Cleaning equipment and system

Abstract

The utility model discloses a cleaning device and system, and belongs to the field of quantum chip packaging. The cleaning equipment comprises a base, a moving mechanism fixed to the base and a cleaning mechanism connected to the moving mechanism in a driven mode. The cleaning mechanism is provided with a recognizer and a cleaning head provided with a switch. Wherein the recognizer is used for recognizing a to-be-cleaned area of the packaging box, and the cleaning head has a first state and a second state which are controlled or switched through the switch. And in the first state and the second state, the cleaning head can emit corresponding and different pulse lasers, so that different to-be-cleaned areas, recognized by the recognizer, of the packaging box are irradiated to implement partitioned cleaning operation. The device can be used for effectively cleaning the packaging box, so that the packaging box can be repeatedly used, the consumption of the packaging box is reduced, and meanwhile, the packaging effect is ensured.

Description

Technical Field

[0001] The present application belongs to the field of quantum chip packaging, especially the field of quantum computing technology. In particular, the present application relates to a cleaning device and system. Background Art

[0002] The superconducting quantum chip mainly includes a nonlinear LC oscillation circuit composed of a Josephson junction and adjacent capacitors. The key structure of the superconducting quantum chip, namely the superconducting quantum bit, is constructed by quantizing the circuit.

[0003] The X, Y, and Z control lines of each qubit are close to the SQUID area to obtain the best control effect. Transmitting microwave signals through the XY lines can achieve operations such as energy level flipping. This signal can make the qubit transition from the ground state to the excited state. Changing the current of the Z line will change its external magnetic field, and at the same time, the magnetic flux of the SQUID will also change. The change in magnetic flux will cause the energy level structure of the qubit to change, causing its frequency to change.

[0004] In order to avoid crosstalk between different quantum bit manipulation channels, the quantum chip packaging space needs to be isolated to prevent leakage signals from affecting adjacent quantum bits.

[0005] Due to technical limitations, the main testing method for quantum chips at this stage is ultra-low temperature testing, so the performance of the chip can only be screened in refrigeration equipment. At this time, it is particularly important that a packaging box can be used to package, disassemble and repackage the chip multiple times. Utility Model Content

[0006] The example of the present application provides a cleaning device and system, which can be used to clean the packaging box of the superconducting quantum chip, so that the packaging box meets the requirements of reuse and ensures that the superconducting quantum chip can be used normally after packaging.

[0007] The solution of this application example is implemented through the following contents.

[0008] In a first aspect, an example of the present application discloses a cleaning device for cleaning a packaging box for packaging quantum chips.

[0009] Cleaning equipment includes:

[0010] A base configured to fix the packaging box;

[0011] A moving mechanism connected to the base for providing multi-degree-of-freedom movement; and

[0012] The cleaning mechanism is drivenly connected to the moving mechanism, and comprises an identifier and a cleaning head provided with a switch. The identifier is used to identify the area to be cleaned of the packaging box, and the cleaning head has a first state and a second state controlled or switched by the switch; in the first state and the second state, the cleaning head can emit corresponding and different pulsed lasers so as to implement a partitioned cleaning operation by irradiating different areas to be cleaned of the packaging box identified by the identifier.

[0013] According to some examples of the present application, the cleaning device further comprises a mounting plate connected to the base and having a plurality of fixing parts, wherein the mounting plate is adapted to be connected to packaging boxes of different specifications through a combination of some fixing parts.

[0014] According to some examples of the present application, the mounting plate is detachably connected to the base.

[0015] According to some examples of the present application, the mounting plate is provided with a positioning portion for being recognized by the identifier to locate the position of the cleaning head.

[0016] According to some examples of the present application, the mounting plate has a mounting area for fixing the packaging box;

[0017] There are multiple positioning parts, and each positioning part includes a pair of first positioning members and second positioning members;

[0018] The first positioning member and the second positioning member are positioned outside the mounting plate based on the mounting area, and along the same measuring direction, the first positioning member of each positioning portion is closer to the mounting area, and the second positioning member is farther away from the mounting area.

[0019] According to some examples of the present application, the identifier is an optical identifier.

[0020] According to some examples of the present application, the cleaning device further includes an auxiliary cover plate disposed between the base and the cleaning mechanism, the cover plate having a plurality of holes for matching the area to be cleaned of the packaging box, and the number of the holes is the same as the number of areas to be cleaned in the packaging box.

[0021] According to some examples of the present application, the auxiliary cover plate includes an independent first plate and a second plate, and the plurality of holes include a plurality of first through holes provided in the first plate, and a plurality of second through holes provided in the second plate;

[0022] Among the multiple first through holes, the gap between two adjacent first through holes is configured to be larger than the second through hole so that the size of the gap can accommodate the second through hole; among the multiple second through holes, the gap between two adjacent second through holes is configured to be larger than the first through hole so that the size of the gap can accommodate the first through hole.

[0023] According to some examples of the present application, the cleaning head includes a first exit window and a second exit window, the first exit window is used to emit a pulse laser corresponding to a first state, the second exit window is used to emit a pulse laser corresponding to a second state, and the switch is configured to control the first exit window and the second exit window to be opened or closed synchronously;

[0024] And / or, the cleaning device further comprises a suction assembly fixed to the base, the suction assembly having a suction head facing the base for mounting the packaging box area, the suction assembly being used to generate suction to remove dirt during the process of cleaning the packaging box by pulsed laser.

[0025] In a second aspect, an example of the present application discloses a cleaning system comprising:

[0026] The aforementioned cleaning equipment; and

[0027] The control cabinet is provided with a power supply and a control device, wherein the power supply is used to supply power to the control device, the moving mechanism and the electrical equipment in the cleaning mechanism, the control device is used to control the movement of the moving mechanism and the cleaning mechanism to perform the cleaning operation.

[0028] Beneficial effects:

[0029] By using the above-mentioned cleaning equipment and cleaning system, it is possible to clean the packaging box of the superconducting quantum chip, for example, to clean the pads (PAD) of the packaging box that are connected to the chip and external devices and circuits. Through such a cleaning operation, the packaging box can be reused many times without worrying about the pads getting dirty. The dirt, for example, can be caused by the residue of the lead when the pad is soldered.

[0030] In the cleaning device, the cleaning head of the cleaning mechanism performs cleaning operation in the form of pulsed laser, so that the high energy of the pulsed laser can be used to clean the dirt, and because the cleaning time can be conveniently controlled, other undesirable damage to the packaging box can be avoided. And due to the configuration of the switch and the different working modes of the cleaning head (corresponding to the first state and the second state of different pulsed lasers), it can adapt to the different cleaning requirements of the pulsed laser for various objects to be cleaned in the packaging box of the superconducting quantum chip, thereby achieving refined, accurate, efficient and non-destructive cleaning operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] For a clearer explanation, the following briefly introduces the drawings required for the description.

[0032] Figure 1 A physical diagram of a partial structure of a packaging box with two types of pads in an example of this application;

[0033] Figure 2 A schematic diagram showing the microscopic reaction of the object being cleaned during laser cleaning is shown;

[0034] Figure 3 It is a schematic diagram of the structure of the cleaning device in the example of this application;

[0035] Figure 4 A schematic diagram of the matching structure of the base and the mounting plate in the example of the present application is disclosed;

[0036] Figure 5 A structural schematic diagram of another mounting plate in an example of the present application is disclosed;

[0037] Figure 6 A schematic diagram of the structure of the mobile mechanism in the example of the present application is disclosed;

[0038] Figure 7 A schematic structural diagram of a first plate in an auxiliary cover plate of an example of the present application is disclosed.

[0039] Explanation of the reference numerals: 200 - cleaning device; 201 - base; 202 - moving mechanism; 203 - cleaning mechanism; 204 - mounting plate; 2041 - fixing portion; 2042 - groove; 301 - vertical track; 302 - horizontal track; 401 - first plate; 402 - first through hole; 101 - object to be processed; 102 - dirt layer; 103 - absorption zone; 104 - surface; 105 - plasma; 106 - laser beam. DETAILED DESCRIPTION

[0040] In a superconducting quantum chip, the core device is a superconducting quantum bit constructed by quantization using a nonlinear LC oscillation circuit composed of a Josephson junction and adjacent capacitors (for example, composed of a Josephson junction and a capacitor).

[0041] Superconducting qubits can be used to form bit gates. For example, a single-bit gate can be implemented using microwave pulses, while a two-bit gate can be implemented using microwave pulses or square wave pulses.

[0042] Since the computation of a superconducting qubit is related to its state, which is controlled by the control circuit, in the manufacturing process, a frequency-adjustable superconducting qubit (with a compatible loop consisting of two Josephson structures) has an XYZ control line, and its X, Y, and Z control lines are all close to the SQUID area (the aforementioned loop) to obtain the best control effect.

[0043] Transmitting microwave signals through the XY line can achieve operations such as flipping the energy level of the superconducting quantum bit, and this signal can make the quantum bit transition from the ground state to the excited state. For the Z line, changing the current of the Z line will change its external magnetic field, and at the same time, the magnetic flux of the SQUID will also change. The change in magnetic flux will cause the energy level structure of the superconducting quantum bit to change, causing the frequency of the superconducting quantum bit to change.

[0044] The performance of a superconducting quantum chip in executing quantum computing d depends to a considerable extent on the number of superconducting quantum bits it has. Considering that each superconducting quantum bit has its corresponding control circuit, it can be understood that for a large-bit superconducting quantum chip, it has a large number of control circuits. And because superconducting quantum bits are very sensitive to noise, in order to avoid crosstalk between different quantum bit control channels, the quantum chip packaging space is isolated to prevent the leakage signal from affecting the adjacent quantum bits.

[0045] On the other hand, quantum computing also requires determining the state of the bit, so each superconducting quantum bit can be read using a separate reading cavity to avoid multiple bits in the reading cavity. In addition, all quantum bit reading cavities are connected to filters so that all quantum bit readings are combined and finally input through a common channel.

[0046] For the reading and control operations of superconducting quantum bits, multiple signal channels are required, especially for multi-bit superconducting quantum chips. However, most of the current multi-qubit layouts for superconducting quantum bit processors are carried out in a planar architecture. The qubits and interconnects are co-fabricated on the surface of a single chip, and the control and readout wiring is introduced laterally from the edge of the chip.

[0047] The above method may support dozens to tens of qubits, but as the number of qubits increases, more signal lines cannot be arranged at the current chip size. As superconducting qubit circuits become more and more complex, processing a large number of qubits becomes a challenging engineering problem. Dense qubit arrays may require special packaging methods to alleviate interconnect congestion.

[0048] In packaging technology, internal interconnection technology is an important part. At present, the main interconnection methods in the industry include wire bonding (WB), flip chip (FC), tap automated bonding (TAB) and through silicon vias (TSV). Among these internal interconnection technologies, wire bonding and flip chip are the most commonly used.

[0049] Wire bonding is the earliest and most commonly used interconnection method in the development of packaging technology. This technology mainly uses the combined effects of ultrasound, pressure, temperature and other conditions to connect the I / O ports on the chip and the pins of the packaging carrier with gold wires, copper wires or aluminum wires to achieve electrical and signal connections between the chip and the outside of the package.

[0050] With the advantages of simple process, stable process and high reliability, wire bonding technology has long been one of the mainstream interconnection methods in chip packaging. However, the carrier frame used in this process is easily limited by equipment capabilities and processing accuracy, and the number of pins that can be arranged on a carrier of fixed size is limited, so it is mainly used for packaging products with low pin counts, and it is difficult to meet the packaging requirements of many high-input and high-output chips. At the same time, the characteristics of the pins on the carrier are distributed all around, which will also limit the further improvement of packaging efficiency and is not conducive to the miniaturization of devices.

[0051] For superconducting quantum chips, as the number of quantum BITs increases, the size of the packaging box used for wire bonding and the size of the corresponding pins are also increasing. At this stage, the main testing method for quantum chips is extremely low temperature testing, and the performance of the chips is screened in a refrigerator. Then, at this time, the packaging box will be used repeatedly. Therefore, it is particularly important for the packaging box to package, disassemble and repackage the chip.

[0052] Currently, the packaging of superconducting quantum chips is achieved by using packaging boxes and wire bonding. Therefore, the packaging boxes that match the superconducting quantum chips will also be used multiple times. Since superconducting quantum chips are sensitive to line quality and various noises, during the packaging and testing process, before removing the previous chip and preparing for the next round of chip packaging, the applicant chooses to clean the packaging box.

[0053] For example, in the applicant's superconducting quantum chip packaging practice, manual wire bonding equipment is used to use Al wire (aluminum wire) as the wire material to perform wire bonding on the PAD of the packaging box. However, in such a scenario, the aluminum wire used is easily oxidized (considering that the aluminum wire in the wire bonding is thinner, the oxidation may be more serious or prominent), so there will be aluminum oxide residue on the PAD of the packaging box, and it is not easy to remove.

[0054] In order to overcome the above problems, some attempts have been made to change the material of the bonding wires used, such as using materials that are not easily oxidized. However, this may not be so easy to implement in some scenarios - for example, it is difficult to use wires made of other materials, such as some wires in superconducting quantum chips (the common ground wires mentioned later).

[0055] In the case of superconducting quantum chips, the packaging box mostly uses an integral aluminum box, and there are two main bonding pads in the aluminum box.

[0056] One type of pad used to connect signal transmission lines is referred to as the first type pad, which is made of copper. The leads used by this pad are copper wires for bonding. And the surface of the pad can be plated with 1μm gold. The plating is set to increase the success rate of bonding and improve the reuse rate of the packaging box. The plating is located on the top surface of the bonding area. Since the plating can also be damaged by the laser, the plating layer can be made thicker to allow multiple laser cleanings.

[0057] Another type of pad used to connect the common ground line is referred to as the second type pad, which is made of aluminum. The lead used by this pad is aluminum wire for bonding. And the surface of this pad can be plated with 1μm silver.

[0058] like Figure 1 As shown, Figure 1 The PCB board made of RO4350 thermosetting PCB material discloses the physical pictures of two pads: Cu plated with Au (copper plated with gold) and Al plated with Ag (aluminum plated with silver).

[0059] In order to solve the problem that aluminum wire easily produces aluminum oxide residue on the gold and silver coatings during welding, in the example of this application, a pulsed laser cleaning solution for the packaging box is proposed for multiple uses and normal operation of the automatic wire bonding machine.

[0060] Pulsed laser cleaning of packaging boxes mainly utilizes the different absorption rates of lasers by different materials. The pulsed laser cleaning process relies on the characteristics of the light pulses generated by the laser, based on the photophysical reaction caused by the interaction between the high-intensity light beam, short-pulse laser and the contamination layer (such as aluminum oxide in the example of this application).

[0061] The laser cleaning process can be summarized as follows:

[0062] (1) The laser beam 106 emitted by the laser is absorbed by the dirt layer 102 on the surface 104 of the treatment object 101 through the absorption action area 103;

[0063] (2) The absorption of large amounts of energy forms a rapidly expanding plasma 105 (highly ionized unstable gas), generating a shock wave;

[0064] (3) The shock wave breaks the pollutants into pieces and removes them.

[0065] In practice, the applicant has found that the width of the light pulses used must be short enough to avoid heat accumulation that would damage the surface being treated - for example to avoid Figure 2The object 101 being processed (or described as a base / substrate) is heated and suffers undesirable damage.

[0066] Furthermore, it has been verified that plasma can be generated on the metal surface when there is an oxide on the metal surface, such as aluminum oxide formed on the gold-plated surface of the copper pad surface in the example of the present application, or aluminum oxide formed on the silver-plated surface of the aluminum pad surface.

[0067] Furthermore, practice has shown that plasma is only generated when the energy density is above a threshold value, which depends on the contamination layer or oxide layer to be removed. This threshold effect has positive significance for effective cleaning while ensuring the safety of the substrate material.

[0068] In addition, there is a second threshold for the appearance of plasma. If the energy density exceeds this threshold (the second threshold), the substrate material will be destroyed. Therefore, it is significantly beneficial to adjust the laser parameters according to the situation so that the energy density of the light pulse is strictly between the two thresholds while ensuring the safety of the substrate material for effective cleaning.

[0069] In short, for the aluminum oxide contaminants on the surfaces of the two pads in the examples of this application, ensuring that the aluminum oxide can be cleaned and the metal plating on the pad surface is not damaged can achieve better cleaning results and less damage to the pad.

[0070] In addition, the experiment also confirmed that each laser pulse can remove a certain thickness of the contamination layer. Therefore, if the contamination layer is thicker, multiple pulses are required for cleaning.

[0071] That is, the number of pulses required to clean the surface depends on the degree of surface contamination, and the self-control of cleaning can be achieved by properly setting the laser parameters at the first two thresholds. That is, light pulses with energy density higher than the first threshold will continue to remove contaminants (aluminum oxide in the example) until they reach the substrate material (gold and silver in the example). And because the energy density of the light pulse is lower than the damage threshold of the substrate material, the substrate will not be damaged.

[0072] The example discloses a cleaning device 200 for cleaning a packaging box for encapsulating quantum chips. The packaging box can be a whole-plate type (where the PCB is a whole block structure) or a tunnel type (where the PCB is a plurality of separate individual structures - strips). The use of the device can realize the cleaning operation of the Bonding PAD of the packaging box without damaging other components in the packaging box. The reuse rate of the packaging box can be significantly improved through reasonable configuration. The packaging box cleaned by this solution is more conducive to wire bonding (wire bonding) of manual bonding machines and automatic wire bonding machines, thereby improving work efficiency.

[0073] In the example, the cleaning device 200 includes a base 201, a moving mechanism 202 and a cleaning mechanism 203, see Figure 3 .

[0074] In the cleaning device 200, the base 201 is used to fix the packaging box, the moving mechanism 202 is connected to the base 201, and is used to provide multi-degree-of-freedom movement. The cleaning mechanism 203 is connected to the moving mechanism 202, and is driven by the moving mechanism 202 to perform position adjustment movement.

[0075] Specifically, the cleaning mechanism 203 has an identifier and a cleaning head, and the cleaning head is provided with a switch.

[0076] The identifier is used to identify the area to be cleaned of the packaging box.

[0077] Corresponding to the aforementioned situation where there are two kinds of solder pads in the packaging box, the cleaning head has a first state and a second state which are controlled or switched by a switch.

[0078] That is, the first state and the second state can exist separately, for example, the first state is in a period of time and the second state is in another period of time; the first state and the second state appear alternately. Alternatively, the first state and the second state can exist at the same time, or be cancelled at the same time. This will be described in detail later.

[0079] As for the first state and the second state, in the first state and the second state, the cleaning head can emit corresponding and different pulsed lasers so as to implement a zoned cleaning operation by irradiating different to-be-cleaned areas of the packaging box identified by the identifier.

[0080] In other words, as an example, in the first state, the cleaning head emits a pulse laser with one parameter (such as a specified pulse width) to clean the aluminum oxide on the surface of the copper-gold-plated pad; in the second state, the cleaning head emits a pulse laser with another parameter (such as another specified pulse width) to clean the aluminum oxide on the surface of the aluminum-silver-plated pad.

[0081] The various structures in the cleaning device 200 will be discussed in more detail below.

[0082] Base 201

[0083] The base 201 may be a flat plate structure, and may be increased in weight, size, etc. to improve its anti-overturning ability. Alternatively, a frame structure made of metal or plastic may be used. Alternatively, the base 201 may also be a block material.

[0084] Alternatively, the base 201 may also adopt a frame structure. For example, it is welded into a frame structure by using angle steels, etc., and then a metal or non-metallic skin is provided on the surface to provide an installation and fixing plane for other structures or components.

[0085] In some other examples, in order to facilitate installation of different packaging boxes, the cleaning device 200 further includes a mounting plate 204 connected to the base 201 and having a plurality of fixing portions 2041, such as Figure 4 The mounting plate 204 is used to adapt to connection with packaging boxes of different specifications through the combination of some fixing parts 2041.

[0086] The mounting plate 204 can be configured to be non-detachably fixedly connected (such as welding) or interference fit connected to the base 201. Alternatively, the mounting plate 204 can also be configured to be detachably connected to the base 201, such as bolt connection, or clamping, etc. Taking the bolt connection as an example, the mounting plate 204 and the base 201 are provided with through holes or threaded holes, and bolts and nuts are used to match and connect the two to fix them.

[0087] For fixing the packaging box, multiple through holes or multiple threaded holes can be set on the mounting plate 204. By selecting holes with different arrangements, the installation and fixing requirements of packaging boxes of different specifications can be met. Therefore, in this example, the fixing portion 2041 set on the mounting plate 204 can be a threaded hole.

[0088] In some other examples, a plurality of grooves 2042 (such as Figure 5 As shown), different grooves 2042 have different specifications to adapt to different packaging boxes. In order to facilitate the identifier to identify the area to be cleaned, or to reduce the difficulty of identification, in some examples, these grooves 2042 can be set concentrically, and different grooves can be set to different depths. The shape of the groove is adapted to the shape of the packaging box. For example, if the shape of the packaging box is a rectangular structure, the shape of the groove 2042 is also rectangular. Alternatively, an elastic crimping piece can be set on the mounting plate 204, and the packaging box is placed on the mounting plate 204, and then the crimping piece is used to apply a force to the packaging box that is perpendicular to the top surface of the mounting plate 204, so that the packaging box is limited.

[0089] As a beneficial option, in some examples, a positioning portion may be provided on the mounting plate 204. The positioning portion is used for identification by the identifier to locate the cleaning head during the cleaning process. The positioning portion can cooperate with the identifier and the moving mechanism in the cleaning mechanism 203 to improve the cleaning efficiency. Because the positioning portion can be easily and quickly identified by the identifier, the cleaning mechanism 203 can be positioned faster so as to efficiently "find" the area to be cleaned on the packaging box, such as the aforementioned solder pad.

[0090] The positioning portion may be a protruding area on the mounting plate 204, and may be visually prominent or prominent in color, etc. For example, for a protruding structure, the positioning portion may be a convex block protruding from the surface of the mounting plate 204, and may be a structure such as a cylinder, a prism, or a hemisphere. For example, for an example of color protrusion, when the mounting plate 204 is off-white, the positioning portion may be set to black or yellow, etc. Alternatively, in other examples, the color protrusion and the structural protrusion may be combined to construct the structure of the positioning portion.

[0091] For the scheme of setting the positioning part, a more beneficial attempt can be further made to better improve the position of the area to be cleaned of the packaging box that the identifier identifies. As an example, for the convenience of discussion, it can be pre-defined that the mounting plate 204 has a mounting area for fixing the packaging box. On this basis, the number of the positioning parts is multiple (for example, 2, 3, or even more), and each positioning part includes a first positioning member and a second positioning member in pairs.

[0092] The first positioning member and the second positioning member are positioned outside the mounting plate 204 based on the mounting area, and along the same measuring direction, the first positioning member of each positioning portion is closer to the mounting area, and the second positioning member is farther away from the mounting area. For example, for a packaging box with a rectangular structure, the measuring direction may be a direction perpendicular to any side of the packaging box.

[0093] The configuration of the first positioning member and the second positioning member can facilitate the determination of the movement direction / orientation of the identifier, so that targeted movement can be performed through the moving mechanism 202 according to the position of the area to be cleaned (such as the position of the pad) to adjust the direction of the cleaning head, thereby also controlling the irradiation position of the pulsed laser.

[0094] Mobile mechanism 202

[0095] As the name implies, the moving mechanism 202 is a structure that provides movement, which may adopt displacement components of various mechanical devices, and the present application does not make any specific limitation on this.

[0096] Exemplarily, the moving mechanism 202 may be a UVW adjustment platform, or an XYZ platform, a three-axis cantilever slide, a multi-axis combined slide, or a three-axis cantilever linear module.

[0097] Or the moving mechanism 202 may include a vertical track 301, a horizontal track 302, and a moving slider, such as Figure 6As shown. The transverse track 302 can move up and down on the vertical track 301, and the motion slider can move left and right on the transverse track 302. The cleaning head and the identifier can be installed and fixed to the motion slider. In this way, the cleaning head and the identifier can move in three-dimensional space through the cooperation of the transverse track 302 and the motion slider.

[0098] Alternatively, in some examples, the lateral track 302 may be rotatably connected to the vertical track 301, that is, rotatably connected with the vertical track 301 as an axis, and may also move up and down along the vertical track 301.

[0099] Various motor devices can be used as the power source of the movement in the moving mechanism 202, such as linear motors, servo motors, various motors, etc. In order to facilitate the installation of various devices, various tracks of the moving mechanism 202 can be provided with internal through grooves, or installation holes and other structures.

[0100] Cleaning mechanism 203

[0101] The cleaning mechanism 203 is a device for pulse laser cleaning, and since the cleaning area in the packaging box is smaller than the non-cleaning area, the cleaning mechanism 203 is equipped with an identifier and a cleaning head. The identifier is used to identify the position to be cleaned, and the cleaning head is used to clean the corresponding position to be cleaned by laser.

[0102] The identifier can be selected according to the conditions of the area to be cleaned of the packaging box. For example, for the two pad examples mentioned above, since the color difference between the gold-plated and silver-plated pad surfaces is large, the identifier can be used as an optical identifier to distinguish the two by color. The optical identifier can include a camera assembly with a lens, a fixing bracket, a circuit board and other structures.

[0103] The optical identifier can take a photo with a CCD or CMOS camera, and then manually identify the color from the photo to find the area to be cleaned. Alternatively, the identification can be performed by using an existing software model, for example, a model trained based on a fully convolutional neural network model, such as a V-Net neural network model, a SN neural network model, an MSN neural network model, etc.

[0104] The cleaning head may include a housing and a laser assembly disposed inside. The laser assembly may include, for example, a laser generating component (such as a pulsed laser, which may include a CO2 laser, a fiber laser, and a solid laser, such as a ruby ​​laser, a neodymium-doped yttrium aluminum garnet laser), a laser transmission component (such as an optical fiber), and an irradiation component (such as a lens assembly).

[0105] The laser generating component generates pulsed laser, which can output high energy density in a very short time. The high energy density of pulsed laser is utilized to achieve high-quality and high-precision cleaning of the contaminated layer of the part to be cleaned.

[0106] Further, as a preferred example, the cleaning head may include a first exit window and a second exit window. The two windows may be provided in the aforementioned housing. The first exit window is used to emit a pulsed laser corresponding to a first state, and the second exit window is used to emit a pulsed laser corresponding to a second state. Corresponding to the two windows, the switch is configured so that the first exit window and the second exit window are opened or closed synchronously. For example, the switch may be an orifice plate having double holes corresponding to the two windows; the orifice plate is, for example, rotatably arranged in the housing. Alternatively, the cleaning head has two sets of laser generating components, and the laser optical paths of the two sets are respectively configured to correspond to the first exit window and the second exit window.

[0107] In other examples, the cleaning head may have a window for laser emission, and two laser generating components are provided at the same time, and the two laser generating components change the laser optical path through a galvanometer or a combination of multiple galvanometers to share the window. Since the two laser generating components are directed to different areas to be cleaned, the two laser generating components can correspondingly generate pulsed lasers with corresponding required parameters (such as pulse width, power, wavelength, etc.).

[0108] Taking into account the configuration of different areas to be cleaned in the packaging box, such as the first type of pads and the second type of pads, for a laser generator that can change the pulse laser parameters, the switch can enable the laser generator to switch under different parameter conditions. For example, when the window of the cleaning head points to the first type of pad, the switch turns on the pulse laser mode corresponding to that type, and turns off the laser pulse mode corresponding to the second type of pad; and vice versa. In this example, the switch can be a switch that can adjust the excitation generating component, rather than the aforementioned mechanical structure such as a perforated plate for adjusting the opening and closing of the two windows. For example, the switch is an adjustment switch that can adjust the laser power, or the switch can also be an adjustment switch that adjusts the pulse width.

[0109] Considering that there are gaps between different areas to be cleaned, and the areas in the gaps are not desired to be affected by the laser, in some examples, the cleaning device 200 further includes an auxiliary cover plate disposed between the base 201 and the cleaning mechanism 203. The auxiliary cover plate may be connected to the moving mechanism, such as the vertical track of the aforementioned moving mechanism; and along the extension direction of the vertical track, the auxiliary cover plate is away from the transverse track (closer to the base) to avoid interference with the transverse track.

[0110] The cover plate has a plurality of holes for matching the areas to be cleaned of the packaging box, and the number of holes is the same as the number of areas to be cleaned in the packaging box. Therefore, the non-hole area of ​​the cover plate can block the pulse laser from directly acting on the non-cleaned areas of the packaging box, so that these non-cleaned areas can be protected.

[0111] Based on the use of laser cleaning, in some examples, the cleaning device 200 may also be equipped with a suction assembly. The suction assembly may be fixed to the base 201, and the suction assembly may also have a suction head facing the base 201 for mounting the packaging box area. The suction assembly is used to generate a suction effect to generate a suction effect to remove dirt during the process of cleaning the packaging box by the pulsed laser.

[0112] Therefore, the suction assembly may include an air pump, a pipeline and the aforementioned suction head, and the air pump and the suction head are connected through the pipeline. The suction assembly operates during the cleaning process and can produce a suction effect on the cleaned area, so that the cleaned dirt (such as the oxide vapor on the surface of the pad) can be led away to prevent it from attaching to the area to be cleaned again.

[0113] In other examples, in order to reduce the difficulty of controlling the laser generator, the auxiliary cover plate can be designed as an independent first plate 401 (eg Figure 7 The plurality of holes in the auxiliary cover plate are divided into a plurality of first through holes 402 disposed in the first plate 401 and a plurality of second through holes disposed in the second plate.

[0114] In other words, when the packaging box is laser cleaned using the auxiliary cover plate, the first plate 401 exposes the first type of pads but does not expose the second type of pads; correspondingly, the second plate exposes the second type of pads but does not expose the first type of pads. The first plate 401 and the second plate are used separately. When the first plate 401 is used, only the first type of pads are cleaned; when the second plate is used, only the second type of pads are cleaned.

[0115] In addition, the through-hole configuration in the two plates can be selected so as to arrange the through-holes more reasonably and effectively utilize the space of the plates. Therefore, illustratively, in the plurality of first through-holes 402, the gap between two adjacent first through-holes 402 is configured to be larger than the second through-hole so that the size of the gap can accommodate the second through-hole; in the plurality of second through-holes, the gap between two adjacent second through-holes is configured to be larger than the first through-hole 402 so that the size of the gap can accommodate the first through-hole 402.

[0116] That is, through the above design, the first through hole 402 and the second through hole are arranged relatively compactly so as to just expose their corresponding areas to be cleaned.

[0117] For ease of use, various peripheral devices can be configured on the basis of the above-mentioned cleaning device 200, and accordingly, the present application proposes a cleaning system. Therefore, the cleaning system includes: a cleaning device 200 and a control cabinet. The control cabinet is provided with a power supply and a control device. The power supply is used to supply power to the control device, and the electric devices in the mobile mechanism 202 and the cleaning mechanism 203 in the cleaning device 200, while the control device is used to control the movement of the mobile mechanism 202 and also control the cleaning mechanism 203 to perform a cleaning operation.

[0118] The power source may be a storage device, such as a primary battery or a secondary battery (rechargeable battery); or, the power source may be a power adapter for connecting to the mains.

[0119] The control device may be any electronic component or its collection or its product that can store and process certain data. For example, a central processing unit (CPU), a microcontroller unit (MCU), a programmable logic controller (PLC), a programmable automation controller (PAC), an industrial control computer (IPC), a field programmable gate array (FPGA), an application-specific integrated circuit chip (ASIC chip, Application Specific Integrated Circuit), etc. or a device manufactured based thereon. For example, the control device may be a computing terminal, such as a computer, which controls the various devices in the system through pre-installed operating software.

[0120] The embodiments described above with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as limiting the present application.

[0121] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the foregoing describes one or more embodiments with reference to the accompanying drawings. Wherein, similar reference numerals throughout the text are used to refer to similar components. In the above description, for the purpose of explanation, many specific details are set forth in order to provide a more thorough understanding of one or more embodiments. However, it is obvious that in various cases, one or more embodiments can be practiced without these specific details, and each embodiment can be combined with each other and referenced to each other without contradiction.

[0122] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0123] In addition, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, product, or apparatus.

[0124] The above describes in detail the structure, features and effects of the present application based on the embodiments shown in the drawings. The above are only preferred embodiments of the present application, but the present application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of the present application, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and drawings, should be within the protection scope of the present application.

Claims

1. A cleaning device for cleaning a packaging box for packaging quantum chips, characterized in that: Cleaning equipment includes: a base configured to removably secure the packaging box; A moving mechanism connected to the base for providing multi-degree-of-freedom movement; and The cleaning mechanism is drivenly connected to the moving mechanism, and has an identifier and a cleaning head equipped with a switch. The identifier is used to identify the area to be cleaned of the packaging box, and the cleaning head has a first state and a second state controlled or switched by the switch; in the first state and the second state, the cleaning head can emit corresponding and different pulse lasers so as to implement a partitioned cleaning operation by irradiating different areas to be cleaned of the packaging box identified by the identifier.

2. The cleaning device according to claim 1, characterized in that: The cleaning device also includes a mounting plate connected to the base and having a plurality of fixing parts. The mounting plate is used to adapt to connection with packaging boxes of different specifications through a combination of some fixing parts.

3. The cleaning device according to claim 2, characterized in that: The mounting plate is detachably connected to the base.

4. The cleaning device according to claim 2 or 3, characterized in that: The mounting plate is provided with a positioning portion for being recognized by the identifier to locate the position of the cleaning head.

5. The cleaning device according to claim 4, characterized in that: The mounting plate has a mounting area for fixing the packaging box; There are multiple positioning parts, and each positioning part includes a pair of first positioning members and a second positioning member; The first positioning member and the second positioning member are positioned outside the mounting plate based on the mounting area, and along the same measuring direction, the first positioning member of each positioning portion is closer to the mounting area, and the second positioning member is farther away from the mounting area.

6. The cleaning device according to claim 1, characterized in that: The identifier is an optical identifier.

7. The cleaning device according to claim 1, characterized in that: The cleaning device further comprises an auxiliary cover plate arranged between the base and the cleaning mechanism, wherein the cover plate has a plurality of holes for matching with the areas to be cleaned of the packaging box, and the number of the holes is the same as the number of the areas to be cleaned in the packaging box.

8. The cleaning device according to claim 7, characterized in that: The auxiliary cover plate includes an independent first plate and a second plate, and the plurality of holes include a plurality of first through holes provided in the first plate, and a plurality of second through holes provided in the second plate; Among the multiple first through holes, the gap between two adjacent first through holes is configured to be larger than the second through hole so that the size of the gap can accommodate the second through hole; among the multiple second through holes, the gap between two adjacent second through holes is configured to be larger than the first through hole so that the size of the gap can accommodate the first through hole.

9. The cleaning device according to claim 1, characterized in that: The cleaning head includes a first exit window and a second exit window, the first exit window is used to emit a pulse laser corresponding to a first state, and the second exit window is used to emit a pulse laser corresponding to a second state, and the switch is configured to control the first exit window and the second exit window to be opened or closed synchronously; And / or, the cleaning device further comprises a suction assembly fixed to the base, the suction assembly having a suction head facing the base for mounting the packaging box area, the suction assembly being used to generate a suction effect to remove dirt during the process of cleaning the packaging box by pulsed laser.

10. A cleaning system, characterized in that: include: A cleaning device as claimed in any one of claims 1 to 9; as well as The control cabinet is provided with a power supply and a control device, wherein the power supply is used to supply power to the electrical equipment in the control device, the moving mechanism and the cleaning mechanism, and the control device is used to control the movement of the moving mechanism and the cleaning mechanism to perform the cleaning operation.

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