Welding assembly for integrated circuit packaging

Abstract

The utility model discloses a welding assembly for integrated circuit packaging, and relates to the technical field of integrated circuit processing. The welding cooling device comprises a welding cooling mechanism, a water tank is fixed on the left side of the upper wall of a bottom plate, a pressing block is arranged above metal pins, a guide plate is fixed on the outer side wall in the pressing block, a Y-shaped pipe is fixed above the guide plate and corresponds to the rear wall of the pressing block, a water pump is fixed at the rear end of the Y-shaped pipe and corresponds to the upper wall of the bottom plate, and a connecting pipe is fixed at the water inlet end of the water pump. And a three-way pipe is fixed below the guide plate and corresponds to the outer side wall of the pressing block. The cooling liquid is driven to flow through the water pump, rapid cooling is conducted in a water-cooling heat dissipation mode so as to improve the heat dissipation effect, harmful gas is purified through cooperation of the draught fan and the activated carbon filter plate, and the problems that in the prior art, natural heat dissipation is adopted, heat conduction is slow, heat dissipation efficiency is still low, and heat dissipation efficiency is poor are solved. And in addition, the problem that in the prior art, generated harmful gas cannot be purified during welding, and consequently the operation environment is polluted is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit processing, in particular to a welding assembly for integrated circuit packaging. Background Art

[0002] An integrated circuit is a circuit that integrates many electronic components (such as transistors, capacitors, resistors, etc.) on a semiconductor chip. It is widely used in various electronic devices and systems, such as computers, mobile phones, televisions, automobiles, medical equipment, etc. In order to protect the chip, isolate and bond, conduct heat and dissipate heat, the integrated circuit needs to be packaged. Currently, when packaging the integrated circuit, welding components are sometimes used to weld the metal pins and wires.

[0003] After searching, the authorization announcement number CN210607204U and the authorization announcement date 2020.05.22 disclose a welding assembly for integrated circuit packaging, including an operating area, a heating block is arranged in the operating area, and metal pins and wires are arranged on the heating block, and a partitioned heat-conducting pressure block is arranged on the metal pin, and a heat dissipation block is connected to one side of the partitioned heat-conducting pressure block. This welding assembly for integrated circuit packaging arranges multiple groups of heat-conducting columns in the partitioned heat-conducting pressure block, and a heat-conducting plate is arranged on the top of the heat-conducting column. The heat is extracted from the metal pin through the heat-conducting column, and is guided to the heat dissipation block by the heat-conducting block. The heat dissipation block is provided with a groove and a heat dissipation hole structure to increase the contact area with the air to achieve the purpose of rapid heat dissipation, thereby making the heat dissipation after welding faster and achieving the purpose of shortening the processing time.

[0004] The prior art achieves the purpose of heat dissipation through the combined action of heat-conducting columns, heat-dissipating blocks and heat-conducting plates. However, the prior art adopts natural heat dissipation, and the heat conduction is slow, and the heat dissipation efficiency is still low. In addition, the prior art cannot purify the harmful gases generated during welding, resulting in pollution of the operating environment. Therefore, we provide a welding assembly for integrated circuit packaging to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a welding assembly for integrated circuit packaging, which uses a water pump to drive the flow of coolant to quickly cool down by water cooling to improve the heat dissipation effect, and purifies harmful gases by the cooperation of a fan and an activated carbon filter plate, thereby solving the problem that the prior art uses natural heat dissipation, the heat conduction is slow, the heat dissipation efficiency is still low, and the prior art cannot purify the harmful gases generated during welding, resulting in pollution of the operating environment.

[0006] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0007] The utility model discloses a welding assembly for integrated circuit packaging, comprising a welding cooling mechanism, wherein the welding cooling mechanism comprises a heating block, wherein the upper wall of the heating block is provided with a wire, metal pins are provided below both ends of the wire, a bottom plate is fixed to the lower wall of the heating block, a water tank is fixed to the left side of the upper wall of the bottom plate, a pressing block is provided above the metal pin, a guide plate is fixed to the outer side wall inside the pressing block, a Y-shaped tube is fixed above the guide plate corresponding to the rear wall of the pressing block, a water pump is fixed at the rear end of the Y-shaped tube corresponding to the upper wall of the bottom plate, a connecting pipe is fixed to the water inlet end of the water pump, and the outer end of the connecting pipe is fixedly connected to the water tank, a three-way pipe is fixed below the guide plate corresponding to the outer side wall of the pressing block, and the rear end of the three-way pipe is fixedly connected to the water tank;

[0008] A purification mechanism is arranged behind the heating block, and the purification mechanism includes an installation box, an activated carbon filter plate is arranged inside the installation box, a fan is fixed on the front side above the installation box, air ducts are fixed to the air inlet and outlet ends of the fan, and the other end of the air duct at the air outlet end of the fan is fixedly connected to the upper wall of the installation box.

[0009] The utility model is further configured that the front and rear side walls of the pressing block are both fixed with protrusions, the outside of the protrusions is provided with vertical plates, and the vertical plates are fixedly connected to the bottom plate.

[0010] The utility model is further configured that an elastic member is fixed to the outer side of the lower wall of the pressing block, and the lower end of the elastic member is fixedly connected to the bottom plate.

[0011] The utility model is further configured that a heat insulation board is provided on the upper wall of the metal pin, and the heat insulation board is fixedly connected to the pressing block, and rectangular grooves are equidistantly provided on the heat insulation board.

[0012] The utility model is further configured such that a fan is fixed to the upper wall inside the water tank, an air inlet is opened at the position of the fan corresponding to the upper wall of the water tank, and dust filter cotton is fixed on the water tank corresponding to the upper side of the air inlet.

[0013] The utility model is further configured such that filter cotton is fixed to the left wall and the right wall on the upper side of the water tank, and an air outlet slot is opened on the water tank corresponding to the position of the filter cotton.

[0014] The utility model is further configured such that a mounting plate is fixed to the front wall of the mounting box, a collecting hood is fixed to the front wall of the mounting plate, and the front end of the air duct at the air inlet end of the fan is fixedly connected to the collecting hood.

[0015] The utility model is further configured as follows: a reinforcing plate is fixed at the corner of the mounting box and the mounting plate, a side plate is fixed to the mounting box corresponding to the rear of the activated carbon filter plate by bolts, an air outlet is opened on the lower wall of the mounting box, connecting plates are fixed on the front and rear sides of the lower wall of the mounting box, and the lower end of the connecting plate is fixedly connected to the bottom plate.

[0016] The utility model has the following beneficial effects:

[0017] 1. The utility model sets a water tank, a water pump, a briquette, a Y-shaped pipe, a tee pipe and a connecting pipe, and uses a water pump to circulate cooling water in the briquette, the water tank, the Y-shaped pipe, the tee pipe and the connecting pipe. When the cooling water flows into the inside of the briquette, it takes away the heat on the surface of the briquette, so as to achieve the purpose of improving the heat dissipation efficiency by water cooling, and solves the problem that the existing technology adopts natural heat dissipation, the heat conduction is slow, and the heat dissipation efficiency is still low.

[0018] 2. The utility model sets a fan and an activated carbon filter plate, and uses the fan to transport the harmful gas generated during welding into the installation box, so that the activated carbon filter plate filters and purifies the harmful substances in the harmful gas, thereby preventing the harmful gas generated during welding from polluting the operating environment. This solves the problem that the prior art cannot purify the harmful gas generated during welding, resulting in pollution of the operating environment.

[0019] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 The figure is an overall structural diagram of a welding assembly for integrated circuit packaging.

[0022] Figure 2 This is the structural diagram of the welding cooling mechanism.

[0023] Figure 3 It is a vertical cross-sectional structural diagram of the welding cooling mechanism.

[0024] Figure 4 This is an exploded view of the pressure block and the insulation board.

[0025] Figure 5 This is the exploded structure diagram of the water tank.

[0026] Figure 6 An exploded view of part of the purification mechanism.

[0027] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0028] 1-welding cooling mechanism, 101-water tank, 1011-dust filter cotton, 1012-filter cotton, 1013-tee pipe, 1014-air inlet, 1015-fan, 1016-air outlet, 102-pressing block, 1021-protrusion, 1022-guide plate, 103-water pump, 1031-Y-shaped pipe, 1032-connecting pipe, 104-wire, 105-bottom plate, 1051-vertical Plate, 1052-elastic part, 106-heating block, 1061-metal pin, 107-heat insulation board, 1071-rectangular groove, 2-purification mechanism, 201-fan, 2011-air duct, 202-installation box, 2021-installation plate, 2022-air outlet, 2023-connecting plate, 2024-side plate, 2025-reinforcement plate, 203-collection cover, 204-activated carbon filter plate. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Specific embodiment 1

[0031] See also Figure 1-5The utility model is a welding assembly for integrated circuit packaging, including a welding cooling mechanism 1, the welding cooling mechanism 1 includes a heating block 106, the upper wall of the heating block 106 is provided with a wire 104, and metal pins 1061 are provided below both ends of the wire 104, and the lower wall of the heating block 106 is fixed with a bottom plate 105, and the bottom plate 105 can be fixed to the installation platform by bolts, and a water tank 101 is fixed on the left side of the upper wall of the bottom plate 105 for storing cooling water, and a pressing block 102 is provided above the metal pin 1061 for pressing the metal pin 1061 and cooling the metal pin 1061, and the pressing block 102 is a heat-conducting material, and a guide plate 1022 is fixed to the outer side wall of the inner part of the pressing block 102, and the inner end of the guide plate 1022 is connected to the inner end of the pressing block 102 The side wall has a notch, so that the cooling water flows from the upper side of the guide plate 1022 to the notch to the lower side of the guide plate 1022, a Y-shaped tube 1031 is fixed to the rear wall of the pressing block 102 above the guide plate 1022, and a water pump 103 is fixed to the upper wall of the bottom plate 105 at the rear end of the Y-shaped tube 1031 for conveying cooling water, a connecting pipe 1032 is fixed to the water inlet end of the water pump 103, and the outer end of the connecting pipe 1032 is fixedly connected to the water tank 101, a three-way pipe 1013 is fixed to the outer side wall of the pressing block 102 below the guide plate 102, and the rear end of the three-way pipe 1013 is fixedly connected to the water tank 101, and the cooling water is conveyed to the pressing block 102 by the water pump 103 to absorb heat to achieve water-cooled heat dissipation, thereby achieving the purpose of improving the heat dissipation efficiency.

[0032] Specifically, protrusions 1021 are fixed to the front and rear side walls of the pressing block 102 . The protrusions 1021 are circular and can rotate relative to the corresponding vertical plates 1051 . The vertical plates 1051 are arranged outside the protrusions 1021 and are fixedly connected to the bottom plate 105 .

[0033] An elastic member 1052 is fixed to the outer side of the lower wall of the pressing block 102, and the lower end of the elastic member 1052 is fixedly connected to the bottom plate 105. The elastic member 1052 provides an upward force for the corresponding pressing block 102, so that the inner side of the pressing block 102 presses the corresponding metal pin 1061. By pressing the upper wall on the outer side of the pressing block 102, the pressing block 102 loses the pressure on the metal pin 1061, and the metal pin 1061 can be removed.

[0034] The upper wall of the metal pin 1061 is provided with a heat insulation board 107, and the heat insulation board 107 is fixedly connected to the pressing block 102. The heat insulation board 107 can prevent the rapid loss of heat during welding. Rectangular grooves 1071 are equidistantly provided on the heat insulation board 107. When heat is dissipated, the heat contacts the pressing block 102 through the rectangular grooves 1071.

[0035] A fan 1015 is fixed to the upper wall inside the water tank 101, which is used to generate airflow to act on the cooling water inside the water tank 101 for heat dissipation. An air inlet hole 1014 is opened on the upper wall of the water tank 101 corresponding to the position of the fan 1015. The external air enters the water tank 101 through the air inlet hole 1014. A dust filter cotton 1011 is fixed on the water tank 101 above the air inlet hole 1014 for dust filtering.

[0036] Filter cotton 1012 is fixed to the left wall and the right wall on the upper side of the water tank 101 for dust filtering. An air outlet slot 1016 is opened on the water tank 101 corresponding to the position of the filter cotton 1012 for discharging the airflow in the water tank 101.

[0037] The operation process of this embodiment is: after welding the metal pin 1061 and the wire 104, the water pump 103 is started, and the water pump 103 transports the cooling water in the water tank 101. Under the operation of the water pump 103, the coolant passes through the connecting pipe 1032, the Y-shaped pipe 1031, and the pressing block 102 and absorbs the heat on the surface of the pressing block 102 and passes through the three-way pipe 1013 into the water tank 101 for internal circulation and heat dissipation. When the metal pin 1061 needs to be removed, the metal pin 1061 can be removed by pressing the outer side of the upper wall of the pressing block 102. Specific embodiment 2

[0039] See also Figure 1 and 6 , which is the second embodiment of the utility model. This embodiment is based on the previous embodiment, but is different from the first embodiment in that: a purification mechanism 2 is arranged at the rear of the heating block 106, and the purification mechanism 2 includes a mounting box 202. The rear wall of the mounting box 202 is open to facilitate the disassembly and assembly of the activated carbon filter plate 204. The interior of the mounting box 202 is provided with an activated carbon filter plate 204 for filtering and purifying harmful gases. A fan 201 is fixed to the front side above the mounting box 202 for conveying harmful gases into the mounting box 202. Air ducts 2011 are fixed to the air inlet and outlet ends of the fan 201, and the other end of the air duct 2011 at the air outlet end of the fan 201 is fixedly connected to the upper wall of the mounting box 202. The harmful gases pass through the activated carbon filter plate 204 through the fan 201, and the activated carbon filter plate 204 is used to purify the harmful gases, so as to achieve the purpose of preventing harmful gases from polluting the operating environment.

[0040] Specifically, a mounting plate 2021 is fixed to the front wall of the mounting box 202. The front side of the mounting plate 2021 is tilted so that the collecting hood 203 faces the welding position. The collecting hood 203 is fixed to the front wall of the mounting plate 2021. The front end of the air duct 2011 at the air inlet end of the fan 201 is fixedly connected to the collecting hood 203.

[0041] A reinforcing plate 2025 is fixed at the corner of the mounting box 202 and the mounting plate 2021 to enhance the stability between the mounting plate 2021 and the mounting box 202. A side plate 2024 is fixed to the mounting box 202 corresponding to the rear of the activated carbon filter plate 204 by bolts. The activated carbon filter plate 204 can be replaced by removing the side plate 2024. An air outlet 2022 is provided on the lower wall of the mounting box 202. The filtered gas is discharged to the outside of the mounting box 202 through the air outlet 2022. Connecting plates 2023 are fixed to the front and rear sides of the lower wall of the mounting box 202, and the lower end of the connecting plate 2023 is fixedly connected to the bottom plate 105.

[0042] The rest of the structure is the same as that of the first embodiment.

[0043] The operation process of this embodiment is as follows: during welding, the fan 201 works to allow harmful gases to pass through the collection cover 203 and enter the installation box 202, and the harmful gases are filtered under the action of the activated carbon filter plate 204, and the filtered gases are discharged to the external environment through the air outlet.

[0044] In addition, the electrical appliances in the welding assembly for integrated circuit packaging are all electrically connected to the external power supply through conductive wires. At the same time, the electrical appliances in the welding assembly for integrated circuit packaging are all existing technologies and their models are not limited here.

[0045] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0046] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A welding assembly for integrated circuit packaging, comprising a welding cooling mechanism (1), the welding cooling mechanism (1) comprising a heating block (106), a wire (104) being arranged on the upper wall of the heating block (106), and metal pins (1061) being arranged below both ends of the wire (104), characterized in that: A bottom plate (105) is fixed to the lower wall of the heating block (106); a water tank (101) is fixed to the left side of the upper wall of the bottom plate (105); a pressing block (102) is arranged above the metal pin (1061); a guide plate (1022) is fixed to the outer side wall inside the pressing block (102); a Y-shaped tube (1031) is fixed above the guide plate (1022) and corresponds to the rear wall of the pressing block (102); the Y-shaped tube (1031) A water pump (103) is fixed at the rear end corresponding to the upper wall of the bottom plate (105), a connecting pipe (1032) is fixed at the water inlet end of the water pump (103), and the outer end of the connecting pipe (1032) is fixedly connected to the water tank (101), and a three-way pipe (1013) is fixed below the guide plate (1022) corresponding to the outer side wall of the pressing block (102), and the rear end of the three-way pipe (1013) is fixedly connected to the water tank (101); A purification mechanism (2) is arranged behind the heating block (106), and the purification mechanism (2) comprises an installation box (202), an activated carbon filter plate (204) is arranged inside the installation box (202), a fan (201) is fixed on the front side above the installation box (202), an air duct (2011) is fixed at both the air inlet and air outlet ends of the fan (201), and the other end of the air duct (2011) at the air outlet end of the fan (201) is fixedly connected to the upper wall of the installation box (202).

2. The soldering assembly for integrated circuit packaging according to claim 1, characterized in that: The front and rear side walls of the pressing block (102) are both fixed with protrusions (1021), and a vertical plate (1051) is arranged outside the protrusion (1021), and the vertical plate (1051) is fixedly connected to the bottom plate (105).

3. The soldering assembly for integrated circuit packaging according to claim 2, characterized in that: An elastic member (1052) is fixed to the outer side of the lower wall of the pressing block (102), and the lower end of the elastic member (1052) is fixedly connected to the bottom plate (105).

4. The soldering assembly for integrated circuit packaging according to claim 1, characterized in that: The upper wall of the metal pin (1061) is provided with a heat insulation board (107), and the heat insulation board (107) is fixedly connected to the pressing block (102), and rectangular grooves (1071) are equidistantly provided on the heat insulation board (107).

5. The soldering assembly for integrated circuit packaging according to claim 1, characterized in that: A fan (1015) is fixed to the upper wall inside the water tank (101), an air inlet hole (1014) is provided at the position where the fan (1015) is located, corresponding to the upper wall of the water tank (101), and a dust filter cotton (1011) is fixed on the water tank (101) above the air inlet hole (1014).

6. The soldering assembly for integrated circuit packaging according to claim 5, characterized in that: Filter cotton (1012) is fixed to the left wall and the right wall on the upper side of the water tank (101), and an air outlet slot (1016) is provided on the water tank (101) corresponding to the position where the filter cotton (1012) is located.

7. The soldering assembly for integrated circuit packaging according to claim 1, characterized in that: A mounting plate (2021) is fixed to the front wall of the mounting box (202), a collecting hood (203) is fixed to the front wall of the mounting plate (2021), and a front end of the air duct (2011) at the air inlet end of the fan (201) is fixedly connected to the collecting hood (203).

8. The soldering assembly for integrated circuit packaging according to claim 7, characterized in that: A reinforcing plate (2025) is fixed at the corner between the installation box (202) and the installation plate (2021); a side plate (2024) is fixed to the installation box (202) corresponding to the rear of the activated carbon filter plate (204) by means of bolts; an air outlet hole (2022) is provided on the lower wall of the installation box (202); connecting plates (2023) are fixed to the front and rear sides of the lower wall of the installation box (202); and the lower end of the connecting plate (2023) is fixedly connected to the bottom plate (105).

Images