Glue removing device

By using image acquisition equipment and lasers in the production of single crystal silicon, the glue layer on the silicon material is quickly removed, and the environmental pollution and cost increase in the chemical glue removal process is solved, and an efficient, safe and environmentally friendly glue removal process is achieved.

CN222343673UActive Publication Date: 2025-01-14CSI CELLS CO LTD +1
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Patent Information

Application Number
CN202421140860.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-23
Publication Date
2025-01-14
Estimated Expiration
2034-05-23

AI Technical Summary

Technical Problem

The existing chemical glue removal process produces volatile organic compounds and harmful gases during the production of single crystal silicon, resulting in increased environmental pollution and production costs.

Method used

A glue removal device was designed to capture the glue layer image on the silicon material using the image acquisition device, and quickly remove the glue layer through the photothermal effect, avoiding the use of chemical glue removal.

Benefits of technology

It achieves an efficient, safe and environmentally friendly glue removal layer, avoids environmental pollution and cost increase caused by chemical glue removal, and has automated control, improving glue removal efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a glue removing device which comprises a conveying mechanism used for conveying materials, the surface of the conveying mechanism comprises a first area and a second area which are distributed in the conveying direction, and the materials comprise silicon materials and glue layers attached to the silicon materials; the image acquisition mechanism and the heating degumming mechanism are installed above the conveying mechanism in the conveying direction of the conveying mechanism, the image acquisition mechanism comprises image acquisition equipment movably installed above the conveying mechanism, and the heating degumming mechanism comprises a laser movably installed above the second area. The glue removing device disclosed by the utility model can be used for efficiently and safely removing a glue layer on a material in an environment-friendly manner.
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Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production, and in particular relates to a glue removal device. Background Art

[0002] In the production and processing of monocrystalline silicon, degumming is an important step to remove impurities, organic matter or other unnecessary coatings that may exist on the surface of silicon materials. The existing process is mainly a chemical degumming process, that is, the material to be degummed is placed in a degumming tank filled with a degumming agent solution and soaked. After the material and the glue layer are completely separated, the material is taken out and rinsed, and the chemical degumming process is completed. The chemical waste liquid generated in the chemical degumming process may produce volatile organic compounds (VOCs) or other harmful gases during the treatment process, posing potential risks to the environment and the health of operators. In addition, the treatment and storage of chemical waste liquid will also increase production costs.

[0003] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0004] The utility model aims to provide a glue removal device, which avoids the problem of chemical pollution that may be generated in chemical glue removal.

[0005] In order to achieve the above object, a specific embodiment of the utility model provides a glue removal device, comprising:

[0006] A conveying mechanism, used for conveying materials, wherein the surface of the conveying mechanism comprises a first area and a second area distributed along a conveying direction, and the materials comprise silicon materials and a glue layer attached to the silicon materials;

[0007] An image acquisition mechanism and a heating and degumming mechanism are installed above the conveying mechanism along the conveying direction of the conveying mechanism. The image acquisition mechanism includes an image acquisition device movably installed above the conveying mechanism, and the heating and degumming mechanism includes a laser movably installed above the second area.

[0008] In one or more embodiments of the present utility model, the conveying mechanism includes a support frame and a conveying roller rotatably installed on the support frame. The top of the support frame is provided with a first slide groove distributed along the conveying direction, and the image acquisition mechanism and the heating and degumming mechanism are both slidably installed in the first slide groove.

[0009] In one or more embodiments of the present invention, the support frame includes support legs and two spaced support plates installed on the top of the support legs, the conveying roller is rotatably installed between the two support plates, and the first slide groove is arranged on the top of the support plate.

[0010] In one or more embodiments of the present invention, the image acquisition mechanism includes two first brackets that are spaced apart and slidably installed in first sliding grooves, respectively, and a second bracket installed between the two first brackets.

[0011] In one or more embodiments of the present invention, a second slide groove distributed along the extension direction of the second bracket is provided at the bottom of the second bracket, a first sliding seat is slidably installed in the second slide groove, and the image acquisition device is fixedly installed on the first sliding seat.

[0012] In one or more embodiments of the present invention, the second slide groove is vertically distributed with respect to the first slide groove.

[0013] In one or more embodiments of the present invention, the image acquisition mechanism includes two third brackets that are spaced apart and slidably mounted in the first sliding grooves, respectively, and a fourth bracket mounted between the two third brackets.

[0014] In one or more embodiments of the present invention, a third slide groove distributed along the extension direction of the fourth bracket is provided at the bottom of the fourth bracket, a second slide seat is slidably installed in the third slide groove, and the laser is fixedly installed on the second slide seat.

[0015] In one or more embodiments of the present invention, the third sliding groove is distributed perpendicularly to the first sliding groove.

[0016] In one or more embodiments of the present invention, the glue removal device also includes a material receiving mechanism, which is located next to the conveying mechanism and adjacent to the second area. The material receiving mechanism includes a material receiving rack and a material receiving basin, and the horizontal height of the top of the material receiving basin is lower than the horizontal height of the second area in the conveying mechanism.

[0017] Compared with the prior art, the glue removal device of the utility model uses an image acquisition device to capture an image of the glue layer on the silicon material in the first area, and confirms the position and thickness of the glue layer on the silicon material based on the image information. Then, the conveying mechanism transports the material to the second area, and the laser emits laser to the glue layer on the silicon material. The glue layer is quickly heated and softened and separated from the material, completing the glue removal process. The utility model uses the photothermal effect of the laser to quickly heat the glue layer (epoxy resin) and achieve rapid removal, while avoiding damage to the silicon material. It can efficiently, safely and environmentally friendly remove the glue layers formed by various adhesives containing epoxy resin, avoiding problems such as environmental pollution and increased costs caused by chemical glue removal. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a three-dimensional diagram of the cooperation between the glue removal device and the material in one embodiment of the utility model;

[0020] Figure 2 It is a top view of the combination of the degumming device and the material in one embodiment of the utility model;

[0021] Figure 3 It is a schematic diagram of an image acquisition mechanism and a heating and degumming mechanism in one embodiment of the utility model.

[0022] Description of main reference numerals:

[0023] 1. Conveying mechanism; 11. Support frame; 111. Support leg; 112. Support plate; 113. First slide; 12. Conveying roller; 13. First area; 14. Second area; 2. Image acquisition mechanism; 21. Image acquisition device; 22. First bracket; 23. Second bracket; 231. Second slide; 24. First sliding seat; 3. Heating and degumming mechanism; 31. Laser; 32. Third bracket; 33. Fourth bracket; 331. Third slide; 34. Second sliding seat; 4. Material receiving mechanism; 41. Material receiving rack; 42. Material receiving basin; 5. Material; 51. Silicon material; 52. Glue layer. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0025] After the single crystal silicon round rod is successfully drawn, the materials such as the adhesive rod and the edge skin produced in the squaring process can be processed. The materials include silicon material and the adhesive layer attached to the silicon material. The raw material of the adhesive layer can be considered as epoxy resin adhesive. The recycled materials only need to recycle the silicon material, so the materials need to be debonded.

[0026] like Figures 1 to 3As shown, a degumming device in an embodiment of the utility model comprises a conveying mechanism 1, an image acquisition mechanism 2 and a heating degumming mechanism 3; the conveying mechanism 1 is used to convey a material 5, and a surface of the conveying mechanism 1 comprises a first area 13 and a second area 14 distributed along a conveying direction, and the material 5 comprises a silicon material 51 and a glue layer 52 attached to the silicon material 51; the image acquisition mechanism 2 and the heating degumming mechanism 3 are installed above the conveying mechanism 1 along the conveying direction of the conveying mechanism 1, the image acquisition mechanism 2 comprises an image acquisition device 21 movably installed above the conveying mechanism 1, and the heating degumming mechanism 3 comprises a laser 31 movably installed above the second area 14.

[0027] It can be understood that the image acquisition mechanism 2 and the heating and degumming mechanism 3 of the utility model can be manually controlled, that is, the operator determines the position and thickness of the glue layer 52 on the silicon material 51 based on the image taken by the image acquisition mechanism 2, and then manually sets the appropriate laser parameters (such as power, speed, frequency, etc.) in the laser 31 to complete the degumming process.

[0028] In this embodiment, the image acquisition mechanism 2 and the heating and degumming mechanism 3 can also be connected to an external terminal, that is, the image acquisition device 21 can transmit the image information of the glue layer 52 to the external terminal, and the external terminal sets the laser parameters (such as power, speed, frequency, etc.) in the laser 31, and controls the laser 31 to emit laser to the glue layer 52 on the silicon material 51, thereby realizing the automated degumming process, which can save labor costs and improve the degree of automation and degumming efficiency.

[0029] It should be noted that the external terminal can be considered as an existing device such as a host computer, a processor, etc. The image acquisition device 21 can be an existing camera, a video camera, a 360° panoramic camera, etc. The laser 31 can be an infrared laser that can be directly purchased on the market.

[0030] like Figure 1 As shown, the conveying mechanism 1 includes a support frame 11 and a conveying roller 12 rotatably mounted on the support frame 11. The top of the support frame 11 is provided with a first slide groove 113 distributed along the conveying direction, and the image acquisition mechanism 2 and the heating and degumming mechanism 3 are both slidably mounted in the first slide groove 113. That is, the image acquisition mechanism 2 and the heating and degumming mechanism 3 can slide on the conveying frame along the extension direction of the first slide groove 113, so that the image acquisition device 21 can capture the image information of the entire area of ​​the glue layer 52 as much as possible, and the laser emitted by the laser 31 can irradiate the entire area of ​​the glue layer 52 as much as possible. The conveying roller 12 plays the role of carrying and conveying the material 5.

[0031] Among them, a transmission driver can be installed on the support frame 11, and the transmission driver is connected to the transmission roller 12 to control the rotation of the transmission roller 12. It can be understood that the transmission driver can be connected to the transmission roller 12 through a common connecting piece (not shown in the figure) or a connecting assembly (not shown in the figure), and the connecting piece or connecting assembly can be a worm and a worm wheel, or a gear set, or a transmission chain and a gear, etc. to realize the transmission connection between the transmission driver and the transmission roller 12. Among them, the transmission driver and the connecting piece or connecting assembly can be installed on the support frame 11.

[0032] Preferably, a first driving mechanism (not shown in the figure) can be installed on the support frame 11, and the first driving mechanism can be connected to the image acquisition mechanism 2 and the heating and degumming mechanism 3 respectively, and is used to drive the image acquisition mechanism 2 and the heating and degumming mechanism 3 to slide along the first slide groove 113, thereby playing a role in automatically controlling the movement of the image acquisition mechanism 2 and the heating and degumming mechanism 3.

[0033] The first driving mechanism may be an electric cylinder or a pneumatic cylinder, etc. The image acquisition mechanism 2 and the heating and degumming mechanism 3 may be respectively connected to the output end of the electric cylinder or the pneumatic cylinder (for example, the image acquisition mechanism 2 and the heating and degumming mechanism 3 are respectively connected to the piston rod of the pneumatic cylinder), so as to automatically or semi-automatically control the movement of the image acquisition mechanism 2 and the heating and degumming mechanism 3, thereby controlling the movement of the image acquisition device 21 and the laser 31. The first driving mechanism may be connected to an external terminal, which may control the start and stop of the first driving mechanism, further improving the automation level of the entire device.

[0034] It can be understood that the image acquisition mechanism 2 can move along the first slide groove 113 in the first area 13, so as to take the image of the material 5; the heating and degumming mechanism 3 can move along the second slide groove 231 in the second area 14, so as to heat the glue layer 52 in the material 5 in the second area 14. In the process of heating the degumming mechanism 3 heating the glue layer 52 in the material 5 in the second area 14, the image acquisition mechanism 2 can also move along the first slide groove 113 from the first area 13 to the second area 14 (or close to the second area 14), take pictures of the material 5 in the second area 14, monitor the laser degumming process in real time, and judge the removal degree of the glue layer 52; the image information taken by the image acquisition mechanism 2 in the above process can be transmitted to the external terminal (or external display screen), and the external terminal (or the operator) judges the removal degree of the glue layer 52 according to the image information displayed on the external display screen.

[0035] In the embodiment, the support frame 11 includes a support leg 111 and two spaced support plates 112 installed on the top of the support leg 111, the conveying roller 12 is rotatably installed between the two support plates 112, and the first slide groove 113 is provided on the top of the support plate 112. The two support plates 112 can play a role in limiting the extension direction of the first slide groove 113.

[0036] like Figure 3 As shown, the image acquisition mechanism 2 includes two first brackets 22 that are spaced apart and slidably installed in the first slide grooves 113, and a second bracket 23 installed between the two first brackets 22. The image acquisition device 21 is installed on the second bracket 23. The cooperation between the first bracket 22 and the first slide groove 113 can limit the movement direction of the image acquisition device 21 on the second bracket 23 (along the direction of the first slide groove 113), so as to capture the image information of the entire area of ​​the rubber layer 52 as much as possible.

[0037] Furthermore, the bottom of the second bracket 23 is provided with a second slide groove 231 distributed along the extension direction of the second bracket 23, and the first sliding seat 24 is slidably installed in the second slide groove 231, and the image acquisition device is fixedly installed on the first sliding seat 24. The cooperation between the second slide groove 231 and the first sliding seat 24 can play a role in limiting the moving direction of the image acquisition device (along the direction of the second slide groove 231).

[0038] Preferably, a second drive mechanism (not shown in the figure) may be installed on the second bracket 23, and the second drive mechanism may be connected to the first sliding seat 24, and is used to drive the first sliding seat 24 to slide on the second bracket 23 along the extension direction of the second slide groove 231, so as to automatically or semi-automatically control the movement of the image acquisition device. The second drive mechanism may be an electric cylinder or a pneumatic cylinder, etc., and the second drive mechanism may work in a manually controlled manner (semi-automatically); or the second drive mechanism may also be connected to an external terminal (working in an automated control manner) to improve the automation level of the device.

[0039] Preferably, the second slide groove 231 is vertically distributed with respect to the first slide groove 113. In this way, the extension direction of the second slide groove 231 and the extension direction of the first slide groove 113 can be respectively regarded as the X direction and the Y direction in a coordinate system, so that the image acquisition device 21 is equivalent to freely moving in an XY plane, achieving the function of controlling the moving position and shooting position of the image acquisition device 21.

[0040] like Figure 3As shown, the image acquisition mechanism 2 includes two third brackets 32 that are spaced apart and slidably mounted in the first slide groove 113, and a fourth bracket 33 mounted between the two third brackets 32. The cooperation between the third bracket 32 ​​and the first slide groove 113 can limit the movement direction of the laser 31 on the fourth bracket 33 (along the direction of the first slide groove 113), thereby increasing the irradiation range and movement range of the laser 31 as much as possible.

[0041] Furthermore, the bottom of the fourth bracket 33 is provided with a third slide groove 331 distributed along the extension direction of the fourth bracket 33, and the second sliding seat 34 is slidably installed in the third slide groove 331, and the laser 31 is fixedly installed on the second sliding seat 34. The cooperation between the third slide groove 331 and the second sliding seat 34 can limit the movement direction of the laser 31 on the second bracket 23 (along the direction of the second slide groove 231), and maximize the irradiation range and movement range of the laser 31.

[0042] Preferably, a third driving mechanism (not shown in the figure) may be installed on the fourth bracket 33, and the second driving mechanism may be connected to the second sliding seat 34 to drive the second sliding seat 34 to slide on the fourth bracket 33 along the extension direction of the third slide groove 331, so as to automatically or semi-automatically control the movement of the laser 31. The third driving mechanism may be an electric cylinder or a pneumatic cylinder, etc., and the third driving mechanism may work in a manually controlled manner (semi-automated); or the third driving mechanism may also be connected to an external terminal (working in an automated control manner) to improve the automation level of the device.

[0043] Preferably, the third slide groove 331 is vertically distributed with respect to the first slide groove 113. In this way, the extension direction of the third slide groove 331 and the extension direction of the first slide groove 113 can be respectively regarded as the X direction and the Y direction in a coordinate system, so that the laser 31 is equivalent to freely moving in an XY plane, so as to achieve the effect of controlling the moving position and irradiation position of the laser 31.

[0044] like Figure 1 and Figure 2 As shown, the glue removal device also includes a material receiving mechanism 4, which is located next to the conveying mechanism 1 and is arranged adjacent to the second area 14. The material receiving mechanism 4 includes a material receiving rack 41 and a material receiving basin 42. The horizontal height of the top of the material receiving basin 42 is lower than the horizontal height of the second area 14 in the conveying mechanism 1.

[0045] The working process of the adhesive removal device of this embodiment will be described in detail below:

[0046] First, the external terminal controls the conveying mechanism 1 to transport the edge skin (material 5) to the first area 13, and the image acquisition device 21 (such as a camera, etc.) captures the image of the edge skin and transmits it to the external terminal;

[0047] Then, the conveying mechanism 1 transports the edge skin (material 5) to the second area 14, and at the same time, the external terminal controls the laser parameters of the laser 31 and emits laser light to the glue layer 52 on the edge skin;

[0048] Then, the image acquisition mechanism 2 moves close to the heating and debonding mechanism 3, and the image acquisition device 21 takes the image of the edge skin in real time and transmits it to the external terminal. Through real-time monitoring, the process of the glue layer 52 (epoxy resin adhesive) gradually softening, bubbling, and falling off can be observed to judge the degree of removal;

[0049] Finally, when the glue layer 52 (epoxy resin adhesive) is completely removed, the edge skin after the glue layer 52 is removed is transported to the receiving basin 42 by the conveying roller 12 of the conveying mechanism 1 .

[0050] In summary, the utility model has the advantages of being efficient, safe, and environmentally friendly, and is applicable to the removal of various adhesives (adhesive layer 52) containing epoxy resin. The adhesive removal device can quickly and accurately remove the epoxy resin adhesive (adhesive layer 52) by using the laser 31, while avoiding damage to the material 5. In addition, the adhesive removal device of the utility model is easy to realize automatic control, and has broad application prospects and market prospects.

[0051] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0052] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A glue removal device, characterized in that: include: A conveying mechanism, used for conveying materials, wherein the surface of the conveying mechanism comprises a first area and a second area distributed along a conveying direction, and the materials comprise silicon materials and a glue layer attached to the silicon materials; An image acquisition mechanism and a heating and degumming mechanism are installed above the conveying mechanism along the conveying direction of the conveying mechanism. The image acquisition mechanism includes an image acquisition device movably installed above the conveying mechanism, and the heating and degumming mechanism includes a laser movably installed above the second area.

2. The adhesive removal device according to claim 1, characterized in that: The conveying mechanism includes a support frame and a conveying roller rotatably mounted on the support frame. The top of the support frame is provided with a first slide groove distributed along the conveying direction. The image acquisition mechanism and the heating and degumming mechanism are both slidably mounted in the first slide groove.

3. The adhesive removal device according to claim 2, characterized in that: The support frame includes a support leg and two support plates installed on the top of the support leg and spaced apart from each other. The conveying roller is rotatably installed between the two support plates, and the first slide groove is arranged on the top of the support plate.

4. The adhesive removal device according to claim 2, characterized in that: The image acquisition mechanism comprises two first brackets which are spaced apart and respectively slidably mounted in first sliding grooves, and a second bracket which is mounted between the two first brackets.

5. The adhesive removal device according to claim 4, characterized in that: A second slide groove distributed along the extension direction of the second bracket is provided at the bottom of the second bracket, a first slide seat is slidably installed in the second slide groove, and the image acquisition device is fixedly installed on the first slide seat.

6. The adhesive removal device according to claim 5, characterized in that: The second sliding groove is vertically distributed with respect to the first sliding groove.

7. The adhesive removal device according to claim 2, characterized in that: The image acquisition mechanism includes two third brackets which are spaced apart and respectively slidably mounted in the first sliding grooves, and a fourth bracket which is mounted between the two third brackets.

8. The adhesive removal device according to claim 7, characterized in that: A third slide groove distributed along the extension direction of the fourth bracket is provided at the bottom of the fourth bracket, a second slide seat is slidably installed in the third slide groove, and the laser is fixedly installed on the second slide seat.

9. The adhesive removal device according to claim 8, characterized in that: The third sliding groove is vertically distributed with respect to the first sliding groove.

10. The adhesive removal device according to claim 1, characterized in that: The degumming device also includes a material receiving mechanism, which is located next to the conveying mechanism and adjacent to the second area. The material receiving mechanism includes a material receiving rack and a material receiving basin, and the horizontal height of the top of the material receiving basin is lower than the horizontal height of the second area in the conveying mechanism.