Metal processing electroplating device

Abstract

The utility model relates to the technical field of metal electroplating, and discloses a metal processing electroplating device which comprises an electroplating box, an electroplating bath is formed in the top of the electroplating box, an electroplating frame is arranged at the bottom of the inner side of the electroplating bath, a lifting mechanism is arranged on the electroplating box, and the lifting mechanism comprises two side fixing frames; the fixing frames on the two sides are symmetrically and fixedly connected to the bottom of the surface of the electroplating box correspondingly, hydraulic rods are installed on the fixing frames on the two sides, guide rods are symmetrically and fixedly connected to the top of the electroplating box, transverse plates are fixedly connected to the tail ends of the hydraulic rods, and connecting rods are fixedly connected to the bottoms of the tail ends of the transverse plates; mounting plates are symmetrically and fixedly connected to the top of the electroplating frame; by designing the lifting mechanism, when the metal part is electroplated, a worker can conveniently place the metal part in electroplating liquid and also conveniently take the metal part from the electroplating liquid, so that the workload of the worker can be reduced, and the worker can be protected.

Description

Technical Field

[0001] The present application relates to the technical field of metal electroplating, and in particular to a metal processing electroplating device. Background Art

[0002] Electroplating refers to the process of plating a thin layer of other metals or alloys on certain metal surfaces through the principle of electrolysis. It is a process that uses electrolysis to make a layer of metal film adhere to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancing aesthetics. It is a technology that uses the principle of electrolytic cells to deposit a metal coating with good adhesion but different performance from the base material on mechanical products. At present, during electroplating processing, workers usually manually place metal parts in the electroplating solution, and after the subsequent electroplating is completed, the workers also take out the metal parts from the electroplating solution. This method will increase the workload of the staff. At the same time, the electroplating solution is also corrosive to a certain extent, which will cause certain damage to the workers. Therefore, a metal processing electroplating device is proposed to solve the problems described in the above background technology.

[0003] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0004] In order to solve the problems existing in taking out metal parts after electroplating, the present application provides a metal processing electroplating device.

[0005] The present application provides a metal processing electroplating device that adopts the following technical solution:

[0006] A metal processing electroplating device comprises an electroplating box, wherein an electroplating tank is provided on the top of the electroplating box, an electroplating frame is provided on the inner bottom of the electroplating tank, a lifting mechanism is provided on the electroplating box, and the lifting mechanism comprises fixed frames on both sides, wherein the fixed frames on both sides are symmetrically fixedly connected to the bottom of the surface of the electroplating box, hydraulic rods are installed on the fixed frames on both sides, guide rods are symmetrically fixedly connected to the top of the electroplating box, a cross plate is fixedly connected to the end of the hydraulic rod, a connecting rod is fixedly connected to the bottom of the end of the cross plate, and a mounting plate is symmetrically fixedly connected to the top of the electroplating frame.

[0007] Preferably, a sewage pipe is fixedly connected to one side of the electroplating box, and a valve is installed on the sewage pipe.

[0008] Preferably, the transverse plate is sleeved on the guide rod, and the top end of the guide rod is fixedly connected to a limiting plate.

[0009] Preferably, the hydraulic rod is vertically arranged on the fixing frame, and the connecting rod is vertically arranged at the bottom of the transverse plate.

[0010] Preferably, the mounting plate is fixed to the bottom end of the connecting rod by bolts.

[0011] In summary, this application includes the following beneficial technical effects:

[0012] By designing a lifting mechanism, when electroplating metal parts, the metal parts are first placed inside the electroplating frame, and then the hydraulic rod drives the cross plate to slide on the guide rod, so that the cross plate drives the bottom connecting rod to move, and the connecting rod drives the electroplating frame as a whole to move, so that the electroplating frame moves into the electroplating tank; after the subsequent processing is completed, the hydraulic rod drives the cross plate to move, so that the electroplating frame is moved out to the electroplating tank, so that the staff can take out the metal parts; compared with the prior art, this design is convenient for the staff to place the metal parts in the electroplating solution, and it is also convenient to take the metal parts out of the electroplating solution, thereby reducing the workload of the staff and protecting the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic diagram of the side view structure of the device of the application embodiment;

[0014] Figure 2 is a schematic diagram of the front view structure of the device of the application embodiment;

[0015] Figure 3 It is a schematic diagram of the cross-sectional structure of the device of the application embodiment.

[0016] Explanation of the accompanying drawings: 1. electroplating box; 2. drain pipe; 3. valve; 4. electroplating tank; 5. electroplating frame; 6. fixing frame; 7. hydraulic rod; 8. guide rod; 9. cross plate; 10. limit plate; 11. connecting rod; 12. mounting plate; 13. bolt. DETAILED DESCRIPTION

[0017] The following is combined with Figure 1 —3 Provide further details of this application.

[0018] The present application embodiment discloses a metal processing electroplating device. Figure 1 A metal processing electroplating device is used for metal electroplating processing, including an electroplating box 1, a sewage pipe 2 is fixedly connected to one side of the electroplating box 1, and the sewage generated during electroplating is conveniently discharged through the sewage pipe 2. A valve 3 is installed on the sewage pipe 2, and the valve 3 is convenient for controlling the on and off of the sewage pipe 2. An electroplating tank 4 is opened on the top of the electroplating box 1, and an electroplating frame 5 is arranged at the bottom of the inner side of the electroplating tank 4. The electroplating frame 5 is convenient for placing metal parts. A lifting mechanism is arranged on the electroplating box 1, and the lifting mechanism is convenient for driving the electroplating frame 5 to move, so as to facilitate the subsequent removal of the metal parts inside the electroplating frame 5;

[0019] During processing, the metal parts are placed inside the electroplating frame 5, and then the electroplating frame 5 is placed inside the electroplating tank 4, and then the electroplating liquid is injected into the electroplating tank 4, so that the metal parts are electroplated inside the electroplating tank 4, and finally the electroplating frame 5 is lifted by the lifting mechanism, so that it is convenient for the staff to take out the processed metal parts.

[0020] Reference Figure 2-3 The lifting mechanism includes two side fixing frames 6, which are convenient for the installation of hydraulic rods 7. The two side fixing frames 6 are symmetrically fixedly connected to the bottom of the surface of the electroplating box 1. Hydraulic rods 7 are installed on the two side fixing frames 6. The hydraulic rods 7 provide power for the operation of the device. The hydraulic rods 7 are vertically arranged on the fixing frames 6. The top of the electroplating box 1 is symmetrically fixedly connected with guide rods 8. The guide rods 8 facilitate the guidance of the subsequent movement of the horizontal plate 9. The end of the hydraulic rod 7 is fixedly connected with a horizontal plate 9, and the horizontal plate 9 is sleeved on the guide rods 8, so that the horizontal plate 9 can move on the guide rod 8, the top of the guide rod 8 is fixedly connected to a limit plate 10, and the moving distance of the horizontal plate 9 is limited by the limit plate 10. The bottom of the end of the horizontal plate 9 is fixedly connected to a connecting rod 11, and the connecting rod 11 is vertically arranged at the bottom of the horizontal plate 9. The top of the electroplating frame 5 is symmetrically fixedly connected to a mounting plate 12, and the mounting plate 12 is fixed to the bottom of the connecting rod 11 by bolts 13. By removing the bolts 13, the mounting plate 12 can be separated from the connecting rod 11, so that the electroplating frame 5 can be disassembled, which is convenient for the subsequent removal of the electroplating frame 5;

[0021] During processing, the metal parts are first placed inside the electroplating frame 5, and then the hydraulic rod 7 is used to drive the cross plate 9 to slide on the guide rod 8, so that the cross plate 9 drives the bottom connecting rod 11 to move, and the connecting rod 11 drives the electroplating frame 5 to move as a whole, so that the electroplating frame 5 moves into the electroplating tank 4; after the subsequent processing is completed, the hydraulic rod 7 is used to drive the cross plate 9 to move, so as to move the electroplating frame 5 out to the inside of the electroplating tank 4, so that the staff can take out the metal parts, and finally the mounting plate 12 can be separated from the connecting rod 11 by removing the bolts 13, so that the electroplating frame 5 can be disassembled so that the electroplating frame 5 can be taken out.

[0022] The implementation principle of a metal processing electroplating device in an embodiment of the present application is as follows: during processing, the metal parts are first placed inside the electroplating frame 5, and then the hydraulic rod 7 drives the cross plate 9 to slide on the guide rod 8, so that the cross plate 9 drives the bottom connecting rod 11 to move, thereby driving the electroplating frame 5 as a whole to move through the connecting rod 11, so that the electroplating frame 5 moves into the electroplating tank 4, and at this time, the electroplating liquid is injected into the electroplating tank 4, so that the metal parts are electroplated inside the electroplating tank 4; after the subsequent processing is completed, the hydraulic rod 7 drives the cross plate 9 to move, so that the electroplating frame 5 is moved out to the inside of the electroplating tank 4, so that the staff can take out the metal parts, and finally the mounting plate 12 can be separated from the connecting rod 11 by removing the bolts 13, so that the electroplating frame 5 is disassembled so that the electroplating frame 5 can be taken out.

[0023] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0024] Secondly: The drawings of the embodiments disclosed in the present utility model only involve structures related to the embodiments disclosed in the present utility model, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0025] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

[0026] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A metal processing electroplating device, comprising an electroplating tank (1), characterized in that: The electroplating box (1) is provided with an electroplating tank (4) at the top, and an electroplating frame (5) is provided at the bottom of the inner side of the electroplating tank (4). The electroplating box (1) is provided with a lifting mechanism, and the lifting mechanism includes fixed frames (6) on both sides, and the fixed frames (6) on both sides are symmetrically fixedly connected to the bottom of the surface of the electroplating box (1). Hydraulic rods (7) are installed on the fixed frames (6) on both sides. The top of the electroplating box (1) is symmetrically fixedly connected with guide rods (8), and the end of the hydraulic rod (7) is fixedly connected with a cross plate (9), and the bottom of the end of the cross plate (9) is fixedly connected with a connecting rod (11), and the top of the electroplating frame (5) is symmetrically fixedly connected with a mounting plate (12).

2. A metal processing electroplating device according to claim 1, characterized in that: A sewage pipe (2) is fixedly connected to one side of the electroplating box (1), and a valve (3) is installed on the sewage pipe (2).

3. A metal processing electroplating device according to claim 1, characterized in that: The transverse plate (9) is sleeved on the guide rod (8), and the top end of the guide rod (8) is fixedly connected to a limiting plate (10).

4. A metal processing electroplating device according to claim 1, characterized in that: The hydraulic rod (7) is vertically arranged on the fixing frame (6), and the connecting rod (11) is vertically arranged at the bottom of the transverse plate (9).

5. The metal processing electroplating device according to claim 1, characterized in that: The mounting plate (12) is fixed to the bottom end of the connecting rod (11) by means of bolts (13).

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