substrate for COB surface light source packaging according to claim 1, characterized in that: The positive electrode circuit layer and the negative electrode circuit layer are both copper-plated circuits.

6. The ceramic substrate for COB surface light source packaging according to claim 1, characterized in that: The positive electrode pad and the negative electrode pad are both formed by thickening through electroplating. The positive electrode pad and the negative electrode pad are both made of copper and exposed on the upper surface of the reinforced frame.

7. The ceramic substrate for COB surface light source packaging according to claim 1, characterized in that: A fixing hole is provided at two diagonal positions of the insulating seat, and each fixing hole penetrates the upper and lower surfaces of the base layer and the upper and lower surfaces of the reinforced frame; the positive electrode pad and the negative electrode pad are respectively located at the other two diagonal positions of the insulating seat.

8. The ceramic substrate for COB surface light source packaging according to claim 1, characterized in that: The lower surface of the base layer is completely covered with a graphene heat dissipation coating.

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