Depth camera and electronic equipment

Abstract

The utility model discloses a depth camera, and the camera comprises a transmitting module which is used for transmitting light to a measured object, and comprises a ceramic plate and a transmitting assembly disposed at one side of the ceramic plate; the receiving module is used for receiving light reflected by the measured object and comprises a circuit board and a receiving assembly arranged on one side of the circuit board, the circuit board and the ceramic plate are arranged side by side, and the circuit board is electrically connected with the transmitting assembly; and the heat dissipation piece is connected to the same side of the ceramic plate and the circuit board. The heat dissipation piece in the depth camera can be in direct contact with the ceramic plate to dissipate heat of the transmitting module, so that heat generated by the transmitting module can be quickly conducted to the shell of the depth camera, and the heat dissipation effect is good; and the length of the transmitting module in the optical axis direction is relatively small, so that miniaturization of the depth camera is facilitated, the size of the circuit board is reduced, and the cost of the circuit board is reduced. The embodiment of the utility model further provides electronic equipment which comprises a body and the depth camera, and the depth camera is arranged in the body.

Description

Technical Field

[0001] The present application relates to the technical field of camera devices, and in particular to a depth camera and electronic equipment. Background Art

[0002] With the development of social industry, depth cameras have been widely used in machine vision, industrial inspection, image processing, pattern recognition, etc. The transmitter module of the depth camera will generate a lot of heat when working. The ceramic plate of the current transmitter module is installed on the circuit board. Due to the poor heat dissipation effect of the circuit board, the heat generated by the transmitter module cannot be quickly transferred to the casing of the depth camera, which can easily damage the depth camera. Utility Model Content

[0003] In view of the above, it is necessary to propose a depth camera and electronic device with better heat dissipation effect.

[0004] An embodiment of the present application provides a depth camera, comprising: a transmitting module, used to transmit light toward an object to be measured, the transmitting module comprising a ceramic board and a transmitting component arranged on one side of the ceramic board; a receiving module, used to receive light reflected by the object to be measured, the receiving module comprising a circuit board and a receiving component arranged on one side of the circuit board, the circuit board and the ceramic board are arranged side by side, and the circuit board is electrically connected to the transmitting component; a heat sink, connected to the same side of the ceramic board and the circuit board.

[0005] In the above-mentioned depth camera, by arranging the circuit board and the ceramic board side by side, and the heat sink is connected to the same side of the ceramic board and the circuit board, the heat sink can directly contact the ceramic plate to dissipate heat to the transmitting component, so that the heat generated by the transmitting module can be quickly conducted to the casing of the depth camera, the heat dissipation effect is better, and the depth camera is not easily damaged; and the length of the transmitting module along the optical axis is small, which is conducive to the miniaturization of the depth camera, the size of the circuit board can be reduced, and the cost of the circuit board is reduced.

[0006] In some embodiments, the transmitting module also includes a transmitting pad electrically connected to the transmitting component, and the transmitting pad is arranged on the side of the ceramic board away from the heat sink. The receiving module also includes a receiving pad electrically connected to the circuit board, and the receiving pad is arranged on the side of the circuit board away from the heat sink. The depth camera also includes a conductive member, and the two ends of the conductive member are respectively electrically connected to the transmitting pad and the receiving pad.

[0007] In this way, the transmitting pad and the receiving pad are electrically connected to each other through the two ends of the conductive member, and the transmitting module and the receiving component share a circuit board, which reduces the size of the circuit board and reduces the cost of the circuit board.

[0008] In some embodiments, the transmitting module also includes a transmitting pad electrically connected to the transmitting component, and the transmitting pad is arranged on the side of the ceramic board away from the heat sink. The receiving module also includes a receiving pad electrically connected to the circuit board, and the receiving pad is arranged on a side of the circuit board close to the ceramic board. The depth camera also includes a conductive member, and the two ends of the conductive member are respectively electrically connected to the transmitting pad and the receiving pad.

[0009] In this way, the transmitting pad and the receiving pad are electrically connected to each other through the two ends of the conductive member, and the transmitting module and the receiving component share a circuit board, which reduces the size of the circuit board and reduces the cost of the circuit board.

[0010] In some embodiments, the transmitting module also includes a transmitting pad electrically connected to the transmitting component, and the transmitting pad is arranged on a side of the ceramic board close to the circuit board. The receiving module also includes a receiving pad electrically connected to the circuit board, and the receiving pad is arranged on a side of the circuit board away from the heat sink. The depth camera also includes a conductive member, and both ends of the conductive member are electrically connected to the transmitting pad and the receiving pad respectively.

[0011] In this way, the transmitting pad and the receiving pad are electrically connected to each other through the two ends of the conductive member, and the transmitting module and the receiving component share a circuit board, which reduces the size of the circuit board and reduces the cost of the circuit board.

[0012] In some embodiments, the conductive member is a connecting pad, a gold wire or a transfer wire.

[0013] In this way, the transmitting pad and the receiving pad are electrically connected through the two ends of the connecting pad, gold wire or adapter wire, so the conduction stability is better, and the transmitting module and the receiving component share a circuit board, which reduces the size of the circuit board and reduces the cost of the circuit board.

[0014] In some embodiments, the depth camera further includes an insulating filler, a gap is provided between the circuit board and the ceramic board, and the insulating filler is disposed in the gap.

[0015] In this way, the insulating filler can isolate the circuit board and the ceramic board, and can also support the connecting pads, gold wires or transfer wires.

[0016] In some embodiments, the transmitting module also includes a transmitting pad electrically connected to the transmitting component, and the transmitting pad is arranged on a side of the ceramic board close to the circuit board. The receiving module also includes a receiving pad electrically connected to the circuit board, and the receiving pad is arranged on a side of the circuit board close to the ceramic board. The depth camera also includes a welding part, and both ends of the welding part are respectively electrically connected to the transmitting pad and the receiving pad.

[0017] In this way, the transmitting pad and the receiving pad are electrically connected through the two ends of the welding part, the conduction stability is good, and the transmitting module and the receiving component share a circuit board, which reduces the size of the circuit board and reduces the cost of the circuit board.

[0018] In some embodiments, a through groove is provided on one side of the circuit board and / or the ceramic board close to each other, and the transmitting pad and / or the receiving pad is correspondingly arranged in the through groove.

[0019] In this way, the size of the transmitting component and the receiving component can be reduced, which is conducive to the miniaturization of the depth camera.

[0020] In some embodiments, the ceramic board has an adjacent first side and a second side, the circuit board has an adjacent third side and a fourth side, the first side and the third side are arranged opposite to each other and abut against each other, the second side and the fourth side are arranged opposite to each other and there is a gap between them, and the circuit board is electrically connected to the transmitting component at the second side and the fourth side.

[0021] In this way, the size of the transmitting component and the receiving component can be reduced, which is conducive to the miniaturization of the depth camera.

[0022] An embodiment of the present application further provides an electronic device, comprising a main body and the depth camera as described above, wherein the depth camera is disposed in the main body.

[0023] The above-mentioned electronic device includes a depth camera. By arranging the circuit board and the ceramic board side by side, and connecting the heat sink to the same side of the ceramic board and the circuit board, the heat sink can directly contact the ceramic board to dissipate heat from the transmitting component, so that the heat generated by the transmitting module can be quickly conducted to the casing of the depth camera, the heat dissipation effect is better, and the depth camera is not easily damaged; and the length of the transmitting module along the optical axis is small, which is conducive to the miniaturization of the depth camera, the size of the circuit board is reduced, and the cost of the circuit board is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the electronic device proposed in the first embodiment of the present application.

[0025] Figure 2 yes Figure 1 The schematic diagram of the partial structural cross-section of the electronic device shown is along the AA line.

[0026] Figure 3 yes Figure 1 A top view of a depth camera in an electronic device is shown.

[0027] Figure 4 It is a schematic cross-sectional diagram of a portion of the structure of an electronic device proposed in the second embodiment of the present application.

[0028] Figure 5 1 is a top view of a depth camera in an electronic device according to a second embodiment of the present application.

[0029] Figure 6 It is a schematic cross-sectional diagram of a portion of the structure of an electronic device proposed in the third embodiment of the present application.

[0030] Figure 7 This is a top view of a depth camera in an electronic device proposed in the third embodiment of the present application.

[0031] Figure 8 This is a top view of a depth camera in an electronic device proposed in the fourth embodiment of the present application.

[0032] Fig. 9 This is a top view of a depth camera in an electronic device proposed in the fifth embodiment of the present application.

[0033] Fig.10 This is a top view of a depth camera in an electronic device proposed in the sixth embodiment of the present application.

[0034] Main component symbols

[0035] Electronic devices 100

[0036] Body 10

[0037] Depth Camera 20

[0038] Transmitter module 21

[0039] Ceramic plate 211

[0040] First side 2111

[0041] Second side 2112

[0042] Transmitter Component 212

[0043] Bracket 2121

[0044] Accommodation chamber 2121A

[0045] Transmitter port 2121B

[0046] Transmitter 2122

[0047] Emitting pad 213

[0048] Receiving module 22

[0049] Circuit board 221

[0050] Through slot 2211

[0051] Gap 2212

[0052] The third side 2213

[0053] Fourth side 2214

[0054] Receiving component 222

[0055] Base 2221

[0056] Through hole 2221A

[0057] Photosensitive chip 2222

[0058] Lens 2223

[0059] Filter 2224

[0060] Receiving pad 223

[0061] Heat sink 23

[0062] Welding part 24

[0063] Conductive parts 25

[0064] Insulation filler 26 DETAILED DESCRIPTION

[0065] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0066] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0067] See also Figure 1 The first embodiment of the present application provides an electronic device 100, including a body 10 and a depth camera 20. The depth camera 20 is disposed in the body 10 and is used to obtain a depth image. The depth camera 20 may be a TOF camera or a structured light camera. The electronic device 100 may be a tablet computer, an electronic paper book, an MP3 / 4 / 5, a personal digital assistant, a camera, a television, a washing machine, a refrigerator, etc.

[0068] See also Figure 2 and Figure 3The depth camera 20 includes a transmitting module 21, a receiving module 22 and a heat sink 23. The transmitting module 21 is used to transmit light toward the object to be measured, and the transmitting module 21 includes a ceramic plate 211 and a transmitting component 212 arranged on one side of the ceramic plate 211. The receiving module 22 is used to receive light reflected by the object to be measured, and the receiving module 22 includes a circuit board 221 and a receiving component 222 arranged on one side of the circuit board 221. The circuit board 221 and the ceramic board 211 are arranged side by side, and the circuit board 221 is electrically connected to the transmitting component 212. The heat sink 23 is connected to the same side of the ceramic board 211 and the circuit board 221.

[0069] In the above-mentioned depth camera 20, by arranging the circuit board 221 and the ceramic board 211 side by side, and the heat sink 23 is connected to the same side of the ceramic board 211 and the circuit board 221, the heat sink 23 can directly contact the ceramic board 211 to dissipate heat to the transmitting component 212, so that the heat generated by the transmitting module 21 can be quickly conducted to the casing of the depth camera 20, the heat dissipation effect is better, and the depth camera 20 is not easily damaged; and the length of the transmitting module 21 along the optical axis direction is small, which is conducive to the miniaturization of the depth camera 20, the size of the circuit board 221 is reduced, and the cost of the circuit board 221 is reduced.

[0070] In this embodiment, the circuit board 221 and the ceramic board 211 are bonded to the heat sink 23 by conductive adhesive and heat dissipation adhesive, and a plurality of electronic components, such as resistors and capacitors, are also arranged on the circuit board 221 and the ceramic board 211. The heat sink 23 is a steel sheet, a copper alloy plate, or the like.

[0071] In some embodiments, the transmitting module 21 also includes a transmitting pad 213 electrically connected to the transmitting component 212, and the transmitting pad 213 is arranged on a side of the ceramic board 211 close to the circuit board 221, and the receiving module 22 also includes a receiving pad 223 electrically connected to the circuit board 221, and the receiving pad 223 is arranged on a side of the circuit board 221 close to the ceramic board 211, and the depth camera 20 also includes a welding portion 24, and the two ends of the welding portion 24 are respectively electrically connected to the transmitting pad 213 and the receiving pad 223. In this way, the two ends of the welding portion 24 are electrically connected to the transmitting pad 213 and the receiving pad 223, respectively, and the conduction stability of the circuit board 221 and the ceramic board 211 is good, and the transmitting module 21 and the receiving component 222 share a circuit board 221, which reduces the size of the circuit board 221 and reduces the cost of the circuit board 221.

[0072] In this embodiment, there are four transmitting pads 213 and four receiving pads 223. The material of the welding part 24 is metal, such as tin, but not limited thereto. It can be understood that in other embodiments, the welding part 24 is conductive glue.

[0073] In some embodiments, a through slot 2211 is provided on one side of the circuit board 221 close to the ceramic board 211, and the receiving pad 223 is correspondingly provided in the through slot 2211. In this way, the size of the transmitting component 212 and the receiving component 222 can be reduced, which is conducive to the miniaturization of the depth camera 20.

[0074] It can be understood that in other embodiments, a through slot 2211 is provided on one side of the ceramic board 211 close to the circuit board 221 , and the emitting pad 213 is disposed in the through slot 2211 .

[0075] It can be understood that in other embodiments, a through slot 2211 is provided on one side of the circuit board 221 and the ceramic board 211 that are close to each other, and the transmitting pad 213 and the receiving pad 223 are correspondingly provided in the through slot 2211 .

[0076] Among them, the method for setting the receiving pad 223 on the side of the circuit board 221 close to the ceramic board 211 is: first, a hole is opened on the side of the circuit board 221 close to the ceramic board 211, and then copper is plated in the hole, and then nickel-palladium-gold treatment is performed on the copper surface, and finally a through groove 2211 is cut from the opening, and the structure formed on the groove wall of the through groove 2211 is the receiving pad 223.

[0077] In some embodiments, the transmitting pad 213 and the receiving pad 223 are arranged relative to each other. In this way, the circuit board 221 and the ceramic board 211 can be abutted together, reducing the use volume of the transmitting module 21 and the receiving module 22, which is conducive to miniaturization of the depth camera 20. In addition, the transmitting pad 213 and the receiving pad 223 are arranged relative to each other, which can make the welding operation easier.

[0078] In some embodiments, the transmitting assembly 212 includes a bracket 2121 and a transmitter 2122. The bracket 2121 is arranged on the side of the ceramic plate 211 away from the heat sink 23, and the bracket 2121 is provided with a receiving cavity 2121A and a transmitting port 2121B connected to the receiving cavity 2121A. The transmitter 2122 is arranged on the ceramic plate 211 and is located in the receiving cavity 2121A. The transmitter 2122 is electrically connected to the circuit board 221, and the transmitter 2122 is directly opposite to the transmitting port 2121B so that the light emitted by the transmitter 2122 passes through the transmitting port 2121B to reach the object to be measured. In this way, the bracket 2121 can form a protection for the transmitter 2122, and the light emitted by the transmitter 2122 can pass through the transmitting port 2121B of the bracket 2121 to reach the object to be measured to obtain a depth image of the object to be measured. In this embodiment, the transmitter 2122 is a vertical cavity surface emitting laser (VCSEL).

[0079] In some embodiments, the receiving module 22 includes a base 2221, a photosensitive chip 2222, a lens 2223 and a filter 2224. The base 2221 is arranged on the side of the circuit board 221 away from the heat sink 23. A through hole 2221A is opened on the base 2221. The photosensitive chip 2222 is arranged on the side of the circuit board 221 away from the heat sink 23 and is located in the through hole 2221A. The photosensitive chip 2222 is electrically connected to the circuit board 221. The lens 2223 is arranged in the through hole 2221A of the base 2221 so that the light reflected by the object to be measured enters the through hole 2221A and reaches the photosensitive chip 2222. The filter 2224 is arranged in the through hole 2221A of the base 2221 and is located between the lens 2223 and the photosensitive chip 2222, and is used to filter the light entering the through hole 2221A. In this way, the light reflected by the object to be measured can enter the through hole 2221A, and reach the photosensitive chip 2222 after being processed by the lens 2223 and the filter element, thereby obtaining a depth image. In this embodiment, the filter element 2224 is a filter.

[0080] Please also see Figure 4 and Figure 5 The second embodiment of the present application provides an electronic device which is similar to the electronic device 100 in the first embodiment, except that: the depth camera 20 also includes a conductive member 25, the conductive member 25 is a gold wire, the transmitting pad 213 is arranged on the side of the ceramic board 211 away from the heat sink 23, the receiving pad 223 is arranged on the side of the circuit board 221 away from the heat sink 23, and the two ends of the conductive member 25 are electrically connected to the transmitting pad 213 and the receiving pad 223 respectively.

[0081] Please also see Figure 6 and Figure 7 The third embodiment of the present application provides an electronic device that is similar to the electronic device 100 in the first embodiment, except that the depth camera 20 also includes a conductive member 25, which is a transfer line. It can be understood that in other embodiments, the conductive member 25 can also be a connecting pad. The transmitting pad 213 is arranged on the side of the ceramic board 211 away from the heat sink 23, and the receiving pad 223 is arranged on the side of the circuit board 221 away from the heat sink 23. The two ends of the conductive member 25 are electrically connected to the transmitting pad 213 and the receiving pad 223 respectively. In this embodiment, the two ends of the transfer line are fixedly connected to the transmitting pad 213 and the receiving pad 223 by hot pressing. There are five transmitting pads 213 and five receiving pads 223. The transmitting pads 213 and the receiving pads 223 are made of metal, such as copper.

[0082] In this way, the transmitting pad 213 and the receiving pad 223 are electrically connected respectively by connecting the two ends of the pad, gold wire or adapter wire, and the conduction stability of the circuit board 221 and the ceramic board 211 is better, and the transmitting module 21 and the receiving component 222 share a circuit board 221, which reduces the size of the circuit board 221 and reduces the cost of the circuit board 221.

[0083] Please continue to see Figure 6 The depth camera 20 further includes an insulating filler 26. A gap 2212 is provided between the circuit board 221 and the ceramic board 211. The insulating filler 26 is disposed in the gap. In this embodiment, the insulating filler 26 is made of an insulating material.

[0084] In this way, the insulating filler 26 can isolate the circuit board 221 and the ceramic board 211, and can also support the connection pads, gold wires or adapter wires. When the number of connection pads, gold wires or adapter wires is large, the insulating filler 26 can also extend between adjacent connection pads, gold wires or adapter wires to isolate and prevent short circuits.

[0085] See also Figure 8 , the depth camera in the electronic device proposed in the fourth embodiment of the present application is similar to the electronic device 100 in the first embodiment, except that: the transmitting module 21 also includes a transmitting pad 213 electrically connected to the transmitting component 212, and the transmitting pad 213 is arranged on the side of the ceramic board 211 away from the heat sink 23, the receiving module 22 also includes a receiving pad 223 electrically connected to the circuit board 221, and the receiving pad 223 is arranged on the side of the circuit board 221 close to the ceramic board 211, and the depth camera 20 also includes a conductive member 25, the conductive member 25 is a gold wire, and the two ends of the conductive member 25 are respectively electrically connected to the transmitting pad 213 and the receiving pad 223. In this way, the transmitting pad 213 and the receiving pad 223 are electrically connected by the two ends of the conductive member 25, and the transmitting module 21 and the receiving component 222 share a circuit board 221, which reduces the size of the circuit board 221 and reduces the cost of the circuit board 221.

[0086] See also Fig. 9The depth camera in the electronic device proposed in the fifth embodiment of the present application is similar to the electronic device 100 in the first embodiment, except that: the transmitting module 21 also includes a transmitting pad 213 electrically connected to the transmitting component 212, and the transmitting pad 213 is arranged on the side of the ceramic board 211 close to the circuit board 221, and the receiving module 22 also includes a receiving pad 223 electrically connected to the circuit board 221, and the receiving pad 223 is arranged on the side of the circuit board 221 away from the heat sink 23, and the depth camera 20 also includes a conductive member 25, and the conductive member 25 is a gold wire, and the two ends of the conductive member 25 are respectively electrically connected to the transmitting pad 213 and the receiving pad 223. In this way, the transmitting pad 213 and the receiving pad 223 are electrically connected by the two ends of the conductive member 25, and the transmitting module 21 and the receiving component 222 share a circuit board 221, which reduces the size of the circuit board 221 and reduces the cost of the circuit board 221.

[0087] See also Fig.10 The depth camera in the electronic device proposed in the sixth embodiment of the present application is similar to the electronic device 100 in the second embodiment, except that: the ceramic board 211 has an adjacent first side 2111 and a second side 2112, the circuit board 221 is an L-shaped structure, the circuit board 221 has an adjacent third side 2213 and a fourth side 2214, the first side 2111 and the third side 2213 are arranged oppositely and abut each other, the second side 2112 and the fourth side 2214 are arranged oppositely and spaced apart, and the circuit board 221 is electrically connected to the transmitting component 212 at the second side 2112 and the fourth side 2214. In this way, the size of the transmitting component 212 and the receiving component 222 can be reduced, which is conducive to the miniaturization of the depth camera 20.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A depth camera, characterized in that: include: An emission module, used for emitting light toward the object to be measured, the emission module comprising a ceramic plate and an emission component arranged on one side of the ceramic plate; A receiving module, used for receiving light reflected by the object to be measured, the receiving module comprising a circuit board and a receiving component arranged on one side of the circuit board, the circuit board and the ceramic board are arranged side by side, and the circuit board is electrically connected to the transmitting component; A heat sink is connected to the same side of the ceramic board and the circuit board.

2. The depth camera according to claim 1, wherein: The transmitting module also includes a transmitting pad electrically connected to the transmitting component, and the transmitting pad is arranged on the side of the ceramic plate away from the heat sink. The receiving module also includes a receiving pad electrically connected to the circuit board, and the receiving pad is arranged on the side of the circuit board away from the heat sink. The depth camera also includes a conductive member, and two ends of the conductive member are respectively electrically connected to the transmitting pad and the receiving pad.

3. The depth camera according to claim 1, wherein: The transmitting module also includes a transmitting pad electrically connected to the transmitting component, and the transmitting pad is arranged on the side of the ceramic board away from the heat sink. The receiving module also includes a receiving pad electrically connected to the circuit board, and the receiving pad is arranged on a side of the circuit board close to the ceramic board. The depth camera also includes a conductive member, and both ends of the conductive member are electrically connected to the transmitting pad and the receiving pad respectively.

4. The depth camera according to claim 1, wherein: The transmitting module also includes a transmitting pad electrically connected to the transmitting component, and the transmitting pad is arranged on a side of the ceramic board close to the circuit board. The receiving module also includes a receiving pad electrically connected to the circuit board, and the receiving pad is arranged on a side of the circuit board away from the heat sink. The depth camera also includes a conductive member, and two ends of the conductive member are respectively electrically connected to the transmitting pad and the receiving pad.

5. The depth camera according to any one of claims 2 to 4, characterized in that: The conductive component is a connecting pad, a gold wire or a transfer wire.

6. The depth camera according to any one of claims 2 to 4, characterized in that: The depth camera further includes an insulating filler, a gap is provided between the circuit board and the ceramic board, and the insulating filler is arranged in the gap.

7. The depth camera according to claim 1, wherein: The transmitting module also includes a transmitting pad electrically connected to the transmitting component, and the transmitting pad is arranged on a side of the ceramic board close to the circuit board. The receiving module also includes a receiving pad electrically connected to the circuit board, and the receiving pad is arranged on a side of the circuit board close to the ceramic board. The depth camera also includes a welding part, and two ends of the welding part are respectively electrically connected to the transmitting pad and the receiving pad.

8. The depth camera according to claim 7, wherein: A through slot is provided on one side of the circuit board and / or the ceramic board that is close to each other, and the transmitting pad and / or the receiving pad is correspondingly arranged in the through slot.

9. The depth camera according to claim 1, wherein: The ceramic board has an adjacent first side and a second side, the circuit board has an adjacent third side and a fourth side, the first side and the third side are arranged opposite to each other and abut against each other, the second side and the fourth side are arranged opposite to each other and there is a gap, and the circuit board is electrically connected to the transmitting component at the second side and the fourth side.

10. An electronic device, characterized in that: It comprises a main body and a depth camera as described in any one of claims 1 to 9, wherein the depth camera is arranged in the main body.

Images