Electronic device

Abstract

The utility model relates to the technical field of servers, and discloses an electronic device which comprises a machine shell, a main board and a fan set are arranged in the machine shell, the fan set is arranged on one side of the main board, and the electronic device further comprises a first frame installed on the main board; the first wind scooper is mounted on the main board, and the first wind scooper is arranged between the first frame and the fan group and is connected with the first frame; the high-heat electronic component is installed on the main board, the high-heat electronic component is arranged between the first wind scooper and the fan set, the first wind scooper comprises a first baffle, one face of the first baffle faces the high-heat electronic component, the other face of the first baffle faces the first frame, and a plurality of first flow guide openings are formed in the first baffle; the first inclined plate is connected with the first baffle and extends in the direction away from the first baffle, and the included angle formed between the first inclined plate and the first baffle is an obtuse angle. In this way, the heat dissipation effect in the electronic device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of servers, and in particular to an electronic device. Background Art

[0002] In recent years, with the rapid development of technology, the operating speed of electronic devices has been continuously improved. In addition, as the performance of electronic devices has been improved, the heat generation power of electronic components of electronic devices has also been continuously increasing. In order to prevent electronic components from overheating and causing temporary or permanent failure, electronic devices must provide sufficient heat dissipation performance for electronic components.

[0003] As for servers, they must have sufficient stability and reliability to avoid interruptions in the services they provide. Therefore, a heat dissipation guide structure is usually configured inside the server casing to increase the efficiency of heat convection. Generally speaking, a traditional server will have a fan configured on one side of the motherboard, and the airflow blown by the fan will dissipate the heat generated by the electronic components on the motherboard out of the casing, thereby reducing the temperature of the server to avoid system failures caused by overheating of the server and stabilize its operation.

[0004] At present, more and more servers will set a variety of different modules on the same side of the server chassis, such as PCIE card modules, power supply modules, hard disk modules, etc. However, these modules have different requirements for heat dissipation, and the fans installed in the servers on the market now generate airflows that are fixed in the same direction. Once there are multiple modules with different heat dissipation requirements in this airflow direction, it is obvious that the traditional heat dissipation design cannot effectively meet the heat dissipation requirements of different modules. Moreover, according to the design requirements, the location of some modules in the server will change according to different requirements. The traditional air guide cover structure is usually fixedly installed in one position, which is inconvenient to use and disassemble, so it is difficult to adapt to the adjustment after the position of different modules in the server is changed, and the flexibility is poor. Summary of the invention

[0005] The purpose of the utility model is to provide an electronic device.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An electronic device comprises a housing, wherein a mainboard and a fan group are arranged in the housing, wherein the fan group is arranged on one side of the mainboard, and wherein the electronic device further comprises: a first frame mounted on the mainboard; a first air guide cover mounted on the mainboard, wherein the first air guide cover is arranged between the first frame and the fan group and connected to the first frame; and a high-heat electronic component mounted on the mainboard, wherein the high-heat electronic component is arranged between the first air guide cover and the fan group, wherein the first air guide cover comprises: a first baffle plate, wherein one side faces the high-heat electronic component and the other side faces the first frame, wherein the first baffle plate is provided with a plurality of A first air guide port; and a first inclined plate, connected to the first baffle and extending in a direction away from the first baffle, the angle formed between the first inclined plate and the first baffle is an obtuse angle; wherein the first air guide cover is located between the high-temperature electronic components and the first frame, so that a part of the airflow driven by the fan group and passing through the high-temperature electronic components passes through the high-temperature electronic components, flows through the first inclined plate on the first air guide cover to a direction away from the first frame, and another part of the airflow driven by the fan group and not passing through the high-temperature electronic components flows into the first frame through the first air guide port of the first baffle on the first air guide cover.

[0008] Preferably, it also includes a second frame, which is adjacent to the first frame and installed on the main board. The second frame is provided with a second protrusion. A first clip portion is provided on the end of the first inclined plate away from the first baffle. The first clip portion is clipped and installed with the second protrusion to connect the first air guide cover with the second frame.

[0009] Preferably, the first air guide cover also includes a first top plate, the first top plate is covered on the first baffle and the first inclined plate, and a first assembly hole is provided on the first top plate, wherein a first assembly column is provided on the first frame, and the first assembly column is installed to match the first assembly hole to connect the first air guide cover to the first frame.

[0010] Preferably, a first extension plate is provided on the first frame, and the first assembling column is arranged on the first extension plate.

[0011] Preferably, it also includes a third frame and a third air guide cover, the third frame is adjacent to the first frame and is installed on the main board, the third frame is provided with a third assembly column, the third air guide cover is provided with a third top plate, the third assembly column is installed to match a third assembly hole on the third top plate to connect the third air guide cover to the third frame.

[0012] Preferably, a first protrusion is provided on the first frame, a third inclined plate is provided on the third air guide cover, and the first protrusion is matched with a third buckle portion on the third inclined plate to connect the third air guide cover to the first frame.

[0013] Preferably, a third extension plate is provided on the third frame, and the third assembly column is arranged on the third extension plate.

[0014] Preferably, the first frame is used to be combined with an electronic module, and the electronic module includes a power module or a PCIE module or a mainboard module.

[0015] Preferably, a wire placement groove is provided at the top end of the first inclined plate for placing wires inside the housing.

[0016] Preferably, a plurality of component installation openings for adapting to the installation of components on the main board are provided at the bottom of the first inclined plate.

[0017] Compared with the prior art, the beneficial effect of the utility model is that through the above-mentioned setting method, the first air guide cover can effectively guide the heat generated by high-heat electronic components to flow in the direction away from the first frame carrying the important electronic modules, greatly reducing the impact of this part of heat on the important electronic modules. At the same time, it is very convenient to install and disassemble, has a wide range of applications, and well solves the shortcomings existing in the background technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The figure is a diagram of the internal structure of an electronic device, illustrating the connection relationship between a first air guide cover, a first frame and a second frame installed on a mainboard in a housing;

[0019] Figure 2 for Figure 1 Schematic diagram of the structure from another perspective;

[0020] Figure 3 for Figure 1 Schematic diagram of the structure at A in the middle;

[0021] Figure 4 for Figure 1 Schematic diagram of the structure at B in the middle;

[0022] Figure 5 is a structural schematic diagram of a first air guide cover;

[0023] Figure 6 is a structural schematic diagram of the first frame;

[0024] Figure 7The figure is a diagram of the internal structure of an electronic device, illustrating the connection relationship between a first air duct cover, a second air duct cover, a first frame, a second frame and a third frame installed on a mainboard in a housing;

[0025] Figure 8 for Figure 7 Schematic diagram of the structure from another perspective;

[0026] Fig. 9 for Figure 7 Schematic diagram of the structure at C in the middle;

[0027] Fig.10 for Figure 7 Schematic diagram of the structure at point D in the middle.

[0028] Description of the numbers in the figure:

[0029] 1. The first air guide cover;

[0030] 101, a first baffle; 1011, a first guide port;

[0031] 102, first inclined plate; 1021, wire placement slot; 1022, component installation port; 1023, air inlet;

[0032] 103. first top plate; 1031. first assembly hole;

[0033] 104. A first buckle portion;

[0034] 2. Casing; 3. Motherboard;

[0035] 4. first frame; 401. first protrusion; 402. first assembly column; 403. first extension plate;

[0036] 5. second frame; 501. second raised portion;

[0037] 6. The third air guide cover;

[0038] 601, third inclined plate; 6011, third buckle portion;

[0039] 602, third top plate; 6021, third assembly hole;

[0040] 7. Power module; 8. PCIE module;

[0041] 9. The third frame; 901. The third assembly column; 902. The third extension plate;

[0042] 10. High-heat electronic components;

[0043] 11. Fan set. DETAILED DESCRIPTION

[0044] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0045] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0046] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0048] See also Figure 1-Figure 5 The utility model discloses an electronic device, which can be a server, a host or other types of electronic devices. The electronic device includes a housing 2, a mainboard 3, a fan assembly 11 and a high-heat electronic component 10 arranged in the housing 2.

[0049] The fan assembly 11 is disposed on one side of the mainboard 3 to drive the airflow in the electronic device, such as the hot airflow generated by the CPU when running at a high speed, to flow in the housing 2 .

[0050] The high-heat electronic component 10 is mounted on the mainboard 3 and is disposed between the first air guide cover 1 and the fan assembly 11. The high-heat electronic component 10 is an electronic component that can generate a large amount of heat, such as a microprocessor.

[0051] The electronic device also has a first frame 4 arranged on the mainboard 3, and the first frame 4 is used to be combined with an electronic module. The electronic module includes a power module 7 or a PCIE module 8 or a mainboard module. The electronic module is installed on the first frame 4 to communicate with the mainboard 3.

[0052] The electronic device also includes a first air guide cover 1, which is installed on the main board 3. The first air guide cover 1 is arranged between the first frame 4 and the fan group 11 and connected to the first frame 4. The first air guide cover 1 includes: a first baffle 101, one side of which faces the high-heat electronic component 10 and the other side faces the first frame 4. The first baffle 101 is provided with a plurality of first air guide ports 1011; and a first inclined plate 102, which is connected to the first baffle 101 and extends in a direction away from the first baffle 101. The angle formed between the first inclined plate 102 and the first baffle 101 is an obtuse angle. The first air guide 1 can improve the heat dissipation environment inside the electronic device. Specifically, the first air guide 1 is located between the high-heat electronic component 10 and the first frame 4, so that a part of the airflow driven by the fan group 11 passes through the high-heat electronic component 10. After the part of the airflow passes through the high-heat electronic component 10, a relatively high-temperature airflow will be formed. The part of the airflow will flow to a direction away from the first frame 4 through the first inclined plate 102 on the first air guide 1, so that most of the airflow with heat is blocked outside the first frame 4, protecting the electronic module in the first frame 4 from high temperature, improving the working stability of the electronic module, thereby meeting the electronic module's need for heat dissipation, and overcoming the shortcomings in the background technology. By setting the first inclined plate 102, most of the airflow with heat can be blocked outside the first frame 4 and guided to other areas along the inclined direction of the first inclined plate 102.

[0053] It should be noted that the fan assembly 11 is generally installed on the periphery of the high-temperature electronic component 10 . When the fan blades of the fan assembly 11 rotate in a counterclockwise direction, the heat flow generated by the high-temperature electronic component 10 will flow away along the first inclined plate 102 .

[0054] In addition, the fan group 11 drives another part of the airflow that has not passed through the high-heat electronic component 10 to flow into the first frame 4 through the first air guide port 1011 of the first baffle 101 on the first air guide cover 1. Since this part of the airflow is far away from the high-heat electronic component 10, the temperature is not high and it is suitable to flow into the first frame 4 to meet the air flow requirements of the electronic modules in the first frame 4. The function of the first air guide port 1011 is to guide the above airflow into the first frame 4.

[0055] Moreover, the flow rate of the airflow into the first frame 4 can be controlled by controlling the number of the first air guide ports 1011 provided on the first baffle plate 101. In some use scenarios where a large airflow is required, the number of the first air guide ports 1011 can be set to be more; in some use scenarios where a small airflow is required, the number of the first air guide ports 1011 can be set to be less. In this way, different heat dissipation needs corresponding to different electronic modules are met, and the deficiencies in the background technology are overcome. In addition, the first air guide ports 1011 have a variety of shapes, such as square, circular, or rectangular. Secondly, if the first baffle plate 101 can also meet the airflow needs of the electronic modules in the first frame 4 without providing the first air guide ports 1011, the first air guide ports 1011 may not be provided on the first baffle plate 101.

[0056] The electronic device further includes a second frame 5, which is adjacent to the first frame 4 and mounted on the mainboard 3, and is provided with a second protrusion 501. A first buckle portion 104 is provided on one end of the first inclined plate 102 away from the first baffle 101, and the first buckle portion 104 is buckled and mounted with the second protrusion 501, so that the first air duct 1 is connected to the second frame 5. Specifically, the second frame 5 is mounted on the mainboard 3 and is located next to the first frame 4, and then the first air duct 1 is directly buckled on the second protrusion 501 through the first buckle portion 104 on the first inclined plate 102, thereby completing the connection between the first air duct 1 and the second frame 5.

[0057] Next, the first air duct 1 also includes a first top plate 103, which is covered on the first baffle 101 and the first inclined plate 102, and a first assembly hole 1031 is provided on the first top plate 103, wherein the first frame 4 is provided with a first assembly column 402, and the first assembly column 402 is matched and installed with the first assembly hole 1031, so that the first air duct 1 is connected to the first frame 4. Specifically, when the first air duct 1 is installed on the main board 3, the first top plate 103 is covered on the top of the first baffle 101 through the first assembly hole 1031, so that the first assembly column 402 is matched and installed in the first assembly hole 1031, thereby completing the connection between the first air duct 1 and the first frame 4. Secondly, a first plate-shaped extension plate 403 is provided on the first frame 4, and the first assembly column 402 is arranged on the first extension plate 403, so that the installation of the first assembly column 402 on the first assembly hole 1031 is smoother. In addition, the first assembly hole 1031 has various shapes, such as square, round, or rectangular.

[0058] See also Figure 1-Figure 5When the first frame 4 and the second frame 5 are both provided in the electronic device, the first frame 4 is located next to the second frame 5, and the installation process of the first air duct 1 is as follows: First, the first air duct 1 will be directly fastened to the second protrusion 501 through the first snap portion 104 on the first inclined plate 102, so that this end of the first air duct 1 is connected to the second frame 5, and at the same time, the first air duct 1 will be directly fastened to the first assembly column 402 through the first assembly hole 1031 on the first top plate 103, so that the other end of the first air duct 1 is connected to the first frame 4, and finally the first air duct 1 is connected between the first frame 4 and the second frame 5. After the above installation process is completed, the first air duct 1 will be set in front of the first frame 4 to block the hot air flow and guide the hot air flow to the direction of the first inclined plate 102. Among them, the electronic module arranged on the first frame 4 can be a PCIE module 8. Since the PCIE module 8 has very high requirements for the working temperature, the arrangement of the first air guide cover 1 can block most of the hot air flow outside the first frame 4, which can meet the needs of the PCIE module 8. In addition, the second frame 5 can also be provided with an electronic module such as a power module 7. In this way, the first air guide cover can be quickly and conveniently installed on the mainboard, and the installation method is very flexible. It can be disassembled and installed according to actual needs, which is very convenient and has a wide range of applications, overcoming the shortcomings of the background technology.

[0059] See also Figure 6-Figure 10 Further, the electronic device also includes a third frame 9 and a third air duct 6. The structure of the third air duct 6 is the same as that of the first air duct 2. The third frame 9 is adjacent to the first frame 4 and is installed on the main board 3. The third frame 9 is provided with a third assembly column 901. The third air duct 6 is provided with a third top plate 602. The third assembly column 901 is matched with a third assembly hole 6021 on the third top plate 602 so that the third air duct 6 is connected to the third frame 9. Specifically, a third frame 9 can be set inside the electronic device to meet actual use needs, and the electronic module carried on the third frame 9 also has temperature requirements. Therefore, a third air duct 6 is also required to be set. The third air duct 6 is connected to the third frame 9. The connection between the two can be completed only by matching the third combination column with the third assembly hole 6021.

[0060] Next, a first protrusion 401 is provided on the first frame 4, and a third inclined plate 601 is provided on the third air guide cover 6. The first protrusion 401 is matched with a third buckle portion 6011 on the third inclined plate 601 to connect the third air guide cover 6 to the first frame 4. Combined with the connection method between the third air guide cover 6 and the third frame 9, the connection between the third air guide cover 6 and the first frame 4 and the third frame 9 is realized. The third air guide cover 6 is arranged in front of the third frame 9 to block the hot air flow from the high-heat electronic components 10, and make the part of the hot air flow flow away along the inclined direction of the first inclined plate 102 of the third air guide cover 6. Secondly, a third extension plate 902 is provided on the third frame 9, and the third assembly column 901 is arranged on the third extension plate 902 to make the installation of the third assembly column 901 on the third assembly hole 6021 smoother.

[0061] When the first frame 4 and the third frame 9 are provided in the electronic device at the same time, the first frame 4 is located next to the third frame 9, and the installation process of the third air duct 6 is as follows: first, the third air duct 6 will be directly fastened on the third protrusion through the third buckle portion 6011 on the third inclined plate 601, so that the end of the third air duct 6 is connected to the third frame 9, and the third air duct 6 will also be directly fastened on the first assembly column 402 through the third assembly hole 6021 on the third top plate 602, so that the other end of the third air duct 6 is connected to the first frame 4, and finally the third air duct 6 is connected between the first frame 4 and the third frame 9. After the above installation process is completed, the third air duct 6 will be arranged in front of the third frame 9 to block the hot air flow and guide the hot air flow to the tilted direction of the third inclined plate 601. Among them, the electronic module arranged on the third frame 9 can be a PCIE module 8. Since the PCIE module 8 has very high requirements for the working temperature, the arrangement of the third air duct 6 can meet the needs of the PCIE module 8. In addition, the second frame 5 may also be provided with an electronic module such as a power module 7

[0062] See also Figure 6-Figure 7 When the first frame 4, the second frame 5 and the third frame 9 are provided in the electronic device at the same time, as an optional arrangement, from left to right, the second frame 5, the first frame 4 and the third frame 9 are arranged in sequence, and a first air guide cover 1 is provided between the high-temperature electronic component 10 and the first frame 4, and a third air guide cover 6 is provided between the high-temperature electronic component 10 and the third frame 9. The first air guide cover 1 is connected between the first frame 4 and the second frame 5, and the third air guide cover 6 is connected between the first frame 4 and the third frame 9. The specific connection methods are mentioned above and will not be repeated here.

[0063] As another preferred embodiment, see Figure 5, the first inclined plate 102 and the third inclined plate 601 are both provided with a plurality of air inlets 1023. Since different electronic modules have different air flow requirements, such as the PCIE module 8, when different PCIE modules 8 are installed on the first frame 4, the number of the air inlets 1023 will be different. At the same time, since the first baffle 101 is provided with the first guide port 1011, the first guide port 1011 can cooperate with the air inlet 1023 to ensure that the air flow meets the requirements of the PCIE module 8. In addition, as another optional embodiment, if the first inclined plate 102 or the third inclined plate 601 can also meet the air flow requirements of the PCIE module 8 without providing the air inlet 1023, the first inclined plate 102 or the third inclined plate 601 may not be provided with the air inlet 1023 to simplify the structure of the first inclined plate 102 or the third inclined plate 601.

[0064] Furthermore, the bottom of the first inclined plate 102 or the third inclined plate 601 is provided with a plurality of component installation openings 1022 for fitting components on the main board 3. The component installation openings 1022 are in the shape of a notch, in order to avoid components on the main board 3, and prevent the first inclined plate 102 or the third inclined plate 601 from causing structural damage to the components on the main board 3. When the first inclined plate 102 or the third inclined plate 601 is installed on the main board 3, the components can be avoided through the component installation openings 1022 so that the installation of the inclined plate will not affect the components on the main board 3, and avoid affecting the working state of the main board 3.

[0065] Furthermore, a wire placement slot 1021 is provided at the top of the first inclined plate 102 or the third inclined plate 601. The wire placement slot 1021 at the top of the first inclined plate 102 or the third inclined plate 601 provides an orderly storage space for the wires on the internal motherboard 3, which helps to reduce the clutter and interference of the wires and improve the cleanliness and maintenance efficiency of the electronic device.

[0066] To sum up, through the above-mentioned setting method, the first air guide cover can guide the airflow with higher temperature to the direction away from the first frame, and at the same time guide the airflow with lower temperature to flow into the first frame, so as to meet the different heat dissipation needs corresponding to different electronic modules; moreover, the installation method of the first air guide cover on the motherboard is very flexible, and can be disassembled and installed according to actual needs, which is very convenient and has a wide range of applications.

[0067] According to the disclosure and teaching of the above description, the technical personnel in the field to which the utility model belongs can also change and modify the above implementation. Therefore, the utility model is not limited to the specific implementation methods disclosed and described above, and some modifications and changes to the utility model should also fall within the scope of protection of the claims of the utility model. In addition, although some specific terms are used in this specification, these terms are only for the convenience of description and do not constitute any limitation to the utility model.

Claims

1. An electronic device, comprising a housing, wherein a mainboard and a fan assembly are arranged in the housing, wherein the fan assembly is arranged on one side of the mainboard, wherein: The electronic device further comprises: A first frame, mounted on the main board; a first air guide cover, mounted on the mainboard, the first air guide cover being disposed between the first frame and the fan assembly and connected to the first frame; and a high-heat electronic component mounted on the mainboard, the high-heat electronic component being arranged between the first air guide cover and the fan assembly, Wherein, the first air guide cover comprises: a first baffle, one side of which faces the high-heat electronic component and the other side of which faces the first frame, and the first baffle is provided with a plurality of first guide ports; and a first inclined plate connected to the first baffle and extending in a direction away from the first baffle, wherein an angle formed between the first inclined plate and the first baffle is an obtuse angle; Among them, the first air guide cover is located between the high-temperature electronic components and the first frame, so that a part of the airflow driven by the fan group and passing through the high-temperature electronic components passes through the high-temperature electronic components and flows to a direction away from the first frame through the first inclined plate on the first air guide cover, and another part of the airflow driven by the fan group and not passing through the high-temperature electronic components flows into the first frame through the first guide port of the first baffle on the first air guide cover.

2. The electronic device according to claim 1, characterized in that: It also includes a second frame, which is adjacent to the first frame and installed on the main board. The second frame is provided with a second protrusion. A first clip portion is provided on the end of the first inclined plate away from the first baffle. The first clip portion is clipped and installed with the second protrusion to connect the first air guide cover with the second frame.

3. The electronic device according to claim 1, characterized in that: The first air guide cover further includes a first top plate, the first top plate is covered on the first baffle plate and the first inclined plate, and a first assembly hole is provided on the first top plate. Wherein, a first assembly column is provided on the first frame, and the first assembly column is installed to match the first assembly hole so that the first air guide cover is connected to the first frame.

4. The electronic device according to claim 3, characterized in that: The first frame is provided with a first extension plate, and the first assembly column is arranged on the first extension plate.

5. The electronic device according to claim 1, characterized in that: It also includes a third frame and a third air duct cover, wherein the third frame is adjacent to the first frame and is installed on the main board, the third frame is provided with a third assembly column, the third air duct cover is provided with a third top plate, the third assembly column is matched with a third assembly hole on the third top plate and installed to connect the third air duct cover to the third frame.

6. The electronic device according to claim 5, characterized in that: The first frame is provided with a first protrusion, the third air guide cover is provided with a third inclined plate, and the first protrusion is matched with a third buckle portion on the third inclined plate to connect the third air guide cover to the first frame.

7. The electronic device according to claim 5, characterized in that: The third frame is provided with a third extension plate, and the third assembly column is arranged on the third extension plate.

8. The electronic device according to claim 1, characterized in that: The first frame is used to be combined with an electronic module, and the electronic module includes a power module or a PCIE module or a mainboard module.

9. The electronic device according to claim 1, characterized in that: A wire placement groove for placing wires inside the housing is provided at the top of the first inclined plate.

10. The electronic device according to claim 1, characterized in that: The bottom of the first inclined plate is provided with a plurality of component installation openings for adapting to the installation of components on the main board.

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