High-power-consumption vapor chamber
By introducing auxiliary parts and capillary structures into the high-power temperature uniform plate, the gas channel design is optimized, and the problems of bulky and low heat dissipation efficiency of traditional temperature uniform plates are solved, achieving dual optimization of lightweight and efficient heat dissipation.
Patent Information
- Application Number
- CN202420844382.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-04-23
AI Technical Summary
Traditional high-power temperature uniform plates often lead to bulky designs when increasing surface strength, which are difficult to meet the needs of lightweight and efficient heat dissipation.
With a new lightweight design, the space size and flow path of the gas channel are increased by providing auxiliary parts and capillary structures between the first cover plate and the second cover plate, and the gas channel is optimized through the raised structure and porous design, reducing the Weight and production difficulty, while improving heat dissipation efficiency.
It has achieved weight reduction and heat dissipation performance improvement of the temperature uniform plate, met the needs of modern electronic equipment for lightweight and efficient heat dissipation, and improved heat dissipation capabilities and structural stability.
Smart Images
Figure CN222336153U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of temperature averaging boards, and in particular to a high-power consumption temperature averaging board. Background Art
[0002] Due to its special heat dissipation requirements, high-power vapor chambers usually require a higher cavity design. However, traditional structural designs rely on increasing the thickness of the cover or using copper pillars to enhance surface strength, which undoubtedly makes the entire vapor chamber appear quite bulky. Faced with this problem, we urgently need to seek a more lightweight design solution to reduce the weight of the vapor chamber, so as to meet the increasingly stringent requirements for lightweight and efficient heat dissipation. Utility Model Content
[0003] In view of this, the utility model provides a large power consumption temperature equalizing board, which adopts a new lightweight design, aiming to ensure efficient heat dissipation while greatly reducing the weight of the temperature equalizing board, successfully achieving dual optimization of heat dissipation performance and structural weight, and meeting the urgent needs of modern electronic equipment for lightweight and efficient heat dissipation.
[0004] The purpose of the utility model is achieved through the following technical solutions:
[0005] A high-power consumption temperature equalizing plate comprises, from top to bottom, a first cover plate, an auxiliary part, a capillary structure and a second cover plate, the first cover plate and the second cover plate form a closed chamber, the capillary structure and the auxiliary part are located in the closed chamber, a first protrusion is arranged on the lower surface of the first cover plate, the auxiliary part has a through hole, a second protrusion is arranged on the upper surface of the auxiliary part, the first protrusion and the second protrusion are arranged opposite to each other and contact each other, the capillary structure is attached to the lower surface of the auxiliary part, and the upper surface of the second cover plate and the lower surface of the capillary structure are in contact with each other.
[0006] In addition to the capillary structure, an auxiliary part is also provided between the first cover plate and the second cover plate, and both the first cover plate and the auxiliary part are designed with a protrusion structure, namely the first protrusion and the second protrusion, wherein the first protrusion and the second protrusion are arranged opposite to each other and contact and support each other, which not only increases the surface area of the temperature equalizing plate and increases the spatial dimension of the gas channel, but also ensures the overall strength of the temperature equalizing plate. By adding an auxiliary part to support the first cover plate, the height of the first protrusion on the first cover plate can be reduced, and the reduced height of the first protrusion is supplemented by the second protrusion. On the premise of ensuring that the spatial dimension of the gas channel is as large as possible, the spacing between adjacent first protrusions can be effectively reduced, reducing the risk of tearing of the first cover plate during stamping manufacturing, reducing the production difficulty of the first cover plate, and also allowing the first cover plate and the second cover plate to select relatively thin materials, thereby greatly reducing the weight of the temperature equalizing plate. The capillary structure is attached to the lower surface of the auxiliary part, and the first cover plate, the first protrusion, the auxiliary part, the second protrusion, the capillary structure and the second cover plate together enclose a gas channel. The first protrusion, the auxiliary part and the second protrusion are arranged to effectively increase the space of the gas channel, so that the gas channel can provide better flow for the gas inside the temperature equalizing plate, improve the circulation efficiency of the working fluid in the temperature equalizing plate, realize rapid heat dissipation of the temperature equalizing plate, enhance the heat dissipation capacity of the temperature equalizing plate, and meet the heat dissipation requirements of high power consumption.
[0007] Preferably, there is a gap between the first cover plate and the auxiliary component, the gap is a gas channel, and the gas channel is connected to the capillary structure through a through hole.
[0008] The gap between the first cover plate and the auxiliary part is cleverly designed. This gap not only provides a smooth passage for the gas, allowing the gas to flow freely inside the heat spreader, but also connects with the capillary structure through the through hole. This design not only increases the spatial size of the gas channel, but also makes the gas channel more solid, thereby improving the overall heat dissipation effect of the heat spreader.
[0009] Preferably, the second protrusion is provided with a plurality of openings, and the gas channel is connected to the capillary structure through the openings.
[0010] The multiple openings on the second protrusion further enhance the heat dissipation performance of the heat spreader. These openings allow the gas channel to be directly connected to the capillary structure, providing more paths for the gas to flow inside the heat spreader. The number and distribution of the openings have been carefully calculated and optimized to ensure that the gas can be evenly distributed to all parts of the capillary structure, thereby achieving more efficient heat transfer. This design not only improves the heat dissipation efficiency of the heat spreader, but also enables it to perform well in heat dissipation of high-power devices.
[0011] Preferably, there are multiple first protrusions, and the number of the second protrusions is equal to the number of the first protrusions.
[0012] The number of the first protrusion and the second protrusion is equal, and the two correspond one to one. The setting of multiple protrusions further improves the performance of the temperature spreader, not only enhancing the structural stability of the temperature spreader, but also further increasing the space of the gas channel. The distribution of multiple protrusions is more even, dividing the gas channel into a more uniform space, making the gas flow inside the temperature spreader smoother, reducing flow resistance and improving circulation efficiency. This design enables the temperature spreader to take away heat more quickly and achieve rapid heat dissipation when facing the heat dissipation needs of high-power consumption equipment.
[0013] Preferably, the first protrusion is integrally formed with the first cover plate or connected in a split manner.
[0014] The one-piece or split connection design of the first protrusion and the first cover plate greatly facilitates the manufacture and installation of the temperature homogenizer. The one-piece design can ensure a stronger connection between the protrusion and the cover plate, reducing the performance degradation caused by loose connection. The split connection provides more flexibility, allowing the protrusion to be replaced or adjusted according to specific needs, thereby adapting to different heat dissipation environments.
[0015] Preferably, the second protrusion is integrally formed with the auxiliary component or connected in a split manner.
[0016] The one-piece or split connection design of the second protrusion and the auxiliary part also shows excellent advantages. The one-piece molding ensures a seamless connection between the protrusion and the auxiliary part, making the structure of the entire heat spreader more compact and reducing the heat transfer obstacles caused by the connection gap. The split connection allows the protrusion and the auxiliary part to be replaced or adjusted independently as needed, thereby extending the service life and maintenance cycle of the heat spreader.
[0017] Preferably, the shape of the first protrusion includes but is not limited to a linear shape, a dot shape, a truncated cone shape, a cylindrical shape, a polygonal shape, or a combination of the above.
[0018] First, the diversity of the protrusion shape design brings more possibilities for the heat dissipation performance of the temperature spreader. Linear or dot-shaped protrusion designs can increase the number and surface area of gas channels, thereby improving the efficiency of heat transfer. Frustum-shaped or cylindrical protrusions can better support gas channels, reduce flow resistance, and improve circulation efficiency. Polygonal protrusions can provide a more stable support structure to ensure that the temperature spreader maintains stable heat dissipation performance during long-term use. These different shape designs can be flexibly selected according to specific application scenarios and needs to achieve the best heat dissipation effect.
[0019] Preferably, the shape of the second protrusion includes but is not limited to a linear shape, a dot shape, a truncated cone shape, a cylindrical shape, a polygonal shape, or a combination of the above.
[0020] The diverse design of the second protrusion shape not only provides more support methods, but also optimizes the distribution and flow path of the gas channel. Linear or dot-shaped second protrusions can increase the density of the gas channel and improve the efficiency of heat transfer; frustum-shaped or cylindrical second protrusions can provide a larger support area, reduce the resistance of gas flow, and enhance the circulation effect; polygonal second protrusions combine stability and heat dissipation efficiency, so that the temperature spreader can maintain excellent heat dissipation performance under various conditions. This diverse design allows the temperature spreader to be flexibly adjusted according to different heat dissipation requirements and application environments to achieve the best heat conduction effect.
[0021] Preferably, the capillary structure includes but is not limited to a mesh structure woven from a plurality of metal wires, and the capillary structure includes but is not limited to a porous structure sintered from metal powder.
[0022] The optimal design of the capillary structure further improves the heat dissipation capacity of the temperature equalizer. The mesh structure woven by several metal wires has excellent thermal conductivity and surface area, which can quickly absorb and disperse heat to achieve efficient heat transfer. The porous structure sintered by metal powder has higher porosity and surface area, which can increase the contact area of heat conduction and further improve the heat dissipation efficiency. The design of these capillary structures can not only meet the heat dissipation requirements of high-power consumption equipment, but also provide uniform and stable temperature distribution to prevent local overheating.
[0023] Compared with the prior art, the utility model has the following beneficial effects:
[0024] In the high-power consumption temperature balancing plate of the utility model, in addition to the capillary structure, an auxiliary part is also provided between the first cover plate and the second cover plate, and both the first cover plate and the auxiliary part are designed with a protrusion structure, namely the first protrusion and the second protrusion, wherein the first protrusion and the second protrusion are arranged opposite to each other and contact and support each other, which not only increases the surface area of the temperature balancing plate and increases the spatial dimension of the gas channel, but also ensures the overall strength of the temperature balancing plate. By adding an auxiliary part to support the first cover plate, the height of the first protrusion on the first cover plate can be reduced, and the reduced height of the first protrusion is supplemented by the second protrusion. Under the premise of ensuring that the spatial dimension of the gas channel is as large as possible, the spacing between adjacent first protrusions can be effectively reduced, reducing the risk of tearing of the first cover plate during stamping manufacturing, reducing the production difficulty of the first cover plate, and also allowing the first cover plate and the second cover plate to select relatively thin materials, thereby greatly reducing the weight of the temperature balancing plate. The capillary structure is attached to the lower surface of the auxiliary part, and the first cover plate, the first protrusion, the auxiliary part, the second protrusion, the capillary structure and the second cover plate together enclose a gas channel. The first protrusion, the auxiliary part and the second protrusion are arranged to effectively increase the space of the gas channel, so that the gas channel can provide better flow for the gas inside the temperature equalizing plate, improve the circulation efficiency of the working fluid in the temperature equalizing plate, realize rapid heat dissipation of the temperature equalizing plate, enhance the heat dissipation capacity of the temperature equalizing plate, and meet the heat dissipation requirements of high power consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0026] Figure 1 This is a structural diagram of a high power consumption temperature equalizing plate according to an embodiment of the utility model.
[0027] Figure 2 for Figure 1 Magnified view of area A.
[0028] Figure 3 This is a structural diagram from another perspective of a high-power consumption temperature equalizing plate according to an embodiment of the utility model.
[0029] Figure 4 for Figure 3 Magnified view of area B. DETAILED DESCRIPTION
[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0031] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0032] It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of the embodiments of the present application, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the application product is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0033] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.
[0034] The technical solution in this application will be described below in conjunction with the accompanying drawings.
[0035] The present embodiment provides a high-power consumption temperature equalizing plate, which includes, from top to bottom, a first cover plate 10, an auxiliary part 20, a capillary structure 30 and a second cover plate 40. The first cover plate 10 and the second cover plate 40 form a closed chamber, the capillary structure 30 and the auxiliary part 20 are located in the closed chamber, the lower surface of the first cover plate 10 is provided with a first protrusion 11, the auxiliary part 20 has a through hole 22, the upper surface of the auxiliary part 20 is provided with a second protrusion 21, the first protrusion 11 and the second protrusion 21 are arranged opposite to each other and contact each other, the capillary structure 30 is attached to the lower surface of the auxiliary part 20, and the upper surface of the second cover plate 40 is in contact with the lower surface of the capillary structure 30.
[0036] In addition to the capillary structure 30, an auxiliary part 20 is also provided between the first cover plate 10 and the second cover plate 40, and both the first cover plate 10 and the auxiliary part 20 are designed with a protrusion structure, namely, a first protrusion 11 and a second protrusion 21, wherein the first protrusion 11 and the second protrusion 21 are arranged opposite to each other and contact and support each other, which not only increases the surface area of the temperature equalizing plate, increases the spatial size of the gas channel, but also ensures the overall strength of the temperature equalizing plate. By adding the auxiliary part 20 to support the first cover plate 10, the height of the first protrusion 11 on the first cover plate 10 can be reduced, and the reduced height of the first protrusion 11 is supplemented by the second protrusion 21. Under the premise of ensuring that the spatial size of the gas channel is as large as possible, the spacing between adjacent first protrusions 11 can be effectively reduced, reducing the risk of tearing of the first cover plate 10 during stamping manufacturing, reducing the production difficulty of the first cover plate 10, and also allowing the first cover plate 10 and the second cover plate 40 to select relatively thin materials, thereby greatly reducing the weight of the temperature equalizing plate. The capillary structure 30 is attached to the lower surface of the auxiliary part 20, and the first cover plate 10, the first protrusion 11, the auxiliary part 20, the second protrusion 21, the capillary structure 30 and the second cover plate 40 together enclose a gas channel. The first protrusion 11, the auxiliary part 20 and the second protrusion 21 are arranged to effectively increase the space of the gas channel, so that the gas channel can provide better flow for the gas inside the temperature equalizing plate, improve the circulation efficiency of the working fluid in the temperature equalizing plate, realize rapid heat dissipation of the temperature equalizing plate, enhance the heat dissipation capacity of the temperature equalizing plate, and meet the heat dissipation requirements of high power consumption.
[0037] In this embodiment, there is a gap between the first cover plate 10 and the auxiliary component 20 , and the gap is a gas channel. The gas channel is connected to the capillary structure 30 through the through hole 22 .
[0038] The gap between the first cover plate 10 and the auxiliary member 20 is designed very cleverly. This gap not only provides a smooth passage for the gas, allowing the gas to flow freely inside the temperature-vaporizing plate, but also connects with the capillary structure 30 through the through hole 22. This design not only increases the spatial size of the gas passage, but also makes the gas passage more solid, thereby improving the overall heat dissipation effect of the temperature-vaporizing plate.
[0039] In this embodiment, the second protrusion 21 is provided with a plurality of openings 23 , and the gas channel is connected to the capillary structure 30 through the openings 23 .
[0040] The design of multiple openings 23 dug on the second protrusion 21 further enhances the heat dissipation performance of the temperature spreader. These openings 23 enable the gas channel to be directly connected to the capillary structure 30, providing more paths for the gas to flow inside the temperature spreader. The number and distribution of the openings 23 have been carefully calculated and optimized to ensure that the gas can be evenly distributed to all parts of the capillary structure 30, thereby achieving more efficient heat transfer. This design not only improves the heat dissipation efficiency of the temperature spreader, but also makes it perform well when dissipating heat from high-power consumption equipment.
[0041] In this embodiment, there are multiple first protrusions 11 , and the number of the second protrusions 21 is equal to the number of the first protrusions 11 .
[0042] The number of the first protrusions 11 and the second protrusions 21 are equal, and the two correspond one to one. The setting of multiple protrusions further improves the performance of the temperature equalizer, not only enhancing the structural stability of the temperature equalizer, but also further increasing the space of the gas channel. The distribution of multiple protrusions is more uniform, dividing the gas channel into a more uniform space, making the flow of gas inside the temperature equalizer smoother, reducing flow resistance and improving circulation efficiency. This design enables the temperature equalizer to take away heat more quickly and achieve rapid heat dissipation when facing the heat dissipation needs of high-power consumption equipment.
[0043] In this embodiment, the first protrusion 11 and the first cover plate 10 are integrally formed or separately connected.
[0044] The one-piece or split connection design of the first protrusion 11 and the first cover plate 10 provides great convenience for the manufacture and installation of the temperature homogenizer. The one-piece design can ensure a stronger connection between the protrusion and the cover plate, reducing the performance degradation caused by loose connection. The split connection provides more flexibility, so that the protrusion can be replaced or adjusted according to specific needs, thereby adapting to different heat dissipation environments.
[0045] In this embodiment, the second protrusion 21 and the auxiliary component 20 are integrally formed or separately connected.
[0046] The one-piece or split connection design of the second protrusion 21 and the auxiliary part 20 also shows excellent advantages. The one-piece molding ensures a seamless connection between the protrusion and the auxiliary part 20, making the structure of the entire heat spreader more compact and reducing the heat transfer barrier caused by the connection gap. The split connection allows the protrusion and the auxiliary part 20 to be replaced or adjusted independently as needed, thereby extending the service life and maintenance cycle of the heat spreader.
[0047] In this embodiment, the shape of the first protrusion 11 includes but is not limited to a line shape, a dot shape, a truncated cone shape, a cylindrical shape, a polygonal shape, or a combination of the above.
[0048] The diversity of the shape design of the first protrusion 11 brings more possibilities for the heat dissipation performance of the temperature spreader. Linear or dot-shaped protrusion designs can increase the number and surface area of gas channels, thereby improving the efficiency of heat transfer. Frustum-shaped or cylindrical protrusions can better support gas channels, reduce flow resistance, and improve circulation efficiency. Polygonal protrusions can provide a more stable support structure to ensure that the temperature spreader maintains stable heat dissipation performance during long-term use. These different shape designs can be flexibly selected according to specific application scenarios and requirements to achieve the best heat dissipation effect.
[0049] In this embodiment, the shape of the second protrusion 21 includes but is not limited to a line shape, a dot shape, a truncated cone shape, a cylindrical shape, a polygonal shape, or a combination of the above.
[0050] The diversified design of the second protrusion 21 not only provides more support methods, but also optimizes the distribution and flow path of the gas channel. The linear or dot-shaped second protrusion 21 can increase the density of the gas channel and improve the efficiency of heat transfer; the truncated cone or cylindrical second protrusion 21 can provide a larger support area, reduce the resistance of gas flow, and enhance the circulation effect; the polygonal second protrusion 21 combines stability and heat dissipation efficiency, so that the temperature plate can maintain excellent heat dissipation performance under various conditions. This diversified design allows the temperature plate to be flexibly adjusted according to different heat dissipation requirements and application environments to achieve the best heat conduction effect.
[0051] In this embodiment, the capillary structure 30 includes but is not limited to a mesh structure woven by a plurality of metal wires, and the capillary structure 30 includes but is not limited to a porous structure sintered by metal powder.
[0052] The preferred design of the capillary structure 30 further improves the heat dissipation capacity of the temperature equalizer. The mesh structure woven by a number of metal wires has excellent thermal conductivity and surface area, can quickly absorb and disperse heat, and achieve efficient heat transfer. The porous structure sintered by metal powder has a higher porosity and surface area, can increase the contact area of heat conduction, and further improve the heat dissipation efficiency. The design of these capillary structures 30 can not only meet the heat dissipation requirements of high-power consumption equipment, but also provide a uniform and stable temperature distribution to prevent the occurrence of local overheating.
[0053] Compared with the prior art, the beneficial effects of this embodiment are:
[0054] In the high power consumption temperature averaging board of this embodiment, in addition to the capillary structure 30, an auxiliary part 20 is also provided between the first cover plate 10 and the second cover plate 40, and both the first cover plate 10 and the auxiliary part 20 are designed with a protrusion structure, namely, a first protrusion 11 and a second protrusion 21, wherein the first protrusion 11 and the second protrusion 21 are arranged opposite to each other and contact and support each other, which not only increases the surface area of the temperature averaging board and increases the spatial size of the gas channel, but also ensures the overall strength of the temperature averaging board. By adding the auxiliary part 20 to support the first cover plate 10, the height of the first protrusion 11 on the first cover plate 10 can be reduced, and the reduced height of the first protrusion 11 is supplemented by the second protrusion 21. Under the premise of ensuring that the spatial size of the gas channel is as large as possible, the spacing between adjacent first protrusions 11 can be effectively reduced, reducing the risk of tearing of the first cover plate 10 during stamping manufacturing, reducing the production difficulty of the first cover plate 10, and also allowing the first cover plate 10 and the second cover plate 40 to select relatively thin materials, thereby greatly reducing the weight of the temperature averaging board. The capillary structure 30 is attached to the lower surface of the auxiliary part 20, and the first cover plate 10, the first protrusion 11, the auxiliary part 20, the second protrusion 21, the capillary structure 30 and the second cover plate 40 together enclose a gas channel. The first protrusion 11, the auxiliary part 20 and the second protrusion 21 are arranged to effectively increase the space of the gas channel, so that the gas channel can provide better flow for the gas inside the temperature equalizing plate, improve the circulation efficiency of the working fluid in the temperature equalizing plate, realize rapid heat dissipation of the temperature equalizing plate, enhance the heat dissipation capacity of the temperature equalizing plate, and meet the heat dissipation requirements of high power consumption.
[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A high power consumption temperature equalizing board, characterized in that: From top to bottom, it includes a first cover plate, an auxiliary part, a capillary structure and a second cover plate, the first cover plate and the second cover plate form a closed chamber, the capillary structure and the auxiliary part are located in the closed chamber, the lower surface of the first cover plate is provided with a first protrusion, the auxiliary part has a through hole, the upper surface of the auxiliary part is provided with a second protrusion, the first protrusion and the second protrusion are arranged opposite to each other and contact each other, the capillary structure is attached to the lower surface of the auxiliary part, and the upper surface of the second cover plate and the lower surface of the capillary structure are in contact with each other.
2. The high power consumption temperature equalizing board according to claim 1, characterized in that: There is a gap between the first cover plate and the auxiliary component, the gap is a gas channel, and the gas channel is connected to the capillary structure through the through hole.
3. The high power consumption temperature equalizing board according to claim 2, characterized in that: The second protrusion is provided with a plurality of openings, and the gas channel is connected to the capillary structure through the openings.
4. The high power consumption temperature equalizing board according to claim 1, characterized in that: There are multiple first protrusions, and the number of the second protrusions is equal to the number of the first protrusions.
5. The high power consumption temperature equalizing board according to claim 1, characterized in that: The first protrusion is integrally formed with the first cover plate or connected in a split manner.
6. The high power consumption temperature equalizing board according to claim 1, characterized in that: The second protrusion is integrally formed with the auxiliary component or connected with the auxiliary component in a split manner.
7. The high power consumption temperature equalizing board according to claim 1, characterized in that: The shape of the first protrusion includes but is not limited to a line shape, a dot shape, a truncated cone shape, a cylindrical shape, a polygonal shape, or a combination of the above.
8. The high power consumption temperature equalizing board according to claim 1, characterized in that: The shape of the second protrusion includes but is not limited to a line shape, a dot shape, a truncated cone shape, a cylindrical shape, a polygonal shape, or a combination of the above.
9. The high power consumption temperature equalizing board according to claim 1, characterized in that: The capillary structure includes but is not limited to a mesh structure woven from a plurality of metal wires.
10. The high power consumption temperature equalizing board according to claim 1, characterized in that: The capillary structure includes but is not limited to a porous structure formed by sintering metal powder.