Manipulator for overturning wafer

Abstract

The utility model relates to the technical field of wafer clamping and overturning, in particular to a manipulator for wafer overturning, which is characterized in that an overturning device comprises a gear, a vertical groove is arranged on the surface of a mounting seat, a sliding strip plate is slidably connected in the vertical groove, a rack is fixedly mounted on the surface of the sliding strip plate, and two fixing plates are fixedly mounted on the surface of the mounting seat. A threaded rod is rotationally connected between the two fixing plates, a motor is fixedly mounted on the surface of one fixing plate, a long groove is formed in the surface of the mounting base, a movable plate is in threaded connection with the surface of the threaded rod, and a connecting rod is fixedly mounted between the movable plate and the sliding strip plate. The wafer cleaning manipulator solves the problems that when one side of a wafer is cleaned in a cleaning box and the other side of the wafer needs to be cleaned, a worker needs to take down the wafer from a clamp, turn over the wafer to the other side and fix the wafer through the clamp again, and then the other side of the wafer can be cleaned continuously; therefore, the whole cleaning efficiency is low.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer clamping and flipping, in particular to a manipulator used for wafer flipping. Background Art

[0002] Chip manufacturing involves process flows such as chip design, wafer manufacturing, wafer processing, electrical measurement, cutting, packaging and testing. In the production and manufacturing process of integrated circuits, wafers will be exposed to a large number of particles during multiple process steps such as thin film deposition, etching and polishing. In order to keep the wafer surface clean and eliminate particles remaining on the wafer surface during the process, the wafer must be cleaned after each process. The wafer is clamped and transported by a robot and a fixture, and then transported to a cleaning box for spray cleaning.

[0003] After the existing wafer robot has finished cleaning one side of the wafer in the cleaning box, when it needs to clean the other side, the worker needs to remove the wafer from the fixture, turn it over to the other side, and fix it with the fixture again before continuing to clean the other side of the wafer, which makes the overall cleaning efficiency low. Utility Model Content

[0004] The utility model aims to solve the technical problems in the above background and proposes a robot for wafer flipping.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a manipulator for wafer flipping, comprising a mounting seat, the surface of the mounting seat is rotatably connected to a rotating shaft, one end of the rotating shaft is fixedly installed with a U-shaped bracket, the outer wall surface of the rotating shaft is provided with a flipping device, the flipping device comprises a gear, the gear is fixedly installed on the outer wall surface of the rotating shaft, the surface of the mounting seat is provided with a vertical groove, the interior of the vertical groove is slidably connected with a sliding plate, the surface of the sliding plate is fixedly installed with a rack, and the rack and the gear are meshed with each other. The setting of the rack has the effect of driving the gear to rotate, and the setting of the gear has the effect of driving the rotating shaft to rotate.

[0006] Preferably, two fixing plates are fixedly mounted on the surface of the mounting seat, a threaded rod is rotatably connected between the two fixing plates, a motor is fixedly mounted on the surface of one of the fixing plates, and the output end of the motor is fixedly connected to the threaded rod. The setting of the motor plays an effect of driving the threaded rod to rotate.

[0007] Preferably, a long groove is formed on the surface of the mounting seat, a movable plate is threadedly connected to the surface of the threaded rod, and a connecting rod is fixedly installed between the movable plate and the sliding strip plate. The threaded rod is provided to drive the movable plate to move inside the long groove, and the connecting rod is provided to drive the sliding strip plate to move inside the vertical groove.

[0008] Preferably, the inner wall surface of the U-shaped bracket is provided with an adjustment device, the adjustment device comprises a through slot, the through slot is provided on the inner wall surface of the U-shaped bracket, a slide bar is fixedly installed between the inner walls at both ends of the through slot, two sliders are slidably connected to the surface of the slide bar, and a clamping ring is fixedly installed on the side of the slider. The setting of the clamping ring plays an effect of clamping and fixing the wafer.

[0009] Preferably, a cylinder is fixedly installed on the side of the U-shaped bracket, and a T-shaped plate is fixedly installed on the output end of the cylinder. The arrangement of the cylinder plays an effect of driving the T-shaped plate to move.

[0010] Preferably, the bottom surface of the T-shaped plate is hinged with two hinged plates, and one end of the hinged plate away from the T-shaped plate is hinged with the slider. The setting of the hinged plates has the effect of driving the slider to move on the surface of the slide bar.

[0011] Compared with the prior art, the advantages and positive effects of the utility model are:

[0012] 1. In the utility model, by setting a turning device, the wafer is first clamped and fixed by a clamping ring, and then the wafer is moved to the cleaning box for cleaning under the action of a manipulator. When one side of the wafer is cleaned, it is necessary to clean the other side. First, the motor is started, and the motor starts to drive the threaded rod to rotate. The rotation of the threaded rod drives the movable plate to move inside the long groove. The movable plate moves inside the long groove to drive the connecting rod to move. The movement of the connecting rod drives the sliding plate to move inside the vertical groove. The movement of the sliding plate inside the vertical groove drives the rack to move. The rack moves and meshes with the gear to rotate the gear. The rotation of the gear drives the rotating shaft to rotate. The rotation of the rotating shaft drives the U-shaped bracket to rotate. The rotation of the U-shaped bracket drives the clamping ring to rotate. The rotation of the clamping ring drives the wafer to complete the flipping operation. Through the cooperation of the above structure, the clamped wafer can be automatically flipped and fixed, thereby improving the cleaning efficiency of the wafer.

[0013] 2. In the utility model, by setting an adjustment device, when it is necessary to adjust the distance between the two clamping rings, first start the cylinder, the cylinder starts to drive the T-plate to move, the T-plate movement drives the two hinged plates to move, the two hinged plates move and drive the two sliders to move on the surface of the slide rod in the direction of moving away from or approaching each other, the two sliders move on the surface of the slide rod in the direction of moving away from or approaching each other and drive the two clamping rings to move in the direction of moving away from or approaching each other, the two clamping rings move in the direction of moving away from or approaching each other, thereby changing the distance between the two clamping rings, and when the clamping ring moves to a suitable position, close the cylinder. Through the cooperation of the above structure, the distance between the clamping rings can be adjusted, thereby facilitating the clamping and fixing of wafers of different sizes, further improving the applicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the three-dimensional structure of a robot for wafer flipping is proposed for the utility model;

[0015] Figure 2 The utility model provides a right-side structural schematic diagram of a robot for wafer flipping;

[0016] Figure 3 The utility model provides a schematic diagram of the left-side structure of a robot for wafer flipping;

[0017] Figure 4 The utility model proposes a robot for wafer flipping Figure 1 The structural diagram at A in the middle;

[0018] Legend:

[0019] 1. Mounting seat; 2. Rotating shaft; 3. U-shaped bracket; 4. Adjusting device; 41. Through slot; 42. Sliding rod; 43. Sliding block; 44. Clamping ring; 45. Cylinder; 46. T-shaped plate; 47. Hinge plate; 5. Turning device; 501. Gear; 502. Vertical slot; 503. Sliding plate; 504. Rack; 505. Fixed plate; 506. Threaded rod; 507. Motor; 508. Long slot; 509. Movable plate; 510. Connecting rod. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0021] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0022] See also Figure 1-4 The utility model provides a technical solution: a manipulator for wafer flipping, comprising a mounting seat 1, a rotating shaft 2 is rotatably connected to the surface of the mounting seat 1, and a U-shaped bracket 3 is fixedly installed at one end of the rotating shaft 2.

[0023] The specific configuration and functions of the turning device 5 and the adjusting device 4 will be described in detail below.

[0024] In this embodiment: a flipping device 5 is provided on the outer wall surface of the rotating shaft 2, and the flipping device 5 includes a gear 501, which is fixedly installed on the outer wall surface of the rotating shaft 2. A vertical groove 502 is opened on the surface of the mounting seat 1, and a sliding plate 503 is slidably connected inside the vertical groove 502. A rack 504 is fixedly installed on the surface of the sliding plate 503, and the rack 504 and the gear 501 are meshed with each other.

[0025] In this embodiment, the arrangement of the rack 504 has the effect of driving the gear 501 to rotate, and the arrangement of the gear 501 has the effect of driving the rotating shaft 2 to rotate.

[0026] Specifically, two fixing plates 505 are fixedly installed on the surface of the mounting base 1 , and a threaded rod 506 is rotatably connected between the two fixing plates 505 . A motor 507 is fixedly installed on the surface of one of the fixing plates 505 , and the output end of the motor 507 is fixedly connected to the threaded rod 506 .

[0027] In this embodiment, the motor 507 is provided to drive the threaded rod 506 to rotate.

[0028] Specifically, a long groove 508 is formed on the surface of the mounting base 1, a movable plate 509 is threadedly connected to the surface of the threaded rod 506, and a connecting rod 510 is fixedly installed between the movable plate 509 and the slide plate 503. The threaded rod 506 is provided to drive the movable plate 509 to move inside the long groove 508, and the connecting rod 510 is provided to drive the slide plate 503 to move inside the vertical groove 502.

[0029] In this embodiment: an adjusting device 4 is provided on the inner wall surface of the U-shaped bracket 3, and the adjusting device 4 includes a through groove 41, and the through groove 41 is opened on the inner wall surface of the U-shaped bracket 3, and a sliding rod 42 is fixedly installed between the inner walls at both ends of the through groove 41, and two sliding blocks 43 are slidably connected to the surface of the sliding rod 42, and a clamping ring 44 is fixedly installed on the side of the sliding block 43. When it is necessary to adjust the distance between the two clamping rings 44, first start the cylinder 45. The cylinder 45 starts to drive the T-plate 46 to move. The movement of the T-plate 46 drives the two hinged plates 47 to move. The movement of the two hinged plates 47 drives the two sliders 43 to move in the direction of moving away from or approaching each other on the surface of the slide rod 42. The two sliders 43 move in the direction of moving away from or approaching each other on the surface of the slide rod 42, driving the two clamping rings 44 to move in the direction of moving away from or approaching each other. The two clamping rings 44 move in the direction of moving away from or approaching each other, thereby changing the distance between the two clamping rings 44. When the clamping rings 44 move to a suitable position, close the cylinder 45. Through the cooperation of the above-mentioned structure, the distance between the clamping rings 44 can be adjusted, thereby facilitating the clamping and fixing of wafers of different sizes, further improving the applicability of the device.

[0030] Specifically, a cylinder 45 is fixedly mounted on the side of the U-shaped bracket 3 , and a T-shaped plate 46 is fixedly mounted on the output end of the cylinder 45 .

[0031] In this embodiment, the cylinder 45 is provided to drive the T-shaped plate 46 to move.

[0032] Specifically, two hinge plates 47 are hingedly connected to the bottom surface of the T-shaped plate 46 , and one end of the hinge plate 47 away from the T-shaped plate 46 is hingedly connected to the slider 43 .

[0033] In this embodiment, the setting of the hinge plate 47 plays an effect of driving the slider 43 to move on the surface of the slide rod 42 .

[0034] Working principle: by setting the flip device 5, first use the clamping ring 44 to clamp and fix the wafer, and then under the action of the robot, move the wafer to the cleaning box for cleaning. When one side of the wafer is cleaned and the other side needs to be cleaned, first start the motor 507, the motor 507 starts to drive the threaded rod 506 to rotate, the threaded rod 506 rotates to drive the movable plate 509 to move inside the long groove 508, the movable plate 509 moves inside the long groove 508 to drive the connecting rod 510 to move, and the connecting rod 510 moves. The sliding plate 503 is driven to move inside the vertical groove 502, and the sliding plate 503 moves inside the vertical groove 502, driving the rack 504 to move, and the rack 504 moves and meshes with the gear 501 to rotate the gear 501, and the rotation of the gear 501 drives the rotating shaft 2 to rotate, and the rotation of the rotating shaft 2 drives the U-shaped bracket 3 to rotate, and the rotation of the U-shaped bracket 3 drives the clamping ring 44 to rotate, and the rotation of the clamping ring 44 drives the wafer to complete the flipping operation. Through the cooperation of the above-mentioned structure, the clamped wafer can be automatically flipped and fixed, thereby improving the cleaning efficiency of the wafer. When it is necessary to adjust the distance between the two clamping rings 44, first start the cylinder 45. The cylinder 45 starts to drive the T-plate 46 to move. The movement of the T-plate 46 drives the two hinged plates 47 to move. The movement of the two hinged plates 47 drives the two sliders 43 to move in the direction of moving away from or approaching each other on the surface of the slide rod 42. The two sliders 43 move in the direction of moving away from or approaching each other on the surface of the slide rod 42, driving the two clamping rings 44 to move in the direction of moving away from or approaching each other. The two clamping rings 44 move in the direction of moving away from or approaching each other, thereby changing the distance between the two clamping rings 44. When the clamping rings 44 move to a suitable position, close the cylinder 45. Through the cooperation of the above-mentioned structure, the distance between the clamping rings 44 can be adjusted, thereby facilitating the clamping and fixing of wafers of different sizes, further improving the applicability of the device.

[0035] The above is only a preferred embodiment of the utility model, and does not limit the utility model in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the utility model without departing from the technical solution of the utility model still belongs to the protection scope of the technical solution of the utility model. In the description of the utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood by specific circumstances.

Claims

1. A robot for wafer flipping, comprising a mounting seat (1), a rotating shaft (2) being rotatably connected to the surface of the mounting seat (1), a U-shaped bracket (3) being fixedly mounted on one end of the rotating shaft (2), characterized in that: The outer wall surface of the rotating shaft (2) is provided with a flipping device (5), and the flipping device (5) comprises a gear (501), and the gear (501) is fixedly mounted on the outer wall surface of the rotating shaft (2); a vertical groove (502) is provided on the surface of the mounting seat (1), and a sliding plate (503) is slidably connected inside the vertical groove (502); a rack (504) is fixedly mounted on the surface of the sliding plate (503), and the rack (504) and the gear (501) are meshed with each other.

2. A wafer flipping robot according to claim 1, characterized in that: Two fixing plates (505) are fixedly mounted on the surface of the mounting seat (1), a threaded rod (506) is rotatably connected between the two fixing plates (505), a motor (507) is fixedly mounted on the surface of one of the fixing plates (505), and an output end of the motor (507) is fixedly connected to the threaded rod (506).

3. A wafer flipping robot according to claim 2, characterized in that: A long groove (508) is provided on the surface of the mounting seat (1), a movable plate (509) is threadedly connected to the surface of the threaded rod (506), and a connecting rod (510) is fixedly installed between the movable plate (509) and the sliding plate (503).

4. The wafer flipping robot according to claim 1, characterized in that: The inner wall surface of the U-shaped bracket (3) is provided with an adjusting device (4), and the adjusting device (4) comprises a through groove (41), and the through groove (41) is opened on the inner wall surface of the U-shaped bracket (3), and a sliding rod (42) is fixedly installed between the inner walls at both ends of the through groove (41), and two sliding blocks (43) are slidably connected to the surface of the sliding rod (42), and a clamping ring (44) is fixedly installed on the side of the sliding block (43).

5. The wafer flipping robot according to claim 1, characterized in that: A cylinder (45) is fixedly mounted on the side of the U-shaped bracket (3), and a T-shaped plate (46) is fixedly mounted on the output end of the cylinder (45).

6. A wafer flipping robot according to claim 5, characterized in that: Two hinged plates (47) are hingedly connected to the bottom surface of the T-shaped plate (46), and one end of the hinged plate (47) away from the T-shaped plate (46) is hingedly connected to the slider (43).

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